CN110129868A - A kind of semiconductor crystal wafer electroplating clamp - Google Patents
A kind of semiconductor crystal wafer electroplating clamp Download PDFInfo
- Publication number
- CN110129868A CN110129868A CN201910435555.1A CN201910435555A CN110129868A CN 110129868 A CN110129868 A CN 110129868A CN 201910435555 A CN201910435555 A CN 201910435555A CN 110129868 A CN110129868 A CN 110129868A
- Authority
- CN
- China
- Prior art keywords
- semiconductor crystal
- crystal wafer
- rubber pad
- baffle
- clamp ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of semiconductor crystal wafer electroplating clamp, structure includes pedestal, baffle, fixture, and pedestal is equipped with adjusting rod, adjustable plate, and adjusting rod is threadingly attached to adjustable plate bottom, and adjustable plate is threadingly attached on baffle；Baffle is equipped with semiconductor crystal wafer, and semiconductor crystal wafer is uniformly distributed on baffle surface；Fixture is equipped with support rod, bull stick, collet; support rod vertical welding is on pedestal; bull stick is bolted on support rod; collet is welded on bull stick; the beneficial effects of the present invention are: can be by squeezing pressing plate; it is conducted to press the air of inside air bag; salient point is pushed up to push up clamp ring; clamp ring is pushed to be clamped work; to which semiconductor crystal wafer is embedded in rubber pad; the outer peripheral film of semiconductor crystal wafer is pressed and protected by rubber pad, film is avoided to peel off in transmit process, the protective effect of semiconductor crystal wafer is reduced.
Description
Technical field
The present invention relates to semiconductor field, specifically a kind of semiconductor crystal wafer electroplating clamp.
Background technique
Semiconductor crystal wafer is a kind of silicon wafer of integrated circuit board, generally unavoidable when carrying out semiconductor crystal wafer processing
The etching for carrying out connecting line construction needs to be transmitted movement during carrying out semiconductor crystal wafer processing, in transmission half
Semiconductor wafer is clamped to be transmitted by electroplating clamp.
For the problem that current semiconductor crystal wafer electroplating clamp, opposite scheme has been formulated for existing below:
Because the surface of semiconductor crystal wafer is smooth, thickness is thin, is easy to scratch during through clamp and partly lead
The outer surface of body wafer, therefore overlay film is carried out to semiconductor crystal wafer in order to protect semiconductor crystal wafer to generally require, and film is pressing from both sides
The film of semiconductor crystal wafer outer surface can be easy to cause to be raised, thus to semiconductor die because contacting back and forth in tight process
Round protective effect reduces.
Summary of the invention
It is a primary object of the present invention to overcome the deficiencies of the prior art and provide a kind of semiconductor crystal wafer electroplating clamp.
The present invention adopts the following technical scheme that realize: a kind of semiconductor crystal wafer electroplating clamp, and structure includes pedestal, gear
Plate, fixture, the pedestal are equipped with adjusting rod, adjustable plate, and the adjusting rod is threadingly attached to adjustable plate bottom, the adjusting
Plate is threadingly attached on baffle；The baffle is equipped with semiconductor crystal wafer, and the semiconductor crystal wafer is uniformly distributed in baffle sheet
On face；The fixture is equipped with support rod, bull stick, collet, and for the support rod vertical welding on pedestal, the bull stick passes through bolt
It is connected on support rod, the collet is welded on bull stick.
As optimization, the collet is equipped with pressing plate, clamp ring, guide-track groove, and the pressing plate is welded on bull stick, and the clamp ring is embedding
On guide-track groove, the guide-track groove is embedded on pressing plate, and the pressing plate is thin rounded flakes, and the pressing plate is metal material, institute
Stating clamp ring is semicircular configuration, and the clamp ring is two, is symmetric on pressing plate, the guide-track groove is two.
As optimization, the pressing plate is equipped with air bag, tracheae, snap-gauge, salient point, and the air bag is embedded at below pressing plate, described
Tracheae is connected to balloon ends, and the snap-gauge is welded in pressing plate inner bottom surface, and the salient point is embedded on tracheae, the air bag
For hollow elliptical structure, the air bag is rubber material, and the inside air bag fills full air, and the tracheae is round tubular
Structure, the tracheae are rubber material, and the snap-gauge is metal material, and the salient point is semicircular structure, and the salient point is gold
Belong to material.
