CN110112595B - 电连接器及电连接器组合 - Google Patents

电连接器及电连接器组合 Download PDF

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CN110112595B
CN110112595B CN201910373636.3A CN201910373636A CN110112595B CN 110112595 B CN110112595 B CN 110112595B CN 201910373636 A CN201910373636 A CN 201910373636A CN 110112595 B CN110112595 B CN 110112595B
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parts
clamping
electrical connector
guide
base
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CN110112595A (zh
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金左锋
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Lotes Guangzhou Co Ltd
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Lotes Guangzhou Co Ltd
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Priority to US16/867,792 priority patent/US11043763B2/en
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Abstract

本发明提供一种电连接器及电连接器组合，包括：一对接组件，包括一载板，及设于所述载板且向下伸出所述载板的多个插接部；一电连接器，用于供所述插接部向下插接，其包括：一基体，设有多个收容孔上下贯穿所述基体；多个端子，收容于所述收容孔，每一端子具有一基部及两个夹持部用于夹持所述插接部，两夹持部位于所述基部的前方且所述基部的顶端低于两夹持部的顶端，当所述插接部被两夹持部共同夹持时，所述插接部低于所述夹持部顶端的部分位于相邻端子的基部正上方；该电连接器及电连接器组合缩短了前后相邻端子之间的距离，从而让端子排布更密集。

Description

电连接器及电连接器组合
【技术领域】
本发明涉及一种电连接器和电连接器组合，尤其涉及一种零插入力的电连接器和电连接器组合
【背景技术】
专利号为CN200720193759.1的中国专利揭示的一种零插入力电连接器，所述电连接器用于电性连接一电子组件至一电路板。所述电子组件包括多数针脚。所述电连接器包括有一座体以及多数电连接器端子，所述座体上下贯穿有多个端子孔，每一所述电连接器端子分别收容于每一所述端子孔，所述电连接器端子具有一基部，从基部的左侧与右侧分别弯折向上延伸一弹性臂，两个弹性臂之间的空间形成一由上而下垂直方向的零插入力式插置空间，并且两弹性臂的上端分别相对于该插置空间而形成一导引部及一接触部；其中两个所述导引部分别相对于该插置空间的水平方向向外且向上斜向延伸，并且朝水平方向且朝远离所述插置空间方向互相接近地延伸，两个所述接触部分别连接两个所述导引部的延伸末端，并且朝水平方向且朝远离所述插置空间方向延伸，并在两个所述接触部之间形成一夹持空间用于夹持所述针脚。所述针脚零插入力式地由上而下置入所述插置空间内，再由两所述导引部导引进入所述夹持空间。
