CN110320213A - A kind of wafer defect detection device and its detection method - Google Patents
A kind of wafer defect detection device and its detection method Download PDFInfo
- Publication number
- CN110320213A CN110320213A CN201910625938.5A CN201910625938A CN110320213A CN 110320213 A CN110320213 A CN 110320213A CN 201910625938 A CN201910625938 A CN 201910625938A CN 110320213 A CN110320213 A CN 110320213A
- Authority
- CN
- China
- Prior art keywords
- wafer
- ontology
- seal box
- turntable
- wafer ontology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 51
- 230000007547 defect Effects 0.000 title claims abstract description 28
- 239000000428 dust Substances 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 13
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 238000002955 isolation Methods 0.000 abstract description 4
- 238000005286 illumination Methods 0.000 abstract description 3
- 230000002452 interceptive effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 235000010894 Artemisia argyi Nutrition 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 235000005324 Typha latifolia Nutrition 0.000 description 1
- 244000030166 artemisia Species 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 244000118869 coast club rush Species 0.000 description 1
- 230000005662 electromechanics Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention belongs to wafer detection equipment technical fields, in particular a kind of wafer defect detection device, including seal box and wafer ontology, telescopic rod output shaft side surface is provided with driving motor, turntable is socketed on the output shaft of the telescopic rod, the wafer ontology is placed on the upper surface of turntable, the bottom surface of the auxiliary frame is fixed with X-ray measuring head, the bottom surface that the side of the X-ray measuring head is located at auxiliary frame, which is set, is provided with camera, and the inner surface that the two sides of the auxiliary frame are located at seal box is provided with light filling plate；X-ray measuring head carries out crack detection to the inside of wafer ontology, light filling plate and the second light compensating lamp give the illumination of different angle, it is exposed in shooting image convenient for dust, seal box, hermatic door, seal cover board carry out light isolation to equipment, it avoids extraneous light from interfering the shooting of camera, promotes the accuracy of data.
Description
Technical field
The invention belongs to wafer detection equipment technical fields, and in particular to a kind of wafer defect detection device and its detection side
Method.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC products for having specific electrical functionality.It is brilliant
Circle needs to carry out defects detection to it using detection device after completing the process, to choose underproof wafer, current
Using progressive scan detection in detection device use process, a wafer needs to take a substantial amount of time when detecting to be swept
It retouches, production efficiency of equipment is slower, besides will receive ambient variation interference when current detection device shooting wafer, causes to examine
It is undesirable to survey effect, for the problem exposed in current detection device use process, it is necessary to tie to detection device
Optimization and improvement on structure.
Summary of the invention
To solve the above-mentioned problems in the prior art, the present invention provides a kind of wafer defect detection device and its inspections
Survey method has the characteristics that the detection efficiency of effective lifting means, promotes detection effect.
To achieve the above object, the invention provides the following technical scheme: a kind of wafer defect detection device, including seal box
With wafer ontology, the seal box inner bay is equipped with transmission belt, and the both ends of the transmission belt reach close through the side wall of seal box
The outside of joint sealing, the both side surface of the seal box have been bolted seal cover board, and the inner bottom surface of the seal box passes through
Bolt is fixed with telescopic rod, and telescopic rod output shaft side surface is provided with driving motor, covers on the output shaft of the telescopic rod
It is connected to turntable, the wafer ontology is placed on the upper surface of turntable, and the top of the wafer ontology is located at the interior ledge of seal box
Equipped with auxiliary frame, the bottom surface of the auxiliary frame is fixed with X-ray measuring head, and the side of the X-ray measuring head is located at the bottom of auxiliary frame
Face, which is set, is provided with camera, and the inner surface that the two sides of the auxiliary frame are located at seal box is provided with light filling plate.
As a kind of wafer defect detection device optimal technical scheme of the invention, the seal cover board is hollow unit,
Seal cover board is spliced to form by two U-shaped components are mutually chimeric.
As a kind of wafer defect detection device optimal technical scheme of the invention, the seal box is hollow cuboid
One side surface of component, the seal box is fixed with hermatic door by shaft.
