CN1103505C - 高功率激光二极管列阵的微通道冷却封装组件 - Google Patents
高功率激光二极管列阵的微通道冷却封装组件 Download PDFInfo
- Publication number
- CN1103505C CN1103505C CN 98102464 CN98102464A CN1103505C CN 1103505 C CN1103505 C CN 1103505C CN 98102464 CN98102464 CN 98102464 CN 98102464 A CN98102464 A CN 98102464A CN 1103505 C CN1103505 C CN 1103505C
- Authority
- CN
- China
- Prior art keywords
- sheet glass
- silicon chip
- electric field
- laser diode
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 98102464 CN1103505C (zh) | 1998-06-26 | 1998-06-26 | 高功率激光二极管列阵的微通道冷却封装组件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 98102464 CN1103505C (zh) | 1998-06-26 | 1998-06-26 | 高功率激光二极管列阵的微通道冷却封装组件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1208274A CN1208274A (zh) | 1999-02-17 |
CN1103505C true CN1103505C (zh) | 2003-03-19 |
Family
ID=5217365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 98102464 Expired - Fee Related CN1103505C (zh) | 1998-06-26 | 1998-06-26 | 高功率激光二极管列阵的微通道冷却封装组件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1103505C (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4581964B2 (ja) * | 2005-02-14 | 2010-11-17 | セイコーエプソン株式会社 | マイクロチャンネル構造体の製造方法 |
-
1998
- 1998-06-26 CN CN 98102464 patent/CN1103505C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1208274A (zh) | 1999-02-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4015435B2 (ja) | 熱電素子を用いた加熱および冷却デバイス | |
JP3851489B2 (ja) | 静電チャック | |
US20120281725A1 (en) | Means for improved implementation of laser diodes and laser diode arrays | |
JPH09504140A (ja) | 熱電モジュールの改良された製造方法およびその結果として得られる熱電モジュール | |
JP6196095B2 (ja) | 静電チャック | |
CN107251246A (zh) | 热电模块及其制造方法 | |
JP2000077508A (ja) | 静電チャック | |
US11380832B2 (en) | Thermoelectric conversion module and method for producing thermoelectric conversion module | |
US20100154854A1 (en) | Thermoelectric module comprising spherical thermoelectric elements and method of manufacturing the same | |
CN1103505C (zh) | 高功率激光二极管列阵的微通道冷却封装组件 | |
JP2001313331A (ja) | 静電吸着装置 | |
JP2018006768A (ja) | 静電チャック | |
JP2020145281A (ja) | 静電チャック | |
JP6158634B2 (ja) | 静電チャック | |
JP3970714B2 (ja) | 複合ヒータ | |
US7137412B2 (en) | Relay | |
KR100811012B1 (ko) | 열전발전용 p-n 모듈 및 그 제조방법 | |
JP3188070B2 (ja) | 熱電発電モジュール | |
JPH09293775A (ja) | 静電チャック | |
JP2002270906A (ja) | 熱電モジュール | |
US10699984B2 (en) | Semiconductor module with a supporting structure on the bottom side | |
JP5225043B2 (ja) | 静電チャック | |
JP2000068565A (ja) | ペルチェ素子 | |
JP6681356B2 (ja) | 熱電変換モジュール | |
KR100267081B1 (ko) | 전력용반도체소자및그제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: CHONGQING NORMAL UNIVERSITY; CHENGDU HUAMIN INDUST Free format text: FORMER NAME OR ADDRESS: CHONGQING NORMAL COLLEGE; CHENGDU HUAMIN INDUSTRIAL CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 400047 Shapingba District, Chongqing Co-patentee after: Chengdu Hua Min Industrial Co., Ltd. Patentee after: Chongqing Normal University Address before: 400047 Shapingba District, Chongqing Co-patentee before: Chengdu Hua Min Industrial Co., Ltd. Patentee before: Chongqing Normal College |
|
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |