CN110089205A - Printed circuit board and manufacturing methods - Google Patents
Printed circuit board and manufacturing methods Download PDFInfo
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- CN110089205A CN110089205A CN201780079214.4A CN201780079214A CN110089205A CN 110089205 A CN110089205 A CN 110089205A CN 201780079214 A CN201780079214 A CN 201780079214A CN 110089205 A CN110089205 A CN 110089205A
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- metal layer
- printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The present invention relates to the Printed circuit board and manufacturing methods that one kind can ensure productivity and economy, the printed circuit board that a kind of separation of the metal release layer for allowing to separate with the first metal layer in particular to utilization between the first metal layer and second metal layer manufactures the method for printed circuit board with core components and manufactured by this method.
Description
Technical field
The present invention relates to the Printed circuit board and manufacturing methods that one kind can ensure productivity and economy.
Background technique
Printed circuit board (Printed Circuit Board, PCB) is the member for being configured to integrated wiring and mounting multiplicity
Part makes the component that can be electrically connected between element.With the development of technology, people are manufacturing form and function with multiplicity
The printed circuit board of energy.
In the past, the method as manufacture printed circuit board, there is the method using foaminess adhesive tape film.As an example, such as Fig. 1
It is illustrated, prepare 2 copper-clad laminates 10 for being sequentially laminated with the first copper foil layer 11, insulating element 12 and the second copper foil layer 13
Afterwards, these are adhered to the upper surface of foaminess adhesive tape film 20 respectively and below come after forming multilayer structure making, in second bronze medal
One region of layers of foil forms through-hole 14, later, removes foaminess adhesive tape film from the multilayer structure making and is separated into 2 stackings
Body 30.By this method, slim multilayer board can be easily manufactured.However, being laminated by copper-clad laminate
When foaminess adhesive tape film, drug may out of, the plywood and foaminess adhesive tape film contacting permeation to plywood, or
Person may have film residue 20a ((d) referring to Fig.1) by the surface of isolated laminated body.Due to such film residue or infiltration
Saturating drug occurs short-circuit (short) etc., the production utilization of capacity of printed circuit board is caused to decline, and disqualification rate rises.
Summary of the invention
Technical problem
The object of the present invention is to provide while a kind of production utilization of capacity that can be improved substrate, substrate is reduced not
The Printed circuit board and manufacturing methods of qualification rate.
Technical solution
To achieve the above object, the present invention provides a kind of manufacturing method of printed circuit board, according to an example, the method packet
It includes: preparing successively to include the first metal layer, metal release layer and the thickness second metal layer thinner than the first metal layer
The step of metal parts (S100)；The metal parts is laminated respectively in a manner of contacting second metal layer with insulating element
In the upper surface of insulating element and below to prepare separation core components the step of (S200)；It will include that insulating layer and pattern are formed and used
The per part of metal layer is laminated in each the first metal layer of separation core components come the step of forming multilayer structure making
(S300)；In a step of region of the insulating layer and pattern formation metal layer forms through-hole (S400)；To the through-hole
And pattern formation is gold-plated come (S500) the step of forming Gold plated Layer with metal layer implementation；And it is obtained from the step (S500)
Multilayer structure making in separate the metal release layer and the first metal layer of the separation core components, and with second metal layer and
Insulating element removes metal release layer together, to separate respectively and obtain the step for being stained with 2 laminated bodies of the first metal layer
Suddenly (S600).
It is alternatively possible to before the step (S600) further include: be breaking at the more of the middle acquisition of the step (S500)
The step of fringe region of laminar structure.
Furthermore, it is possible to before the step (S300) further include: the separation core obtained in the step (S200)
Component penetrates through to the vertical direction of separation core components and is formed and be mutually registrated for the interlayer in printed circuit board
(registration) the step of the first pilot hole (guide hole)；And before the step (S400) further include:
The first pilot hole inside the multilayer structure making obtained in the step (S300) is identified with X-ray, and in the multilayered structure
The edge of body formed vertically through the second pilot hole the step of.
Here, the metal release layer can be by selected from by chromium (Cr), nickel (Ni), zinc (Zn), molybdenum (Mo), tungsten (W), cobalt
(Co), lead (Pb), silver (Ag), tantalum (Ta), copper (Cu), aluminium (Al), manganese (Mn), iron (Fe), titanium (Ti), tin (Sn), steel (Steel)
And the formation of at least one of group of vanadium (V) composition.
For such metal release layer, metal steam plating amount can be 0.5 to 20mg/ ㎡.
In addition, the thickness of the first metal layer can be in the range of 6 to 35 μm, the thickness of the second metal layer can
In the range of 0.5 to 5 μm.
Furthermore, it is possible to be formed with bump on the surface of the first metal layer contacted with the insulating layer of the per part.
At this point, the mean roughness (Ra) of the bump can be in the range of 3.0 to 6.5 μm.In this case, the insulation
Adhesive strength between layer and the first metal layer is in the range of 0.8 to 3.0N/ ㎜.
In the step (S600), when separating the metal release layer and the first metal layer, metal release layer and the
Off-type force between one metal layer can be in the range of 10 to 90N/m.
In addition, the structure of the laminated body separated respectively centered on core components in the step (S600) by separation can be with
It is mutually the same.
On the other hand, the present invention provides a kind of printed circuit board manufactured by preceding method.As an example, the printing
Circuit board successively includes the first metal layer, insulating layer and pattern formation metal layer, and is had: being formed in the insulating layer
And the through-hole of metal layer；And it is formed in the Gold plated Layer in the metal layer that the through-hole is not formed and the through-hole.
On the other hand, as the intermediate for manufacturing aforementioned printed circuit board, the present invention provides one kind and is used to form print
The multilayer structure making of printed circuit board.The multilayer structure making for being used to form printed circuit board includes: separation core components, packet
It the upper surface of includes insulating element and is respectively laminated on the insulating element and following metal parts；And per part, difference
It is laminated in the upper surface of described separation core components and in the following, and successively including insulating layer and pattern formation metal layer, the gold
Belonging to component successively includes: the first metal layer；Metal release layer；And thickness is thinner than the first metal layer, and with the insulation
The second metal layer of component contact.
