CN110129868B

CN110129868B - Semiconductor wafer electroplating clamp

Info

Publication number: CN110129868B
Application number: CN201910435555.1A
Authority: CN
Inventors: 潘国堃
Original assignee: Winmax Control Technology Shanghai Co ltd
Current assignee: WINMAX CONTROL TECHNOLOGY (SHANGHAI) Co.,Ltd.
Priority date: 2019-05-23
Filing date: 2019-05-23
Publication date: 2021-08-03
Anticipated expiration: 2039-05-23
Also published as: CN110129868A

Abstract

The invention discloses a semiconductor wafer electroplating clamp which structurally comprises a base, a baffle and a clamp, wherein the base is provided with an adjusting rod and an adjusting plate, the adjusting rod is connected to the bottom of the adjusting plate through threads, and the adjusting plate is connected to the baffle through threads; the baffle is provided with semiconductor wafers which are uniformly distributed on the surface of the baffle; the fixture is provided with a support rod, a rotating rod and a chuck, the support rod is vertically welded on the base, the rotating rod is connected on the support rod through a bolt, the chuck is welded on the rotating rod, and the fixture has the beneficial effects that: can be through the extrusion clamp plate to the inside air of pressure-actuated airbag conducts, promotes the bump and up pushes up the clamp ring, promotes the clamp ring and carries out clamping work, thereby with semiconductor wafer embedding rubber pad, press and protect the film of semiconductor wafer outward flange through the rubber pad, avoid the film to peel off in data send process, reduce semiconductor wafer's guard action.

Description

Semiconductor wafer electroplating clamp

Technical Field

The invention relates to the field of semiconductors, in particular to a semiconductor wafer electroplating clamp.

Background

The semiconductor wafer is a silicon wafer for an integrated circuit board, etching of a connecting structure is generally avoided when the semiconductor wafer is processed, a transfer operation is required during the processing of the semiconductor wafer, and the semiconductor wafer is clamped by a plating jig during the transfer so as to be transferred.

Aiming at the current semiconductor wafer electroplating clamp, a relative scheme is made aiming at the following problems:

since the surface of the semiconductor wafer is smooth and thin, the outer surface of the semiconductor wafer is easily scratched during the clamping process by the clamp, so that the semiconductor wafer generally needs to be coated with a film for protecting the semiconductor wafer, and the film is easily lifted due to the contact between the film and the clamp, so that the protection effect on the semiconductor wafer is reduced.

Disclosure of Invention

The invention mainly aims to overcome the defects of the prior art and provides a semiconductor wafer electroplating clamp.

The invention is realized by adopting the following technical scheme: a semiconductor wafer electroplating clamp structurally comprises a base, a baffle and a clamp, wherein the base is provided with an adjusting rod and an adjusting plate, the adjusting rod is connected to the bottom of the adjusting plate through threads, and the adjusting plate is connected to the baffle through threads; the baffle is provided with semiconductor wafers which are uniformly distributed on the surface of the baffle; the anchor clamps are equipped with bracing piece, bull stick, chuck, the bracing piece welds perpendicularly on the base, the bull stick passes through bolted connection on the bracing piece, the chuck welds on the bull stick.

As optimization, the chuck is equipped with clamp plate, clamp ring, guide rail groove, the clamp plate welds on the bull stick, the clamp ring inlays to be located on the guide rail groove, the guide rail groove inlays to be located on the clamp plate, the clamp plate is circular thin slice, the clamp plate is the metal material, the clamp ring is semi-annular structure, the clamp ring is two, is symmetric distribution on the clamp plate, the guide rail groove is two.

As optimization, the clamp plate is equipped with gasbag, trachea, cardboard, bump, the gasbag inlays and locates the clamp plate below, the trachea is connected in the gasbag both ends, the cardboard welds on the inside bottom surface of clamp plate, the bump inlays and locates on the trachea, the gasbag is the oval structure of cavity, the gasbag is the rubber material, the inside full air that fills of gasbag, the trachea is circular tubular structure, the trachea is the rubber material, the cardboard is the metal material, the bump is semi-circular structure, the bump is the metal material.

Preferably, the clamping ring is provided with a rubber pad, the rubber pad is connected to the inner wall of the clamping ring through a bolt, the rubber pad is made of rubber materials, and the rubber pad is of a U-shaped structure.

