CN201075553Y - 电连接器及使用该电连接器的电连接装置 - Google Patents

电连接器及使用该电连接器的电连接装置 Download PDF

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CN201075553Y
CN201075553Y CNU2007200542458U CN200720054245U CN201075553Y CN 201075553 Y CN201075553 Y CN 201075553Y CN U2007200542458 U CNU2007200542458 U CN U2007200542458U CN 200720054245 U CN200720054245 U CN 200720054245U CN 201075553 Y CN201075553 Y CN 201075553Y
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terminal
electric connector
accommodation hole
scolder
weld part
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朱德祥
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Lotes Guangzhou Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • H01R4/028Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10984Component carrying a connection agent, e.g. solder, adhesive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一种电连接器,包含:绝缘本体,该绝缘本体设有至少一端子容纳孔;至少一黏结片,该黏结片设置于所述绝缘本体底部的所述端子容纳孔的至少一侧;至少一端子,对应设置于所述端子容纳孔中,该端子包括突出所述端子容纳孔底部的焊接部,该焊接部设有焊料,所述焊接部与所述黏结片间形成将焊料留置于其中的焊料留置区域。该电连接器,由于在所述绝缘本体底部设置黏结片,端子突出所述端子容纳孔底部的焊接部与所述黏结片间形成的焊料留置区域,焊料留置区域可将较多的焊料留置在端子的焊接部附近,使端子可有效的与对接电子元件相焊接,既能提高焊接质量,又能保证良好导电品质。