As a kind of wafer defect detection device optimal technical scheme of the invention, the lower end side surface of the turntable is opened up
There is gear tooth, toothed disc is socketed on the output shaft of the driving motor, the driving motor is protected by toothed disc and turntable
Hold engagement connection.
As a kind of wafer defect detection device optimal technical scheme of the invention, the auxiliary frame is cuboid component,
The camera is uniformly erected at the lower end of auxiliary frame, and the bottom surface that auxiliary frame is located between two cameras is provided with the
Two light compensating lamps.
As a kind of wafer defect detection device optimal technical scheme of the invention, the light filling plate is described equipped with two
Light filling plate is fixed on the inner wall of seal box at an oblique angle, and two light filling plates are with auxiliary frame for symmetrical axial symmetry.
As a kind of wafer defect detection device optimal technical scheme of the invention, the transmission belt is equipped with two, two
The transmission belt is symmetrically erected at the two sides of telescopic rod.
The present invention also provides following technical solutions: a kind of wafer defect detection method, including step 1: wafer ontology is placed
Surface on the belt conveys wafer ontology in transmission belt operational process, so that the center of circle of wafer ontology and turntable
The center of circle is kept on the same line；
Step 2: telescopic rod runs and extends so that the lifting of its telescopic end is stretched so that wafer ontology is separated with transmission belt
It drives turntable to rotate by the rotation of output shaft when bar is run, drives wafer ontology to revolve with identical angular speed when turntable rotates
Turn；
Step 3: when wafer ontology rotates first lap, camera and the second light compensating lamp are run, and the second light compensating lamp is to wafer sheet
Body carries out vertical polishing, and camera shoots wafer ontology, and by the image transmitting of shooting to computer-internal, passes through meter
Image is compared in calculation machine, to determine the upper surface of wafer ontology with the presence or absence of scuffing, dust；
Step 4: when wafer ontology the second circle of rotation, camera and the operation of light filling plate, light filling plate to wafer ontology into
The inclination light filling in one direction of row, camera shoot wafer ontology, and by the image transmitting of shooting to computer-internal,
Image is compared by computer, to determine the upper surface of wafer ontology with the presence or absence of scuffing, dust；
Step 5: when wafer ontology rotates third circle, camera and another light filling plate are run, and light filling plate is to wafer ontology
The inclination light filling in another direction is carried out, camera shoots wafer ontology, and by the image transmitting of shooting to computer
Inside is compared image by computer, to determine the upper surface of wafer ontology with the presence or absence of scuffing, dust；
Step 6: when wafer ontology starts turning, X-ray measuring head begins to run, and always to the wafer sheet in rotation
Body is scanned, and determines whether the inside of wafer ontology is cracked；
Step 7: driving motor is out of service after detection device detection finishes, and turntable is stalled, telescopic rod operation
And shrink, so that the bottom surface of wafer ontology and the upper surface of transmission belt are kept in contact, telescopic rod continues to run and to turn at this time
Disk is separated with wafer ontology；
Step 8: transmission belt, which runs and will test the wafer ontology of completion, is transported out seal box, in drive belt slip process
In another wafer ontology to be detected be transported to the top of turntable, and make wafer ontology the center of circle and turntable the center of circle protect
It holds point-blank；Equipment recycles above-mentioned step and carries out defects detection to next wafer ontology.
