CN110326096B - 激光回流焊装置 - Google Patents
激光回流焊装置 Download PDFInfo
- Publication number
- CN110326096B CN110326096B CN201880013564.5A CN201880013564A CN110326096B CN 110326096 B CN110326096 B CN 110326096B CN 201880013564 A CN201880013564 A CN 201880013564A CN 110326096 B CN110326096 B CN 110326096B
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- China
- Prior art keywords
- laser
- laser beam
- welding
- transmitting plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005476 soldering Methods 0.000 title claims description 18
- 238000003466 welding Methods 0.000 claims abstract description 84
- 238000012546 transfer Methods 0.000 claims abstract description 38
- 230000005540 biological transmission Effects 0.000 claims description 30
- 239000010408 film Substances 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 15
- 239000000779 smoke Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000010453 quartz Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229910052594 sapphire Inorganic materials 0.000 claims description 8
- 239000010980 sapphire Substances 0.000 claims description 8
- 239000000428 dust Substances 0.000 claims description 6
- 239000005350 fused silica glass Substances 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 238000009501 film coating Methods 0.000 claims description 4
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 229920001774 Perfluoroether Polymers 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000004904 shortening Methods 0.000 abstract description 3
- 230000004323 axial length Effects 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 11
- 238000001514 detection method Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/706—Protective screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0090589 | 2017-07-17 | ||
| KR1020170090589A KR101937360B1 (ko) | 2017-07-17 | 2017-07-17 | 레이저 리플로우 장치 |
| PCT/KR2018/007920 WO2019017650A1 (ko) | 2017-07-17 | 2018-07-12 | 레이저 리플로우 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110326096A CN110326096A (zh) | 2019-10-11 |
| CN110326096B true CN110326096B (zh) | 2023-09-15 |
Family
ID=65015286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880013564.5A Active CN110326096B (zh) | 2017-07-17 | 2018-07-12 | 激光回流焊装置 |
Country Status (7)
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101816291B1 (ko) | 2016-10-20 | 2018-01-08 | 크루셜머신즈 주식회사 | 3차원 구조물을 위한 레이저 본딩장치 |
| TWI693119B (zh) * | 2019-03-06 | 2020-05-11 | 台灣愛司帝科技股份有限公司 | 應用於固接led的雷射加熱裝置 |
| KR102199450B1 (ko) * | 2019-04-09 | 2021-01-06 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
| KR102228432B1 (ko) * | 2019-04-09 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
| KR102228433B1 (ko) * | 2019-05-08 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
| KR102228434B1 (ko) * | 2019-05-08 | 2021-03-16 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 리플로우 방법 |
| KR102747470B1 (ko) * | 2019-07-05 | 2024-12-27 | 주식회사 엘지에너지솔루션 | 흄 제거 기능이 구비된 용접장치 |
| KR102374612B1 (ko) | 2019-08-22 | 2022-03-15 | 삼성디스플레이 주식회사 | 레이저 장치 및 레이저 가공 방법 |
| KR20210062376A (ko) * | 2019-11-21 | 2021-05-31 | 레이저쎌 주식회사 | 레이저 리플로우 장치 및 레이저 리플로우 방법 |
| CN114388393A (zh) * | 2020-10-22 | 2022-04-22 | 均华精密工业股份有限公司 | 生产设备及固晶装置 |
| CN113547210A (zh) * | 2021-07-15 | 2021-10-26 | Tcl华星光电技术有限公司 | 颗粒物粘附装置与激光处理工艺 |
| KR102695706B1 (ko) * | 2022-05-24 | 2024-08-16 | 레이저쎌 주식회사 | 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치 |
| CN116851864A (zh) * | 2023-08-22 | 2023-10-10 | 东莞市德镌精密设备有限公司 | 一种用于封装基板与贴装元件焊接的焊接平台及焊接设备 |
| CN116884887B (zh) * | 2023-09-06 | 2023-12-08 | 北京华卓精科科技股份有限公司 | 一种压合装置及压合方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5227604A (en) * | 1991-06-28 | 1993-07-13 | Digital Equipment Corporation | Atmospheric pressure gaseous-flux-assisted laser reflow soldering |
