CN100418275C - Transducer assembly for semiconductor device testing processors - Google Patents
Transducer assembly for semiconductor device testing processors Download PDFInfo
- Publication number
- CN100418275C CN100418275C CNB2004100089346A CN200410008934A CN100418275C CN 100418275 C CN100418275 C CN 100418275C CN B2004100089346 A CNB2004100089346 A CN B2004100089346A CN 200410008934 A CN200410008934 A CN 200410008934A CN 100418275 C CN100418275 C CN 100418275C
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- latch
- semiconductor device
- conveyor member
- clamping
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Abstract
The present invention relates to a transport assembly for a semiconductor device testing processor, which comprises a transport assembly body, a device base, at least a pair of first clamping teeth, at least a pair of second clamping teeth, a clamping tooth button, a first spring element and a second spring element, wherein the device base is positioned at the bottom of the transport assembly; the pair of clamping teeth are positioned at the opposite side of the device base, are arranged oppositely, and can move away from each other or close to each other for clamping or releasing the opposite side of the semiconductor device; the pair of second clamping teeth are arranged at the opposite sides of the first clamping teeth in rotation for clamping the bottom of the semiconductor device on the device base, and interlock and release the semiconductor device by the release action of the first clamping teeth; the clamping tooth button is arranged on the transport assembly, can move along an upper direction and a lower direction and is connected with one end of each first clamping tooth; the first spring element and the second spring element are respectively used for elastically supporting the first clamping teeth and the second clamping teeth. Thus, the transport assembly ensures to reliably clamp and transport the semiconductor device and contacts a test slot to conveniently test.
Description
Technical field
The present invention relates to the conveyor member on a kind of test board that is installed in the processor that is used for semiconductor test, more specifically, relate to a kind of conveyor member that is used for the semiconducter device testing processor, it is loading semiconductor device reliably, and can be advantageously connected to the test socket the inside of the test position of this device being distributed with the semiconductor device of pin or orbicule or very little ball grid array (BGA) N-type semiconductor N device around those devices bottom.
Background technology
In general, modular integrated circuit (this integrated circuit is with storage or the circuit of non-storing semiconductor device arrangements on a plate) after manufacturing and before dispatching from the factory, all will carry out various tests.
Usually, the test processor that is used for automatic semiconductor test and modular integrated circuit (modularIC), will pass through following steps in the process of testing: the workman is being equipped with on the loading stacker that the pallet for the treatment of the side semiconductor device is contained in processor, above semiconductor device is housed test board (test tray) be sent to test position, then the pin of semiconductor device or orbicule are connected electrically on the joint of test socket, carry out needed test, test board is separated with semiconductor device, according to test result device is classified, and component mounting to the unloading stacker user tray on.
The master that the test board of conveyor member is housed above Fig. 1 shows looks schematic diagram, and Fig. 2 shows the stereogram of the conveyor member of prior art.
Referring to Fig. 1, a plurality of conveyor members 2 are housed on the test board 1 of prior art, this conveyor member 2 is installed on the metal framework 11 at certain intervals, is used for loading semiconductor device in the above.
Referring to Fig. 2, this conveyor member 2 has: a base 22 that is positioned on the hexahedron 21 is used for mounting semiconductor device D in the above; And the latch 23 on a pair of relative side that is positioned at base 22, be used for clamping semiconductor device D.
Referring to Fig. 2, on the conveyor member 2 of prior art semiconductor device D is housed, its surface that is formed with orbicule is up.When the top test board 1 that semiconductor device D is housed is sent to the test position of test processor, the indexing unit of test position (index unit) is pushed conveyor member 2 to test socket, make the orbicule Db of semiconductor device D and the terminal of slot (also can be described as " end pin ", do not draw among the figure) contact, so that can test.
Yet, though when not forming orbicule Db or pin (not shown) in many positions of semiconductor device D, the conveyor member 2 of prior art can pass through latch 23 clamping semiconductor device D fully, but the development trend of semiconductor device shows recently, entire circumference in the bottom of semiconductor device D all is distributed with under the situation of orbicule or pin, perhaps under the minimum situation of the size of semiconductor device D, when be used for parts by latch 23 clamping semiconductor device in fact be not enough reliable, the biography of prior art advance device assembly 2 just can not semiconductor device D be contained in it above.
Summary of the invention
Correspondingly, the present invention relates to a kind of conveyor member that is used for the semiconductor test processor, this conveyor member has solved basically because the limitation of existent technique and one or more problem that shortcoming is brought.