Compared with prior art, the beneficial effects of the present invention are: the inside of seal box has additional telescopic rod and driving motor,
Telescopic rod can hold up wafer ontology, and turntable rotation is driven when driving motor operation, so that wafer ontology rotates, it is brilliant
Circle ontology carries out defects detection during rotation, and X-ray measuring head carries out crack detection to the inside of wafer ontology, light filling plate with
Second light compensating lamp gives the illumination of different angle, is exposed in shooting image convenient for dust, seal box, hermatic door, seal cover board
Light isolation is carried out to equipment, avoids extraneous light from interfering the shooting of camera, promotes the accuracy of data.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the schematic diagram of internal structure in the present invention；
Fig. 3 is the line A-A structural schematic diagram along Fig. 2 in the present invention；
In figure: 1, seal box；2, hermatic door；3, seal cover board；4, transmission belt；5, wafer ontology；6, auxiliary frame；7, X-ray
Measuring head；8, camera；9, light filling plate；10, telescopic rod；11, driving motor；12, turntable；13, the second light compensating lamp.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment
Please refer to Fig. 1-3, the present invention the following technical schemes are provided: a kind of wafer defect detection device, including seal box 1 with
Wafer ontology 5,1 inner bay of seal box are equipped with transmission belt 4, and the both ends of transmission belt 4 reach seal box 1 through the side wall of seal box 1
Outside, the both side surface of seal box 1 has been bolted seal cover board 3, and the inner bottom surface of seal box 1 has been bolted
Telescopic rod 10,10 output shaft side surface of telescopic rod are provided with driving motor 11, turntable 12 are socketed on the output shaft of telescopic rod 10,
Wafer ontology 5 is placed on the upper surface of turntable 12, and the inner wall that the top of wafer ontology 5 is located at seal box 1 is provided with auxiliary frame 6,
The bottom surface of auxiliary frame 6 is fixed with X-ray measuring head 7, and the bottom surface that the side of X-ray measuring head 7 is located at auxiliary frame 6, which is set, is provided with camera
8, the camera 8 in the present embodiment is ultra high-definition camera, can shoot the dust on wafer ontology 5, scratch trace, auxiliary frame
The inner surface that 6 two sides are located at seal box 1 is provided with light filling plate 9, and in the present embodiment, X-ray measuring head 7 is for detecting wafer sheet
Crackle situation inside body 5, X-ray measuring head 7 is evenly distributed in the bottom surface of auxiliary frame 6, and comprehensive inspection is carried out to wafer ontology 5
It surveys.
Specifically, seal cover board 3 is hollow unit, seal cover board 3 is spliced to form by two U-shaped components are mutually chimeric, this
In embodiment seal cover board 3 also to seal box 1 carry out light isolation, avoid ambient from the both-side opening of seal box 1 to
Up to box house, the shooting to camera 8 is avoided to interfere.
Specifically, seal box 1 is hollow cuboid component, a side surface of seal box 1 is fixed with sealing by shaft
Door 2, hermatic door 2 is all made of lighttight material with seal box 1 and is made in the present embodiment, and hermatic door 2 is for seal box 1
Light isolation is carried out, extraneous light is avoided to interfere detection device.
Specifically, the lower end side surface of turntable 12 offers gear tooth, it is socketed on the output shaft of driving motor 11 with teeth
Wheel disc, driving motor 11 engage connection, the present embodiment middle gear disk rotation process turntable with the holding of turntable 12 by toothed disc
12 keep identical linear velocity with it, so that turntable 12 can also rotate and wafer ontology 5 is driven to rotate.
Specifically, auxiliary frame 6 is cuboid component, camera 8 is uniformly erected at the lower end of auxiliary frame 6, two camera shootings
It is provided with the second light compensating lamp 13 positioned at the bottom surface of auxiliary frame 6 between first 8, the second light compensating lamp 13 is in a perpendicular direction in the present embodiment
It is irradiated light filling to wafer ontology 5, so that dust is easily identified.
Specifically, light filling plate 9 is equipped with two, light filling plate 9 is fixed on the inner wall of seal box 1, two benefits at an oblique angle
Tabula rasa 9 is with auxiliary frame 6 for symmetrical axial symmetry, and light filling plate 9 is irradiated benefit to wafer ontology 5 in different directions in the present embodiment
Light, so that the dust when being taken of wafer ontology 5 is more easily identified out, the detection effect of lifting means.