然而，所述插脚进入所述夹持空间后，插脚与相邻的前方电连接器端子的基部之间沿前后方向保持一定的距离，从而前后相邻两电连接器端子之间的距离较大，不利于电连接器端子密集化排布的发展趋势。
因此，有必要设计一种电连接器及电连接器组合，以克服上述问题
【发明内容】
本发明的创作目的在于提供一种端子排布更密集的电连接器及电连接器组合。
为了达到上述目的，本发明的电连接器采用如下技术方案：
一种电连接器，用于电性连接具有多个插接部的对接元件，包括：一基体，设有多个收容孔上下贯穿所述基体；多个端子，分别对应收容于所述收容孔中，所述端子具有一基部及自所述基部向上延伸形成的两个连接部，所述端子还具有两个导引部和两个夹持部，两个导引部之间的间隙大于两个夹持部之间的间隙，所述导引部连接所述连接部，所述夹持部自所述导引部向前延伸形成，两夹持部用于夹持所述插接部，当所述插接部向下插入两导引部之间后所述导引部导引所述插接部向前移动至所述夹持部，所述基部的顶端低于所述夹持部的顶端，从而于所述基部的正上方形成一收容空间位于所述导引部的后方，所述收容空间的高度介于所述夹持部的顶端和所述基部的顶端之间，当所述插接部被两夹持部共同夹持时，所述插接部低于所述夹持部顶端的部分向前凸出于所述夹持部而被收容于前方相邻端子的收容空间中。
进一步，所述基体为电路板，自所述基部向下延伸形成至少一固定部固定于所述收容孔，至少一导向部自所述固定部向下倾斜延伸形成且伸出所述收容孔，以焊接于一主电路板，所述基部位于所述基体外，所述夹持部的前端向前超出所述固定部。
进一步，所述固定部有两个，一第一通槽形成于两个所述固定部的前侧之间，一第二通槽形成于两个所述固定部的后侧之间。
进一步，所述导向部有两个且分开设置，一第一开口形成于两个所述导向部的前侧之间，一第二开口形成于两个所述导向部的后侧之间。
进一步，所述导向部有两个且分开设置，一第一开口形成于两个所述导向部的前侧之间，一第二开口形成于两个所述导向部的后侧之间。
进一步，所述端子还包括多个接地端子，所述基体的下表面具有一屏蔽层，所述收容孔的内壁为绝缘，通过焊料将所述接地端子焊接于一主电路板，所述焊料连接所述接地端子与所述屏蔽层。
进一步，所述插接部为球状，每一端子的两夹持部之间的距离从下向上逐渐变小，且两夹持部夹持所述插接部的位置高于所述插接部的水平中心线。
与现有技术相比，本发明的电连接器具有以下有益效果：
本发明通过设置所述插接部低于所述导引部的顶端的部分向前凸出于所述夹持部而被收容于相邻端子的收容空间中，使得所述插接部与前方相邻端子可以沿上下方向重叠设置而不必前后保持一定距离，缩短了前后相邻端子之间的距离，从而让端子排布更密集。
为了达到上述目的，本发明的电连接器组合采用如下技术方案：
一种电连接器组合，包括：一对接元件，包括一载板，及设于所述载板且向下伸出所述载板的多个插接部；一电连接器，用于供所述插接部向下插接，其包括：一基体，设有多个收容孔上下贯穿所述基体；多个端子，收容于所述收容孔，每一端子具有一基部及两个夹持部用于夹持所述插接部，两夹持部位于所述基部的前方且所述基部的顶端低于两夹持部的顶端，当所述插接部被两夹持部共同夹持时，所述插接部低于所述夹持部顶端的部分位于相邻端子的基部正上方。
进一步，自所述基部向上延伸两个连接部，自两夹持部向后延伸形成两导引部，以导引所述插接部向前移动，两夹持部之间的距离小于两导引部之间的距离，所述导引部连接所述连接部，所述夹持部的前端向前超出所述连接部。
进一步，所述插接部为球状且由铜制成。
进一步，每一端子的两夹持部之间的距离从下向上逐渐变小，且两夹持部夹持所述插接部的位置高于所述插接部的水平中心线。
进一步，所述载板的上表面具有多个焊接区分别用于对应焊接一芯片模块的多个导电体,相邻两所述插接部之间的距离大于相邻两所述导电体之间的距离。
