CN110137162A - A kind of LED product and preparation method thereof of adjustable light light shape out - Google Patents
A kind of LED product and preparation method thereof of adjustable light light shape out Download PDFInfo
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- CN110137162A CN110137162A CN201910257588.1A CN201910257588A CN110137162A CN 110137162 A CN110137162 A CN 110137162A CN 201910257588 A CN201910257588 A CN 201910257588A CN 110137162 A CN110137162 A CN 110137162A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 230000001105 regulatory effect Effects 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000010410 layer Substances 0.000 claims description 27
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000002310 reflectometry Methods 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 230000000574 ganglionic effect Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000003447 ipsilateral effect Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims 1
- 238000005286 illumination Methods 0.000 abstract description 13
- 238000004020 luminiscence type Methods 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 239000003292 glue Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to LED technology fields, disclose a kind of LED product and preparation method thereof of adjustable light light shape out.The LED product of adjustable light light shape out includes substrate, LED chip, encapsulated layer and light regulating course, LED chip is fixed on substrate, encapsulated layer is set to the top of substrate, and in LED chip is wrapped in by encapsulated layer, light regulating course is set to the outer surface of encapsulated layer, the some light that light regulating course can issue LED chip reflects, and some light is transmitted, to increase the range of exposures of the light of LED chip sending.The production method of the adjustable LED product of light light shape out includes the following steps, LED chip is fixed on substrate；LED chip is packaged in substrate top to form encapsulated layer, LED chip is wrapped in interior by encapsulated layer；Light regulating course is prepared in the outer surface of encapsulated layer.The light range of exposures that LED product in the present invention issues luminescence chip becomes larger, and wide-angle goes out light, and intensity of illumination is more evenly；Its production method is relatively simple, easily operated.
Description
Technical field
The present invention relates to LED technology field more particularly to a kind of adjustable LED product of light light shape and its production sides out
Method.
Background technique
LED encapsulation is that LED luminescence chip is fixed on substrate, and luminescence chip is realized by bonding line with substrate electrical mutual
Even, and it is packaged using packaging plastic outside luminescence chip, to protect internal wick.Common encapsulating structure makes light
It directly transmits, without having reflection function, the light that LED luminescence chip issues will be directed through packaging plastic outgoing.So that
The range of emergent ray is more concentrated, and the angle that light can irradiate is smaller, and the intensity of illumination in centre is higher, peripheral part
Intensity of illumination it is weaker, cause the extremely non-uniform phenomenon of illumination.Therefore, be badly in need of one kind can uniformly light-emitting angle to expanding hair
Optical range, and the uniformly LED product of different location intensity of illumination.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides the LED product and its production of a kind of adjustable light light shape out
Method, the LED product is by increasing light regulating course, so that the range of exposures for the light that luminescence chip issues becomes larger, is formed big
Angle light-out effect, and keep intensity of illumination more uniform；Its production method is relatively simple, easily operated.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of LED product of adjustable light light shape out is provided, including substrate, LED chip, encapsulated layer and light are adjusted
Layer, the LED chip is fixed on the substrate, and the encapsulated layer is set to the top of the substrate, and the encapsulated layer is by institute
It states in LED chip is wrapped in, the light regulating course is set to the outer surface of the encapsulated layer, and the light regulating course can be to institute
The some light for stating LED chip sending is reflected, and some light is transmitted, to increase the light that the LED chip issues
Range of exposures.
As an improvement of the above technical solution, the light regulating course at least can be by the light of the side of the LED chip
Reflection.
As a further improvement of the above technical scheme, the light regulating course is greater than 20% to the reflectivity of light.
As a further improvement of the above technical scheme, the light regulating course can be by the light of the two sides of the LED chip
Line reflection, and it is located at the symmetrical shape setting of the light regulating course of the two sides of the LED chip.
As a further improvement of the above technical scheme, the light regulating course includes at least the first reflecting surface, and described the
One reflecting surface is arranged relative to the top surface inclination of the LED chip.
As a further improvement of the above technical scheme, the light regulating course further includes the second reflecting surface, and described first
Reflecting surface is distributed in the ipsilateral of the LED chip with second reflecting surface, and second reflecting surface is parallel to the LED core
The top surface of piece.
As a further improvement of the above technical scheme, the light regulating course is white adhesive layer, and the white adhesive layer is dioxy
Change the mixture of titanium particle and silica gel；Alternatively, the light regulating course is metal film；Alternatively, the light regulating course is distribution
Formula Bragg mirror.
As a further improvement of the above technical scheme, the substrate is equipped with several described LED chips.
A kind of production method of adjustable LED product of light light shape out is additionally provided, is included the following steps,
LED chip is fixed on substrate by S10；
S20 is packaged the LED chip at the top of the substrate to form encapsulated layer, and the encapsulated layer will be described
In LED chip is wrapped in；
S30 prepares light regulating course in the outer surface of the encapsulated layer.
As a further improvement of the above technical scheme, the method for the light regulating course is prepared are as follows: by the light tune
Ganglionic layer is covered in the outer surface of the packaging plastic by the technique for being molded or spraying.
The beneficial effects of the present invention are: the LED product in the present invention, which passes through, increases light regulating course, so that luminescence chip is sent out
The range of exposures of light out becomes larger, and forms wide-angle light-out effect, and keep intensity of illumination more uniform；Its production method is more
Simplicity, it is easily operated.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples:
Fig. 1 is the structural schematic diagram of LED product in the prior art；
Fig. 2 is the optical range schematic diagram out of LED product in the prior art；
Fig. 3 is the structural schematic diagram of LED product in one embodiment of the invention；
Fig. 4 is the optical range schematic diagram out of LED product in one embodiment of the invention；
Fig. 5 is the structural schematic diagram of whole plate LED product in one embodiment of the invention.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to design of the invention, specific structure and generation clear
Chu, complete description, to be completely understood by the purpose of the present invention, scheme and effect.It should be noted that the case where not conflicting
Under, the features in the embodiments and the embodiments of the present application can be combined with each other.
It should be noted that unless otherwise specified, when a certain feature referred to as " fixation ", " connection " are in another feature,
It can directly fix, be connected to another feature, and can also fix, be connected to another feature indirectly.In addition, this
The descriptions such as up, down, left, right, before and after used in invention are only relative to the mutual of each component part of the invention in attached drawing
For positional relationship.
In addition, unless otherwise defined, the technology of all technical and scientific terms used herein and the art
The normally understood meaning of personnel is identical.Term used in the description is intended merely to description specific embodiment herein, without
It is to limit the present invention.Term " and or " used herein includes the arbitrary of one or more relevant listed items
Combination.
Dotted line shown in Figure of description is only used for signal optical path, cannot be understood as the profile of product in this programme
Line.
Referring to Fig.1, the structural schematic diagram of LED product in the prior art is shown.LED product includes substrate 01, is fixed on
LED chip 02 on substrate 01, and the encapsulated layer 03 positioned at 01 top of substrate.In LED chip 02 is wrapped in by encapsulated layer 03,
LED chip 02 is by realizing electric interconnection between bonding line 021 and substrate 01.The encapsulated layer of light issued from LED chip 02
03 is directly emitted.
Referring concurrently to Fig. 2, the optical range schematic diagram out of LED product in the prior art is shown.By can be seen that in figure, light
Outgoing range it is smaller, and the intensity of illumination in centre is higher, and the intensity of illumination of peripheral part is lower, intensity of illumination distribution
Unevenly.
Referring to Fig. 3, the structural schematic diagram of LED product in one embodiment of the invention is shown.LED product include substrate 1,
It is fixed on the LED chip 2 on substrate 1, the encapsulated layer 3 positioned at 1 top of substrate, and the light tune positioned at 3 outer surface of encapsulated layer
Ganglionic layer 4.In LED chip 2 is wrapped in by encapsulated layer 3, LED chip 2 is by realizing electric interconnection between bonding line 21 and substrate 1.
The light that light regulating course 4 can issue LED chip 2 is reflected, transmitted and is scattered.