Here it is possible to be, in the separation core components, vertically through and be formed with for the interlayer in printed circuit board
The first pilot hole being mutually registrated, the edge of the multilayer structure making be formed with vertically through the second pilot hole.
The metal release layer can be separated with the first metal layer by 10 to 90N/m power.
Furthermore, it is possible to be formed with bump on the surface of the first metal layer contacted with the insulating layer of the per part.
Meanwhile the present invention provides and a kind of to form the printed circuit of the multilayer structure making of printed circuit board including being previously used for
Plate.
The effect of invention
The manufacturing method of printed circuit board of the invention using can be release with the first metal layer metal release layer between
The separation core components of the first metal layer and second metal layer, thus, compared to the previous system using foaminess adhesive tape film
Method is made, disqualification rate can be reduced while improving the production utilization of capacity of printed circuit board.
Further, since using separation core components instead of foaminess adhesive tape film, multiple printed circuits can be made simultaneously
Plate, so as to improve the productivity of manufacturing engineering.
Meanwhile making the bending in manufacturing engineering caused by the unsymmetric structure of printed circuit board and the structure as final thing
Property flexural property minimize, so as to ensure manufacture easiness.
Detailed description of the invention
Fig. 1 is the flow chart for showing the manufacturing engineering of previous printed circuit board.
Fig. 2 to Fig. 6 is the cross-sectional view for showing the manufacturing engineering of printed circuit board of one embodiment of the invention.
Fig. 7 is the cross-sectional view for showing the manufacturing engineering of printed circuit board of another embodiment of the present invention.
Fig. 8 to Fig. 9 is the cross-sectional view for showing the manufacturing engineering of printed circuit board of another embodiment of the present invention.
Figure 10 is the cross-sectional view for showing another embodiment for the separation core components being used in the present invention.
Symbol description
10: copper-clad laminate, 11,13: copper foil, 12: insulating element, 20: foaminess adhesive tape film, 20a: film residue, 30: layer
Stack, 100: separation core components, 111a, 111b: the first metal layer, 112a, 112b: metal release layer, 113a, 113b: the
Two metal layers, 120: insulating element, 111a-1,111b-1: bump, 131: the first pilot holes, 132: the second pilot holes, 200:
Multilayer structure making, 210a, 210b: per part, 211a, 211b: insulating layer, 212a, 212b: pattern, which is formed, uses metal layer,
213a, 213b: through-hole, 214a, 214b: Gold plated Layer, 220a, 220b: laminated body, 300,400: multilayer structure making, 310a,
310b, 410a, 420b: laminated body, X, Y: place of incision.
Specific embodiment
The present invention will be described below.
It is a feature of the present invention that utilizing the metal for allowing to separate with the first metal layer when manufacturing printed circuit board
Release layer between the first metal layer and second metal layer separation core components, thus, later by make the metal from
Type layer is separated with the first metal layer, and the mode that the metal release layer is removed together with second metal layer is stained with to manufacture simultaneously
2 laminated bodies of the first metal layer.When present invention manufacture printed circuit board in this way, manufacturing engineering can improved
It is productive simultaneously, reduce disqualification rate.
The present inventor learns, when using will the one side of metal foil be deposited can be release with the metal foil metal layer
(calling " metal release layer " in the following text) and formed 2 metal parts be adhered to insulating element top and bottom form separation unit come
When manufacturing printed circuit board, the metal foil can be made to can be easily separated in separation engineering with metal release layer.Specifically, due to
The metal release layer is by vapour deposition method (for example, electrolysis vapour deposition method (electro-deposition) etc.) directly vapor deposition in metal
The one side of foil, thus can steadily be adhered to the metal foil in the state of usually.Further, since the metal release layer
By can be release with metal foil metal form, thus can be separated by defined external force with metal foil.
It should be noted that since the metal release layer is formed by vapour deposition method, thus profile (profile) have it is close
The flatness of 0 (zero).Therefore, the bonding force (engaging force) of the metal release layer and insulating element is lower, therefore, in layer
When folded engineering, the metal release layer is possibly separated with insulating element.Further, since the metal release layer and insulating element
Lower engaging force, in separation engineering, since insulating element can not support (holding) metal release layer, compared with metal foil
Separation, metal release layer are more likely to separate with insulating element.
In addition in separation engineering, metal foil should separate with metal release layer and be adhered to laminated body, if but the metal foil
Thickness it is excessively thin, when separation, may be such that metal foil deforms or impaired, additionally, there may be subsequent in the metal-foil circuit
It can not be directly patterned when pattern, and need to form the trouble of kind of layer.
Therefore, in the present invention, utilizing in the manufacturing of printed circuit boards will be in the one side of the first metal layer 111a, 111b
Metal release layer 112a, the 112b that can be separated with the first metal layer and thickness are sequentially laminated with than the first metal layer
2 metal parts of thin second metal layer 113a, 113b are adhered to the top and bottom of insulating element 120 and the separation that obtains respectively
With core components 100 (referring to Fig. 2).Such present invention can be reduced while improving the production utilization of capacity of printed circuit board
Disqualification rate, and then multiple printed circuit boards can be made simultaneously, it is thus possible to improve the productivity of manufacturing engineering.