进一步，所述基体为电路板，自所述基部向下延伸形成至少一固定部固定于所述收容孔，至少一导向部自所述固定部向下倾斜延伸形成且伸出所述收容孔，以焊接于一主电路板，所述基部位于所述基体外，所述夹持部的前端向前超出所述固定部。
进一步，所述固定部有两个，一第一开口形成于两个所述固定部的前侧之间，一第二开口形成于两个所述固定部的后侧之间。
进一步，所述导向部有两个且分开设置，一第一开口形成于两个所述导向部的前侧之间，一第二开口形成于两个所述导向部的后侧之间。
进一步，所述端子还包括多个接地端子，所述基体的上表面和所述载板的下表面分别具有一屏蔽层，所述接地端子与所述屏蔽层电性连接所述端子还包括多个接地端子，所述基体的下表面具有一屏蔽层，所述收容孔的内壁没有导电层，通过焊料将所述接地端子焊接于一主电路板，所述焊料连接所述接地端子与所述屏蔽层。
进一步，所述载板设有一被挡部，一挡止部位于所述被挡部前方，所述挡止部向前抵挡所述被挡部。
与现有技术相比，本发明的电连接器组合具有以下有益效果：
本发明通过设置所述插接部低于所述夹持部顶端的部分位于相邻端子的基部正上方，使得所述插接部与前方相邻端子可以沿上下方向重叠设置而不必前后保持一定距离，缩短了前后相邻端子之间的距离，从而让端子排布更密集。
【附图说明】
图1为本发明电连接器组合的插接部移至夹持部时的立体视图；
图2为图1的分解视图；
图3为图1的右视图；
图4本发明电连接器组合的插接部向下插入两导引部之间后未移至夹持部时的视图；
图5为本发明电连接器的俯视图；
图6为图5的B-B位置的剖视图；
图7为图3的C-C位置的剖视图；
图8本发明端子夹持所述插接部时的立体视图；
图9为图8的俯视图；
图10为本发明端子的主视图；
图11为图10的俯视图；
图12为图10的右视图；
图13为本发明的芯片模块与载板连接示意图；
图14为端子与主电路板焊接示意图。
具体实施方式的附图标号说明：
Figure BDA0002050875340000051
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等，现结合附图和具体实施方式对本发明作进一步说明。
如图1-14所示，本发明电连接器组合，用以电性连接一芯片模块500至一主电路板800，其包括一对接元件400及一电连接器300，所述对接元件400包括一载板4及设于所述载板4且向下伸出所述载板4的多个插接部2，所述插接部2为球状且由铜制成(当然,在其它实施例中,所述插接部2也可为细长的圆柱状或平板状或其它形状)，所述芯片模块500承载于所述载板4的上表面且两者电性连接；所述电连接器300位于所述主电路板800上，其包括一基体3及收容于所述基体3的多个端子1。
如图1、2、7所示，所述基体3为电路板(当然在其它实施例中并不限于此)，所述基体3上下贯穿有多个收容孔31，所述收容孔31的内壁没有导电层，即所述所述收容孔31的内壁为绝缘，所述收容孔31的横截面为圆形，多个所述收容孔31包括多个第一收容孔311和多个第二收容孔312，所述基体3上表面镀有一第三屏蔽层33，所述第三屏蔽层33覆盖至所述第二收容孔312的上边缘；所述基体3的上表面具有一绝缘区域32围设于所述第一收容孔311且位于所述第一收容孔311与所述第三屏蔽层33之间，使得所述第一收容孔311与所述第三屏蔽层33隔开；所述基体3下表面具有一第四屏蔽层34，所述第四屏蔽层34延伸至所述第二收容孔312的下边缘,所述第四屏蔽层34与所述第一收容孔311的下边缘之间具有间隔。
