CN219350264U

CN219350264U - LED lamp bead

Info

Publication number: CN219350264U
Application number: CN202222549511.1U
Authority: CN
Inventors: 江柳杨; 赵汉民
Original assignee: Jiangxi Latticepower Semiconductor Corp
Current assignee: Jiangxi Latticepower Semiconductor Corp
Priority date: 2022-09-26
Filing date: 2022-09-26
Publication date: 2023-07-14
Anticipated expiration: 2032-09-26

Abstract

The utility model provides an LED lamp bead, which comprises: a supporting substrate, the surface of which is provided with a conductive circuit; the LED chip with the flip-chip structure is fixedly arranged on the conductive line on the surface of the supporting substrate through a chip electrode; the fluorescent adhesive layer is arranged on the light emitting surface, opposite to the electrode, of the LED chip with the flip structure; the light blocking adhesive layer is arranged around the LED chip with the flip structure on the surface of the supporting substrate in a surrounding manner; and the silica gel lens is configured on the surfaces of the fluorescent glue layer and the light blocking glue layer, so that the light emitting efficiency of the LED lamp beads can be effectively improved.

Description

LED lamp bead

Technical Field

The utility model relates to the technical field of semiconductors, in particular to an LED lamp bead.

Background

In the process of packaging a blue light LED chip into a white light LED lamp bead, a fluorescent powder layer needs to be packaged on the surface of the blue light LED chip, and white light is emitted under the excitation of blue light. In order to obtain better light spots, the application forms of packaging the high-reflectivity white glue around the flip sapphire chip into single-sided light emitting are more and more. Although the above-described packaged products can meet the daily lighting requirements to some extent, higher light extraction efficiency has been the goal pursued by the industry.

Disclosure of Invention

In order to overcome the defects, the utility model provides the LED lamp bead, which can effectively improve the light emitting efficiency of the LED lamp bead.

An LED light bead, comprising:

a supporting substrate, the surface of which is provided with a conductive circuit;

the LED chip is provided with at least one light emitting surface and is fixedly arranged on the conductive line on the surface of the supporting substrate;

the fluorescent adhesive layer is configured on the light emitting surface of the LED chip; the fluorescent glue layer is doped with at least one fluorescent powder with preset color, and the light emitting surface of the fluorescent glue layer is determined by the type of the LED chip;

the light blocking adhesive layer is arranged around the LED chip on the surface of the supporting substrate in a surrounding manner; a kind of electronic device with high-pressure air-conditioning system

And the silica gel lens is arranged on the surfaces of the fluorescent glue layer and the light blocking glue layer.

The LED lamp bead provided by the utility model comprises: the fluorescent glue layer, the light blocking glue layer and the silica gel lens, the light blocking glue layer prevents that the light of LED chip from the side from the emergent time silica gel lens from further concentrating to emergent light to this luminous efficacy who improves LED lamp pearl.

Drawings

FIG. 1 is a schematic diagram of an embodiment of an LED lamp bead according to the present utility model;

FIG. 2 is a schematic view of another embodiment of an LED lamp bead according to the present utility model;

FIG. 3 is a schematic view of another embodiment of an LED lamp bead according to the present utility model;

FIG. 4 is a schematic view of another embodiment of an LED lamp bead according to the present utility model;

FIG. 5 is a schematic view of another embodiment of an LED lamp bead according to the present utility model;

fig. 6 is a schematic structural diagram of another embodiment of an LED lamp bead according to the present utility model.

Reference numerals:

the LED chip comprises a 1-supporting substrate, a 2-flip-chip structure LED chip, a 3-light blocking adhesive layer, a 4-fluorescent adhesive layer, a 5-triangular reflecting structure and a 6-silica gel lens.

Detailed Description

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following description will explain the specific embodiments of the present utility model with reference to the accompanying drawings. It is evident that the drawings in the following description are only examples of the utility model, from which other drawings and other embodiments can be obtained by a person skilled in the art without inventive effort.