<manufacturing method of printed circuit board>
The manufacturing method of the printed circuit board of one embodiment of the invention includes: to prepare successively to include the first metal layer, gold
The step of belonging to the metal parts of release layer and the thickness second metal layer thinner than the first metal layer (S100)；It will be described
Metal parts is respectively laminated on the upper surface of insulating element in a manner of contacting second metal layer with insulating element and comes below quasi-
Back-up is from (S200) the step of core components；Per part including insulating layer and pattern formation metal layer is laminated in described
Each the first metal layer of separation core components is come (S300) the step of forming multilayer structure making；It is formed in the insulating layer and pattern
The step of forming through-hole with a region of metal layer (S400)；It is gold-plated come shape with metal layer implementation to the through-hole and pattern formation
At (S500) the step of Gold plated Layer；And the separation is separated from the multilayer structure making obtained in the step (S500) and is used
The metal release layer and the first metal layer of core components, and metal release layer is removed together with second metal layer and insulating element, from
And the step of separating respectively and obtaining 2 laminated bodies for being stained with the first metal layer (S600).It should be noted that not only limiting
In the manufacturing method, as needed, the step of each engineering, can be deformed or selectively use with and execute.
At this point, it is preferred that the manufacturing method is equal to the upper and lower part of separation core components centered on separating and use core components
Carry out step (S300) to step (S500) in the same manner respectively.
Referring to appended Fig. 2 to Fig. 9 to each step performed in printed circuit board constructed in accordance into
Row explanation.
(1) step (S100): the preparation of metal parts
Referring to Fig. 2, metal parts 110a, 110b include the first metal layer 111a, 111b, metal release layer 112a, 112b
And second metal layer 113a, 113b.
In the present invention, metal release layer is deposited after being laminated in the first metal layer, second metal layer is bonded or is steamed
The metal release layer is plated on metal parts is bonded in insulating element in step (S200) after separately preparing metal parts
To obtain separation core components.Because it is release to form metal by being deposited after second metal layer is laminated in insulating element
When layer, since the insulating element is cold material, in order to need plasma by vapour deposition method formation metal release layer
The other equipment of form.Therefore, in the present invention, after separately preparing metal parts, it is obtained with insulating element bonding
Core components are used in separation.
Described the first metal layer 111a, 111b be as separating step the step of in (S600) by metal release layer from
Separation can play printed circuit later with the part that core components 100 separate the one side that (unsticking) is adhered to each laminated body
Plate the effect of supporter while, can be by graphically play the role of wiring layer without kind of layer.
For such the first metal layer 111a, 111b, as long as by making in the industry in order to form circuit pattern
The metallic film form that conductive material is constituted, then do not do particular determination.As the non-limiting of the conductive material
Example, have chromium (Cr), nickel (Ni), zinc (Zn), molybdenum (Mo), tungsten (W), cobalt (Co), lead (Pb), silver (Ag), tantalum (Ta), copper
(Cu), aluminium (Al), manganese (Mn), iron (Fe), titanium (Ti), tin (Sn), steel (Steel), zinc (Zn) and vanadium (V), palladium (Pd) etc., these
Substance can be used alone or two or more is mixed or is used with alloy morphology.Wherein, consider economy, it is preferable to use copper is thin
Film.
Although in addition, do not do particular determination to the thickness of the first metal layer, when in the range of about 6 to 35 μm,
While can preventing the intracorporal circuit pattern layer of the stacking separated in separation engineering or insulating layer from deforming or is impaired, subsequent nothing
Layer, which need to be planted, to play the role of wiring layer and graphically forming circuit pattern in a short time.
Described the first metal layer 111a, 111b include being formed in the table contacted with insulating layer 211a, 211b of per part
Bump 111a-1,111b-1 (referring to Fig.1 0) in face.By bump 111a-1,111b-1, can be further improved
Bonding force (binding force) between the first metal layer 111a, 111b and insulating layer 211a, 211b.Therefore, in later separation engineering
In when separating the first metal layer with metal release layer, the strength of glass between the first metal layer and insulating layer can be made to decline institute
The generation of caused pattern removing (Pattern Peel Off) defect is minimized.
Although the mean roughness (Ra) to the bump does not do particular determination, when in the range of about 3.0 to 6.5 μm
When, the adhesive strength between the first metal layer and insulating layer can be made to further increase to 0.8 to 3.0N/mm or so.
Described metal release layer 112a, 112b are formed in the one side of described the first metal layer 111a, 111b.Due to the gold
Belong to release layer to be directly deposited and be formed in the first metal layer, thus stacking engineering, through-hole formed engineering and gold-plated engineering (with
Lower step (S300) can steadily maintain the coherent condition with the first metal layer into step (S500)).On the other hand, second
Metal layer is directly deposited and is formed in the metal release layer, and such second metal layer and insulating element adhere to.That is, described
Second metal layer 113a, 113b that metal release layer 112a, 112b is contacted with insulating element and engaged supports.Therefore, dividing
It, can when from separating described metal release layer 112a, 112b and the first metal layer 111a, 111b in engineering (following steps (S600))
Be separated from each other metal release layer 112a, 112b and the first metal layer by defined external force, the metal release layer 112a,
112b is (releasable) metal layer that can be separated with the first metal layer 111a, 111b, is different from macromolecule release film,
Splitting will not occur when engineering is laminated, also, be different from foaminess adhesive tape film, even if the metal release layer in separation engineering
A part be transcribed to the first metal layer, short-circuit (short) will not be caused.
Such metal release layer is by selected from by chromium (Cr), nickel (Ni), zinc (Zn), molybdenum (Mo), tungsten (W), cobalt (Co), lead
(Pb), silver-colored (Ag), tantalum (Ta), copper (Cu), aluminium (Al), manganese (Mn), iron (Fe), titanium (Ti), tin (Sn), steel (Steel) and vanadium
(V) at least one of group formed is formed.At this point, when the metal release layer is lower for reacting with each other property with the first metal layer
Dissimilar metal when, can avoid or damage to avoid laminated body in separation engineering, only can be with the first gold medal with less power
Belonging to layer can be easily separated.For example, the first metal release layer can be different from layers of copper when the first metal layer is layers of copper
Other compositions, for example, chromium, nickel etc..
