CN110249418B - 基板收容容器 - Google Patents
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Abstract
一种基板收容容器(1),具备:容器本体(10),在一端具有开口部(11),在另一端具有与开口部(11)对向且可供基板(W)重叠收容的搭载部(12);以及盖体(20),用以堵塞开口部(11);盖体(20)具有:盖体部(21),用以堵塞开口部(11);以及在盖体部(21)的至少两个部位所具有的按压构件(22),朝向盖体部(21)的中心方向摆动,并且将收容重叠于容器本体(10)的基板(W)的外侧予以按压;容器本体(10)具有导槽(13),该导槽(13)使按压构件(22)的前端部(22a)从搭载部(12)的外侧朝向内侧移动且被导引至按压基板(W)的外侧的位置;导槽(13)形成为比搭载部(12)的表面还凹下。
Description
技术领域
本发明涉及一种基板收容容器。
背景技术
作为收容基板的基板收容容器,例如有专利文献1所揭示的收容半导体晶圆(wafer)的容器。
专利文献1所揭示的基板收容容器,在容器本体上具备筒状的基板收容部。在基板收容部的最上层和最下层设置有缓冲材料(cushion material)等。使晶圆(基板)和层间纸(合成树脂制薄片(sheet)或无尘纸或合成树脂制成形品等)交替地夹设并收容于上下的缓冲材料之间,且将盖体予以盖上。
[现有技术文献]
[专利文献]
专利文献1:日本特开平09-129719号公报。
发明内容
[发明所要解决的问题]
在专利文献1的基板收容容器中,为了收容晶圆,而有必要对应于晶圆的外径事先加大基板收容部的内径。因此,由于基板收容部与晶圆的间隙,晶圆会因输送中的震动、冲击等而于水平方向移动。
由于此种晶圆的水平方向的移动,会有与晶圆直接接触的层间纸等的摩擦、因伤痕或裂痕等所引起的破损、扬尘、因化学成分而带给晶圆的污染等的问题。
本发明有鉴于此种现有技术的问题点而开发完成,目的在于提供一种可以抑制所收容的基板的移动的基板收容容器。
[解决问题的技术手段]
为了达成所述目的,本发明的基板收容容器,具备:容器本体,在一端具有开口部,在另一端具有与所述开口部对向且可供基板重叠收容的搭载部;以及盖体,用以堵塞所述开口部;所述盖体具有:盖体部,用以堵塞所述开口部;以及在所述盖体部的至少两个部位所具有的按压构件,朝向所述盖体部的中心方向摆动,并且将收容重叠于所述容器本体的所述基板的外侧予以按压;所述容器本体具有导槽(guide groove),所述导槽使所述按压构件的前端部从所述搭载部的外侧朝向内侧移动且被导引至按压所述基板的外侧的位置;所述导槽形成为比所述搭载部的表面还凹下。
所述容器本体优选是在所述搭载部隔开间隔地形成有将收容所述基板的收容部予以划分的固定侧壁部,且在所述固定侧壁部之间的所述搭载部形成有所述导槽;所述盖体在与所述固定侧壁部的间隔对应的位置的所述盖体部形成有所述按压构件。
所述按压构件优选是与所述盖体形成为一体,或是所述按压构件优选是沿着所摆动的摆动轴部而形成有促进摆动的槽部。
[发明的效果]
依据本发明的基板收容容器,可以抑制所收容的基板的移动。
附图说明
图1中的(a)为显示本发明的基板收容容器的一实施方式的容器本体的俯视图。图1中的(b)为图1中的(a)的A-A剖视图。
图2中的(a)为显示本发明的基板收容容器的一实施方式的卡止片,且为图1中的(a)的B箭视图。图2中的(b)为图1中的(a)的C-C剖视图。
图3中的(a)为显示本发明的基板收容容器的一实施方式的前视图。图3中的(b)为盖体的俯视图。
图4为本发明的基板收容容器的一实施方式的盖体的仰视图。
图5为本发明的基板收容容器的一实施方式的盖体与容器本体的一部分的图3中的(b)的D-D剖视图。
图6为本发明的基板收容容器的一实施方式的盖体的图3中的(b)的E-E剖视图。
图7为本发明的基板收容容器的一实施方式的按压构件的动作的说明图。
图8为本发明的基板收容容器的一实施方式的基板的收容步骤的说明图。
具体实施方式
以下,基于附图详细说明本发明的基板收容容器的一实施方式。