Specifically, transmission belt 4 is equipped with two, two transmission belts 4 are symmetrically erected at the two sides of telescopic rod 10, the present embodiment
In, a kind of wafer defect detection method, including
Step 1: wafer ontology 5 is placed on 4 upper surface of transmission belt, carries out in 4 operational process of transmission belt to wafer ontology 5
Conveying, so that the center of circle of wafer ontology 5 and the center of circle of turntable 12 are kept on the same line；
Step 2: telescopic rod 10 runs and extends so that its telescopic end is lifted, so that wafer ontology 5 is separated with transmission belt 4,
Telescopic rod 10 drives turntable 12 to rotate by the rotation of output shaft when running, drive wafer ontology 5 with phase when turntable 12 rotates
Same angular speed rotation；
Step 3: when wafer ontology 5 rotates first lap, camera 8 and the second light compensating lamp 13 are run, and the second light compensating lamp 13 is right
Wafer ontology 5 carries out vertical polishing, and camera 8 shoots wafer ontology 5, and will be in the image transmitting to computer of shooting
Portion is compared image by computer, to determine the upper surface of wafer ontology 5 with the presence or absence of scuffing, dust；
Step 4: when the second circle of rotation of wafer ontology 5, camera 8 and a light filling plate 9 are run, and light filling plate 9 is to wafer sheet
Body 5 carries out the inclination light filling in a direction, and camera 8 shoots wafer ontology 5, and by the image transmitting of shooting to calculating
Inside machine, image is compared by computer, to determine the upper surface of wafer ontology 5 with the presence or absence of scuffing, dust；
Step 5: when wafer ontology 5 rotates third circle, camera 8 and another light filling plate 9 are run, and light filling plate 9 is to wafer
Ontology 5 carries out the inclination light filling in another direction, and camera 8 shoots wafer ontology 5, and the image transmitting of shooting is arrived
Computer-internal is compared image by computer, to determine the upper surface of wafer ontology 5 with the presence or absence of scuffing, dust；
Step 6: when wafer ontology 5 starts turning, X-ray measuring head 7 begins to run, and always to the wafer in rotation
Ontology 5 is scanned, and determines whether the inside of wafer ontology 5 is cracked；
Step 7: driving motor 11 is out of service after detection device detection finishes, and turntable 12 is stalled, telescopic rod
10 run and shrink, so that the bottom surface of wafer ontology 5 and the upper surface of transmission belt 4 are kept in contact, telescopic rod 10 is after reforwarding at this time
It goes and turntable 12 is separated with wafer ontology 5；
Step 8: transmission belt 4, which runs and will test the wafer ontology 5 of completion, is transported out seal box 1, slides in transmission belt 4
Another wafer ontology 5 to be detected is transported to the top of turntable 12 in the process, and makes the center of circle and the turntable of wafer ontology 5
12 center of circle is kept point-blank；Equipment recycles above-mentioned step and carries out defects detection to next wafer ontology 5.
Light filling plate 9 is the known technology for being widely used in daily life having disclosed in the present embodiment, and light filling plate 9 uses
The white light filling plate of the model UltraColor Z400S of Fuzhou F & V Photographic Equipment Co., Ltd.'s production；Second light compensating lamp
The white light lamp bead of the 13 model 20-24LM produced using Dongguan City with bright illumination Industrial Co., Ltd.；During telescopic rod 10 uses
The electric expansion loop bar of the model JINGE-1604 of brocade lattice hardware electromechanics Co., Ltd, mountain city production；Driving motor 11 is using east
The servo motor motor at a slow speed of the model SST43D2120 of macro Chinese mugwort transmission Science and Technology Ltd., tabernaemontanus bulrush city production.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (8)
1. a kind of wafer defect detection device, including seal box (1) and wafer ontology (5), it is characterised in that: the seal box
(1) inner bay is equipped with transmission belt (4), and side wall of the both ends of the transmission belt (4) through seal box (1) reaches seal box (1)
The both side surface of outside, the seal box (1) has been bolted seal cover board (3), and the inner bottom surface of the seal box (1) is logical
It crosses bolt to be fixed with telescopic rod (10), telescopic rod (10) the output shaft side surface is provided with driving motor (11), described flexible
It is socketed on the output shaft of bar (10) turntable (12), the wafer ontology (5) is placed on the upper surface of turntable (12), the wafer
The inner wall that the top of ontology (5) is located at seal box (1) is provided with auxiliary frame (6), and the bottom surface of the auxiliary frame (6) is fixed with X-ray
Measuring head (7), the bottom surface that the side of the X-ray measuring head (7) is located at auxiliary frame (6), which is set, is provided with camera (8), the auxiliary
The inner surface that the two sides of frame (6) are located at seal box (1) is provided with light filling plate (9).