It, will be according to metal evaporation for nanometer unit although not doing particular determination to the thickness of the metal release layer
Amount and it is different.In addition, according to the metal steam plating amount, in separation engineering, the off-type force (release of metal release layer
It force) also can be different.That is, metal steam plating amount more increases, in separation engineering, the off-type force of metal release layer can also rise.By
In such reason, when the metal steam plating amount is excessive, in separation engineering, between metal release layer and the first metal layer
Separation may be not easy；On the other hand, when metal steam plating amount is very few, when engineering is laminated, it is also possible to it is release metal to occur
Splitting between layer and the first metal layer.Therefore, in order to make the metal release layer avoid stacking engineering in layer occurs
Between remove and have in separation engineering with the off-type force of the segregative degree of the first metal layer, can be by the metal evaporation
Amount is adjusted to about 0.5 to 20mg/ ㎡ range, is preferably adjusted to about 3.5 to 8mg/ ㎡ range.According to such metal evaporation
Amount, the metal release layer can have about 20nm hereinafter, preferably from about 5 to 20nm range thickness, in addition, in separation engineering
In, the off-type force in the range of about 10 to 90N/m, preferably from about 15 to 60N/m, more preferably from about 20 to 55N/m and can be passed through
The separation of one metal layer.
Such metal release layer can be formed by the vapour deposition method of non-existing rubbing method.For example, 22 DEG C at a temperature of,
By utilizing including chromic acid about 150~300g/l (preferably, about 240~260g/l) and sulfuric acid about 1.5~3g/l (preferably,
About 2.2~2.5g/l) electrolyte electrolysis be deposited (electro-deposition), the metal release layer is directly deposited
And it is formed in the one side of the first metal layer.At this point, the metal steam plating amount of the metal release layer can be about 0.5 to 20mg/ ㎡
In the range of.
As illustrated in Figure 2, described metal parts 110a, 110b include being formed in aforementioned metal release layer 112a, 112b
Second metal layer 113a, 113b of another side.Second metal layer 113a, 113b be in separating step with metal release layer
The part that 112a, 112b are removed by separation together, by improving the bonding force between the metal release layer and insulating element
Metal release layer is supported, makes the metal release layer in separating step from the interfacial separation with the first metal layer.
For the thickness of second metal layer 113a, 113b, as long as thicker than described the first metal layer 111a, 111b
It spends thin, then particular determination is not done to it.According to an example, when the first metal layer is with a thickness of about 6 to 35 μm, described second
The thickness of metal layer can be in the range of about 0.5 to 5 μm.
Such second metal layer is the metallic film form being made of conductive material, as the conductive material
Example, as above-mentioned in the first metal layer.At this point, the ingredient of the second metal layer can be with the first metal layer
Ingredient it is identical or different.
(2) step (S200): the separation preparation of core components
Referring to Fig. 2, separation core components 100 are metal parts 110a, the 110b that will be obtained in the step (S100)
Be respectively laminated on the upper surface of insulating element 120 and below and obtain form, the second metal layer 113a of the metal parts,
113b is contacted with insulating element 120 and is engaged.Such separation core components 100 are identical as the metal foil layer lamination of the industry
Form, when engineering is laminated, it is not easy to splitting occur because of physics or thermal shock.
The insulating element 120 plays the role of the supporter of separation core components, in separating step with the second metal
Layer 113a, 113b and metal release layer 112a, 112b are removed together.For insulating element 120 workable in the present invention,
As long as it is known in the industry in current row, then it can not by particular determination use, for example, it may be polyimides (PI) etc. is soft
Material；Utilize the rigid material of mixing material etc. of glass fibre (glass fiber), BT, epoxy resin, phenolic resin etc..
Wherein, if using the semi-cured state for including epoxy resin and glass fibre preimpregnation material (prepreg), with institute
Metal parts is seamlessly closely attached on when stating metal parts bonding, thus can not only make the splitting being laminated in engineering minimum
Change, moreover, from batch production in terms of for, be easily manufactured compared to other material.
(3) step (S300): the formation of multilayer structure making
As illustrated in fig. 3, the separation prepared in the step (S200) each the first metal layer of core components 100
Stacking includes insulating layer 211a, 211b and pattern formation metal layer 212a, the 212b for being laminated in its one side on 111a, 111b
Per part 210a, 210b simultaneously compress to form multilayer structure making 200.At this point, described insulating layer 211a, 211b and the first metal
Layer 111a, 111b contact.
The multilayer structure making 200 is centered on the separation core components 100 and including stacking gradually face thereon
Insulating layer 211a and pattern on (that is, the first metal layer 111a), which are formed, uses metal layer 212a；And it stacks gradually in described point
From with below core components 110 (that is, the first metal layer 111b) on insulating layer 211b and pattern formed use metal layer 212b.
At this point, the insulating layer is separately configured at centered on core components with pattern formation metal layer to separate
Top and lower part.Therefore, the insulating layer can be divided into upper insulation layer 211a and lower insulation layer 211b, pattern respectively
Formation can also be divided into pattern formation with upper metallization layer 212a and pattern formation lower metal layer with metal layer respectively
212b.In the following, the another composition of the invention for being used in top and lower part respectively centered on core components by separation can also be by
It distinguishes in the same manner.
It is described in detail as follows referring to Fig. 3.Multilayer structure making 200 is with lower insulation layer 211b, separation core components
100, upper insulation layer 211a and pattern formation are laminated in pattern formation lower metal layer with the sequence of upper metallization layer 212a
On 212b.
The upper insulation layer 211a and lower insulation layer 211b be make respectively in final printed circuit board it is interconnected
Each layer is electrically connected to form the appearance of printed circuit board, and provides the part of endurance.Such as aforementioned separation core components 100
Insulating element 120, the material of such insulating layer can be thermosetting resin with adhesive properties, can be polyimides
(PI) etc. flexible materials, utilize rigid material of the mixing materials such as glass fibre, BT, epoxy resin, phenolic resin etc..It can make
Inorganic filler or glass fibre etc. equably adjust thermal expansion coefficient respectively at the insulating layer on the whole, can also distinguish
It adjusts the thermal expansion coefficient of polymer substance and glass fibre and uses.