As optimization, the clamp ring is equipped with rubber pad, and the rubber pad is bolted on clamp ring inner wall, the rubber
Rubber mat is rubber material, and the rubber pad is U-shaped structure.
As optimization, the rubber pad is U-shaped structure, and the rubber pad is equipped with sawtooth, and the sawtooth is uniformly distributed in rubber
On rubber mat inner wall.
Beneficial effect
When a kind of semiconductor crystal wafer electroplating clamp of the present invention is worked:
By being equipped with a kind of pressing plate, the pressing plate is equipped with air bag, tracheae, snap-gauge, salient point, when semiconductor crystal wafer is transmitted to gear
When on plate, semiconductor crystal wafer is fixed by collet, pressing plate is squeezed by semiconductor crystal wafer, so that air bag is extruded,
Air inside when air bag is extruded, so that tracheae be pushed to swell, pushes salient point to move up, so that clamp ring is past towards flowing in tracheae
Upper top, so that clamp ring is detached from the control of snap-gauge, so that the horizontal position of clamp ring is higher than the position of snap-gauge, so that clamp ring passes through guide rail
It is mobile that slot carries out relative direction；
By being equipped with a kind of clamp ring, the clamp ring is equipped with rubber pad, when clamp ring carries out relative direction movement, thus by half
Semiconductor wafer sticks into rubber pad, so that the sawtooth by rubber pad fixes semiconductor crystal wafer, will partly be led by rubber pad
Film on body crystal round fringes is clamped.
It compared with prior art, the beneficial effects of the present invention are: can be by squeezing pressing plate, to press inside air bag
Air is conducted, and salient point is pushed up to push up clamp ring, pushes clamp ring to be clamped work, so that semiconductor crystal wafer is embedded in rubber
In rubber mat, the outer peripheral film of semiconductor crystal wafer is pressed and protected by rubber pad, avoids film in transmit process
It peels off, the protective effect of semiconductor crystal wafer is reduced.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is a kind of structural schematic diagram of semiconductor crystal wafer electroplating clamp of the present invention.
Fig. 2 is the schematic diagram under hairpin loop structure open state of the present invention.
Fig. 3 is the schematic diagram under hairpin loop structure closed state of the present invention.
Fig. 4 is the internal sectional schematic diagram under chuck structure stationary state of the present invention.
Fig. 5 is the internal sectional schematic diagram under chuck structure working condition of the present invention.
Fig. 6 is the side elevational cross-section schematic diagram of hairpin loop structure of the present invention.
In figure: pedestal 1, baffle 2, fixture 3, adjusting rod 10, adjustable plate 11, semiconductor crystal wafer 20, support rod 30, bull stick
31, collet 32, pressing plate 320, clamp ring 321, guide-track groove 322, air bag a, tracheae b, snap-gauge c, salient point d, rubber pad e.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1-6, the present invention provides a kind of semiconductor crystal wafer electroplating clamp technical solution: its structure include pedestal 1,
Baffle 2, fixture 3, the pedestal 1 are equipped with adjusting rod 10, adjustable plate 11, and the adjusting rod 10 is threadingly attached to adjustable plate 11
Bottom, the adjustable plate 11 are threadingly attached on baffle 2；The baffle 2 is equipped with semiconductor crystal wafer 20, the semiconductor die
Circle 20 is uniformly distributed on 2 surface of baffle；The fixture 3 is equipped with support rod 30, bull stick 31, collet 32, and the support rod 30 hangs down
Directly it is welded on pedestal 1, the bull stick 31 is bolted on support rod 30, and the collet 32 is welded on bull stick 31,
The collet 32 is equipped with pressing plate 320, clamp ring 321, guide-track groove 322, and the pressing plate 320 is welded on bull stick 31, the clamp ring 321
It is embedded on guide-track groove 322, the guide-track groove 322 is embedded on pressing plate 320, and the pressing plate 320 is used for extruding gasbag a, described
Clamp ring 321 is for fixing semiconductor crystal wafer, and the guide-track groove 322 is horizontally moved for transmitting clamp ring 321, the pressure
Plate 320 is embedded at 320 lower section of pressing plate equipped with air bag a, tracheae b, snap-gauge c, salient point d, the air bag a, and the tracheae b is connected to gas
The both ends capsule a, the snap-gauge c are welded in 320 inner bottom surface of pressing plate, and the salient point d is embedded on tracheae b, and the snap-gauge c is used for
Clamp ring 321 is blocked, the movement of clamp ring 321 is controlled, the salient point d makes clamp ring 321 be detached from the control of snap-gauge c for jacking up clamp ring 321
System, the clamp ring 321 are equipped with rubber pad e, and the rubber pad e is bolted on 321 inner wall of clamp ring, the rubber pad e
For preventing fixture 3 from scratching the outer surface of semiconductor crystal wafer in clamping semiconductor wafer, the rubber pad e is U-shaped structure, institute
Rubber pad e is stated equipped with sawtooth, the sawtooth is uniformly distributed on rubber pad e inner wall, and the sawtooth is kept away for carrying out anti-skidding effect
Exempt from fixture and has skidded the case where falling off in clamping semiconductor wafer.
