CN110153593A - 气体保护电弧焊用药芯焊丝 - Google Patents

气体保护电弧焊用药芯焊丝 Download PDF

Info

Publication number
CN110153593A
CN110153593A CN201910534785.3A CN201910534785A CN110153593A CN 110153593 A CN110153593 A CN 110153593A CN 201910534785 A CN201910534785 A CN 201910534785A CN 110153593 A CN110153593 A CN 110153593A
Authority
CN
China
Prior art keywords
mass
compound
welding
flux
scaled value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910534785.3A
Other languages
English (en)
Chinese (zh)
Inventor
石崎圭人
小池贵之
古川尚英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of CN110153593A publication Critical patent/CN110153593A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3026—Mn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053—Fe as the principal constituent
    • B23K35/3093—Fe as the principal constituent with other elements as next major constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/325—Ti as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/16—Arc welding or cutting making use of shielding gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01003—Lithium [Li]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01009—Fluorine [F]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01016—Sulfur [S]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01041—Niobium [Nb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01083—Bismuth [Bi]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Arc Welding In General (AREA)
  • Butt Welding And Welding Of Specific Article (AREA)
CN201910534785.3A 2013-03-25 2013-12-19 气体保护电弧焊用药芯焊丝 Pending CN110153593A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-062929 2013-03-25
JP2013062929A JP6085205B2 (ja) 2013-03-25 2013-03-25 ガスシールドアーク溶接用フラックス入りワイヤ
CN201310704268.9A CN104070305A (zh) 2013-03-25 2013-12-19 气体保护电弧焊用药芯焊丝

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201310704268.9A Division CN104070305A (zh) 2013-03-25 2013-12-19 气体保护电弧焊用药芯焊丝

Publications (1)

Publication Number Publication Date
CN110153593A true CN110153593A (zh) 2019-08-23

Family

ID=51592128

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201310704268.9A Pending CN104070305A (zh) 2013-03-25 2013-12-19 气体保护电弧焊用药芯焊丝
CN201910534785.3A Pending CN110153593A (zh) 2013-03-25 2013-12-19 气体保护电弧焊用药芯焊丝

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201310704268.9A Pending CN104070305A (zh) 2013-03-25 2013-12-19 气体保护电弧焊用药芯焊丝

Country Status (3)

Country Link
JP (1) JP6085205B2 (ja)
KR (1) KR101600172B1 (ja)
CN (2) CN104070305A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6509007B2 (ja) * 2015-03-30 2019-05-08 株式会社神戸製鋼所 ガスシールドアーク溶接用フラックス入りワイヤの製造方法
JP2016187828A (ja) * 2015-03-30 2016-11-04 株式会社神戸製鋼所 ガスシールドアーク溶接用フラックス入りワイヤ
JP6746338B2 (ja) * 2016-03-25 2020-08-26 株式会社神戸製鋼所 ガスシールドアーク溶接用フラックス入りワイヤ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006289404A (ja) * 2005-04-07 2006-10-26 Nippon Steel & Sumikin Welding Co Ltd ガスシールドアーク溶接用フラックス入りワイヤ
CN101157169A (zh) * 2006-10-02 2008-04-09 株式会社神户制钢所 二氧化钛系气体保护弧焊用填充焊剂金属丝
JP2012011429A (ja) * 2010-07-01 2012-01-19 Kobe Steel Ltd すみ肉溶接継手およびガスシールドアーク溶接方法
CN102554497A (zh) * 2010-12-21 2012-07-11 中冶建筑研究总院有限公司 一种细晶粒高强度钢筋co2电弧焊用药芯焊丝
JP2012218065A (ja) * 2011-04-13 2012-11-12 Nippon Steel & Sumikin Welding Co Ltd ２電極水平すみ肉ｃｏ２ガスシールドアーク溶接用フラックス入りワイヤ
JP2013018031A (ja) * 2011-07-12 2013-01-31 Nippon Steel & Sumikin Welding Co Ltd 水平すみ肉ガスシールドアーク溶接用フラックス入りワイヤ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2667635B2 (ja) * 1994-03-31 1997-10-27 株式会社神戸製鋼所 ステンレス鋼フラックス入りワイヤ
JPH09314383A (ja) * 1996-05-24 1997-12-09 Nippon Steel Corp 高速水平すみ肉ガスシールドアーク溶接方法
JP4425756B2 (ja) 2004-09-28 2010-03-03 日鐵住金溶接工業株式会社 水平すみ肉溶接用フラックス入りワイヤ
JP4838100B2 (ja) * 2006-11-06 2011-12-14 日鐵住金溶接工業株式会社 耐候性鋼用水平すみガスシールドアーク溶接用フラックス入りワイヤ
JP4776508B2 (ja) * 2006-11-20 2011-09-21 株式会社神戸製鋼所 エレクトロガスアーク溶接用フラックス入りワイヤ
CN101396774B (zh) * 2007-09-30 2010-12-08 苏派特金属（昆山）有限公司 药芯焊丝
JP5014189B2 (ja) * 2008-02-12 2012-08-29 日鐵住金溶接工業株式会社 ２電極すみ肉ガスシールドアーク溶接方法
EP2289661B1 (en) * 2009-08-27 2014-04-02 Nippon Steel & Sumikin Welding Co., Ltd. Flux cored wire for gas shielded arc welding of high strength steel
JP4949449B2 (ja) 2009-09-18 2012-06-06 株式会社神戸製鋼所 溶接用フラックス入りワイヤ
CN102873468B (zh) * 2012-09-18 2014-10-01 武汉铁锚焊接材料股份有限公司 一种高速平角焊药芯焊丝及其制备与应用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006289404A (ja) * 2005-04-07 2006-10-26 Nippon Steel & Sumikin Welding Co Ltd ガスシールドアーク溶接用フラックス入りワイヤ
CN101157169A (zh) * 2006-10-02 2008-04-09 株式会社神户制钢所 二氧化钛系气体保护弧焊用填充焊剂金属丝
JP2012011429A (ja) * 2010-07-01 2012-01-19 Kobe Steel Ltd すみ肉溶接継手およびガスシールドアーク溶接方法
CN102554497A (zh) * 2010-12-21 2012-07-11 中冶建筑研究总院有限公司 一种细晶粒高强度钢筋co2电弧焊用药芯焊丝
JP2012218065A (ja) * 2011-04-13 2012-11-12 Nippon Steel & Sumikin Welding Co Ltd ２電極水平すみ肉ｃｏ２ガスシールドアーク溶接用フラックス入りワイヤ
JP2013018031A (ja) * 2011-07-12 2013-01-31 Nippon Steel & Sumikin Welding Co Ltd 水平すみ肉ガスシールドアーク溶接用フラックス入りワイヤ

