CN110167278A - A kind of PCB thickness copper sheet circuit manufacturing method - Google Patents
A kind of PCB thickness copper sheet circuit manufacturing method Download PDFInfo
- Publication number
- CN110167278A CN110167278A CN201711224165.7A CN201711224165A CN110167278A CN 110167278 A CN110167278 A CN 110167278A CN 201711224165 A CN201711224165 A CN 201711224165A CN 110167278 A CN110167278 A CN 110167278A
- Authority
- CN
- China
- Prior art keywords
- copper
- substrate
- circuit manufacturing
- copper sheet
- photosensitive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of PCB thickness copper sheet circuit manufacturing methods, the specific steps are as follows: (1) in one layer of substrate copper of the electroplating surface of substrate medium layer, forms copper-clad plate, wherein the thickness of substrate copper is 12um or 18um；(2) high-molecular photosensitive film is bonded in the substrate layers of copper of substrate medium layer outer surface；(3) chemical attack is carried out to the copper-clad plate for posting high-molecular photosensitive film using chemistry is practical；(4) filled high polymer resin in the region that the copper-clad plate surface in step (3) is corroded；(5) plating electro-coppering is powered in the obtained smooth plate face with macromolecule resin of step (4), then repeatedly operation of the step (2) to step (4)；(6) operation for repeating step (5) according to demand, thus the thick copper circuit being superimposed.The present invention is electroplated using differential and is superimposed to form PCB thickness copper sheet route, to guarantee thick copper products circuit section even thickness；The environmental protections such as route oxidation can be realized；It transmits and stablizes conducive to product signal.
Description
Technical field
The present invention relates to circuit board print field, specifically a kind of PCB thickness copper sheet circuit manufacturing method.
Background technique
With the continuous development of electronic technology, the Functional Unit number of packages integrated on PCB is more and more, part high current class product
The requirement of current capacity and bearing capacity to route is higher and higher, and the copper thickness of such product is more and more thicker, and can mention
One of another trend of PCB development will necessarily be become for high current and the super-thick copper printed circuit board for integrating power supply；And copper is thick
Increase (6OZ-12OZ) to route make exist challenge.
The production method of existing PCB thickness copper sheet is using thick Copper base material, primary to lose after primary plating, straight forming route.
Route production has the problems such as etch copper residual and route cross section are prominent intermediate tiny up and down (such as Fig. 1, thick Copper base material copper 600
The surface of Yu Houtong dielectric layer 610, the cross section of thick Copper base material copper 600 are the uneven shape of section thickness of intermediate indent),
Line protection is not easy to realize.It is unfavorable for product realization to transmit with electric signal, route is unfavorable for product protection after having made.It needs out
New technology is sent out to realize that product circuit makes and meet the cross section copper of route uniformly and realizes that line protection is feasible.
Summary of the invention
The purpose of the present invention is to provide a kind of conductor layers by specific thicknesses to carry out differential into multiple flash platings, then leads to
The mode for crossing continuous electroplating superposition obtains PCB thickness copper sheet circuit manufacturing method, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme:
A kind of PCB thickness copper sheet circuit manufacturing method, the specific steps are as follows:
(1) in one layer of substrate copper of the electroplating surface of substrate medium layer, form copper-clad plate, wherein the thickness of substrate copper be 12um or
18um；
(2) be bonded high-molecular photosensitive film in the substrate layers of copper of substrate medium layer outer surface, the shape of high-molecular photosensitive film according to
The shape of actual track makes；
(3) chemical attack is carried out to the copper-clad plate for posting high-molecular photosensitive film using chemistry is practical, thus by high-molecular photosensitive film
Substrate copper corrosion outside pasted region falls；
(4) filled high polymer resin in the region that the copper-clad plate surface in step (3) is corroded, and after macromolecule resin filling
Plate face is smooth；
(5) plating electro-coppering is powered in the obtained smooth plate face with macromolecule resin of step (4), then repeatedly step (2)
To the operation of step (4)；
(6) operation for repeating step (5) according to demand, thus the thick copper circuit being superimposed.