An object of the present invention is to provide a kind of conveyor member that is used for the semiconducter device testing processor, this conveyor member is clamping securely and transmission semiconductor device not only, even under the very little situation of dimensions of semiconductor devices, or at little pin configuration (the Micro Lead Frame that develops recently, be called for short MCF), the whole zone or the edge of the semiconductor device of four limit flat non-pins (Quad Flat No-lead is called for short QFN) or ball grid array (BGA) type all have been covered with under the situation of pin or orbicule, also semiconductor device stably can be linked to each other with test socket and test.
Another object of the present invention provides a kind of conveyor member that is used for the semiconductor test processor, this conveyor member not only can firm clamping and is transmitted semiconductor device, and even under the very thin situation of semiconductor device, also semiconductor device stably can be linked to each other with test socket and tests.
Other features and advantages of the present invention will be described in the explanation of back, be conspicuous for those skilled in the art in a part of following summary of the invention being studied these feature and advantage of back, and can understand by implementing the present invention.The advantage of purpose of the present invention and other will realize and obtain by pointed structure in text description and protection range and the accompanying drawing.
In order to obtain above-mentioned technique effect and other advantage and to reach purpose of the present invention, as example given here embodied and explanation widely, the conveyor member that is used for the semiconducter device testing processor according to the present invention comprises: the conveyor member body; Be positioned at the base of conveyor member body downside; At least one pair of is positioned at the first relative latch of base both sides, and described latch can leave each other or be approaching, in order to clamping be placed on base on the relative side of semiconductor device; At least one pair of is rotatably installed in second latch of the first latch both sides, is positioned at the semiconductor device that the bottom of the semiconductor device on the base and the release movement by first latch discharge interlocking in order to clamping; Be installed in the latch button on conveyor member top, it can move along the vertical direction and link to each other with an end of first latch, is used to move up and down so that first latch is moved; And first and second spring elements that are used for resiliency supported first and second latches.
Conveyor member also comprises from the side-prominent projection in the second latch bottom two, and it is relative with this projection from the side-prominent latch pushing block of test socket two, semiconductor device and test socket carry out electricly contacting and testing, when being positioned at semiconductor device on the base and contacting with test socket, the projection of second latch contacts with the latch pushing block, make second latch outwards rotate, so that discharge of the clamping of second latch to semiconductor device.
Conveyor member also comprises a plurality of little teeth that stretch out from the front end of first latch, and described little tooth is used for the bottom edge of support semiconductor device between pin and orbicule adjacent on the semiconductor device.
Like this, the present invention allows to test reposefully in the following cases, wherein in conveyor member clamping semiconductor device, the first and second latch clamping semiconductor device, and under semiconductor device and situation that test socket contacts, have only second latch outwards to rotate to discharge semiconductor device, this moment, first latch still was in the state of the relative side of clamping semiconductor device, and test, in addition, when the needs conveyor member discharged or receive semiconductor device, first and second latches were simultaneously separately to discharge semiconductor device fully.
It will be appreciated that foregoing description of the present invention and following detailed are exemplary with illustrative, its purpose is the present invention is described further.
Description of drawings
The present invention is described further by accompanying drawing, and accompanying drawing combines and constitute the part of specification with specification, embodiments of the invention is described and explains technical conceive of the present invention with specification.Wherein:
Fig. 1 shows the front view of the test board of the conveyor member that prior art is housed;
Fig. 2 represents the face upwarding stereogram of the conveyor member of prior art;
Fig. 3 represents the stereogram of bottom view of conveyor member according to a preferred embodiment of the invention;
Fig. 4 A-4C is the sectional view of the along the line A-A of the conveyor member in the presentation graphs 3 under in working order respectively;
Fig. 5 represents the stereogram of bottom view of conveyor member according to a further advantageous embodiment of the invention;
Fig. 6 A and 6B be the sectional view of the critical piece of the conveyor member in the presentation graphs 5 under in working order respectively;
Fig. 7 A represents respectively when the conveyor member among Fig. 5 is connected semiconductor device with test socket with 7B, in working order the sectional view of the B-B along the line under;
Fig. 8 represents the face upwarding stereogram of conveyor member according to a further advantageous embodiment of the invention;
The sectional view of the critical piece of the conveyor member in Fig. 9 presentation graphs 8.
Embodiment
Below in conjunction with accompanying drawing to a preferred embodiment of the present invention will be described in detail.