A part is reflected on substrate 1 when the encapsulated layer 3 of the light issued from LED chip 2 reaches light regulating course 4,
It is a part of directly to be transmitted away by light regulating course 4.Substrate 1 is that sheet metal is made by the method for etching or punching,
Light can also be reflected, therefore, the light on arrival substrate 1, which will be again reflected, returns to light regulating course 4 or direct
Outgoing.Multiple reflections are carried out to light by light regulating course 4 and substrate, increase the outgoing range of light.Light regulating course 4
It needs at least to reflect away the light of LED chip side.Preferably, the light of LED chip two sides can be reflected.
Light regulating course 4 shown in Fig. 3 includes the first reflecting surface 41, the second reflecting surface 42, third reflecting surface 43 and the 4th
Reflecting surface 44.First reflecting surface 41 and the second reflecting surface 42 are located at the side of LED chip 2, third reflecting surface 43 and the 4th reflection
Face 44 is located at the other side of LED chip 2, and the shape of the first reflecting surface 41 and third reflecting surface 43 is symmetrically set about LED chip 2
It sets, the shape of the second reflecting surface 42 and the 4th reflecting surface 44 is symmetrical arranged about LED chip 2.First reflecting surface 41 and third are anti-
The top surface that face 43 is penetrated relative to LED chip 2 is tilted, and the second reflecting surface 42 and the 4th reflecting surface 44 are parallel to LED chip
Top surface.
Certainly, light regulating course 4 is not limited to the present embodiment the shape of middle offer, as long as meeting its shape and the top of packaging plastic 3
The shape in portion matches.
Referring concurrently to Fig. 4, the optical range schematic diagram out of LED product in one embodiment of the invention is shown.By can in figure
Find out, the range of the outgoing range of light than in the prior art expands, and the intensity of illumination peak value in centre is weakened, week
The intensity of illumination in edge position and centre is closer to, and keeps whole light out more uniform.
When preparing this kind of LED product, mainly include the following steps:
The first step prepares substrate.The metal blank of predetermined size and shape is got out, material generally selects copper alloy,
And plating protection processing is carried out in panel surface, the material of plating includes at least one of Cu, Ni, Ag, Au and Pa.Pass through again
Metal blank is removed material by the methods of etching or punching, the line pattern of needs is made.
LED chip is fixed on substrate obtained above by second step.LED chip is welded on substrate by solder,
Golden tin solder etc. can be used in solder.And make to realize electric interconnection between LED chip and substrate by bonding line.
Third step is packaged the LED chip on substrate.Select thermosetting material as packaging plastic, such as silica gel or ring
Oxygen etc..Needs are applied according to LED product, the substances such as fluorescent powder or spread powder are mixed into packaging plastic.According to required light
Outgoing range and angle design go out shape and size at the top of packaging plastic, and prepare phase with size according to the shape at the top of packaging plastic
Packaging plastic is fixed on the top of substrate with mold obtained by the mold answered by mould pressing process.The some processes parameter is direct
Use the prior art.
4th step prepares light regulating course.Light regulating course selects reflexive preferable material, needs to the reflectivity of light
Greater than 20%.Certainly, it also needs light be transmitted and be scattered.White glue, metal film or distribution can be selected in light regulating course
Bragg mirror etc..The shape of light regulating course bottom is matched with the shape at the top of packaging plastic.White glue is mixing material, is logical
It crosses for high reflection molecule to be mixed into thermosetting material and be made, wherein the content of high reflection molecule can be adjusted according to light
Albedo power needed for layer is adjusted.Substances, the thermosetting materials such as titanium dioxide can be selected in high reflection molecule can
Select the substances such as silica gel or epoxy.The outer surface of packaging plastic is moulded directly into as the method for molding white glue by made from.Or
White glue obtained is diluted using volatile diluent, and covers the outer surface of packaging plastic by way of spraying.
Metal film need to select the material for having reflecting effect to light, such as AL, Ag or Au.Distributed bragg reflector mirror be by two kinds not
Material with refractive index is alternately arranged the periodic structure formed in the way of ABAB, reflects centered on the optical thickness of every layer material
The 1/4 of wavelength, to improve the reflectivity to light.Metal film or distributed bragg reflector mirror can be covered by way of molding
Cover the outer surface of packaging plastic.
5th step cuts product made from the 4th step, forms single LED product.(wherein product made from the 4th step is
Whole plate LED product, structure is as described in attached drawing 5.)