According to an example, the upper insulation layer 211a and lower insulation layer 211b can have and use core components with described separate
The 100 identical structure of insulating element 120, these 120,211a, 211b can be by the preimpregnation materials of semi-cured state
(prepreg) it constitutes.
In the pattern formation upper metallization layer 212a and pattern formation lower metal layer 212b can not only be played
Function is conducted in layer, the function of the passage of heat (Heat path) can also be played.Not made it to the thickness of the metal layer special
It limits, for example, can be in the range of 9 to 12 μm (1/4 to 1/3 ounce (oz)).
Although in the present invention to stack gradually pattern formation lower metal layer 212b, lower insulation layer 211b, separation use
Core components 100, upper insulation layer 211a and pattern formation are illustrated with upper metallization layer 212a, but make this as needed
The situation that a little lamination orders is partly deformed or selectively used with is also fallen into scope of the invention.
(4) step (S400): the formation of through-hole
The pattern of the multilayer structure making obtained in the step (S300) forms the region with metal layer and insulating layer
Form through-hole.
As illustrated in figure 4, respectively in top and lower part symmetrically or asymmetrically shape centered on separation core components 100
At 1 or more through-hole 213a, 213b.At this point, through-hole can be divided into upper through-hole 213a and lower through-hole 213b.
The through-hole can be by forming in current row method known in the industry.For example, can be to be formed logical with laser irradiation
The position in hole and form through-hole.At this point, the position or shape, number to through-hole are not done specifically limited, it can according to need and come from
By adjusting.
After forming the through-hole, it can be removed and be formed in inner wall during as needed to process the through-hole
Impurity post-processing engineering.
(5) step (S500): forming through-hole and pattern forms the Gold plated Layer for using metal layer
Later, described through-hole 213a, 213b and pattern formation are carried out with metal layer 212a, 212b gold-plated gold-plated to be formed
Layer 214a, 214b (referring to Fig. 5).At this point it is possible to which Gold plated Layer 214a, 214b is formed in described through-hole 213a, 213b
Gold plated Layer 214a, 214b is formed inside inner wall, or filling described through-hole 213a, 213b.In addition, forming the Gold plated Layer
The pattern formation of 214a, 214b are pattern formation metal layer 212a, 212b that through-hole is not formed with metal layer 212a, 212b
Part.
The Gold plated Layer forming method is not done it is specifically limited, can according to current row usual way known in the industry come
It executes.
(6) 2 laminated bodies step S600: are separated from multilayer structure making
It separates and is removed other than the first metal layer from the multilayer structure making obtained in the step (S500)
Separation core components, just obtain in 2 laminated bodies for being stained with the first metal layer on one side.
As illustrated in FIG. 6, if making metal release layer 112a, 112b and the first metal layer of the separation core components 100
111a, 111b separate (unsticking), from the multilayer structure making 200 with 2 second metal layers 113a, 113b and insulating element
120 remove 2 metals release layer 112a, 112b together, then can separate and obtain one respectively from the multilayer structure making 200
Surface layer is laminated with 2 laminated bodies 220a, 220b of the first metal layer 111a, 111b.
According to an example, when performing identical manufacturing step respectively with the top of core components 100 and lower part to the separation
When, the structure of each laminated body 220a, 220b for being separated centered on core components 100 by separation are mutually the same.At this point, each stacking
Body 220a, 220b include on the first metal layer 111a, 111b insulating layer 211a, 211b and pattern formation metal layer 212a,
212b, and include: the through-hole 213a for being formed in described insulating layer 211a, 211b and pattern formation metal layer 212a, 212b,
213b；And it is formed in Gold plated Layer 214a, 214b of described through-hole 213a, 213b and pattern formation metal layer 212a, 212b.
At this point, by isolated laminated body 220a, 220b, even if through-hole 213a, 213b are formed as non-in the up-down direction
Symmetrical structure (unbalanced structure), due to being tieed up centered on core components 100 in aforementioned manufacturing engineering by separation
The structure symmetrical above and below between top laminated body and lower part laminated body is held, it is thus possible to make the bending occurred in manufacturing engineering
(warpage) characteristic minimizes.Furthermore it is possible to which production has the printed circuit board of the structure of multiplicity simultaneously.
(7) circuit diagram can be formed in the upper surface of laminated body separated in the step (S600) step and/or below
Case.
According to an example, the laminated body 220a obtained in the step (S600) includes the first metal layer 111a and gold-plated
Layer 214a can form the electricity with defined shape in a region of the first metal layer 111a and/or Gold plated Layer 214a
Road pattern (not shown).At this point, kind of a layer (seed can be used as when the Gold plated Layer 214a is film morphology
Layer the second Gold plated Layer (not shown) for), and being above it further formed desired thickness (is not schemed to form circuit pattern
Show).
The method for forming the circuit pattern is not done it is specifically limited, can be according in current row common side known in the industry
Method executes.
In this way, after the circuit pattern with defined shape is formed in laminated body, by enterprising in the laminated body
One step executes the manufacturing engineering in current row common printed circuit board known in the industry, for example, welding resistance forms engineering, etches and match
Line engineering, electronic component mount engineering etc. to complete the production of printed circuit board.
The manufacturing method of aforementioned printed circuit board is not really wanted successively to execute each step described above to be manufactured, root
According to design specification, the step of each engineering, can be deformed or selectively be used with and be executed surely.
On the other hand, bending (warpage) phenomenon of printed circuit board is when carrying out the attachment of printed circuit board to engineering
Rate and productivity cause more influence, and further, which is to be also possible to cause to transfer mistake in encapsulation packing engineering
It changes or the particularly important factor of the defect that conduct printed circuit board can not.Printed circuit board be stacking multiple material and shape
At works, the main reason for buckling phenomenon is the difference of the thermal expansion coefficient (CTE) of each stacking material, is caused as other
The reason of influence, the well-known coefficient of elasticity (Young's modulus) for having each material, temperature applied in engineering become
Change, moisture absorption, mechanical load etc..