As a further solution of the present invention: the high-molecular photosensitive film in the step (2) is Du Pont's dry film.
As a further solution of the present invention: in the step (4) be specifically by the macromolecule resin of liquid be poured by
The region of corrosion, and allow its Self-leveling, then solidified using macromolecule resin of the high temperature to liquid.
As a further solution of the present invention: step (4) macromolecule resin is thermosetting resin.
As a further solution of the present invention: the plating mode is that gantry is electroplated or VCP is electroplated.
As a further solution of the present invention: the high-molecular photosensitive film can be combined to substrate by the way of thermal transfer
On copper or electro-coppering.
Compared with prior art, the beneficial effects of the present invention are:
(1) present invention is electroplated using differential and is superimposed to form PCB thickness copper sheet route, to guarantee thick copper products circuit section thickness
Uniformly；
(2) environmental protections such as route oxidation can be realized；
(3) it is conducive to product signal transmission to stablize.
Detailed description of the invention
Fig. 1 is existing PCB thickness copper sheet route cross-sectional structure schematic diagram.
Fig. 2 is the structural schematic diagram of copper-clad plate surface bonding high-molecular photosensitive film in PCB thickness copper sheet circuit manufacturing method.
Fig. 3 be PCB thickness copper sheet circuit manufacturing method in substrate copper be corroded after structural schematic diagram.
Fig. 4 is to corrode the filled structural schematic diagram in post-etching area in PCB thickness copper sheet circuit manufacturing method.
Fig. 5 is the structural schematic diagram that electro-coppering is electroplated in PCB thickness copper sheet circuit manufacturing method on macromolecule resin.
Fig. 6 be PCB thickness copper sheet circuit manufacturing method in it is differential superimposed after structural schematic diagram.
In figure: 100 substrate copper, 110 substrate medium layers, 200 high-molecular photosensitive films, 300 macromolecule resins, 400 plating
Copper, 500 line protection materials, 600 thick Copper base material copper, 610 thick copper dielectric layers.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the embodiment of the present invention, a kind of PCB thickness copper sheet circuit manufacturing method, the specific steps are as follows:
(1) it in one layer of substrate copper 100 of the electroplating surface of substrate medium layer 110, is formed copper-clad plate (such as Fig. 1), wherein substrate copper 100
Thickness be 12um or 18um, and thickness of dielectric layers is according to product specification, while substrate copper herein can be common copper product；
(2) high-molecular photosensitive film 200 is bonded in the substrate layers of copper of 110 outer surface of substrate medium layer, high-molecular photosensitive film 200
Shape makes (such as Fig. 2) according to the shape of actual track；
(3) chemical attack is carried out to the copper-clad plate for posting high-molecular photosensitive film 200 using chemistry is practical, thus by high-molecular photosensitive
Substrate copper 100 outside the pasted region of film 200 erodes (such as Fig. 3)；
(4) macromolecule resin 300 of heat curing type, and high score are filled in the region that the copper-clad plate surface in step (3) is corroded
Plate face is smooth after subtree rouge 300 is filled；The macromolecule resin of liquid 300 is specifically poured into the region being corroded, and allows it
Then Self-leveling is solidified (such as Fig. 4) using macromolecule resin 300 of the high temperature to liquid, for filling, circuit table between route
Face protection and insulation；It is herein that there is mobility under its liquid condition using the purpose of macromolecule resin, is easy to be evenly distributed on
Between route, while there is the pliability similar with substrate medium layer, is also able to satisfy line protection and insulating requirements；
(5) plating electro-coppering 400 is powered in the obtained smooth plate face with macromolecule resin 300 of step (4), then repeats to walk
Suddenly (2) arrive the operation (such as Fig. 5) of step (4)；
(6) operation of step (5) is repeated according to demand, thus the thick copper circuit being superimposed, and the thick copper circuit regular shape,
Circuit section even thickness (such as Fig. 6).