When in use, when semiconductor crystal wafer is transmitted on baffle 2, semiconductor crystal wafer is fixed by collet 32, is led to
Cross semiconductor crystal wafer and squeeze pressing plate 320 so that air bag a is extruded, when air bag a is extruded inside air towards in tracheae b
Flowing pushes salient point d to move up so that tracheae b be pushed to swell, to clamp ring 321 up be pushed up, so that clamp ring 321 is detached from snap-gauge c
Control so that the horizontal position of clamp ring 321 is higher than the position of snap-gauge c, so that clamp ring 321 is carried out relatively by guide-track groove 322
Direction is mobile, to semiconductor crystal wafer be sticked into rubber pad e, to be fixed semiconductor crystal wafer by the sawtooth of rubber pad e
Firmly, the film in semiconductor die the edge of the circle is clamped by rubber pad e.
The technological progress that the present invention obtains compared with the prior art is:
, so that the air for pressing inside air bag is conducted, salient point can be pushed up to push up clamp ring by squeezing pressing plate,
Clamp ring is pushed to be clamped work, to semiconductor crystal wafer is embedded in rubber pad, by rubber pad to outside semiconductor crystal wafer
The film of edge is pressed and is protected, and film is avoided to peel off in transmit process, is reduced to the protective effect of semiconductor crystal wafer.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection scope of invention.
Claims (5)
1. a kind of semiconductor crystal wafer electroplating clamp, structure includes pedestal (1), baffle (2), fixture (3), it is characterised in that:
The pedestal (1) is equipped with adjusting rod (10), adjustable plate (11), and the adjusting rod (10) is threadingly attached to adjustable plate
(11) bottom, the adjustable plate (11) are threadingly attached on baffle (2)；
The baffle (2) is equipped with semiconductor crystal wafer (20), and the semiconductor crystal wafer (20) is uniformly distributed on baffle (2) surface；
The fixture (3) is equipped with support rod (30), bull stick (31), collet (32), and support rod (30) vertical welding is in pedestal
(1) on, the bull stick (31) is bolted on support rod (30), and the collet (32) is welded on bull stick (31).
2. a kind of semiconductor crystal wafer electroplating clamp according to claim 1, it is characterised in that: the collet (32) is equipped with pressure
Plate (320), clamp ring (321), guide-track groove (322), the pressing plate (320) are welded on bull stick (31), and the clamp ring (321) is embedded
In on guide-track groove (322), the guide-track groove (322) is embedded on pressing plate (320).
3. a kind of semiconductor crystal wafer electroplating clamp according to claim 2, it is characterised in that: the pressing plate (320) is equipped with
Air bag (a), tracheae (b), snap-gauge (c), salient point (d), the air bag (a) are embedded at below pressing plate (320), and the tracheae (b) is even
Air bag (a) both ends are connected to, the snap-gauge (c) is welded in pressing plate (320) inner bottom surface, and the salient point (d) is embedded at tracheae (b)
On.
4. a kind of semiconductor crystal wafer electroplating clamp according to claim 2, it is characterised in that: the clamp ring (321) is equipped with
Rubber pad (e), the rubber pad (e) are bolted on clamp ring (321) inner wall.