Preferably, the rubber pad is of a U-shaped structure, and the rubber pad is provided with sawteeth which are uniformly distributed on the inner wall of the rubber pad.

Advantageous effects

When the semiconductor wafer electroplating clamp works, the invention comprises the following steps:

the clamp plate is provided with the air bag, the air pipe, the clamping plate and the salient points, when the semiconductor wafer is conveyed to the baffle plate, the semiconductor wafer is fixed through the chuck, the clamp plate is extruded through the semiconductor wafer, so that the air bag is extruded, air in the air bag flows towards the air pipe when the air bag is extruded, the air pipe is pushed to expand, the salient points are pushed to move upwards, the clamping ring is pushed upwards, the clamping ring is separated from the control of the clamping plate, the horizontal position of the clamping ring is higher than the position of the clamping plate, and the clamping ring moves in the relative direction through the guide rail groove;

by providing a clamping ring with a rubber pad, the semiconductor wafer is clamped into the rubber pad when the clamping ring is moved in the opposite direction, so that the semiconductor wafer is fixed by the teeth of the rubber pad and the film on the edge of the semiconductor wafer is clamped by the rubber pad.

Compared with the prior art, the invention has the beneficial effects that: can be through the extrusion clamp plate to the inside air of pressure-actuated airbag conducts, promotes the bump and up pushes up the clamp ring, promotes the clamp ring and carries out clamping work, thereby with semiconductor wafer embedding rubber pad, press and protect the film of semiconductor wafer outward flange through the rubber pad, avoid the film to peel off in data send process, reduce semiconductor wafer's guard action.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic structural diagram of a semiconductor wafer electroplating jig according to the present invention.

FIG. 2 is a schematic view of the open state of the clamp ring structure of the present invention.

FIG. 3 is a schematic view of the clamp ring structure of the present invention in a closed state.

Fig. 4 is a schematic internal cross-sectional view of the chuck structure of the present invention at rest.

Fig. 5 is a schematic internal sectional view of the chuck structure of the present invention in an operating state.

FIG. 6 is a schematic side sectional view of a clamp ring structure according to the present invention.

In the figure: the device comprises a base 1, a baffle 2, a clamp 3, an adjusting rod 10, an adjusting plate 11, a semiconductor wafer 20, a supporting rod 30, a rotating rod 31, a chuck 32, a pressing plate 320, a clamping ring 321, a guide rail groove 322, an air bag a, an air pipe b, a clamping plate c, salient points d and a rubber pad e.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a semiconductor wafer electroplating jig, which comprises: the structure of the adjustable clamp comprises a base 1, a baffle 2 and a clamp 3, wherein the base 1 is provided with an adjusting rod 10 and an adjusting plate 11, the adjusting rod 10 is connected to the bottom of the adjusting plate 11 through threads, and the adjusting plate 11 is connected to the baffle 2 through threads; the baffle plate 2 is provided with semiconductor wafers 20, and the semiconductor wafers 20 are uniformly distributed on the surface of the baffle plate 2; the clamp 3 is provided with a support rod 30, a rotating rod 31 and a chuck 32, the support rod 30 is vertically welded on the base 1, the rotating rod 31 is connected on the support rod 30 through a bolt, the chuck 32 is welded on the rotating rod 31, the chuck 32 is provided with a pressing plate 320, a clamping ring 321 and a guide rail groove 322, the pressing plate 320 is welded on the rotating rod 31, the clamping ring 321 is embedded on the guide rail groove 322, the guide rail groove 322 is embedded on the pressing plate 320, the pressing plate 320 is used for extruding an air bag a, the clamping ring 321 is used for fixing a semiconductor wafer, the guide rail groove 322 is used for conveying the clamping ring 321 to horizontally move, the pressing plate 320 is provided with an air bag a, an air pipe b, clamping plates c and salient points d, the air bag a is embedded below the pressing plate 320, the air pipe b is connected at two ends of the air bag a, the clamping plates c are welded on the inner bottom surface of the pressing plate 320, the salient points d are embedded on the air pipe b, cardboard c is used for blocking clamp ring 321, controls clamp ring 321's removal, bump d is used for jacking up clamp ring 321, makes clamp ring 321 break away from cardboard c's control, clamp ring 321 is equipped with rubber pad e, rubber pad e passes through bolted connection on clamp ring 321 inner wall, rubber pad e is used for preventing anchor clamps 3 from scraping colored semiconductor wafer's surface when pressing from both sides tight semiconductor wafer, rubber pad e is U type structure, rubber pad e is equipped with the sawtooth, sawtooth evenly distributed is on rubber pad e inner wall, the sawtooth is used for carrying out anti-skidding effect, avoids the anchor clamps the circumstances that appears skidding and drop when pressing from both sides tight semiconductor wafer.