The PCB thickness copper sheet route according to made from the above method is needed in one sandwich circuit protective materials 500 of its surface recombination,
To protection circuit, avoids aoxidizing and damage.
The present invention is route copper layer thickness as needed, and carries out differential to its thickness, then plating thin copper several times
The production of thick copper sheet route is realized in layer superposition.This is electroplated and is superimposed the technique to form PCB thickness copper sheet route using differential, can
Guarantee thick copper products circuit section even thickness；The environmental protections such as route oxidation can be realized；Be conducive to product signal transmission simultaneously
Stablize.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection scope of invention.
Claims (6)
1. a kind of PCB thickness copper sheet circuit manufacturing method, which is characterized in that specific step is as follows:
(1) in one layer of substrate copper of the electroplating surface of substrate medium layer, form copper-clad plate, wherein the thickness of substrate copper be 12um or
18um；
(2) be bonded high-molecular photosensitive film in the substrate layers of copper of substrate medium layer outer surface, the shape of high-molecular photosensitive film according to
The shape of actual track makes；
(3) chemical attack is carried out to the copper-clad plate for posting high-molecular photosensitive film using chemistry is practical, thus by high-molecular photosensitive film
Substrate copper corrosion outside pasted region falls；
(4) filled high polymer resin in the region that the copper-clad plate surface in step (3) is corroded, and after macromolecule resin filling
Plate face is smooth；
(5) plating electro-coppering is powered in the obtained smooth plate face with macromolecule resin of step (4), then repeatedly step (2)
To the operation of step (4)；
(6) operation for repeating step (5) according to demand, thus the thick copper circuit being superimposed.
2. PCB thickness copper sheet circuit manufacturing method according to claim 1, which is characterized in that the high score in the step (2)
Sub- light-sensitive surface is Du Pont's dry film.
3. PCB thickness copper sheet circuit manufacturing method according to claim 1, which is characterized in that be specifically in the step (4)
The macromolecule resin of liquid is poured into the region being corroded, and allows its Self-leveling, then using high temperature to the macromolecule of liquid
Resin is solidified.
4. PCB thickness copper sheet circuit manufacturing method according to claim 1 or 3, which is characterized in that step (4) high score
Subtree rouge is thermosetting resin.
5. PCB thickness copper sheet circuit manufacturing method according to claim 1, which is characterized in that the plating mode is dragon
Door plating or VCP plating.
6. PCB thickness copper sheet circuit manufacturing method according to claim 1 or 2, which is characterized in that the high-molecular photosensitive film
It can be combined to by the way of thermal transfer in substrate copper or electro-coppering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711224165.7A CN110167278A (en) | 2017-11-29 | 2017-11-29 | A kind of PCB thickness copper sheet circuit manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711224165.7A CN110167278A (en) | 2017-11-29 | 2017-11-29 | A kind of PCB thickness copper sheet circuit manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110167278A true CN110167278A (en) | 2019-08-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711224165.7A Pending CN110167278A (en) | 2017-11-29 | 2017-11-29 | A kind of PCB thickness copper sheet circuit manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110167278A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598397A (en) * | 1982-06-28 | 1984-01-17 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Sealed wire circuit board and method of producing same |
| CN1805658A (en) * | 2006-01-16 | 2006-07-19 | 深圳市深南电路有限公司 | Thick copper foil fine-wire circuit manufacturing method |
| CN102056413A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing printed circuit board |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
-
2017
- 2017-11-29 CN CN201711224165.7A patent/CN110167278A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS598397A (en) * | 1982-06-28 | 1984-01-17 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | Sealed wire circuit board and method of producing same |
| CN1805658A (en) * | 2006-01-16 | 2006-07-19 | 深圳市深南电路有限公司 | Thick copper foil fine-wire circuit manufacturing method |
| CN102056413A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing printed circuit board |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
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Application publication date: 20190823 |