Also Published As

Publication number Publication date
JP2014184481A (ja) 2014-10-02
JP6085205B2 (ja) 2017-02-22
CN104070305A (zh) 2014-10-01
KR20140116821A (ko) 2014-10-06
KR101600172B1 (ko) 2016-03-04

Similar Documents

Publication Publication Date Title
JP4986562B2 (ja) チタニヤ系ガスシールドアーク溶接用フラックス入りワイヤ
KR101177217B1 (ko) 경화 육성용 ｍｉｇ 아크 용접 와이어 및 경화 육성용 ｍｉｇ 아크 용접 방법
JP5283993B2 (ja) チタニヤ系ガスシールドアーク溶接用フラックス入りワイヤ
KR101148277B1 (ko) 플럭스 내장 와이어
MXPA05013178A (es) Electrodo de mecha para reducir hidrogeno difusible.
KR101153572B1 (ko) 플럭스 내장 와이어
WO2018051823A1 (ja) エレクトロスラグ溶接用ワイヤ、エレクトロスラグ溶接用フラックス及び溶接継手
KR100985681B1 (ko) 가스 실드 아크 용접용 플럭스 함유 와이어
EP3378594A1 (en) Flux-cored wire for gas-shielded arc welding
JP2007136548A (ja) ガスシールドアーク溶接用フラックス入りワイヤ
KR101171445B1 (ko) 플럭스 내장 와이어
JP5014189B2 (ja) ２電極すみ肉ガスシールドアーク溶接方法
KR101600174B1 (ko) 가스 실드 아크 용접용 플럭스 내장 와이어
JP7231499B2 (ja) フラックス入りワイヤ及び溶接方法
JP6017406B2 (ja) セルフシールドアーク溶接用ステンレス鋼フラックス入りワイヤ
CN110153593A (zh) 气体保护电弧焊用药芯焊丝
EP3081327A1 (en) Flux-cored wire for gas-shielded arc welding
KR101164756B1 (ko) 용접용 플럭스 함유 와이어
CN113613829A (zh) Ni基合金药芯焊丝
JP5938375B2 (ja) ２電極水平すみ肉ｃｏ２ガスシールドアーク溶接用フラックス入りワイヤ
JP2006224178A (ja) ガスシールドアークすみ肉溶接用フラックス入りワイヤ
JP2020157315A (ja) エレクトロガスアーク溶接用フラックス入りワイヤ
JP6726008B2 (ja) ガスシールドアーク溶接用フラックス入りワイヤ
JP5361797B2 (ja) 水平すみ肉ガスシールドアーク溶接用フラックス入りワイヤ
KR100578750B1 (ko) 용접성이 우수한 고장력강용 메탈계 플럭스 코어드 와이어

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190823