2. a kind of wafer defect detection device according to claim 1, it is characterised in that: the seal cover board (3) is sky
Heart component, seal cover board (3) are spliced to form by two U-shaped components are mutually chimeric.
3. a kind of wafer defect detection device according to claim 1, it is characterised in that: the seal box (1) is hollow
Cuboid component, a side surface of the seal box (1) is fixed with hermatic door (2) by shaft.
4. a kind of wafer defect detection device according to claim 1, it is characterised in that: the lower end side of the turntable (12)
Surface offers gear tooth, and toothed disc is socketed on the output shaft of the driving motor (11), and the driving motor (11) is logical
Toothed disc is crossed to keep engaging connection with turntable (12).
5. a kind of wafer defect detection device according to claim 1, it is characterised in that: the auxiliary frame (6) is rectangular
Body component, the camera (8) are uniformly erected at the lower end of auxiliary frame (6), are located at auxiliary between two cameras (8)
The bottom surface of frame (6) is provided with the second light compensating lamp (13).
6. a kind of wafer defect detection device according to claim 1, it is characterised in that: the light filling plate (9) is equipped with two
Item, the light filling plate (9) are fixed on the inner wall of seal box (1) at an oblique angle, and two light filling plates (9) are with auxiliary frame
It (6) is symmetrical axial symmetry.
7. a kind of wafer defect detection device according to claim 1, it is characterised in that: the transmission belt (4) is equipped with two
Item, two transmission belts (4) are symmetrically erected at the two sides of telescopic rod (10).
8. a kind of wafer defect detection method, it is characterised in that: including step 1: wafer ontology (5) is placed on transmission belt (4)
Surface conveys wafer ontology (5) in transmission belt (4) operational process, so that the center of circle of wafer ontology (5) and turntable (12)
The center of circle keep on the same line；
Step 2: telescopic rod (10) runs and extends so that its telescopic end is lifted, so that wafer ontology (5) and transmission belt (4) point
From telescopic rod (10) drives turntable (12) to rotate by the rotation of output shaft when running, turntable (12) drives wafer when rotating
Ontology (5) is with the rotation of identical angular speed；
Step 3: when wafer ontology (5) rotates first lap, camera (8) and the second light compensating lamp (13) are run, the second light compensating lamp
(13) vertical polishing is carried out to wafer ontology (5), camera (8) shoots wafer ontology (5), and the image of shooting is passed
It is defeated to arrive computer-internal, image is compared by computer, is drawn with determining that the upper surface of wafer ontology (5) whether there is
Wound, dust；
Step 4: when wafer ontology (5) the second circle of rotation, camera (8) is run with a light filling plate (9), and light filling plate (9) is to crystalline substance
Circle ontology (5) carries out the inclination light filling in a direction, and camera (8) shoots wafer ontology (5), and by the image of shooting
It is transferred to computer-internal, image is compared by computer, is drawn with determining that the upper surface of wafer ontology (5) whether there is
Wound, dust；
Step 5: when wafer ontology (5) rotates third circle, camera (8) and another light filling plate (9) are run, and light filling plate (9) is right
Wafer ontology (5) carries out the inclination light filling in another direction, and camera (8) shoots wafer ontology (5), and by shooting
Image transmitting is compared image to computer-internal, by computer, to determine whether the upper surface of wafer ontology (5) deposits
In scuffing, dust；
Step 6: when wafer ontology (5) starts turning, X-ray measuring head (7) begins to run, and persistently to the wafer in rotation
