CN110300784A - 聚异丁烯基钝化粘合剂 - Google Patents
聚异丁烯基钝化粘合剂 Download PDFInfo
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- CN110300784A CN110300784A CN201880012158.7A CN201880012158A CN110300784A CN 110300784 A CN110300784 A CN 110300784A CN 201880012158 A CN201880012158 A CN 201880012158A CN 110300784 A CN110300784 A CN 110300784A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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Abstract
本发明为一种用于使电子设备中的金属导体钝化的粘合剂组合物,该粘合剂组合物包含至少一种具有约75,000或更低的重均分子量的低分子量聚异丁烯聚合物、至少一种具有约120,000或更高的重均分子量的高分子量聚异丁烯聚合物,和任选地至少一种增粘剂。聚异丁烯和任选的增粘剂中的每一者具有不超过1ppm的卤素离子含量。
Description
背景技术
当前很多类型的输入设备可用于在电子系统中执行操作,诸如按钮、按键、鼠标、触摸面板、触摸屏等等。尤其是触摸屏,由于其直观的吸引力和易于操作而变得越来越受欢迎。触摸屏可允许用户通过触摸触摸传感器面板来执行各种功能。为了制造这些设备,越来越多地利用银纳米线、金属网(金属可为Cu、Ag、卤化Ag)、氧化铟锡(ITO)替代物。非ITO基导电膜相对于ITO透明电极具有低电阻,这些ITO透明电极具有高电阻问题,在大型触摸传感器应用中尤其如此。
遗憾的是,即使具有更低的电阻和更便宜的制造成本,为人们所熟知的是,基于金属的材料易于被氧化剂,诸如氧气和水分电化学氧化。当在电流和高温/高湿度环境(即65℃和90%湿度)下时,银或铜迹线之间的氧化和电迁移将导致导电迹线中的连通性问题。实际上,迹线之间的金属迁移可引起所谓的枝晶生长和迹线之间的桥接,这最终使电路短路。相比之下,腐蚀能够破坏迹线,并且因此破坏穿过其中的电流。
有机发光二极管(OLED)由于其较低的功率消耗、较高的响应速度和优异的空间利用率而越来越多地用于显示器和光源中。OLED元件对水分或氧气非常敏感。有机发光材料一旦暴露于水分就容易失去其自发光,并且具有低功函数的高反应性阴极很容易被水分和氧气腐蚀。
发明内容
在一个实施方案中,本发明为一种用于使电子设备中的金属导体钝化的粘合剂组合物。该粘合剂组合物包含至少一种具有约75,000或更低的重均分子量的低分子量聚异丁烯聚合物、至少一种具有约120,000或更高的重均分子量的高分子量聚异丁烯聚合物,和任选地至少一种增粘剂。聚异丁烯和任选的增粘剂中的每一者具有不超过1ppm的卤素离子含量。
在另一个实施方案中,本发明为用于使电子设备组合物中的金属导体钝化的粘合剂组合物。该粘合剂组合物包含至少一种具有约75,000或更低的重均分子量的低分子量聚异丁烯聚合物、至少一种具有约120,000或更高的重均分子量的高分子量聚异丁烯聚合物、钝化剂,和任选地至少一种增粘剂
附图说明
图1为用于图案化ITO聚酯膜电阻变化测量的样品构造的顶视图。