Fig. 3 to Fig. 4 C has illustrated the conveyor member of semiconducter device testing processor according to a preferred embodiment of the present invention, wherein conveyor member 100 comprises a conveyor member body 110, one is positioned at conveyor member body 110 downside central parts, the device base 115 that is used for the mounting semiconductor device, an opposite side that is positioned at base 115, be respectively applied for the relative side of clamping semiconductor device 101 and following first latch 140 and second latch 150, also comprise a latch button 130 that is installed in conveyor member body 110 tops movably, in order to move first latch 140 along the vertical direction.
This assembly has a pair of second latch 150 and is positioned at two couples, first latch 140 of the opposite side of second latch 150.
Middle body at conveyor member body 101 has a radiator 120, is used to suppress the temperature rising of semiconductor device, and has a vertical through hole 122 in the radiator middle part.
Be inserted at latch button 130 under the situation of 116 the insides, hole of radiator 120 both sides, the lower end of each latch button 130 all flexibly is supported on above the body 110 by the first compression spring 132.
Like this, if there is an external force to be applied on the latch button 130, latch button 130 is moved down, gathering sill 144 is subjected to the guiding of guide pin 112, and such first latch 140 just outwards moves along oblique line directions, so that outwards move down; In contrast, if the external force that is applied on the latch button 130 disappears, latch button 130 is moved up by the effect of the elastic force of the first compression spring 132, correspondingly, the gathering sill 144 of first latch 140 is subjected to the guiding of guide pin 112, first latch 140 moves inward along oblique line directions, so that inwardly move upward.
In addition, (this assembly) has from the latch movable block 147 of the lateral projections of first latch 140, so that contact with the inner surface of second latch 150.
Simultaneously, a groove 156 is arranged at second latch 150 top outside it, accommodates an end of second holddown spring 114 in this groove, so that flexibly support conveyor member body 110.Second latch 150 has a projection 158, and protrude its inboard from second latch, 150 bottoms, and below semiconductor device 101; And a projection 154, protrude in its outside from second latch, 150 bottoms, will push this projection 154 when second connects pin 152 rotations second latch 150 with box lunch.
The operational circumstances of conveyor member of the present invention is described below.
Referring to Fig. 4 A, when below the conveyor member 100 that semiconductor device 101 to be measured is sent to test board 1 (referring to Fig. 1) by a device conveyer (not shown) time, thrust assembly 170 moves downward above conveyor member 100, and pushes latch button 130.
When thrust assembly 170 was pushed latch button 130 downwards, as previously mentioned, first latch 140 outwards moved along outside oblique line directions under the guiding of guide pin 112.Meanwhile, when first latch 140 outwards moves, because the inboard that latch movable block 147 promotes second latch 150 makes second latch 150 outwards rotate, so that open (away from each other).
Like this, when first latch 140 and second latch 150 away from each other the time, the bottom push mechanism (not showing among the figure) below the conveyor member 100 upwards promote this semiconductor device 101, so that be placed on the base 115.
If semiconductor device 101 is placed on the base 115, along with thrust assembly 170 moves upward, latch button 130 is also moved up by the effect of first holddown spring, 132 elastic force, first latch 140 is closed along the inside direction of oblique line, clamp the both sides (relative side) of semiconductor device 101, shown in Fig. 4 B.
Meanwhile, along with first latch 140 moves up, second latch 150 is subjected to the elastic force effect of second holddown spring 114, also turns to the inside, and projection 158 just clamps the relative bottom side of semiconductor device 101 like this.
Under semiconductor device 101 is clamped in situation in the conveyor member 100, when test board 1 (as shown in Figure 1) was sent to position at the test socket 160 of test position, a pressing component (not demonstrating among the figure) was pushed conveyor member body 110 to test socket 160.
The latch pushing block 162 that projects upwards from two side portions that test socket has that projection 154 with second latch 150 is complementary.Shown in Fig. 4 C, if conveyor member 100 is to the direction motion of test socket 160, the projection 154 of second latch 150 just contacts with latch pushing block 162, make second latch 150 outwards rotate, second latch 150 opened and discharge clamping this semiconductor device, at this moment have only the opposite flank of first latch, 140 clamping semiconductor device, and make the orbicule 101a on the semiconductor device 101 contact with the connector 164 of test socket 160.