本发明的基板收容容器1具备:容器本体10,在一端具有开口部11,在另一端具有与开口部11对向且可供基板W重叠收容的搭载部12;以及盖体20,用以堵塞开口部11;盖体20具有:盖体部21,用以堵塞开口部11;以及在盖体部21的至少两个部位所具有的按压构件22,朝向盖体部21的中心方向摆动,并且将收容重叠于容器本体10的基板W的外侧予以按压;容器本体10具有导槽13,该导槽13使按压构件22的前端部22a从搭载部12的外侧朝向内侧移动且被导引至按压基板W的外侧的位置;导槽13形成为比搭载部12的表面还凹下。
藉此,当将盖体20盖上容器本体10时,按压构件22的前端部22a就会通过容器本体10的导槽13从外侧朝向内侧移动。此时,前端部22a通过在至少两个部位按压已被重叠的基板W的外侧来防止基板W的移动。
在本实施方式中,以容器本体10的开口部11朝向上方开口且在搭载部12上重叠收容呈水平的基板W的情况为例来加以说明。进而,在将基板W重叠收容于基板收容容器1且完成将盖体20予以盖上的收容作业后,无论基板W在任何的状态(无论基板W的方向是例如水平或垂直等)下皆可进行搬运等。
容器本体10具备成为底面板的搭载部12。如图1中的(a)所示,搭载部12形成为使正方形的四角隅带有切口的八角形状。搭载部12为分割设置于中央部上表面的平面,且包含可供基板W重叠收容的基板搭载部12a。进而,搭载部12也可形成为四角形状。
在搭载部12以朝向上方突出的方式形成有用以划分基板W的收容部S的固定侧壁部14。固定侧壁部14配合基板W的形状而形成为构成圆筒的一部分的多个(例如四个)圆弧状,并沿着圆周隔开间隔L所形成。固定侧壁部14与搭载部12形成为一体。藉此,固定侧壁部14的上端部就成为容器本体10的开口部11,而由固定侧壁部14所划分出的空间则成为基板W的收容部S。
固定侧壁部14的内径形成为不妨碍基板W的收容或取出的大小。固定侧壁部14的内径形成为比基板W的大小(直径)还大,例如形成为比5吋、6吋、8吋、12吋等的尺寸还大(例如,直径大1mm至2mm左右)。固定侧壁部14的间隔L形成为基板W的取出时的机械手臂(robotarm)的插入口。
如图2中的(b)所示,在容器本体10中,在固定侧壁部14的下端部外周形成有与盖体20进行密封的密封面15。在密封面15的外侧圆弧状地形成有朝向上方突出的突出片15a。如图1中的(b)所示,在固定侧壁部14之间的间隔L部分以从搭载部12朝向上方突出的方式形成有密封面16。密封面16与密封面15连续而成为环状。在密封面16的外侧省略了突出片15a。
藉此,当后面所述的盖体20被盖上时,就能通过盖体20的圆筒部23的内侧面接触密封面15、16来密封。通过用突出片15a来按压盖体的圆筒部23的外侧面,就能保持密封状态。
如图1及图2所示,容器本体10在位于搭载部12的四角隅的四个固定侧壁部14的外侧分别形成有卡止片17。卡止片17具备已设置于前端内侧的爪部17a。卡止片17与搭载部12朝向上方突出而形成为一体。通过将卡止片17的爪部17a卡止于盖体20就可以保持容器本体10与盖体20的连结状态。有关盖体20的详细内容将于后述。
如图1所示,容器本体10具备导槽13。导槽13形成于搭载部12的固定侧壁部14的间隔L的四个部位。导槽13以通过基端部22b使已设置于后面所述的盖体20的盖体部21的按压构件22摆动且使前端部22a从搭载部12的外侧朝向内侧(中心侧)移动的方式来导引。
导槽13与成为底面板的搭载部12的中心方向正交而形成为直线状。导槽13形成为比基板搭载部12a的表面还凹下。导槽13由容器本体10的外侧较高而中心侧较低的倾斜面13a、以及连续于倾斜面13a的中心侧的垂直面13b构成为大致V字状的剖面形状。
进而,如图1及图2所示,为了进行补强或其他步骤的装卸(handling)等,容器本体10依需要在搭载部12、固定侧壁部14等的构件上形成有凹凸部或肋条(rib)等。上面所述的容器本体10的各部也可全部形成为一体。
如图3至图5所示,盖体20以堵塞容器本体10的开口部11的方式盖上。盖体20具备盖体部21,盖体部21的外形与搭载部12同一形状且成为八角形状的顶面板。