图2a为在铜腐蚀测试之前的比较例1的图。
图2b为在65℃/90%RH下进行500小时的铜腐蚀测试后的比较例1的图。
图2c为在铜腐蚀测试之前的比较例2的图。
图2d为在65℃/90%RH下进行500小时的铜腐蚀测试后的比较例2的图。
图2e为在铜腐蚀测试之前的粘合剂实施例1的图。
图2f为在65℃/90%RH下进行500小时的铜腐蚀测试后的粘合剂实施例1的图。
图2g为在铜腐蚀测试之前的粘合剂实施例2的图。
图2h为在65℃/90%RH下进行500小时的铜腐蚀测试后的粘合剂实施例2的图。
这些附图不是按比例绘制的,并且仅用于为了进行示意性的说明。
具体实施方式
为了保护电子设备中的触摸传感器和OLED,描述了一种钝化粘合剂,该钝化粘合剂可直接整合到电子设备中,以保护传感器和显示器免受水分、温度、异物或化学渗透的影响。该粘合剂具有低水蒸气传输速率(WVTR)、低含水量、低介电常数(Dk)和紫外线(UV)阻隔特征。本文所述的钝化粘合剂可直接接触金属迹线而无需单独的钝化层,诸如无机氧化物或有机涂层。即使具有低WVTR和低含水量,粘合剂仍在耐久性测试期间保持其光学质量,即,该粘合剂保持高可见光透射率和低雾度。由于该粘合剂保持高可见光透射率和低雾度,因此其可有利地用于触摸传感器面板的可见区域中。尤其是那些在设备的环境暴露条件下为颜色中性且颜色稳定,并且可用作光学透明的粘合剂(OCA)的制剂。另外,本文所述的粘合剂提供良好的一致性,赋予腐蚀保护,并提供流动特性以覆盖传感器迹线、柔性印刷电路(FPC)和任何显示器覆盖油墨阶。
在一个实施方案中,粘合剂包含使用路易斯酸催化剂(诸如SnCl4、AlCl3、BF3、TiCl4)制备的聚合物,使用经典质子酸(磷酸、硫酸、三氟甲磺酸)制备的聚合物,以及使用碳正离子盐(三苯甲基和卓鎓阳离子)制备的聚合物,例如聚异丁烯、聚丁烯和丁基橡胶醚。
在一个实施方案中,粘合剂包含聚异丁烯(PIB)作为基体聚合物,其中PIB为一种或多种各自具有75,000和更低的重均分子量的PIB聚合物(在下文中称为“低分子量PIB聚合物”)的组合,以及一种或多种各自具有120,000和更高的重均分子量的PIB聚合物(在下文中称为“高分子量PIB聚合物”)的组合。此类重均分子量可通过针对聚苯乙烯标准物进行凝胶渗透色谱法确定。
适用于本文所述粘合剂材料的PIB聚合物通常为在主链或侧链中具有聚异丁烯骨架的聚合物。根本地,这种聚异丁烯聚合物可在路易斯酸催化剂(诸如氯化铝或三氟化硼)的存在下单独地聚合异丁烯或者聚合作为异丁烯与正丁烯、异戊二烯或丁二烯的组合来制备。适宜的聚异丁烯聚合物以商品名VISTANEX(Exxon化学公司)、HYCAR(Goodrich公司)、OPPANOL(BASF AG)和JSR BUTYL(日本丁基有限公司)可商购获得。这些聚异丁烯中的一些可商购获得,其中卤素离子水平低于分析检测限(所谓的B级,如Oppanol-B),而其它的则可具有更高的卤素含量。在某些情况下,可使用与不含卤素离子的增粘剂(例如二环戊二烯衍生的增粘剂)组合的B级聚合物而不为用于电子迹线的金属添加额外的稳定剂或钝化剂。它们的低含水量和低极性可向它们直接接触的金属提供足够的钝化。当使用具有较高卤素离子浓度的PIB级和/或添加剂时,可能需要钝化剂以在某些环境暴露条件下进一步使金属钝化。