5. a kind of semiconductor crystal wafer electroplating clamp according to claim 4, it is characterised in that: the rubber pad (e) is U-shaped
Structure, the rubber pad (e) are equipped with sawtooth, and the sawtooth is uniformly distributed on rubber pad (e) inner wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910435555.1A CN110129868B (en) | 2019-05-23 | 2019-05-23 | Semiconductor wafer electroplating clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910435555.1A CN110129868B (en) | 2019-05-23 | 2019-05-23 | Semiconductor wafer electroplating clamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110129868A true CN110129868A (en) | 2019-08-16 |
| CN110129868B CN110129868B (en) | 2021-08-03 |
Family
ID=67572972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910435555.1A Active CN110129868B (en) | 2019-05-23 | 2019-05-23 | Semiconductor wafer electroplating clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110129868B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513109A (en) * | 2022-11-03 | 2022-12-23 | 泓浒(苏州)半导体科技有限公司 | Clamping and conveying device for semiconductor wafer |
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|---|---|---|---|---|
| US5429733A (en) * | 1992-05-21 | 1995-07-04 | Electroplating Engineers Of Japan, Ltd. | Plating device for wafer |
| CN1670539A (en) * | 2004-03-15 | 2005-09-21 | 未来产业株式会社 | Transducer assembly for semiconductor device testing processors |
| CN102117736A (en) * | 2006-02-22 | 2011-07-06 | 株式会社荏原制作所 | Substrate treating device, substrate conveying device, substrate grasping device, and chemical solution treating device |
| US20140182631A1 (en) * | 2012-12-28 | 2014-07-03 | Tokyo Electron Limited | Cleaning jig and cleaning method for cleaning substrate processing apparatus, and substrate processing system |
| CN104867846A (en) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备（上海）有限公司 | Wafer processing device |
| CN106449510A (en) * | 2016-09-26 | 2017-02-22 | 天津华海清科机电科技有限公司 | Wafer transmission device |
| CN207233720U (en) * | 2017-07-19 | 2018-04-13 | 常州旺童半导体科技有限公司 | A kind of wafer clamp for machining |
| CN109056018A (en) * | 2018-10-15 | 2018-12-21 | 安徽宏实自动化装备有限公司 | A kind of ultrasonic enhancing electroplanting device |
| CN109103137A (en) * | 2018-08-17 | 2018-12-28 | 浙江雅市晶科技有限公司 | A kind of grabbing device of semiconductor haulage equipment |
| CN211980588U (en) * | 2020-04-30 | 2020-11-20 | 上海灏谷集成电路技术有限公司 | Wafer positioning structure for reducing film defects |
-
2019
- 2019-05-23 CN CN201910435555.1A patent/CN110129868B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5429733A (en) * | 1992-05-21 | 1995-07-04 | Electroplating Engineers Of Japan, Ltd. | Plating device for wafer |
| CN1670539A (en) * | 2004-03-15 | 2005-09-21 | 未来产业株式会社 | Transducer assembly for semiconductor device testing processors |
| CN102117736A (en) * | 2006-02-22 | 2011-07-06 | 株式会社荏原制作所 | Substrate treating device, substrate conveying device, substrate grasping device, and chemical solution treating device |
| US20140182631A1 (en) * | 2012-12-28 | 2014-07-03 | Tokyo Electron Limited | Cleaning jig and cleaning method for cleaning substrate processing apparatus, and substrate processing system |
| CN104867846A (en) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备（上海）有限公司 | Wafer processing device |
| CN106449510A (en) * | 2016-09-26 | 2017-02-22 | 天津华海清科机电科技有限公司 | Wafer transmission device |
| CN207233720U (en) * | 2017-07-19 | 2018-04-13 | 常州旺童半导体科技有限公司 | A kind of wafer clamp for machining |
| CN109103137A (en) * | 2018-08-17 | 2018-12-28 | 浙江雅市晶科技有限公司 | A kind of grabbing device of semiconductor haulage equipment |
| CN109056018A (en) * | 2018-10-15 | 2018-12-21 | 安徽宏实自动化装备有限公司 | A kind of ultrasonic enhancing electroplanting device |
| CN211980588U (en) * | 2020-04-30 | 2020-11-20 | 上海灏谷集成电路技术有限公司 | Wafer positioning structure for reducing film defects |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513109A (en) * | 2022-11-03 | 2022-12-23 | 泓浒(苏州)半导体科技有限公司 | Clamping and conveying device for semiconductor wafer |
| CN115513109B (en) * | 2022-11-03 | 2023-10-27 | 泓浒(苏州)半导体科技有限公司 | Clamping and conveying device for semiconductor wafer |
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| Publication number | Publication date |
|---|---|
| CN110129868B (en) | 2021-08-03 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20210616 Address after: 200135 A1-2, 1st floor, great wall building, 333 Fute West 1st Road, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Applicant after: WINMAX CONTROL TECHNOLOGY (SHANGHAI) Co.,Ltd. Address before: Quanzhou yikeda semiconductor refrigeration technology Co., Ltd Applicant before: Pan Guokun |
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