盖体部21从八角形的端缘部突出而形成有外壁部24,且与容器本体10的搭载部12的表面周围的唇(lip)部接触。在盖体部21的外壁部24的内侧,从成为顶面部的盖体部21突出而形成有圆筒状的圆筒部23。圆筒部23与容器本体10的搭载部12的密封面15及密封面16接触而密封成为密封状态。
在为盖体部21的四角隅且也与容器本体10的卡止片17的配置成对应的四个部位形成有卡止孔25。在从容器本体10的搭载部12朝向上方突出的卡止片17的爪部17a越过卡止孔25后,爪部17a的下端水平面会被卡止。
如图6所示,卡止孔25形成于在盖体部21的上表面所形成的凹部21a。如图5所示,凹部21a具有使卡止片17插通卡止孔25后能够以不从盖体部21的表面突出的方式收容爪部17a的深度。可供爪部17a卡止的卡止孔25的卡止面25a会在使中央部凹下并解除卡止状态时容易回推卡止片17。
藉此,在将盖体20盖上容器本体10时,能通过使四个部位的容器本体10侧的卡止片17的爪部17a越过盖体20侧的卡止孔25而使爪部17a卡止于卡止面25a。
在该卡止状态下成为能通过容器本体10和盖体20使基板W的收容部S以密闭状态成为被密封的状态。
另一方面,卡止状态的解除是利用盖体20的卡止面25a的中央部的凹部。藉此,可以确实地将卡止片17从中心侧回推至外侧,且可以简单地进行。
盖体20在基板W的外侧部的至少两个部位(例如四个部位)具备按压构件22。
按压构件22形成为平板状。按压构件22从成为顶面部的盖体部21的内侧朝向下方突出,且配置于与盖体部21的中心方向正交的位置。按压构件22形成为能够以基端部22b的摆动轴部26作为中心来摆动,且通过与盖体20形成为一体,而使摆动轴部26成为铰链构造。
在此,按压构件22在摆动轴部26的外侧部分形成有槽部27。藉此,按压构件22的铰链构造部分就能通过形成于摆动轴部26的槽部27而成为薄壁。从而,容易进行以槽部27作为中心的按压构件22的摆动,并可以顺利地进行通过导槽13而致使的按压构件22的导引。
按压构件22的内侧面(基板W的中心侧的面)以成为与所重叠收容的基板W的外径一致的位置的方式设定有摆动轴部26的位置。按压构件22的突出长度设定为如下。按压构件22在将盖体20盖上容器本体10的情况下,于开始盖上的初期(参照图7中的(a)),使前端部(图示例中为下端部)22a位于容器本体10的导槽13内。之后,按压构件22能随着将盖体20予以盖上而由导槽13所导引。在完全将盖体20盖上容器本体10的终期(参照图7中的(b)),按压构件22的突出长度为已定,以便能导引至按压构件22的内侧面接触导槽13的垂直面13b的状态为止。
即,在将盖体20盖上容器本体10并予以密封卡止的状态下,按压构件22的前端部22a位于导槽13的槽前端,且成为因倾斜面13a而不会回到外侧的状态。
藉此,在将盖体20盖上容器本体10并予以密封卡止的状态下,四个部位的按压构件22能保持于与基板W的外径对应的位置。从而,可以用四个部位的按压构件22来按压已被重叠的基板W的外侧(外侧面),且可以确实地防止基板W的水平移动。
按压构件22位于从盖体部21至导槽13之间,该盖体部21成为盖体20的顶面部,该导槽13朝向成为容器本体10的底面部的搭载部12凹下。藉此,可以按压被堆叠于基板搭载部12a上的全部的基板W,且即便是最下层的基板W仍可以确实地按压。
又,按压构件22不存在于已将盖体20卸下的容器本体10内。从而,基板W对容器本体10的收容不受按压构件22妨碍而可以按照至今为止的方式来进行。
进而,如图3至图5所示,为了进行补强或其他步骤的装卸等,盖体20依需要而在盖体部21、圆筒部23、外壁部24等的构件形成有凹凸部或肋条等。又,上部按压部28一体地形成于盖体部21的顶面部,上部按压部28用以上下按压已收容于容器本体10的基板搭载部12a的基板W。与至今为止同样地,按压部28在与基板搭载部12a之间从上下按压已被重叠的基板W。上面所述的盖体20的各部也可全部形成为一体。
在基板收容容器1中,容器本体10及盖体20优选是由导电性塑胶所形成。作为导电性塑胶,可列举添加有导电性填料(filler)的塑胶或经聚合物合金(polymer alloy)处理过的塑胶等。作为导电性填料,可列举碳黑(carbon black)、石墨碳(graphite carbon)、石墨、碳纤维、金属粉末、金属纤维、金属氧化物的粉末、金属涂布后的无机质微粉末、有机质微粉末或纤维等。