如图8、9、12所示，所述端子1具有一基部13呈环状，所述基部13的前侧形成有一缺口16；自所述基部13向上延伸两连接部14，所述端子1还具有两个导引部12和两个夹持部11，两夹持部11用于夹持所述插接部2，两导引部12之间的距离大于两夹持部11之间的距离，从而两导引部12之间的距离大于所述插接部2的直径，从而实现所述插接部2以零插入力向下插入两导引部12之间，然后所述导引部12导引所述插接部2水平移动至所述夹持部11(如图4、5所示)，所述导引部12连接所述连接部14，所述夹持部11自所述导引部12向前延伸形成。沿自下向上的方向，所述连接部14向外扩张(当然，在其它实施例中，所述连接部14也可以只有一部分向外扩张)，且所述导引部12向内倾斜，也就是说，两连接部14之间的距离从下向上逐渐变大，两个导引部12之间的距离从下向上逐渐变小，从而两夹持部11之间的距离从下向上逐渐变小，以方便所述夹持部11夹持所述插接部2的位置高于所述插接部2的水平中心线L。当所述插接部2被所述夹持部11夹持时，如若所述夹持部11夹持所述插接部2的位置低于所述插接部2的水平中心线L，插接部2会受到来自夹持部11向上的推力，导致所述芯片模块500往上移。因而，在本实施例中，所述夹持部11夹持所述插接部2的位置高于所述插接部2的水平中心线L，从而使得所述夹持部11对插接部2形成一个向下的压力，避免了插接部2受向上的推力而导致芯片模块500往上移。所述基部13正上方具有一收容空间15，所述收容空间15位于所述导引部12的后方，如图3所示，当所述插接部2被所述夹持部11夹持时，所述插接部2低于所述夹持部11的顶端的部分向前凸出于所述夹持部11而被收容于相邻端子1的收容空间15中，即所述插接部2低于所述夹持部11的顶端的部分位于所述基部13正上方。所述基部13位于所述收容孔31外，自所述基部13向下延伸两固定部17(当然，在其它实施例中，也可以只有一个固定部17)，所述夹持部11的前端向前超出所述固定部17，如图6所示，所述固定部17与所述收容孔31干涉配合而将所述端子1固定于所述收容孔31中，如图7所示，所述固定部17的表面为与所述收容孔31的内壁匹配的弧面，从而所述固定部17与所述收容孔31的内壁有更大的接触面积，使得所述端子1更牢固的固定于所述基体3，两固定部17的前侧分别相向凸设一凸部171，一第一通槽1a形成于两固定部17的前侧之间，一第二通槽1b形成于两固定部17的后侧之间。所述端子1还具有两个分开设置的导向部18(当然，在其它实施例中，也可以只有一个导向部18)，从而一第一开口1c形成于两个所述导向部18的前侧之间，一第二开口1d形成于两个所述导向部18的后侧之间，所述第一通槽1a、所述第二通槽1b、所述第一开口1c、所述第二开口1d可以减少所述端子1的横截面积，增大特性阻抗，改善高频。所述导向部18自所述固定部17向下倾斜延伸，用于导引所述端子1插入所述收容孔31中，所述导向部18一部分位于所述收容孔31中另一部分伸出所述收容孔31以与所述主电路板800焊接。
如图5、6所示，多个所述端子1包括多个信号端子200分别对应收容于所述第一收容孔311中及至多个接地端子100分别对应收容于所述第二收容孔312中，所述信号端子200与所述第三屏蔽层33和所述第四屏蔽层34不导通，由于所述接地端子100的固定部17贴紧所述第二收容孔312的上边缘，使得所述接地端子100与所述第三屏蔽层33接触从而电性导通，如图14所示，因所述接地端子100的导向部18部分位于所述第二收容孔312，故所述导向部18与所述第二收容孔312的下边缘之间有间隔，通过焊料700将所述导向部18焊接于所述主电路板800时所述焊料700填充所述接地端子100的导向部18与所述第四屏蔽层34之间的间隔，从而使得所述焊料700均连接所述第四屏蔽层34和所述导向部18，使得所述第四屏蔽层34与所述接地端子100电性导通。