When the clamping device is used, when a semiconductor wafer is conveyed to the baffle 2, the semiconductor wafer is fixed through the chuck 32, the pressing plate 320 is extruded through the semiconductor wafer, so that the air bag a is extruded, the air inside the air bag a flows towards the air pipe b when the air bag a is extruded, the air pipe b is pushed to expand, the salient point d is pushed to move upwards, the clamping ring 321 is pushed upwards, the clamping ring 321 is separated from the control of the clamping plate c, the horizontal position of the clamping ring 321 is higher than the position of the clamping plate c, the clamping ring 321 moves in the relative direction through the guide rail groove 322, the semiconductor wafer is clamped into the rubber pad e, the semiconductor wafer is fixed through the sawteeth of the rubber pad e, and the thin film on the edge of the semiconductor wafer is clamped through the rubber pad e.

Compared with the prior art, the invention has the technical progress that:

can be through the extrusion clamp plate to the inside air of pressure-actuated airbag conducts, promotes the bump and up pushes up the clamp ring, promotes the clamp ring and carries out clamping work, thereby with semiconductor wafer embedding rubber pad, press and protect the film of semiconductor wafer outward flange through the rubber pad, avoid the film to peel off in data send process, reduce semiconductor wafer's guard action.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a semiconductor wafer electroplating clamp, its structure includes base (1), baffle (2), anchor clamps (3), its characterized in that: the base (1) is provided with an adjusting rod (10) and an adjusting plate (11), the adjusting rod (10) is connected to the bottom of the adjusting plate (11) through threads, and the adjusting plate (11) is connected to the baffle (2) through threads; the baffle plate (2) is provided with semiconductor wafers (20), and the semiconductor wafers (20) are uniformly distributed on the surface of the baffle plate (2); the fixture (3) is provided with a support rod (30), a rotating rod (31) and a chuck (32), the support rod (30) is perpendicularly welded on the base (1), the rotating rod (31) is connected onto the support rod (30) through a bolt, and the chuck (32) is welded on the rotating rod (31); the clamping head (32) is provided with a pressing plate (320), a clamping ring (321) and a guide rail groove (322), the pressing plate (320) is welded on the rotating rod (31), the clamping ring (321) is embedded in the guide rail groove (322), and the guide rail groove (322) is embedded in the pressing plate (320); the pressing plate (320) is provided with an air bag (a), an air pipe (b), a clamping plate (c) and salient points (d), the air bag (a) is embedded below the pressing plate (320), the air pipe (b) is connected to two ends of the air bag (a), the clamping plate (c) is welded on the bottom surface inside the pressing plate (320), and the salient points (d) are embedded on the air pipe (b); the clamping ring (321) is provided with a rubber pad (e), and the rubber pad (e) is connected to the inner wall of the clamping ring (321) through a bolt; the rubber pad (e) is of a U-shaped structure, and the rubber pad (e) is provided with sawteeth which are uniformly distributed on the inner wall of the rubber pad (e).

2. A semiconductor wafer plating jig according to claim 1, characterized in that: in use, when the semiconductor wafer is transferred onto the baffle plate (2), the semiconductor wafer is fixed by the clamping head (32), the pressing plate (320) is pressed by the semiconductor wafer, thereby the air bag (a) is pressed, the air inside the air bag (a) flows to the air pipe (b) when the air bag (a) is pressed, thereby pushing the trachea (b) to swell and the salient point (d) to move upwards so as to push the clamp ring (321) upwards, so that the clamping ring (321) is separated from the control of the clamping plate (c), the horizontal position of the clamping ring (321) is higher than that of the clamping plate (c), so that the clamping ring (321) moves in the opposite direction through the guide rail groove (322), thereby clamping the semiconductor wafer into the rubber pad (e), so that the semiconductor wafer is fixed by the sawteeth of the rubber pad (e), and the film on the edge of the semiconductor wafer is clamped by the rubber pad (e).