如图8所示,在如此所构成的基板收容容器1中,在由容器本体10的四个固定侧壁部14所包围的基板搭载部12a上配置最下层的缓冲材料31,且在缓冲材料31上交替地重叠基板W和层间纸32,在最上层配置收容缓冲材料31。
在容器本体10重叠收容预定片数的基板W后,将盖体20予以盖上。
如图7中的(a)所示,当被盖上直至盖体20的圆筒部23的前端接触容器本体10的密封面16的状态为止时,盖体20的按压构件22的前端部22a就会位于容器本体10的导槽13。
进而,当将盖体20盖上容器本体10时,按压构件22的前端部22a就会由容器本体10的导槽13的倾斜面13a所导引并从外侧朝向中心侧移动。按压构件22以基端部22b的摆动轴部26作为中心来摆动。
然后,在盖体20完全盖上容器本体10的状态下,如图7中的(b)所示,按压构件22接触导槽13的中心侧的垂直面13b。此时,按压构件22的内侧面成为基板W的外径的位置。
藉此,能用四个部位的按压构件22来按压已被重叠的基板W的外侧(外侧面),且可以防止水平方向的移动。
又,已被重叠的基板W被容器本体10的基板搭载部12a的上表面和盖体20的盖体部21的上部按压部28所按压,且上下方向的移动也被按压。
进而,在将该盖体20完全盖上容器本体10的状态下,成为盖体20的圆筒部23已接触容器本体10的密封面15、16的密封状态。
又,在容器本体10的卡止片17的爪部17a越过盖体20的卡止孔25后,会卡止于卡止面25a,且保持盖体20与容器本体10的连结状态。
在如此地将基板W重叠收容于容器本体10且将盖体20予以盖上后,已收容于收容部S的基板W从上下方向及左右方向被按压。藉此,即便将基板收容容器1以任意的方向搬运,基板W仍不会移动,且可以防止与基板W直接接触的层间纸等摩擦、因伤痕或裂痕等所引起的破损、扬尘、因化学成分而带给晶圆的污染等的问题。
依据本发明的基板收容容器1,基板收容容器1具备:容器本体10,在一端具有开口部11,在另一端具有与开口部11对向且可供基板W重叠收容的搭载部12;以及盖体20,用以堵塞开口部11;盖体20具有:盖体部21,用以堵塞开口部11;以及在盖体部21的至少两个部位所具有的按压构件22,朝向盖体部21的中心方向摆动,并且将收容重叠于容器本体10的基板W的外侧予以按压;容器本体10具有导槽13,该导槽13使按压构件22的前端部22a从搭载部12的外侧朝向内侧移动且被导引至按压基板W的外侧的位置;导槽13形成为比搭载部12的表面还凹下;从而,可以用按压构件22从两侧按压以防止收容于容器本体10的基板W的移动。
又,由于是用使朝向搭载部12凹下的导槽13来导引按压构件22的前端部22a并予以按压,所以可以按压搭载部12上的全部的基板W的外侧(外侧面)。藉此,即便基板W的厚度较薄,仍可以确实地按压并防止移动。
又,依据本发明的基板收容容器1,容器本体10在搭载部12隔开间隔L地形成有将收容基板W的收容部S予以划分的固定侧壁部14,且在固定侧壁部14之间的搭载部12形成有导槽13;盖体20在与固定侧壁部14的间隔L对应的位置的盖体部21形成有按压构件22。因此,通过利用固定侧壁部14的间隔L设置导槽13和按压构件22,就能在于容器本体10收容或取出基板W时,完全不受导槽13或按压构件22的妨碍,而可以与至今为止同样地进行收容或取出。
现有的收容容器形成为可以在固定侧壁部内使可动侧壁绕垂直轴摆动的铰链构造,且将盖体予以盖上,藉此将可动侧壁朝向中心侧推出来按压基板。在此情况下,在可动侧壁与容器本体的搭载部的表面之间需要容许可动的间隙。因此,恐有可动侧壁以离开搭载部的表面达间隙量的方式往上方移动的情形,视基板的厚度而有无法按压最下层的基板W等的问题。
相对于此,在本发明的基板收容容器1中,由于按压构件22的前端部22a位于比搭载部12的表面还凹下的位置,所以不受基板W的厚度影响而可以按压全部的基板W。
又,在现有的可动侧壁中,在将基板收容于容器本体时可动侧壁并未回到原来的状态的情况下,恐有发生与收容的基板干涉之虞。
相对于此,在本发明的基板收容容器1中,由于按压构件22设置于盖体20,所以在进行基板W的收容时不会存在于容器本体10内,且完全不会发生与基板W的干涉,而可如同至今为止般地进行作业。