在存在卤素离子(例如氯化物、溴离子、氟化物)的环境暴露下,金属(即铜、铝、银等)腐蚀可以显著的速率发生,腐蚀产物对化妆品(即铜脱色)和导电性具有负面影响。另外,本发明的聚合物可含有大于1ppm的卤素离子浓度,这可引起铜和其它金属的腐蚀,从而使得它对于直接接触金属迹线是关键要求的应用是不可取的。当卤素离子浓度处于腐蚀成为问题的水平下时,杂环化合物,尤其是基于氮的化合物诸如唑衍生物,是有效的抑制剂,或者也被称为钝化剂。此类化合物可通过它们的氮原子孤对电子与铜(和其它一些金属)配位,以形成具有高耐腐蚀性的复合物。这些复合物在铜表面上形成吸附的保护性膜,从而通过充当对侵蚀性离子诸如氯离子的屏障来提供腐蚀抑制。合适的腐蚀抑制剂的示例包括但不限于具有富电子官能团诸如氮、硫和氧以及共轭双键的化合物。此类化合物的示例包括苯并三唑、二唑、三嗪、硫醇、冠醚、肉桂酸酯、水杨醛(salicylidene)等。如果粘合剂组合物中存在痕量的酸性物质,并且这些酸性物质可被具有碱性氮的化合物中和,则此类具有碱性氮的化合物可以是特别有用的。
低分子量PIB聚合物具有75,000g/mol或更低的重均分子量。高分子量PIB聚合物具有120,000g/mol或更高的重均分子量。申请人已发现低分子量和高分子量PIB聚合物的组合是特别有利的,因为该组合提供了宽范围的所需特征。低分子量PIB通过降低配混的粘合剂混合物的熔体粘度而促进热熔融挤出过程中的加工。在溶剂加工中,低分子量有利于溶剂在干燥过程中更快地扩散,从而能够形成更厚的涂层。而且,低分子量PIB赋予粘合剂适形能力,这实现油墨阶覆盖,以及在不同表面上的适当润湿度,这些是粘合剂中的关键特征。高分子量赋予粘合剂体系内聚力,这改善了粘合力、剪切强度、拉伸强度、室温和高温尺寸稳定性。这些特性对于粘合剂是关键的,并且不同的应用可能需要宽范围的组合物以适应每种特定应用的特定特征。存在于粘合剂组合物中的低分子量PIB的量可在按重量计1-90%的范围内,并且存在于粘合剂中的高分子量PIB的量可在按重量计1-80%的范围内。可使用多于一种的低分子量PIB和多于一种的高分子量。
本文所公开的粘合剂组合物可任选地包含增粘剂。增粘剂的添加允许组合物具有更高的粘附性,这对于粘附到不同基底是关键要求的一些应用是有益的。增粘剂的添加增加了组合物的Tg(玻璃化转变温度),并且可将其储能模量降低至高于Tg,从而使其具有更低的弹性和更大的可流动性,诸如层压过程中符合油墨阶所需的条件。然而,增粘剂的相同添加可能使粘弹性平衡向粘性行为转变过多,诸如在需要最小蠕变并因此需要更小的可流动性的那些情况下。因此,增粘剂的添加是任选的,并且其存在和浓度取决于具体应用。
合适的增粘剂包括非氢化和氢化的脂族增粘剂,包括所谓的C5树脂和二环戊二烯基树脂。氢化树脂是优选的。基于聚异丁烯组分,使用的这些增粘剂通常在1和70重量份/100重量份之间。在一些实施方案中,基于聚异丁烯组分,使用的这些增粘剂通常在10和60重量份/100重量份之间。
其它合适的增粘剂包括有机树脂,诸如木基树脂诸如松香树脂,松香酚醛树脂和松香酯树脂;通过使这些松香基树脂氢化获得的氢化松香基树脂;基于萜烯的树脂,包括基于萜烯酚醛的树脂和基于芳族改性的萜烯的树脂;以及通过使这些基于萜烯的树脂氢化获得的氢化的基于萜烯的树脂;以及衍生自石油的树脂,诸如基于C9的石油树脂及其氢化变型(环脂族),或混合的合成树脂,诸如通过使石油树脂的C9级分和C5级分共聚获得的那些及其氢化变型。这些增粘剂的可混溶性和着色性较差,因此在可接受的雾度较小且浓度较低的情况下使用,因此粘合剂颜色是可接受的。