如图1、2、13所示，所述载板4的材质为印刷电路板，具体为FR4，所述载板4上表面与下表面之间具有多层印刷电路45，所述载板4的前侧面设有一被挡部41，自所述载板4的前侧面向内凹陷形成一防呆槽44。所述载板4的下表面具有一第一屏蔽层42，所述载板4的上表面具有一第二屏蔽层43。如图1、3所示，所述插接部2的顶部向上焊接于所述载板4的下表面，所述插接部2由铜制成，可为纯铜或铜合金，本实例中为铜合金，具体为98％重量的黄铜和2％重量的锡，另外所述插接部2表面镀有防氧化的镀层，所述镀层的材料为金。多个所述插接部2包括多个第一插接部21供所述信号端子200夹持和多个第二插接部22供所述接地端子100夹持。第一屏蔽层42延伸至所述第二插接部22从而所述第一屏蔽层42与所述第二插接部22导通，从而将多个所述第二插接部22相互串联，所述第一屏蔽层42与所述第一插接部21具有间隔从而使得第一屏蔽层42与第一插接部21不导通,但是所述第二屏蔽层43与所述印刷电路45连接且所述印刷电路45与所述第二插接部22连接,从而使得所述第二屏蔽层43与所述第二插接部22电性连接。如图13所示，所述载板4的上表面还具有多个焊接区46，所述芯片模块500具有多个导电体600焊接于多个所述焊接区46，所述导电体600与所述第二屏蔽层43之间有间隔从而所述导电体600与所述所述第二屏蔽层43不导通。所述导电体600通过多层印刷电路45与所述插接部2电性导通，相邻两所述插接部2之间的距离大于相邻两所述导电体600之间的距离，使得有足够的空间设置与所述导电体600数量相同的所述端子1。
如图1、2所示，一挡框5向下延伸有多个固定柱53分别对应向下插入所述固定孔35以将所述挡框5固定于基体3上，所述挡框5具有一挡止部51位于所述被挡部41的前方、以及具有一防呆部52，将所述载板4向下安装于所述电连接器300时，所述防呆部52收容于所述防呆槽44，避免装反。所述挡止部51沿前后方向与所述被挡部41重叠，所述插接部2水平移动至所述夹持部11时，所述挡止部51沿所述插接部2的水平移动方向向前抵挡所述被挡部41。
综上所述，本发明的电连接器300及电连接器组合具有下列有益效果：
(1)由于所述端子1的两个夹持部11之间的距离从下向上逐渐变小，且所述夹持部11夹持所述插接部2的位置高于插接部2的水平中心线L，从而使得所述夹持部11对插接部2形成一个向下的压力，避免了插接部2受向上的推力而导致芯片模块500往上移。
(2)本发明由于所述插接部2为球状，故所述插接部2沿上下方向的长度较短而宽度较大，所述插接部2有足够的强度抵抗受到的外力撞击，故所述插接部2不易变形，从而保证端子1与所述插接部2的良好接触。另外，由于所述插接部2沿上下方向的长度较短，故所述插接部2下端离其被所述夹持部11夹持的位置较近，因而可以改善木桩效应，从而改善高频。再者，由于所述插接部2由铜制成，故熔点较高，可以承受芯片模块500运行时的高温而不会发生蠕变或潜变而偏离所述夹持部11，影响芯片模块500与电连接器300电性连接的稳定性。另外，铜的硬度较好，故镀于铜表面的防氧化层不容易被夹持部11刮擦损坏。
(3)由于所述插接部2低于所述导引部12的顶端的部分向前凸出于所述夹持部11而被收容于前相邻端子1的收容空间15中，即所述插接部2低于所述夹持部11顶端的部分位于相邻端子1的基部13正上方，可以缩短前后相邻两所述端子1之间的距离，从而更得端子1可以更密集的排列。
(4)所述收容孔31的内壁为绝缘，从而所述第三屏蔽层34和所述第四屏蔽层34的电性导通没有经过所述收容孔31的内壁,从而降低容性，改善高频。
以上详细说明仅为本发明之较佳实施例的说明，非因此局限本发明的专利范围，所以，凡运用本创作说明书及图示内容所为的等效技术变化，均包含于本发明的专利范围内。

Claims (16)

1.一种电连接器，用于电性连接具有多个插接部的对接元件,其特征在于，包括：
一基体，设有多个收容孔上下贯穿所述基体；
多个端子，分别对应收容于所述收容孔中，所述端子具有一基部及自所述基部向上延伸形成的两个连接部，所述端子还具有两个导引部和两个夹持部，两个导引部之间的间隙大于两个夹持部之间的间隙，所述导引部连接所述连接部，所述夹持部自所述导引部向前延伸形成，两夹持部用于夹持所述插接部，当所述插接部向下插入两导引部之间后，所述导引部导引所述插接部向前移动至所述夹持部，所述基部的顶端低于所述夹持部的顶端，从而于所述基部的正上方形成一收容空间位于所述导引部的后方，所述收容空间的高度介于所述夹持部的顶端和所述基部的顶端之间，当所述插接部被两夹持部共同夹持时，所述插接部低于所述夹持部顶端的部分部分向前凸出于所述夹持部而被收容于前方相邻端子的收容空间中。