After finishing test, test board is moved to the position of unloading semiconductor device, and according to the description of Fig. 4 A, promotes assembly 170 and move downward once more in this unloading position, and semiconductor device 101 is separated with conveyor member 100.
Simultaneously, when semiconductor device 101 contacts with test socket 160, and when carrying out electric performance test, because heat is discharged into the outside by radiator 120 rapidly from semiconductor device 101, do not need the heat radiation of extra equipment and time, so so just reduced testing time and cost.
And, can be by the through hole 122 test vacuum degrees that are positioned at radiator 120 central authorities, to determine whether semiconductor device 101 is transmitted device assembly 100 clamping correctly.
Fig. 5 to Fig. 7 C has illustrated conveyor member according to a further advantageous embodiment of the invention, wherein this conveyor member 200 comprises a base 215 that is positioned at conveyor member body 210 middle parts, is used to place very little ball grid array (BGA) semiconductor device 102; And the first paired latch 240 and second latch 250 that on oblique line directions, lay respectively at the both sides of base 215.
The detailed structure of first latch 240 and second latch 250 respectively with the foregoing description in first latch 140 identical with second latch 150, omit its explanation at this.
Because conveyor member 200 has first latch 240 and second latch 250 of arranging in oblique line (diagonal) direction each other, conveyor member 200 just can be effectively, the undersized semiconductor device in clamping position securely.
The operation of the conveyor member 200 of another preferred embodiment of the present invention is described below.
Referring to Fig. 6 A or 6B, under the situation of conveyor member 200 receptions or release semiconductor device 102, the thrust assembly 170 of conveyor member 200 tops moves down, and promotes latch button 230.Like this, first latch 240 moves down so that open along outside oblique line directions, meanwhile, second latch 250 also outwards rotates by the effect of the latch moving member 247 on first latch 240, so that open, make conveyor member 200 be in the state that base 215 receives semiconductor device 102 or semiconductor device 102 is discharged from base 215 thus.
Participate in Fig. 6 B or 6A, if thrust assembly 170 moves up, to discharge latch button 130, the latch button just moves up under the elastic force effect of first holddown spring 232, first latch 240 moves along the outside oblique line directions of (inwardly), so that close and clamp the opposite side of semiconductor device 102 in the oblique line position.Meanwhile, when first latch 240 moved up, second latch 250 was subjected to the effect of the elastic force of second holddown spring 214, also turned to the inside, so that clamp the both sides of semiconductor device 102 in the oblique line position.
Simultaneously, referring to Fig. 7 A, contact with test socket under the also tested situation at semiconductor device, if semiconductor device 102 moves down under the state that is arranged in base 215, the projection 254 on second latch 250 just contacts with the latch pushing block 162 of test socket 160 both sides.
Referring to Fig. 7 B, if conveyor member 200 continues to move down under this state, second latch 250 overcomes the elastic force of second holddown spring 214 and opens, orbicule 102a on the semiconductor device 102 contacts with connector 164, the first latch 240 clamping relative side that device as before still under this state.
In case finish test, conveyor member 200 moves to a predetermined unloading position, and semiconductor device 210 separates with conveyor member according to the step shown in Fig. 6 B.
Simultaneously, the conveyor member of Fig. 8 and 9 expression an alternative embodiment of the invention, wherein conveyor member 300 comprises a lot of little tooth 341 of the front end of first latch 340, these little teeth will be placed between the adjacent orbicule 103a of semiconductor device 103, such first latch 340 just can the clamping semiconductor device relative side and the part of bottom surface, when contacting with test socket, can provide more stable support to very thin BGA semiconductor device with convenient BGA semiconductor device.
Certainly, the thickness of little tooth 341 must be thinner than orbicule 103a (part of exposing), like this, the orbicule 103a on the semiconductor device 103 can fully be contacted with connector 164 (referring to Fig. 4 B).
As mentioned above, by being clamped in the semiconductor device that has been covered with limb and orbicule on the whole fringe region securely, and it is contacted with test socket, can improve the reliability of test.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. conveyor member that is used for the semiconducter device testing processor comprises:
A conveyor member body;
A device base that is positioned at conveyor member body bottom;
At least one pair of is positioned at first latch of described device base opposite side, and described first latch is oppositely arranged and can be away from each other or approaching, is positioned at the relative side of the semiconductor device on the described device base in order to clamping or release;
At least one pair of second latch, the opposite flank that it is rotatably installed in described first latch is used for the bottom that clamping is positioned at the semiconductor device on the device base, and cooperates by the release movement with first latch and to discharge semiconductor device;
The latch button, it is installed in the top of described conveyor member, and described latch button can move along the vertical direction and be connected with an end of first latch, thereby in order to move up and down described first latch is moved;
First spring element and second spring element are respectively applied for described first latch of resiliency supported and second latch.