As above-mentioned, since the flexural property of printed circuit board is mainly the difference because of thermal expansion and contraction between stacking material
Occurred with load, in order to reduce the difference, another feature of the present invention is that, the stacking material of multilayer is laminated for by changing
The physical property such as the composition and thickness (dielectric thickness control) of material, thermal expansion coefficient (CTE) keep the bending special
Property minimize.
For this purpose, in the present invention, as 1 or more used in abovementioned steps (S300) insulating layer, can be used
It is configured to the content (Resin contents) for making to constitute the resin of the insulating layer, the material or composition, structure for constituting resin
Thickness at the thermal expansion coefficient (CTE) of the ingredient of insulating layer, insulating layer is different, or is configured to make these all different exhausted
Edge layer.
One embodiment of the invention for controlling the bending degree of the printed circuit board is as follows.
Predict or survey in advance first the multilayered structure for being used to form printed circuit board obtained in each manufacturing step
The bending degree of body or the printed circuit board finally manufactured.
Later, if bending numerical value predicted or actual measurement is (+) value, insulating layer used in engineering is being laminated later
Use the insulating element with the structure that can correct (+) value.It is, for example, possible to use: i) content of resin is conditioned less,
Or ii) thickness is conditioned smaller or iii) thermal expansion coefficient (CTE) is conditioned to obtain lower insulating element etc..
Conversely, can be used in stacking engineering later if the bending numerical value predicted or surveyed is (-) value: i) setting
Rouge content is conditioned get Geng Gao or II) thermal expansion coefficient is higher and/or III) thickness be conditioned higher edge part corrects
Bending degree.
Contained although being instantiated in the present invention by the CTE match or resin for 2 or more insulating layers for being laminated for multilayer
The dielectric thickness of amount, resin thickness or the like adjusts (dielectric thickness control) to carry out bending control
System, but in addition to this do not use CCL (copper clad laminate, copper foil covered pressure) core centreless (coreless)
The thickness for being configured to make to be laminated for the metal layer of multilayer and/or circuit pattern in the printed circuit board of form different from each other improves
The case where flexural property, also falls into scope of the invention.
For result, in the present invention, the caused buckling phenomenon in aforementioned manufacturing engineering can not only minimized,
The printed circuit board formation intermediate obtained in separation engineering or the printed circuit board finally manufactured can also be significantly improved
Flexural property.
(8) optionally, the present invention may also include: being breaking at the side of the multilayer structure making obtained in the step (S500)
The step of edge.
Another example according to the present invention, other than abovementioned steps (S100) to step (S600), the manufacture of printed circuit board
Method can also include: the side for being breaking at the multilayer structure making obtained in the step (S500) before the step (S600)
The step of edge.
Specifically, the size of the per part used in the step (S300) is (that is, length direction and width direction
Length) separation core components can be greater than or equal to.It should be noted that as illustrated in figure 7, when the per part 210a,
When the size of 210b is greater than separation core components 100, if the per part is laminated in the two-sided of separation core components and is pressed
Tightly, then the insulating layer material of the per part will surround separation core components edge.In this case, in separating step
Before, need to cut off and remove the edge X of the multilayer structure making 300.
Later, such as above-mentioned in the step (S600), separation core is removed and separating in multilayer structure making 200
Component 100 (except the first metal layer 111a, 111b) can obtain and be laminated with 2 of the first metal layer 111a, 111b on one side
Laminated body 310a, 310b.
(9) optionally, the present invention may also include: the step of multilayer structure making forms pilot hole.
Another example according to the present invention, other than abovementioned steps (S100) to step (S600), the manufacture of printed circuit board
Method can also include: the separation core components that obtain in the step (S200) before the step (S300) to described
The vertical direction of separation core components penetrates through and is formed and be mutually registrated (registration) for the interlayer in printed circuit board
The first pilot hole (guide hole) the step of；It can also include: to be identified with X-ray described before the step (S400)
The first pilot hole inside multilayer structure making obtained in step (S300), forms at the edge of the multilayer structure making and vertically passes through
The step of logical second pilot hole；It and before the step (S600) can also include: to be breaking at the step (S500)
The step of edge of the multilayer structure making of middle acquisition.In the present invention, by forming first pilot hole and the second pilot hole,
Improve the interlayer registration in printed circuit board, thus can make interlayer be not connected to or wiring between short circuit incidence it is minimum
Change, and reliability can also be improved.
As illustrated by figures 8 and 9, it is formed vertically through in the separation core components obtained in the step (S200)
First pilot hole 131 (referring to (b) of Fig. 8) at 100 edge.Later, per part 210a, 210b are respectively laminated on to be formed
There are the upper surface of separation core components of the first pilot hole 131 and below and compresses and form multilayer structure making 400 (referring to Fig. 8
(c)).At this point, the inside of first pilot hole 131 is by the material of insulating layer 211a, 211b of per part (for example, thermosetting
Property resin, preimpregnation material) filling.Optionally, in addition, when the size of described per part 210a, 210b are greater than separation core
When the size of part 100, as illustrated in figure 8, the insulating layer material of the per part will surround the edge of separation core components.It
Afterwards, the first pilot hole 131 of the multilayer structure making 400 is identified with X-ray, is formed vertically through in the multilayer structure making 400
The second pilot hole 132 (referring to (d) of Fig. 8).At this point, second pilot hole 132 can be formed in corresponding to described first
The region of the position of pilot hole 131, alternatively, can also be separated with first pilot hole 131 and be formed in multilayer structure making
Fringe region.Later, such as above-mentioned in the step (S400), in the insulating layer and pattern formation metal layer of multilayer structure making
A region form through-hole 213a, 213b, and carry out the gold-plated of the through-hole and the pattern formation metal layer and form plating
Layer gold 214a, 214b.At this point, also carrying out gold-plated (referring to (d) of Fig. 8) to the inner wall of second pilot hole 132.Then, edge
The inside of first pilot hole 131 cuts off and removes the fringe region (Y) of multilayer structure making 400 (referring to (f) of Fig. 9).It
Afterwards, such as above-mentioned in the step (S600), separation core components 100 (are removed and separating from multilayer structure making 400
Except one metal layer 111a, 111b), it can obtain in 2 laminated bodies for being laminated with the first metal layer 111a, 111b on one side
410a, 410b (referring to (g) of Fig. 9).