2.如权利要求1所述的电连接器，其特征在于：所述基体为电路板，自所述基部向下延伸形成至少一固定部固定于所述收容孔，至少一导向部自所述固定部向下倾斜延伸形成且伸出所述收容孔，以焊接于一主电路板，所述基部位于所述基体外，所述夹持部的前端向前超出所述固定部。
3.如权利要求2所述的电连接器，其特征在于：所述固定部有两个，一第一通槽形成于两个所述固定部的前侧之间，一第二通槽形成于两个所述固定部的后侧之间。
4.如权利要求2所述的电连接器，其特征在于：所述导向部有两个且分开设置，一第一开口形成于两个所述导向部的前侧之间，一第二开口形成于两个所述导向部的后侧之间。
5.如权利要求1所述的电连接器，其特征在于：所述端子还包括多个接地端子，所述基体的下表面具有一屏蔽层，所述收容孔的内壁为绝缘，通过焊料将所述接地端子焊接于一主电路板，所述焊料连接所述接地端子与所述屏蔽层。
6.如权利要求1所述的电连接器，其特征在于：所述插接部为球状，每一端子的两夹持部之间的距离从下向上逐渐变小，且两夹持部夹持所述插接部的位置高于所述插接部的水平中心线。
7.一种电连接器组合，其特征在于，包括：
一对接元件，包括一载板，及设于所述载板且向下伸出所述载板的多个插接部；
一电连接器，用于供所述插接部向下插接，其包括：
一基体，设有多个收容孔上下贯穿所述基体；
多个端子，收容于所述收容孔，每一端子具有一基部及两个夹持部用于夹持所述插接部，两夹持部位于所述基部的前方且所述基部的顶端低于两夹持部的顶端，当所述插接部被两夹持部共同夹持时，所述插接部低于所述夹持部顶端的部分位于相邻端子的基部正上方。
8.如权利要求7所述的电连接器组合，其特征在于：自所述基部向上延伸两个连接部，自两夹持部向后延伸形成两导引部，以导引所述插接部向前移动，两夹持部之间的距离小于两导引部之间的距离，所述导引部连接所述连接部，所述夹持部的前端向前超出所述连接部。
9.如权利要求8所述的电连接器组合，其特征在于：所述插接部为球状且由铜制成。
10.如权利要求9所述的电连接器组合，其特征在于：每一端子的两夹持部之间的距离从下向上逐渐变小，且两夹持部夹持所述插接部的位置高于所述插接部的水平中心线。
11.如权利要求7所述的电连接器组合，其特征在于：所述载板的上表面具有多个焊接区分别用于对应焊接一芯片模块的多个导电体,相邻两所述插接部之间的距离大于相邻两所述导电体之间的距离。
12.如权利要求7所述的电连接器组合，其特征在于：所述基体为电路板，自所述基部向下延伸形成至少一固定部固定于所述收容孔，至少一导向部自所述固定部向下倾斜延伸形成且伸出所述收容孔，以焊接于一主电路板，所述基部位于所述基体外，所述夹持部的前端向前超出所述固定部。
13.如权利要求12所述的电连接器组合，其特征在于：所述固定部有两个，一第一开口形成于两个所述固定部的前侧之间，一第二开口形成于两个所述固定部的后侧之间。
14.如权利要求12所述的电连接器组合，其特征在于：所述导向部有两个且分开设置，一第一开口形成于两个所述导向部的前侧之间，一第二开口形成于两个所述导向部的后侧之间。
15.如权利要求7所述的电连接器组合，其特征在于：所述端子还包括多个接地端子，所述基体的上表面和所述载板的下表面分别具有一屏蔽层，所述接地端子与所述屏蔽层电性连接。
16.如权利要求7所述的电连接器组合，其特征在于：所述载板设有一被挡部，一挡止部位于所述被挡部前方，所述挡止部向前抵挡所述被挡部。
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