Description

电连接器及使用该电连接器的电连接装置
【技术领域】
本实用新型涉及一种用以连接两电子元件的电连接器,及使用该电连接器的电连接装置。
【背景技术】
目前,用于连接两电子元件(如芯片模块与电路板、电子卡与电路板或两电路板间)的电连接器通常包括绝缘本体及设置于绝缘本体中用于导电的端子,在将这种类型的电连接器与其中一电子元件(如电路板)连接时,一般有两种连接方式,一种是电连接器的端子直接与电路板的接触垫压缩接触,另一种是将电连接器端子的焊接端直接焊接在电路板上的接触垫上。由于第一种连接方式对电连接器端子的要求比较高,并未被业界广泛采用,故绝大部分的电连接器连接到电路板上都是采用第二种连接方式,即将电连接器端子的焊接端直接焊接在电路板上的接触垫上。如图1、2所示的电连接器1,该电连接器包括绝缘本体10及设置于绝缘本体10上的端子容纳孔11中的端子12,该端子12设有固定于绝缘本体中的固定部120,由固定部120底端弯折形成焊接部121,该焊接部121用以与电路板13相互焊接,焊接部121上连接有焊料14,由固定部120上与焊接部121相对的另一端弯折延伸形成弹性接触部122,该弹性接触部122可与外接电子元件(图中未示出)相接触,当将该电连接器焊接到电路板13上时,将端子的焊接部121上的焊料14与电路板上的接触垫131相对应设置,后经过加热使得焊料14熔解,并连接在端子的焊接部121与电路板的接触垫131间,而实现将电连接器焊接在电路板上,然而,这种技术仍然存在以下缺点:因焊接后,端子的焊接部121与电路板的接触垫131保持有一段距离L(如图2中所示),且在端子的焊接部121与电路板的接触垫131间间隔着焊料14,焊料的导电率一般比端子(由金属板材如铜材等冲压形成)的导电率低,因此,在端子的焊接部121与电路板的接触垫131间间隔着较长距离的焊料14会增加端子与电路板间的电阻值,进而影响导电品质。另一种可直接焊接于电路板上的电连接器,如图3图4所示的电连接器1′,该电连接器1′与上述电连接器的区别在于:固定部120′底端未经弯折直接延伸形成焊接部121′,该焊接部121′周围直接连接焊料14′,在将该电连接器1′焊接至电路板13′上时,可将焊接部121′直接对准电路板上的接触垫131′,后经过加热使得焊料熔解,并连接在端子的焊接部121′与电路板的接触垫131′间,而实现将电连接器焊接在电路板上,这种电连接器焊接在电路板上因焊接部121′与电路板的距离很小,可有效克服上述第一种电连接器与电路板间因为间隔着较长距离的焊料而增加端子与电路板间的电阻值的问题,但其也存在新的技术问题,由于这种电连接器端子焊接部粘附的焊料较少,很容易形成空焊(即有些端子因为焊料较少而不能焊接在电路板上,会使其与电路板间不能形成电性导通,引起断路)或焊接强度不足,使焊接质量受到较大影响,从而影响电连接器与电路板之间的正常导通。
因此,有必要设计一种新型电连接器,以克服上述缺陷。
【发明内容】
本实用新型的目的在于提供一种能提高焊接质量、并能保证良好导电品质的电连接器。
为了达到上述目的,本实用新型电连接器,包含:绝缘本体,该绝缘本体设有至少一端子容纳孔;至少一黏结片,该黏结片设置于所述绝缘本体底部的所述端子容纳孔的至少一侧;至少一端子,对应设置于所述端子容纳孔中,该端子包括突出所述端子容纳孔底部的焊接部,该焊接部设有焊料,所述焊接部与所述黏结片间形成将焊料留置于其中的焊料留置区域。
使用上述电连接器的电连接装置,包含:一电连接器,该电连接器包括绝缘本体,该绝缘本体设有至少一端子容纳孔,至少一黏结片,该黏结片设置于所述绝缘本体底部的所述端子容纳孔的至少一侧,至少一端子,对应设置于所述端子容纳孔中,该端子包括突出所述端子容纳孔底部的焊接部该焊接部设有焊料;一电路板,用以连接所述电连接器,该电路板设有与所述端子的焊接部相对应的接触垫,在所述黏结片、焊接部及接触垫间形成将焊料留置于其中的焊料留置区域。
与现有技术相比,本实用新型电连接器,由于在所述绝缘本体底部设置黏结片,端子突出所述端子容纳孔底部的焊接部与所述黏结片间形成的焊料留置区域,焊料留置区域可将较多的焊料留置在端子的焊接部附近,使端子可有效的与对接电子元件相焊接,既能提高焊接质量,又能保证良好导电品质。
【附图说明】
图1是现有技术电连接器的局部剖视图;
图2是图1所示电连接器焊接于电路板后的示意图;
图3是现有技术另一种电连接器的局部剖视图;
图4是图3所示电连接器焊接于电路板后的示意图;
图5是本实用新型电连接器的立体局部剖视图;
图6是图5所示电连接器设置焊料后的示意图;
图7是图6所示的电连接器焊接于电路板后的示意图;
图8是图7的局部放大示意图;
图9是本实用新型电连接装置与芯片模块连接后的局部剖视图。
【具体实施方式】
下面结合附图和具体实施例,对本实用新型电连接器及使用该电连接器的电连接装置作进一步说明。
请参照图5至图7所示,本实用新型电连接器2可用以承接芯片模块(未图示)并抵接于电路板3上,提供芯片模块与电路板3间的电性连接,该电连接器2包括绝缘本体21、至少一端子22及至少一黏结片23,绝缘本体21上设有呈矩阵排列的端子容纳孔24(在本实施例中端子容纳孔的数目多于一个,故端子与黏结片的数目也多于一个,若端子容纳孔仅为一个,端子及黏结片也可以仅为一个),端子22对应设置于所述端子容纳孔24中,所述黏结片23设置于绝缘本体21底部端子容纳孔24附近的至少一侧,在本实施例中端子容纳孔24的底部设有与端子容纳孔24周围形成连通的凹槽26,所述黏结片23设置于该凹槽26中,故在端子容纳孔24的周围设有连续的黏结片23,当然黏结片23也可不是连续的设置于端子容纳孔的周围,而设置在端子容纳孔一侧或两侧或根据需要设置于端子容纳孔附近的预定位置,在本实施例中黏结片23为金属片,当然黏结片23也可不是金属片而是由可有效粘接焊料的其它材料所制成,黏结片23设置在凹槽26中可有效降低电连接器的整体高度。端子22包括可固定于绝缘本体端子容纳孔24中的固定部220,由固定部220底端直接延伸形成焊接部221,该焊接部221突出端子容纳孔24的底部,且端子22突出端子容纳孔24的长度较长,由固定部220上与焊接部221相对的另一端弯折延伸形成弹性接触部222,该弹性接触部222可与外接电子元件(如图9中所示的芯片模块4)相接触。所述端子的焊接部221与所述黏结片23间形成的焊料留置区域(图6中所示的A区域),用于焊接的焊料25留置在焊料留置区域A中。因为黏结片23的设置,该黏结片23可与端子的焊接部221共同粘接焊料25,使得较多的焊料被留置在所述的焊料留置区域A中。
当将电连接器2焊接至电路板3上时,将电连接器2放置于电路板3上,并使粘接有焊料25的焊接部221对准电路板3上的接触垫31,后经过加热使得焊料25熔解,并连接在端子的焊接部221与电路板的接触垫31间,而实现将电连接器2焊接在电路板3上。
请参照图9,本实用新型电连接器2还包括设置于绝缘本体周围的定位边框27,该定位边框27可将对接于该电连接器2的芯片模块4定位于电连接器中,在电连接器绝缘本体底部突出设有定位柱28,电路板3上设有定位孔32,电连接器2安装在电路板3上时,定位柱28定位于定位孔32中,定位柱28及定位孔32的设置可使电连接器2在安装到电路板3上时端子的焊接部221与电路板的接触垫31能迅速的相互对准并完成安装。
如图7及图9所示,本实用新型电连接装置5,该电连接装置5包括上述电连接器2及电路板3,在此不再描述电连接器2的具体结构,电连接器2上的黏结片23与端子的焊接部221及电路板的接触垫31共同形成焊料留置区域(图8中所示的B区域),由于黏结片23的设置使得在黏结片23与端子的焊接部221及电路板的接触垫31间留置充足的焊料,保证电连接器2与电路板3有效的焊接在一起,形成一稳固连接为一整体的电连接装置5。
本实用新型电连接器在端子容纳孔边缘设置金属的黏结片23,该黏结片23与端子的焊接部221一起形成将焊料留置的焊料留置区域,且黏结片设置在端子容纳孔的周围使得形成的焊料留置区域较大,焊料留置区域可将较多的焊料留置在其中,使端子粘接有足够的焊料,进而保证在将电连接器焊接至电路板上时焊料充足,而避免背景技术所述第二种电连接器所存在的技术问题,且端子的焊接部与电路板不会存在较大由焊料连接的距离也可避免背景技术第一种电连接器所存在的技术问题。同时,在绝缘本体底部设有与端子容纳孔相互连通收容黏结片的凹槽,可使电连接器的整体高度相对较低。
本实用新型电连接装置在黏结片23与端子的焊接部221及电路板的接触垫31共同形成焊料留置区域,将充足的焊料留置在其中,而使得电连接器与电路板能有效的焊接在一起,形成一稳固连接为一整体的电连接装置。