此外,也可使用液体流变改性剂,诸如增塑剂或油。例如矿物油(Kaydol)、环烷油(Calsol 5550)、石蜡(Hyprene P100N)等。使用增塑剂/油与增粘剂组合的有益效果是,除了降低组合物的储能模量之外,它还允许降低组合物的玻璃化转变温度。这赋予组合物更高的流动特征,这在需要适形于诸如油墨阶、柔性连接等的特征的应用中是有利的。在需要无缺陷层合覆盖油墨阶的应用中,已知具有较高蠕变柔量的粘合剂组合物提供更好的油墨阶覆盖。在一个实施方案中,大于1.5×104的蠕变柔量适用于商业油墨阶特征部上的最佳层合覆盖。
本文所公开的粘合剂组合物还可包含UV阻隔剂。UV阻隔包装件包括UV吸收剂或UV吸收剂和光稳定剂的组合。合适的UV吸收剂的示例包括但不限于二苯甲酮、苯并三唑、三嗪或它们的组合。光稳定剂的示例包括但不限于受阻胺光稳定剂(HALS)。本发明的粘合剂片材可具有中性色和低雾度,这是光学透明的粘合剂所需的。本发明的粘合剂片材具有清楚的UV截留,UV截留的示例包括但不限于在380nm波长下小于1.5%的透射率(%T)、在400nm波长下小于84%和在410nm波长下高于96%及以上,其可有效地阻隔UV光或甚至紫色光,但不会引起过多的黄色。
本文所公开的粘合剂组合物还可包含额外的添加剂,诸如主抗氧化剂和辅助抗氧化剂、工艺内稳定剂、光稳定剂、加工助剂和弹性体聚合物、纳米级填料、透明填料、吸气剂/清除剂填料、干燥剂、交联剂、颜料、增量剂、软化剂、树脂稳定剂。可单独地或者组合其中的两种或更多种来使用这些添加剂。
在某些实施方案中,如果粘合剂组合物中的任何组分(聚合物、增粘剂或任何前述添加剂)包含超过1ppm的卤素离子,则基于粘合剂组合物的总固体,通常以约0.1重量%至3重量%的浓度范围添加额外的添加剂,在下文中如上所述称为“钝化剂”。这使得粘合剂组合物对金属无腐蚀性。
在某些实施方案中,包含PIB的压敏粘合剂组合物为光学透明的。因此,某些制品可为层合物,这些层合物包括光学透明基底(例如,光学基底诸如光学膜)和与光学透明基底的至少一个主表面相邻的PIB压敏粘合剂组合物的光学透明粘合剂层。层合物还可包括永久性地或暂时地附接到压敏粘合剂层的第二基底,并且压敏粘合剂层位于光学透明基底和第二基底之间。
在一些示例性层合物中,其中光学透明的压敏粘合剂层(即,本文所述的基于PIB的压敏粘合剂组合物)位于两个基底之间,至少一个基底为光学膜、显示单元、触摸传感器或透镜。光学膜意在增强、调控、控制、维持、透射、反射、折射、吸收、延迟或以其它方式改变投射在光学膜表面上的光。包括在层合物中的光学膜包括具有光学功能的材料类别,诸如偏振器、干涉型偏振器、反射型偏振器、漫射器、有色光学膜、镜面、百叶式光学膜、光控制膜、透明片、增亮膜、抗炫光和抗反射膜等等。用于所提供的层合体的光学膜还可包括延迟板,诸如四分之一波长和半波长相位延迟光学元件。其它光学透明的膜可包括透光塑料(诸如聚酯、环烯烃共聚物、透光型聚酰亚胺、聚碳酸酯或聚甲基丙烯酸甲酯)、抗裂膜和电磁干扰滤波器。这些膜中的一些也可用作ITO(即,氧化铟锡)涂层或图案化的基底,诸如使用用于制造触摸传感器的那些。本发明的PIB粘合剂的低吸水性和WVTR提供稳定的低介电常数粘合剂,该粘合剂可非常有利地用于触摸传感器的应用中,既保护传感器和集成导体免受环境和腐蚀的影响,又最小化传感器的电子噪声通信。
在一些实施方案中,包括如本文所述的PIB压敏粘合剂的层合物可为光学元件或可用于制备光学元件。如本文所用,术语“光学元件”是指具有光学效应或光学应用的制品。光学元件可用于例如电子显示器(例如,液晶显示器(LCD)、有机发光显示器(OLED)、建筑应用、运输应用、投影应用、光电应用和图形应用。合适的光学元件包括但不限于窗用玻璃(例如,窗户和挡风玻璃)、屏幕或显示器、偏振光分束器,ITO涂覆的触摸传感器,诸如使用玻璃或透光塑料基底的那些,和反射器。