2. conveyor member according to claim 1 also comprises:
The projection of protruding from the opposite side of the bottom of described second latch; And
From the outstanding latch pushing block relative with described projection of the opposite side portion of test socket, described test socket and semiconductor device carry out electric contact and described semiconductor device is tested in described test socket;
Like this, when the semiconductor device on being positioned at described device base contacted with test socket, the projection of second latch contacted with the latch pushing block, and second latch is outwards rotated, so that discharge the clamping of second latch to semiconductor device.
3. conveyor member according to claim 1 also comprises a plurality of little teeth that stretch out from the front end of described first latch, and described little tooth is between pin or orbicule adjacent on the semiconductor device, in order to the bottom edge of support semiconductor device.
4. conveyor member according to claim 2 also comprises a plurality of auxiliary little teeth that stretch out from the front end of described first latch, and described little tooth is between the adjacent pin or orbicule of semiconductor device, in order to the bottom edge of support semiconductor device.
5. conveyor member according to claim 1, an end of wherein said first latch is connected pin with described latch button by one and connects rotationally.
6. conveyor member according to claim 5 also comprises:
Long hole shape oriented groove that is positioned at described first latch middle part and
One is fixed on the conveyor member body so that insert guide pin in the described gathering sill, in order to guide the motion of first latch.
7. conveyor member according to claim 1, also comprise one from the outstanding latch movable block of described first latch, when described first latch separated and discharge semiconductor device, described latch movable block contacted with the inner surface of second latch, and second latch is outwards rotated.
8. conveyor member according to claim 6, also comprise one from the outstanding latch movable block of described first latch, when described first latch separated and discharge semiconductor device, described movable block contacted with the inner surface of second latch, and second latch is outwards rotated.
9. conveyor member according to claim 1, wherein two pairs of described first latches lay respectively at the opposite flank of described second latch.
10. conveyor member according to claim 1, wherein said first latch and second latch are provided with respectively along oblique line directions each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100089346A CN100418275C (en) | 2004-03-15 | 2004-03-15 | Transducer assembly for semiconductor device testing processors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100089346A CN100418275C (en) | 2004-03-15 | 2004-03-15 | Transducer assembly for semiconductor device testing processors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1670539A CN1670539A (en) | 2005-09-21 |
| CN100418275C true CN100418275C (en) | 2008-09-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100089346A Expired - Fee Related CN100418275C (en) | 2004-03-15 | 2004-03-15 | Transducer assembly for semiconductor device testing processors |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100418275C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100860597B1 (en) * | 2007-04-18 | 2008-09-26 | 미래산업 주식회사 | A receiver of an electronic element and a handler including the same |
| KR100865910B1 (en) * | 2007-07-30 | 2008-11-10 | 미래산업 주식회사 | Handler and method of manufacturing semiconductor using the same |
| KR101556324B1 (en) * | 2010-07-15 | 2015-09-30 | (주)테크윙 | Insert for test handler |
| KR101149759B1 (en) * | 2011-03-14 | 2012-06-01 | 리노공업주식회사 | A testing apparatus of the semiconductor device |
| TWI657621B (en) * | 2018-04-12 | 2019-04-21 | 和碩聯合科技股份有限公司 | Test seat for surface-mount device |
| CN110129868B (en) * | 2019-05-23 | 2021-08-03 | 冠礼控制科技（上海）有限公司 | Semiconductor wafer electroplating clamp |
| CN113457997B (en) * | 2021-09-03 | 2021-11-05 | 南通国为半导体科技有限公司 | Semiconductor package element testing device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004061490A (en) * | 2002-07-24 | 2004-02-26 | Mire Kk | Carrier module for semiconductor element test handler, and test array provided therewith |
-
2004
- 2004-03-15 CN CNB2004100089346A patent/CN100418275C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004061490A (en) * | 2002-07-24 | 2004-02-26 | Mire Kk | Carrier module for semiconductor element test handler, and test array provided therewith |
Non-Patent Citations (2)
| Title |
|---|
| 特开2000-195635 2000.07.14 |
| 特开2004-61490 2004.02.26 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1670539A (en) | 2005-09-21 |
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