Claims (10)

1.一种电连接器,其特征在于,包含:
绝缘本体,该绝缘本体设有至少一端子容纳孔;
至少一黏结片,该黏结片设置于所述绝缘本体底部的所述端子容纳孔的至少一侧;
至少一端子,对应设置于所述端子容纳孔中,该端子包括突出所述端子容纳孔底部的焊接部,该焊接部设有焊料,所述焊接部与所述黏结片间形成将焊料留置于其中的焊料留置区域。
2.如权利要求1所述的电连接器,其特征在于:所述黏结片设置于所述容纳孔两侧。
3.如权利要求1所述的电连接器,其特征在于:所述黏结片设置于所述容纳孔的周围。
4.如权利要求1所述的电连接器,其特征在于:所述黏结片为金属片。
5.如权利要求1所述的电连接器,其特征在于:所述端子容纳孔的底部设有与端子容纳孔形成连通的凹槽,所述黏结片设置于该凹槽中。
6.一种电连接装置,其特征在于,包含:
一电连接器,该电连接器包括绝缘本体,该绝缘本体设有至少一端子容纳孔,至少一黏结片,设置于所述绝缘本体底部的所述端子容纳孔的至少一侧,至少一端子,对应设置于所述端子容纳孔中,该端子包括突出所述端子容纳孔底部的焊接部,该焊接部设有焊料;
一电路板,用以连接所述电连接器,该电路板设有与所述端子的焊接部相对应的接触垫,在所述黏结片、焊接部及接触垫间形成将焊料留置于其中的焊料留置区域。
7.如权利要求6所述的电连接装置,其特征在于:所述黏结片设置于所述容纳孔的两侧。
8.如权利要求6所述的电连接装置,其特征在于:所述黏结片设置于所述容纳孔的周围。
9.如权利要求6所述的电连接装置,其特征在于:所述黏结片为金属片。
10.如权利要求6所述的电连接装置,其特征在于:所述端子容纳孔的底部设有与端子容纳孔形成连通的凹槽,所述黏结片设置于该凹槽中。
CNU2007200542458U 2007-07-17 2007-07-17 电连接器及使用该电连接器的电连接装置 Expired - Lifetime CN201075553Y (zh)

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US12/115,964 US20090023314A1 (en) 2007-07-17 2008-05-06 Electrical connector and electrical connecting device using the same

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CN110112595A (zh) * 2019-05-07 2019-08-09 番禺得意精密电子工业有限公司 电连接器及电连接器组合

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CN202189913U (zh) * 2011-03-29 2012-04-11 番禺得意精密电子工业有限公司 电连接器

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CN110112595A (zh) * 2019-05-07 2019-08-09 番禺得意精密电子工业有限公司 电连接器及电连接器组合
CN110112595B (zh) * 2019-05-07 2020-10-30 番禺得意精密电子工业有限公司 电连接器及电连接器组合
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