除了各种光学相关的应用和/或电子显示器组件应用之外,PIB压敏粘合剂组合物还可用于多种其它应用中。例如,可通过在背衬或剥离衬件上形成压敏粘合剂组合物层(例如,膜)来形成制品。如果使用剥离衬件,则可将层转移到另一个基底上。该另一个基底可为例如电子显示器组件的部件。即,可将该层层合至另一个基底上。通常将膜层合在第一基底和第二基底之间(即,压敏粘合剂层位于第一基底和第二基底之间)。
虽然使用示例进一步详细地解释了本发明,但它们不对本发明产生任何限制。
实施例
在以下仅意图用作例证的实施例中更具体地描述本发明,这是由于本发明范围内的许多修改和变型对于本领域技术人员而言将显而易见。除非另外指明,否则下述实例中提及的所有份数、百分比和比率均按重量计。
表1:材料
比较例-1:
将Oppanol N50/N80/Escorez 5300=25/50/25(质量份)用庚烷溶解以制备均匀的溶液。基于干燥聚合物和树脂质量分别以4.2、0.3、0.6和0.06质量%的比率,向该溶液添加Tinuvin 928、Tinuvin 477、Tinuvin 123和BHT。然后,将制得的溶液涂覆在50μm厚剥离膜RF22N上,并于70℃下在烘箱中干燥30分钟。在干燥之后PSA的厚度为25μm。随后,将该PSA表面与50μm厚剥离膜RF02N层合。样品具有60C/5min的蠕变柔量0.50×10-4。
比较例-2:
将Oppanol B15/N80/Escorez 5300=80/20/20(质量份)用庚烷溶解以制备均匀的溶液。基于干燥聚合物和树脂质量分别以4.2、0.3、0.6和0.06质量%的比率,向该溶液添加Tinuvin 928、Tinuvin 477、Tinuvin 123和BHT。然后,将制得的溶液涂覆在50μm厚剥离膜RF22N上,并于70℃下在烘箱中干燥30分钟。在干燥之后PSA的厚度为25μm。随后,将该PSA表面与50μm厚剥离膜RF02N层合。样品具有60C/5min的蠕变柔量1.84×10-4。
粘合剂实施例-1:
将Oppanol B50/B80/Escorez 5300=25/50/25(质量份)用庚烷溶解以制备均匀的溶液。基于干燥聚合物和树脂质量分别以4.2、0.3、0.6和0.06质量%的比率,向该溶液添加Tinuvin 928、Tinuvin 477、Tinuvin 123和BHT。然后,将制得的溶液涂覆在50μm厚剥离膜RF22N上,并于70℃下在烘箱中干燥30分钟。在干燥之后PSA的厚度为25μm。随后,将该PSA表面与50μm厚剥离膜RF02N层合。样品具有60C/5min的蠕变柔量0.50×10-4。
粘合剂实施例-2:
将Oppanol B15/N80/Escorez 5300=80/20/20(质量份)用庚烷溶解以制备均匀的溶液。基于干聚合物和树脂质量分别以4.2、0.3、0.6、0.06和0.04质量%的比率,向该溶液添加Tinuvin 928、Tinuvin 477、Tinuvin 123、BHT和4-氨基-5-苯基-4H-1,2,4-三唑-3-硫醇。然后,将制得的溶液涂覆在50μm厚剥离膜RF22N上,并于70℃下在烘箱中干燥30分钟。在干燥之后PSA的厚度为25μm。随后,将该PSA表面与50μm厚剥离膜RF02N层合。样品具有60C/5min的蠕变柔量1.84×10-4
铜腐蚀测试:
从2英寸×3英寸的粘合带上移除透明衬件,并将其与铜片的两侧直接接触。用小型橡胶手动辊四次经过转移带来固定,确保没有包埋气泡。从一侧移除第二衬件,并将粘合带层合到LCD玻璃上。然后移除另一侧的剥离衬件,并置于65oC/90%RH中500小时。在50X显微镜下检查并记录相对于顶侧铜片(非LCD侧)所看到的任何腐蚀。测试结果在图2a-2h中示出。
确定胶粘剂完整性的测试方法(蠕变柔量测试)
使用配备有Peltier板加热夹具的流变动态分析仪(型号DHR-3流变仪,可购自美国特拉华州纽卡斯尔的TA仪器公司(TA Instruments,New Castle,DE,USA))在60℃下评估样品的蠕变柔量(J)。通过将聚合物材料涂覆到硅树脂剥离衬件上并且在真空炉中在160℃下干燥来制备样品。然后将所得的聚合物膜在140℃下压制至大约1毫米(0.039英寸)的厚度。在环境条件下冷却至室温后,然后使用直径为8毫米(0.315英寸)的圆形口模冲压样品,并在移除剥离衬件后粘附到8毫米直径的上平行板上。将具有聚合物膜的板位于流变仪中的Peltier板上方并置于其上,暴露的聚合物样品表面接触Peltier板,并且压缩聚合物膜,直到样品的边缘与顶板的边缘一致。然后在0克+/-15克的标称轴向力下,在测试温度下平衡温度2分钟。两分钟后,停用轴向力控制器,以便在测试的剩余时间期间保持固定间隙。对样品施加8,000帕斯卡的应力300秒,并记录287秒时的蠕变柔量(J)。
ITO相容性测试
移除透明衬件,并且在2mil SH81聚酯(PET,得自SKC膜)和氧化铟锡(ITO)图案化PET之间层合粘合剂样品。然后将ITO图案化PET粘贴至玻璃上以用于支撑,并且每个测试带包含六个电路,如图1所示。使用EXTECH万用表380198测量每个电路的电阻(单位为kOhm),并将它们平均为初始电阻R0,无环境暴露。然后将样品置于65℃/90%RH环境舱中并在t小时环境暴露后测量Rt。电阻变化百分比相对于环境暴露时间的计算如下:%电阻变化=100*(Rt-R0)/R0,其中R0是没有环境暴露的初始电阻,Rt是t小时环境暴露后的电阻。测试结果汇总在表2中。
表2:热浸处理条件下的ITO相容性(65℃/90%RH)
油墨阶覆盖和耐久性测试
将粘合剂样品手工层合到10μm厚的油墨阶印刷玻璃上(即25微米粘合剂厚度的40%),然后在60℃和6kg/cm2的压力下高压消毒15分钟。与油墨阶重叠的粘合剂为约0.2至0.5mm。然后,从粘合剂移除第二剥离衬件,并且手工层合2mil SH 81PET,并使样品通过40PSI加压橡胶辊层合机。然后将样品在60℃和6kg/cm2压力的条件下再次高压消毒15分钟。然后将样品在环境舱中调理以进行耐久性测试。在特定时间间隔后,检查气泡或分层。结果汇总在表3中,其中“良好”意味着没有观察到气泡或分层。表中指示的“不好”意味着观察到气泡、分层或两者。
在需要无缺陷层合覆盖油墨阶的应用中,已知具有较高蠕变柔量的粘合剂组合物提供更好的油墨阶覆盖。在一个实施方案中,大于1.5×104的蠕变柔量适用于商业油墨阶特征部上的最佳层合覆盖。
表3:油墨阶覆盖层合和耐久性测试结果
介电常数(Dk)和介电常数稳定性的测量方法:
应准备原始样品以物理地装配到环境舱和电容测量装置中。在将样品置于热浸处理(HS)室中之前,应移除一个衬件。在HS暴露过程中,样品的厚度为150μm,并且暴露条件为65℃,相对湿度为90%。样品应在环境条件中浸泡指定时间,诸如0、72、168、336和504hr。浸泡时间后,应将样品从室中取出,并在室温和湿度条件下,即25℃和40-45%RH下静置24小时。在Dk测量之前,将两个150μm的片层合在一起。然后,应对样品进行介电常数测量。测量设备可被定位于标准的工作室条件下。根据ASTM D150使用宽带Novocontrol电介质光谱仪测量介电常数和电耗散因数(tanδ)。
Claims (12)
1.一种用于使电子设备中的金属导体钝化的粘合剂组合物,包含:
至少一种具有约75,000或更低的重均分子量的低分子量聚异丁烯聚合物;
至少一种具有约120,000或更高的重均分子量的高分子量聚异丁烯聚合物;以及
任选地,至少一种增粘剂,
其中所述聚异丁烯和任选的增粘剂中的每一者具有不超过1ppm的卤素离子含量。
2.一种用于使电子设备组合物中的金属导体钝化的粘合剂组合物,包含:
至少一种具有约75,000或更低的重均分子量的低分子量聚异丁烯聚合物;
至少一种具有约120,000或更高的重均分子量的高分子量聚异丁烯聚合物;
钝化剂;以及
任选地,至少一种增粘剂。
3.根据权利要求1或权利要求2所述的用于使电子设备钝化的粘合剂组合物,其中所述组合物具有大于1.5×10-4的60℃/5min的蠕变柔量。
4.根据权利要求2所述的粘合剂组合物,其中所述钝化剂以基于总固体计约0.1%至约3%的量存在。
5.根据前述权利要求中任一项所述的粘合剂组合物,其中存在所述增粘剂并且所述增粘剂为非氢化或氢化的脂族烃增粘剂。
6.根据权利要求5所述的用于使电子设备钝化的粘合剂组合物,其中各组分的重量百分比为:1-90%低分子量聚异丁烯、1-80%高分子量聚异丁烯和1-60%增粘剂。
7.根据前述权利要求中任一项所述的粘合剂组合物,其中所述粘合剂的厚度为0.001-1mm。
8.根据前述权利要求中任一项所述的粘合剂组合物,其中所述组合物未交联。
9.根据前述权利要求中任一项所述的粘合剂组合物,其中所述组合物涂覆在基底上。
10.根据前述权利要求中任一项所述的粘合剂组合物,其中所述组合物位于两个基底之间。
11.根据权利要求9或10所述的粘合剂组合物,其中所述基底中的一个或多个为剥离衬件。
12.根据权利要求9或10所述的粘合剂组合物,其中所述基底中的一个或多个为光学膜、显示单元、触摸传感器或透镜。
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US20160017197A1 (en) * | 2013-03-27 | 2016-01-21 | Furukawa Electric Co., Ltd. | Element sealing resin composition for organic electronic device, element sealing resin sheet for organic electronic device, organic electroluminescence element, and image display |
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EP2727972B1 (en) * | 2011-06-28 | 2017-11-01 | Lintec Corporation | Adhesive composition and adhesive sheet |
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