Ontology (5) is scanned, and whether the inside to determine wafer ontology (5) is cracked；
Step 7: driving motor (11) is out of service after detection device detection finishes, and turntable (12) are stalled, telescopic rod
(10) it runs and shrinks, so that the bottom surface of wafer ontology (5) and the upper surface of transmission belt (4) are kept in contact, telescopic rod at this time
(10) it continues to run and turntable (12) is separated with wafer ontology (5)；
Step 8: transmission belt (4), which runs and will test the wafer ontology (5) of completion, is transported out seal box (1), in transmission belt (4)
The wafer ontology (5) to be detected of another in sliding process is transported to the top of turntable (12), and makes wafer ontology (5)
The center of circle of the center of circle and turntable (12) is kept point-blank；Equipment recycle above-mentioned step to next wafer ontology (5) into
Row defects detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910625938.5A CN110320213A (en) | 2019-07-11 | 2019-07-11 | A kind of wafer defect detection device and its detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910625938.5A CN110320213A (en) | 2019-07-11 | 2019-07-11 | A kind of wafer defect detection device and its detection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110320213A true CN110320213A (en) | 2019-10-11 |
Family
ID=68121929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910625938.5A Pending CN110320213A (en) | 2019-07-11 | 2019-07-11 | A kind of wafer defect detection device and its detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110320213A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110579486A (en) * | 2019-10-18 | 2019-12-17 | 东莞市庆颖智能自动化科技有限公司 | equipment and method for detecting internal flaw image of semiconductor silicon crystal column |
| CN111007080A (en) * | 2019-12-25 | 2020-04-14 | 成都先进功率半导体股份有限公司 | Wafer crack inspection device |
| CN112730252A (en) * | 2020-12-30 | 2021-04-30 | 湖南三安半导体有限责任公司 | Wafer detection device |
| CN113035750A (en) * | 2021-03-02 | 2021-06-25 | 深圳鹏瑞智能科技有限公司 | Wafer flaw measuring device capable of automatically feeding and discharging and using method thereof |
| CN116242780A (en) * | 2023-05-11 | 2023-06-09 | 山东工业职业学院 | Computer chip detection equipment and method based on image recognition |
| CN116430087A (en) * | 2023-06-12 | 2023-07-14 | 南京银茂微电子制造有限公司 | Fixing mechanism for chip wafer test bench |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62119446A (en) * | 1985-11-20 | 1987-05-30 | Ratotsuku Syst Eng Kk | Method and apparatus for inspecting defect in crystal |
| KR19990080388A (en) * | 1998-04-16 | 1999-11-05 | 김영환 | Wafer transfer method of semiconductor exposure equipment |
| KR20030000440A (en) * | 2001-06-25 | 2003-01-06 | 에이티아이 주식회사 | Form defect inspection device of pcb for ic using 2 boat |
| KR100989561B1 (en) * | 2010-06-10 | 2010-10-25 | 주식회사 창성에이스산업 | Led and wafer inspection apparatus and inspection method of the same |
| CN102023168A (en) * | 2010-11-08 | 2011-04-20 | 北京大学深圳研究生院 | Method and system for detecting chips on semiconductor wafer surface |
| KR20130021877A (en) * | 2011-08-24 | 2013-03-06 | 한미반도체 주식회사 | Wafer inspection device |
| CN207540992U (en) * | 2017-12-19 | 2018-06-26 | 昆山成功环保科技有限公司 | A kind of wafer surface defects detection device |
| CN210376165U (en) * | 2019-07-11 | 2020-04-21 | 江苏斯米克电子科技有限公司 | Wafer defect detection device |
-
2019
- 2019-07-11 CN CN201910625938.5A patent/CN110320213A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62119446A (en) * | 1985-11-20 | 1987-05-30 | Ratotsuku Syst Eng Kk | Method and apparatus for inspecting defect in crystal |
| KR19990080388A (en) * | 1998-04-16 | 1999-11-05 | 김영환 | Wafer transfer method of semiconductor exposure equipment |
| KR20030000440A (en) * | 2001-06-25 | 2003-01-06 | 에이티아이 주식회사 | Form defect inspection device of pcb for ic using 2 boat |