In above-mentioned preparation process, it can need to carry out the reflectance/transmittance of light regulating course according to application scenarios
It adjusts, to reach expected lighting effect.
LED product in the present invention is by increasing light regulating course, so that the range of exposures for the light that luminescence chip issues
Become larger, forms wide-angle light-out effect, and keep intensity of illumination more uniform.
It is to be illustrated to what preferable implementation of the invention carried out, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (10)
1. a kind of LED product of adjustable light light shape out, which is characterized in that including substrate, LED chip, encapsulated layer and light tune
Ganglionic layer, the LED chip are fixed on the substrate, and the encapsulated layer is set to the top of the substrate, and the encapsulated layer will
In the LED chip is wrapped in, the light regulating course is set to the outer surface of the encapsulated layer, and the light regulating course can be right
The some light that the LED chip issues is reflected, and some light is transmitted, to increase the light that the LED chip issues
The range of exposures of line.
2. the LED product of adjustable light light shape out according to claim 1, which is characterized in that the light regulating course is extremely
The light of the side of the LED chip can be reflected less.
3. the LED product of adjustable light light shape out according to claim 1, which is characterized in that the light regulating course pair
The reflectivity of light is greater than 20%.
4. the LED product of adjustable light light shape out according to claim 2, which is characterized in that the light regulating course energy
The light of the two sides of the LED chip is reflected, and is located at the shape pair of the light regulating course of the two sides of the LED chip
Claim setting.
5. the LED product of adjustable light light shape out according to claim 1, which is characterized in that the light regulating course is extremely
It less include the first reflecting surface, first reflecting surface is arranged relative to the top surface inclination of the LED chip.
6. the LED product of adjustable light light shape out according to claim 5, which is characterized in that the light regulating course is also
Including the second reflecting surface, first reflecting surface is distributed in the ipsilateral of the LED chip, and described with second reflecting surface
Two reflectings surface are parallel to the top surface of the LED chip.
7. it is according to claim 1 it is adjustable go out light light shape LED product, which is characterized in that the light regulating course is
White adhesive layer, the white adhesive layer are the mixture of titanium dioxide granule and silica gel；Alternatively, the light regulating course is metal film；Or
Person, the light regulating course are distributed bragg reflector mirror.
8. the LED product of adjustable light light shape out according to claim 1, which is characterized in that if the substrate is equipped with
The dry LED chip.
9. a kind of production method of the adjustable LED product of light light shape out, which is characterized in that include the following steps,
LED chip is fixed on substrate by S10；
S20 is packaged the LED chip at the top of the substrate to form encapsulated layer, and the encapsulated layer is by the LED
In chip is wrapped in；
S30 prepares light regulating course in the outer surface of the encapsulated layer.
10. the production method of the adjustable LED product of light light shape out according to claim 9, which is characterized in that preparation institute
The method for stating light regulating course are as follows: the light regulating course is covered in the outer of the packaging plastic by the technique for being molded or spraying
Surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910257588.1A CN110137162A (en) | 2019-04-01 | 2019-04-01 | A kind of LED product and preparation method thereof of adjustable light light shape out |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910257588.1A CN110137162A (en) | 2019-04-01 | 2019-04-01 | A kind of LED product and preparation method thereof of adjustable light light shape out |
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| Publication Number | Publication Date |
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| CN110137162A true CN110137162A (en) | 2019-08-16 |
Family
ID=67569137
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910257588.1A Pending CN110137162A (en) | 2019-04-01 | 2019-04-01 | A kind of LED product and preparation method thereof of adjustable light light shape out |
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| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
| CN114093998A (en) * | 2022-01-21 | 2022-02-25 | 季华实验室 | Light emitting diode, display panel, display device and preparation method |
| CN114361318A (en) * | 2022-01-14 | 2022-04-15 | 福建天电光电有限公司 | LED packaging structure capable of emitting light at large angle and packaging method thereof |
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| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
| CN114361318A (en) * | 2022-01-14 | 2022-04-15 | 福建天电光电有限公司 | LED packaging structure capable of emitting light at large angle and packaging method thereof |
| CN114093998A (en) * | 2022-01-21 | 2022-02-25 | 季华实验室 | Light emitting diode, display panel, display device and preparation method |
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