After forming first pilot hole and the second pilot hole, executes to the property of can choose desmearing and deburring processing comes
Remove the pollutant of hole inner wall and substrate.
<printed circuit board>
On the other hand, the present invention provides a kind of printed circuit board that the manufacturing method according to aforementioned printed circuit board manufactures.
As an example, the printed circuit board successively includes that the first metal layer 111a, insulating layer 211a and pattern are formed
With metal layer 212a, and has the through-hole 213a for being formed in the insulating layer 211a and pattern formation metal layer 212a；And
It is formed in the Gold plated Layer 214a of the metal layer 212a that the through-hole is not formed and the through-hole 213a.With regard to such printed circuit
For plate, double-sided printed-circuit board can be manufactured according to the manufacturing method in current row double-sided printed-circuit board known in the industry.
Although being illustrated centered on embodiment above, this is only to illustrate, not to limit the present invention, this
General technical staff in field that the present invention belongs to can implement in the range of not departing from the essential characteristic of the present embodiment
The various deformation and application not illustrated above.For example, each component specifically occurred in embodiment can by deformation reality
It applies.In addition, should be interpreted that such deformation and the relevant difference of application and fall into this hair specified in the appended claims
In bright range.
Claims (15)
1. a kind of manufacturing method of printed circuit board characterized by comprising
Prepare successively to include the first metal layer, metal release layer and the thickness second metal layer thinner than the first metal layer
Metal parts the step of (S100)；
The metal parts is respectively laminated on the upper surface of insulating element in a manner of contacting second metal layer with insulating element
And below come (S200) the step of preparing separation core components；
It will include that the per part of insulating layer and pattern formation metal layer is laminated in each first gold medal of the separation core components
Belong to layer come (S300) the step of forming multilayer structure making；
In a step of region of the insulating layer and pattern formation metal layer forms through-hole (S400)；
It is gold-plated come (S500) the step of forming Gold plated Layer with metal layer implementation to the through-hole and pattern formation；And
Separated from the multilayer structure making obtained in the step (S500) the separation core components metal release layer and
The first metal layer, and metal release layer is removed together with second metal layer and insulating element, to separate and be adhered to respectively
There is the step of 2 laminated bodies of the first metal layer (S600).
2. the manufacturing method of printed circuit board according to claim 1, which is characterized in that
Before the step (S600) further include: be breaking at the marginal zone of the multilayer structure making obtained in the step (S500)
The step of domain.
3. the manufacturing method of printed circuit board according to claim 2, which is characterized in that
Before the step (S300) further include: the separation core components obtained in the step (S200) are to the separation
The step of forming the first pilot hole that the interlayer being used in printed circuit board is mutually registrated with the perforation of the vertical direction of core components；
And
Before the step (S400) further include: with X-ray identification in the middle multilayered structure body obtained of the step (S300)
First pilot hole in portion, and the edge of the multilayer structure making formed vertically through the second pilot hole the step of.
4. the manufacturing method of printed circuit board according to claim 1, which is characterized in that
The metal release layer be by selected from by chromium, nickel, zinc, molybdenum, tungsten, cobalt, lead, silver, tantalum, copper, aluminium, manganese, iron, titanium, tin, steel,
What at least one of zinc and the group of vanadium composition were formed.
5. the manufacturing method of printed circuit board according to claim 1, which is characterized in that
The vapor deposition amount of the metal release layer is 0.5 to 20mg/ ㎡.
6. the manufacturing method of printed circuit board according to claim 1, which is characterized in that
The thickness of the first metal layer is in the range of 6 to 35 μm, model of the thickness of the second metal layer at 0.5 to 5 μm
In enclosing.
7. the manufacturing method of printed circuit board according to claim 1, which is characterized in that
It is formed with bump on the surface of the first metal layer contacted with the insulating layer of the per part,
The mean roughness of the bump is viscous between the insulating layer and the first metal layer in the range of 3.0 to 6.5 μm
Intensity is connect in the range of 0.8 to 3.0N/ ㎜.
8. the manufacturing method of printed circuit board according to claim 1, which is characterized in that
When separating the metal release layer and the first metal layer, the off-type force between metal release layer and the first metal layer is 10
To 90N/m.
9. the manufacturing method of printed circuit board according to claim 1, which is characterized in that
The structure of the laminated body separated respectively centered on core components by the separation is mutually the same.
10. a kind of printed circuit board, which is characterized in that
It is manufactured by method described in any one of claims 1 to 9.
11. a kind of multilayer structure making for being used to form printed circuit board characterized by comprising
Separation core components comprising insulating element and the upper surface of be respectively laminated on the insulating element and following metal portion
Part；And
Per part is respectively laminated on the upper surface of described separation core components and in the following, and successively including insulating layer and pattern
It is formed and uses metal layer,
The metal parts successively includes: the first metal layer contacted with the insulating layer；Metal release layer；And thickness compares institute
State that the first metal layer is thin, and the second metal layer contacted with the insulating element.
12. the multilayer structure making according to claim 11 for being used to form printed circuit board, which is characterized in that
At the edge of the separation core components, vertically through and be formed with and be mutually registrated for the interlayer in printed circuit board
First pilot hole,
The edge of the multilayer structure making be formed with vertically through the second pilot hole.