又,也可以利用固定侧壁部14的间隔L作为机械手臂的插入口,且利用于基板W的取出。
依据本发明的基板收容容器1,按压构件22与盖体20形成为一体。藉此,就不需要组装按压构件22或调整位置,且可以确实地按压被重叠收容的基板W。
依据本发明的基板收容容器1,按压构件22在摆动轴部26形成有促进摆动的槽部27。藉此,按压构件22的铰链构造部分会成为薄壁,且容易进行以槽部27作为中心的按压构件22的摆动,并可以顺利地进行通过导槽13而致使的按压构件22的导引。
在所述实施方式中,已说明以将按压构件22设置于四个部位的情况为例。除了所述情况以外,只要至少设置于对角位置的两个部位即可。进而,通过在三个部位以上设置按压构件22,就可以确实地按压基板W。
又,在所述实施方式中,假设在一个部位设置一个平板状的按压构件22。除了所述情况以外,也可以将一个部位的按压构件22作为分割构造而将多个平板状的按压构件22分别正交于中心来摆动。如此,就可以用各自被分割后的按压构件22来按压基板W。
进而,通过在按压构件22的表面将朝向基板W侧突出的突条设置于宽度方向两侧等,则不仅在按压构件22的中央部的突条,就连两侧的突条也可以按压基板W。或是,也可以使平板状的按压构件22的表面凹下并使两侧相对地突出,且用所突出的部分来按压基板W,且凹部也可形成一个或多个。或是,也可在与平板状的按压构件22的基板W接触的表面形成与基板W的外周形状大致同等的曲面,且利用该曲面来按压基板W。
本发明在未脱离本发明的广义的精神和范围内,能够进行各种的实施方式及变化。又,上面所述的实施方式是用以说明本发明,而非是限定本发明的范围。即,本发明的范围并非是由实施方式所界定,而是由权利要求所界定。而且,在权利要求的范围内以及与该权利要求的范围内同等的发明的意义的范围内所实施的各种变化,被视为本发明的范围内。
[产业可利用性]
本发明的基板收容容器优选地被使用作为例如收容半导体晶圆的基板收容容器。
图中:
1 基板收容容器
10 容器本体
11 开口部
12 搭载部
12a 基板搭载部
13 导槽
13a 倾斜面
13b 垂直面
14 固定侧壁部
15 密封面
15a 突出片
16 密封面
17 卡止片
17a 爪部
20 盖体
21 盖体部
21a 凹部
22 按压构件
22a 前端部
22b 基端部
23 圆筒部
24 外壁部
25 卡止孔
25a 卡止面
26 摆动轴部
27 槽部
28 上部按压部
31 缓冲材料
32 层间纸
L 间隔
S 收容部
W 基板
Claims (3)
1.一种基板收容容器,具备:容器本体,在一端具有开口部,在另一端具有与所述开口部对向且可供基板重叠收容的搭载部;以及盖体,用以堵塞所述开口部;
所述盖体具有:盖体部,用以堵塞所述开口部;以及在所述盖体部的至少两个部位所具有的按压构件,朝向所述盖体部的中心方向摆动,并且将收容重叠于所述容器本体的所述基板的外侧予以按压;
所述容器本体具有导槽,所述导槽使所述按压构件的前端部从所述搭载部的外侧朝向内侧移动且被导引至按压所述基板的外侧的位置;
所述导槽形成为比所述搭载部的表面还凹下;
所述容器本体在所述搭载部隔开间隔地形成有将收容所述基板的收容部予以划分的固定侧壁部,且在所述固定侧壁部之间的所述搭载部形成有所述导槽;
所述盖体在与所述固定侧壁部的间隔对应的位置的所述盖体部形成有所述按压构件。
2.如权利要求1所述的基板收容容器,其特征在于,所述按压构件与所述盖体形成为一体。
3.如权利要求1或2所述的基板收容容器,其特征在于,所述按压构件沿着所摆动的摆动轴部而形成有促进摆动的槽部。
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US (1) | US11538703B2 (zh) |
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2017
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Also Published As
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