The utility model provides an LED lamp bead, which comprises: a supporting substrate, the surface of which is provided with a conductive circuit; the LED chip is provided with at least one light emitting surface and is fixedly arranged on the conductive line on the surface of the supporting substrate; the fluorescent adhesive layer is configured on the light-emitting surface of the LED chip; the fluorescent glue layer is doped with at least one fluorescent powder with preset color, and the light emitting surface of the fluorescent glue layer is determined by the type of the LED chip; the light blocking adhesive layer is arranged around the LED chip on the surface of the supporting substrate in a surrounding manner; and the silica gel lens is configured on the surfaces of the fluorescent glue layer and the light blocking glue layer.

In the LED lamp bead, the supporting substrate may be a ceramic base plate, EMC, SMC, PCT, PPA, etc., which is not limited herein, and the surface of the supporting substrate may be configured with corresponding conductive lines according to actual requirements, including a positive electrode pad, a negative electrode pad, etc.

The LED chip can be an LED chip with a flip-chip structure or an LED chip with a vertical structure, and for the LED chip with the flip-chip structure, the fluorescent glue layer is configured on the light emitting surface of the opposite side of the LED chip to the electrode. For the chip with the vertical structure, the matched fluorescent glue is configured on the light-emitting surface of the chip by means of coating, film pasting and the like according to the configuration mode of the chip electrode on the light-emitting surface. The matching refers to matching in appearance, for example, for a vertical structure LED chip, in general, an electrode area is formed on the light emitting surface, and then the corresponding position of the fluorescent glue layer needs to be cut off, so that the electrode area is left free. The size of the fluorescent glue layer can be configured according to practical application, but at least the light emitting surface of the LED chip is covered. For convenience, the following description will be made with the LED chip in a flip-chip configuration.

The light-blocking glue layer is doped with light-reflecting particles, so that the layer has the characteristic of high reflectivity (the reflectivity is at least more than 90 percent),the material is a polymer material containing a high-reflectivity particle, and the light-reflectivity particle includes but is not limited to titanium dioxide (TiO) ₂ ) Powder, silica (SiO) ₂ ) Powders, etc., and polymeric materials include, but are not limited to, epoxy, silicone, etc. The light blocking adhesive layer is arranged around the LED chip in a surrounding manner, the purpose of preventing light of the LED chip from exiting from the side edge is achieved, and in practical application, the thickness of the light blocking adhesive layer around the chip and the doping amount of light reflection particles are freely allocated by taking the reflectivity of the final adhesive layer as a reference.

The fluorescent glue layer is doped with YAG, luAG and other fluorescent powder, so that the packaged LED lamp beads emit light with corresponding colors, for example, the LED lamp beads emit white light and the like by doping red fluorescent powder and yellow fluorescent powder with a certain proportion. The mass ratio of the silica gel to the fluorescent powder, the mass ratio of different fluorescent powders and the thickness of the fluorescent glue layer are not particularly limited, and the silica gel and the fluorescent glue layer can be configured according to the light emitting requirement in practical application, for example, the mass ratio of the silica gel to the fluorescent powder is 1: (1-2), the thickness of the fluorescent glue layer is 50-150 μm, etc. In addition, the arrangement modes of the fluorescent glue layer and the light blocking glue layer can be selected according to practical applications, for example, in one embodiment, the LED chip 2 is fixedly arranged on the conductive line on the surface of the supporting substrate 1, and the fluorescent glue layer 4 is arranged on the surfaces of the light blocking glue layer 3 and the LED chip 2, as shown in fig. 1; as another example, the light blocking adhesive layer 4 is disposed around the LED chip 2 and the fluorescent adhesive layer on the surface of the support substrate 1, and the upper surface is flush with the upper surface of the fluorescent adhesive layer, as shown in fig. 2. In other embodiments, to increase the luminous flux of the LED beads, a proportion of alumina is added to the fluorescent patch.