13. the multilayer structure making according to claim 11 for being used to form printed circuit board, which is characterized in that
The metal release layer is separated with the first metal layer by 10 to 90N/m power.
14. the multilayer structure making according to claim 11 for being used to form printed circuit board, which is characterized in that
Bump is formed on the surface of the first metal layer contacted with the insulating layer of the per part.
15. a kind of printed circuit board, which is characterized in that
Multilayer structure making including being used to form printed circuit board described according to claim 1 any one of 1 to 14.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0174271 | 2016-12-20 | ||
| KR1020160174271A KR101932326B1 (en) | 2016-12-20 | 2016-12-20 | Printed circuit board and method of producing the same |
| PCT/KR2017/015029 WO2018117604A2 (en) | 2016-12-20 | 2017-12-19 | Printed circuit board and method for manufacturing same |
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| Publication Number | Publication Date |
|---|---|
| CN110089205A true CN110089205A (en) | 2019-08-02 |
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ID=62627752
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| Application Number | Title | Priority Date | Filing Date |
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| CN201780079214.4A Pending CN110089205A (en) | 2016-12-20 | 2017-12-19 | Printed circuit board and manufacturing methods |
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| Country | Link |
|---|---|
| KR (1) | KR101932326B1 (en) |
| CN (1) | CN110089205A (en) |
| WO (1) | WO2018117604A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114765928A (en) * | 2021-01-12 | 2022-07-19 | 深南电路股份有限公司 | Printed circuit board and laminating method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101955685B1 (en) * | 2018-07-20 | 2019-03-08 | 주식회사 에스아이 플렉스 | Method for manufacturing flexible printed circuits board and flexible printed circuits board |
| KR102357725B1 (en) | 2020-01-17 | 2022-02-03 | 한국표준과학연구원 | Railway rail breakage detection device using seismic waves and detection method using the same |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
| WO1992004811A1 (en) * | 1990-09-04 | 1992-03-19 | Chisso Corporation | Flexible printed circuit board and its manufacturing |
| US5427848A (en) * | 1991-05-06 | 1995-06-27 | International Business Machines Corporation | Stress balanced composite laminate material |
| CN1269285A (en) * | 1998-12-21 | 2000-10-11 | 索尼化学株式会社 | Soft substrate plate |
| CN1645990A (en) * | 2004-01-19 | 2005-07-27 | 新光电气工业株式会社 | Circuit substrate manufacturing method |
| CN101257775A (en) * | 2007-02-28 | 2008-09-03 | 新光电气工业株式会社 | Method of manufacturing wiring substrate and method of manufacturing electronic component device |
| JP2010199616A (en) * | 2010-05-12 | 2010-09-09 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring board |
| KR20120086195A (en) * | 2011-01-25 | 2012-08-02 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
| TW201323217A (en) * | 2011-12-07 | 2013-06-16 | Sk Innovation Co Ltd | Manufacturing method of multilayer polyimide flexible metal-clad laminate |
| TW201334956A (en) * | 2011-12-06 | 2013-09-01 | Shinko Electric Ind Co | Method and support member for manufacturing wiring substrate, and structure member for wiring substrate |
| US20130299227A1 (en) * | 2010-11-05 | 2013-11-14 | Doosan Corporation | New printed circuit board and method for manufacturing same |
| CN104943273A (en) * | 2014-03-26 | 2015-09-30 | Jx日矿日石金属株式会社 | Lamination body formed by platelike carrier made of resin and metal layer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101141215B1 (en) * | 2010-07-19 | 2012-05-04 | 최문화 | Plasma Generating Cold Storage Device |
-
2016
- 2016-12-20 KR KR1020160174271A patent/KR101932326B1/en active IP Right Grant
-
2017
- 2017-12-19 WO PCT/KR2017/015029 patent/WO2018117604A2/en active Application Filing
- 2017-12-19 CN CN201780079214.4A patent/CN110089205A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
| WO1992004811A1 (en) * | 1990-09-04 | 1992-03-19 | Chisso Corporation | Flexible printed circuit board and its manufacturing |
| US5427848A (en) * | 1991-05-06 | 1995-06-27 | International Business Machines Corporation | Stress balanced composite laminate material |
| CN1269285A (en) * | 1998-12-21 | 2000-10-11 | 索尼化学株式会社 | Soft substrate plate |
| CN1645990A (en) * | 2004-01-19 | 2005-07-27 | 新光电气工业株式会社 | Circuit substrate manufacturing method |
| CN101257775A (en) * | 2007-02-28 | 2008-09-03 | 新光电气工业株式会社 | Method of manufacturing wiring substrate and method of manufacturing electronic component device |
| JP2010199616A (en) * | 2010-05-12 | 2010-09-09 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring board |
| US20130299227A1 (en) * | 2010-11-05 | 2013-11-14 | Doosan Corporation | New printed circuit board and method for manufacturing same |
| KR20120086195A (en) * | 2011-01-25 | 2012-08-02 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
| TW201334956A (en) * | 2011-12-06 | 2013-09-01 | Shinko Electric Ind Co | Method and support member for manufacturing wiring substrate, and structure member for wiring substrate |
| TW201323217A (en) * | 2011-12-07 | 2013-06-16 | Sk Innovation Co Ltd | Manufacturing method of multilayer polyimide flexible metal-clad laminate |
| CN104943273A (en) * | 2014-03-26 | 2015-09-30 | Jx日矿日石金属株式会社 | Lamination body formed by platelike carrier made of resin and metal layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114765928A (en) * | 2021-01-12 | 2022-07-19 | 深南电路股份有限公司 | Printed circuit board and laminating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101932326B1 (en) | 2018-12-24 |
| KR20180071545A (en) | 2018-06-28 |
| WO2018117604A3 (en) | 2018-08-16 |
| WO2018117604A2 (en) | 2018-06-28 |
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