| JP2004289084A (ja) * | 2003-03-25 | 2004-10-14 | Matsushita Electric Ind Co Ltd | 部品圧着装置および部品圧着方法 |
| KR20050042582A (ko) * | 2003-11-03 | 2005-05-10 | 주식회사 젯텍 | 레이저를 이용한 이방전도성필름 본딩 장치 및 방법 |
| JP2005178220A (ja) * | 2003-12-19 | 2005-07-07 | Seiko Epson Corp | 接合方法、接合構造、接合装置、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置 |
| CN1951676A (zh) * | 2005-10-19 | 2007-04-25 | 丰田自动车株式会社 | 用于激光焊接热塑树脂部件的方法和装置 |
| JP2008153366A (ja) * | 2006-12-15 | 2008-07-03 | Omron Corp | 接合装置による接合方法 |
| JP2012089696A (ja) * | 2010-10-20 | 2012-05-10 | Adwelds:Kk | 接合装置 |
| KR20170048971A (ko) * | 2015-10-27 | 2017-05-10 | 한화테크윈 주식회사 | 플립칩 본딩 장치 |
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| JPH11297764A (ja) * | 1998-04-14 | 1999-10-29 | Ricoh Co Ltd | ボンディングツール及びそれを用いた半導体チップのボンディング方法 |
| JP2001148403A (ja) | 1999-11-18 | 2001-05-29 | Seiko Epson Corp | 半導体チップの実装方法および装置 |
| EP1400832B1 (en) | 2002-09-19 | 2014-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer and laser irradiation apparatus and method of manufacturing semiconductor device |
| JP4272634B2 (ja) | 2005-03-16 | 2009-06-03 | 芝浦メカトロニクス株式会社 | 電子部品の本圧着装置 |
| KR20090028161A (ko) * | 2007-09-14 | 2009-03-18 | 삼성테크윈 주식회사 | 반도체 칩 본딩 장치 및 방법 |
| JP4880561B2 (ja) | 2007-10-03 | 2012-02-22 | 新光電気工業株式会社 | フリップチップ実装装置 |
| JP5214345B2 (ja) | 2008-06-24 | 2013-06-19 | ヤマハ発動機株式会社 | レーザーリフロー方法および装置 |
| JP2011171551A (ja) * | 2010-02-19 | 2011-09-01 | Toyota Motor Corp | 半導体装置の製造方法 |
| KR101245356B1 (ko) | 2012-08-30 | 2013-03-19 | (주)정원기술 | 플립 칩 본더의 가압 헤드 |
| JP6237979B2 (ja) | 2013-03-15 | 2017-11-29 | 澁谷工業株式会社 | ボンディング装置 |
| KR101976103B1 (ko) | 2017-05-10 | 2019-05-07 | (주)안마이크론시스템 | 열 압착 본딩 장치 |
-
2017
- 2017-07-17 KR KR1020170090589A patent/KR101937360B1/ko active Active
-
2018
- 2018-07-12 JP JP2018562342A patent/JP2019534547A/ja active Pending
- 2018-07-12 WO PCT/KR2018/007920 patent/WO2019017650A1/ko unknown
- 2018-07-12 CN CN201880013564.5A patent/CN110326096B/zh active Active
- 2018-07-12 US US16/305,278 patent/US11213913B2/en active Active
- 2018-07-12 EP EP18835546.5A patent/EP3584826B1/en active Active
- 2018-07-16 TW TW107124498A patent/TWI673126B/zh active
-
2019
- 2019-11-15 JP JP2019206625A patent/JP7188767B2/ja active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5227604A (en) * | 1991-06-28 | 1993-07-13 | Digital Equipment Corporation | Atmospheric pressure gaseous-flux-assisted laser reflow soldering |
| JP2004289084A (ja) * | 2003-03-25 | 2004-10-14 | Matsushita Electric Ind Co Ltd | 部品圧着装置および部品圧着方法 |
| KR20050042582A (ko) * | 2003-11-03 | 2005-05-10 | 주식회사 젯텍 | 레이저를 이용한 이방전도성필름 본딩 장치 및 방법 |
| JP2005178220A (ja) * | 2003-12-19 | 2005-07-07 | Seiko Epson Corp | 接合方法、接合構造、接合装置、液滴吐出ヘッドの製造方法、液滴吐出ヘッドおよび液滴吐出装置 |
| CN1951676A (zh) * | 2005-10-19 | 2007-04-25 | 丰田自动车株式会社 | 用于激光焊接热塑树脂部件的方法和装置 |
| JP2008153366A (ja) * | 2006-12-15 | 2008-07-03 | Omron Corp | 接合装置による接合方法 |
| JP2012089696A (ja) * | 2010-10-20 | 2012-05-10 | Adwelds:Kk | 接合装置 |
| KR20170048971A (ko) * | 2015-10-27 | 2017-05-10 | 한화테크윈 주식회사 | 플립칩 본딩 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019534547A (ja) | 2019-11-28 |
| TWI673126B (zh) | 2019-10-01 |
| EP3584826C0 (en) | 2024-01-17 |
| TW201908042A (zh) | 2019-03-01 |
| EP3584826A1 (en) | 2019-12-25 |
| WO2019017650A1 (ko) | 2019-01-24 |
| EP3584826A4 (en) | 2021-04-21 |
| CN110326096A (zh) | 2019-10-11 |
| KR101937360B1 (ko) | 2019-01-11 |
| JP7188767B2 (ja) | 2022-12-13 |
| EP3584826B1 (en) | 2024-01-17 |
| US20210220945A1 (en) | 2021-07-22 |
| US11213913B2 (en) | 2022-01-04 |
| JP2020057790A (ja) | 2020-04-09 |
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