The LED lamp bead structure is improved, and for the LED chip with the flip structure, the LED lamp bead comprises a supporting substrate, the LED chip with the flip structure, a fluorescent glue layer and a light blocking glue layer, and also comprises a triangle-like reflecting structure which is surrounded on the periphery of the LED chip with the flip structure at the joint of the fluorescent glue layer and the LED chip with the flip structure, a reflecting cavity is formed on the periphery of the LED chip with the flip structure, and light emitted from the periphery is reflected back to become effective light to be output from a luminous surface. The triangular reflecting structure can be prepared from high polymer materials such as epoxy resin, silicon resin and the like, and an included angle (alpha) formed at the edge of the fluorescent membrane ranges from 25 degrees to 75 degrees. Taking the configuration of the fluorescent glue layer and the light blocking glue layer as shown in fig. 2 as an example, the structure after the triangular reflecting structure 5 is configured is shown in fig. 3.

The silica gel lens may be a spherical lens or a planar lens:

in the embodiment of the spherical lens, the silica gel lens is configured by wrapping the surface of the supporting substrate with the light blocking glue layer and the fluorescent glue layer, and taking the structure shown in fig. 3 as an example, the LED lamp beads of the spherical lens (corresponding to the silica gel lens 6) are further configured as shown in fig. 4 and 5. In the LED lamp beads shown in fig. 4 and 5, in the LED lamp beads shown in fig. 4, the light blocking adhesive layer surrounds the LED chip and the fluorescent adhesive layer by dispensing for a single chip (the single lamp bead is cut first and then the light blocking adhesive is dispensed), and at this time, an arc structure with a certain shape is presented around the LED chip according to the dosage of the light blocking adhesive layer. In the LED lamp beads shown in fig. 5, the light blocking adhesive layer is formed by dispensing between the whole LED chips (first dispensing the light blocking adhesive and then cutting into individual lamp beads), so that the formed light blocking adhesive layer is a flat structure. In practical application, parameters such as the size, thickness, position relation and the like of the spherical lens and the light blocking adhesive layer can be configured according to practical situations, and the parameters are not particularly limited herein. The shape of the light blocking adhesive layer can also vary according to different processes.

In the embodiment of the planar lens, the silica gel lens is disposed on the surfaces of the fluorescent glue layer and the light blocking glue layer, and the structure shown in fig. 3 is taken as an example, and the LED lamp beads of the planar lens (corresponding to the silica gel lens 6) are further disposed as shown in fig. 6. In other embodiments, the fluorescent glue layer is located on the surfaces of the LED chip and the light blocking glue layer, and the planar lens is configured on the surface of the fluorescent glue layer.

It should be noted that the above embodiments can be freely combined as needed. The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which are intended to be comprehended within the scope of the present utility model.

Claims

1. An LED lamp bead, comprising:

2. The LED light bulb of claim 1, wherein the silicone lens is a spherical lens, and the light blocking glue layer and the fluorescent glue layer are wrapped on the surface of the support substrate.

3. The LED lamp bead of claim 1, wherein the silicone lens is a planar lens disposed on the surface of the phosphor layer.

4. The LED light bulb of claim 1, wherein the silicone lens is a planar lens, the light blocking glue layer is disposed around the LED chip and around the fluorescent glue layer, and the upper surface is flush with the upper surface of the fluorescent glue layer, and the planar lens is disposed on the surfaces of the fluorescent glue layer and the light blocking glue layer.

5. The LED lamp bead of any of claims 1-4, wherein the phosphor layer is disposed on the light blocking layer and the LED chip surface.

6. The LED lamp bead of any of claims 1-4, wherein the light blocking layer surrounds the LED chip and the phosphor layer on the surface of the support substrate, and the upper surface is flush with the upper surface of the phosphor layer.

7. The LED lamp bead of claim 1, wherein the LED chip is a flip-chip structure LED chip, the LED lamp bead further comprising: and the joint of the fluorescent glue layer and the LED chip with the flip structure is surrounded by a triangle-like reflection structure around the LED chip with the flip structure.

8. The LED lamp bead of claim 7, wherein the triangle-like reflective structure has an included angle in the range of 25 ° to 75 ° at the edge of the phosphor film.

9. The LED lamp bead of any of claims 1-4, 7-8, wherein the light blocking glue layer is doped with light reflective particles.