| KR100989561B1 (en) * | 2010-06-10 | 2010-10-25 | 주식회사 창성에이스산업 | Led and wafer inspection apparatus and inspection method of the same |
| CN102023168A (en) * | 2010-11-08 | 2011-04-20 | 北京大学深圳研究生院 | Method and system for detecting chips on semiconductor wafer surface |
| KR20130021877A (en) * | 2011-08-24 | 2013-03-06 | 한미반도체 주식회사 | Wafer inspection device |
| CN207540992U (en) * | 2017-12-19 | 2018-06-26 | 昆山成功环保科技有限公司 | A kind of wafer surface defects detection device |
| CN210376165U (en) * | 2019-07-11 | 2020-04-21 | 江苏斯米克电子科技有限公司 | Wafer defect detection device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110579486A (en) * | 2019-10-18 | 2019-12-17 | 东莞市庆颖智能自动化科技有限公司 | equipment and method for detecting internal flaw image of semiconductor silicon crystal column |
| CN111007080A (en) * | 2019-12-25 | 2020-04-14 | 成都先进功率半导体股份有限公司 | Wafer crack inspection device |
| CN111007080B (en) * | 2019-12-25 | 2022-07-12 | 成都先进功率半导体股份有限公司 | Wafer crack inspection device |
| CN112730252A (en) * | 2020-12-30 | 2021-04-30 | 湖南三安半导体有限责任公司 | Wafer detection device |
| CN113035750A (en) * | 2021-03-02 | 2021-06-25 | 深圳鹏瑞智能科技有限公司 | Wafer flaw measuring device capable of automatically feeding and discharging and using method thereof |
| CN113035750B (en) * | 2021-03-02 | 2024-03-22 | 深圳鹏瑞智能科技股份有限公司 | Automatic loading and unloading wafer flaw measurement device and use method thereof |
| CN116242780A (en) * | 2023-05-11 | 2023-06-09 | 山东工业职业学院 | Computer chip detection equipment and method based on image recognition |
| CN116430087A (en) * | 2023-06-12 | 2023-07-14 | 南京银茂微电子制造有限公司 | Fixing mechanism for chip wafer test bench |
| CN116430087B (en) * | 2023-06-12 | 2023-09-01 | 南京银茂微电子制造有限公司 | Fixing mechanism for chip wafer test bench |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110320213A (en) | A kind of wafer defect detection device and its detection method | |
| KR101613135B1 (en) | Device and method for detecting position of semiconductor substrate | |
| CN104460060B (en) | Liquid crystal display die set optical detection apparatus and method | |
| CN105424717B (en) | Optical detection device for detecting multiple defects | |
| CN104597634B (en) | Optical detection machine | |
| US20120038780A1 (en) | Apparatus and method for inspecting display device | |
| TWI393878B (en) | Panel inspection device and inspection method of panel | |
| KR101716817B1 (en) | Image creation method, substrate inspection method, storage medium for storing program for executing image creation method and substrate inspection method, and substrate inspection apparatus | |
| CN102565080A (en) | Vision detection device and system | |
| CN215466247U (en) | Battery appearance detection equipment | |
| CN104635427B (en) | Mask apparatus for shaping and mask shaping methods for lithographic equipment | |
| US20110128371A1 (en) | Device and method for inspecting semiconductor wafers | |
| CN110044926A (en) | A kind of lens defect detection device | |
| KR20110077681A (en) | Apparatus and method for checking transferred thin film using vacuum suction conveyer belt | |
| CN108426893B (en) | Abnormity detection method for transparent liquid container | |
| CN206363037U (en) | Nonopaque type negative pressure plummer | |
| CN210376165U (en) | Wafer defect detection device | |
| CN211959944U (en) | Flexible FPC circuit vision automatic feeding device | |
| CN116008303A (en) | Large-size wafer appearance defect detection equipment | |
| JP5347452B2 (en) | Surface inspection machine | |
| CN206363036U (en) | Liquid crystal display appearance images harvester and general detection device | |
| KR100902709B1 (en) | Apparatus for detecting defect on the edge of glass panel in the moving direction | |
| CN203037586U (en) | Detection device | |
| KR101275863B1 (en) | Wafer inspection device | |
| KR102117652B1 (en) | Apparatus for testing of display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |