CN105979710A - Composite metal foil and manufacturing method thereof, and printed wiring board - Google Patents
Composite metal foil and manufacturing method thereof, and printed wiring board Download PDFInfo
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- CN105979710A CN105979710A CN201610137357.3A CN201610137357A CN105979710A CN 105979710 A CN105979710 A CN 105979710A CN 201610137357 A CN201610137357 A CN 201610137357A CN 105979710 A CN105979710 A CN 105979710A
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- Prior art keywords
- metallic material
- peel ply
- composite metallic
- transfer printing
- carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0531—Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a composite metal foil which has low-level stable peel strength even though after a heating compression process, and a manufacturing method thereof. The composite metal foil has a structure of carriers formed by metal foil, a diffusion prevention layer formed on the surface of the carriers, a stripping layer which is formed by metal through a physical film formation method on the diffusion prevention layer, and a transfer layer which is formed by metal through a plating method on the stripping layer. The metal forming the stripping layer is in the same element with the metal which forms the transfer layer. The stripping layer forms specific film density through the physical film formation method.
Description
Technical field
The present invention relates to composite metallic material and manufacture method thereof and printed wiring board.
Background technology
In recent years, in the electronic equipment requiring miniaturization, high processing rate, use and formed
There is the printed wiring board of the multi-ply construction of fine pattern (accurate (fine) pattern), come highly dense
The semiconductor element carried by base plate for packaging is installed on degree ground.
It addition, as installation elements, for rewiring, and use increasing layer (build up)
Substrate, substantially by being referred to as the supporting layer of core (core) layer and in its one or two sides
On the lamination (build up layer) that connected up constitute.For this lamination, along with
The miniaturization of element, it is also desirable to precise pattern.
As the manufacture method of the printed wiring board being suitable for forming precise pattern, have for
The copper clad layers that insulating resin (hereinafter referred to as " base material ") is gone up laminating ultrathin copper foil and formed
The method that lamination forms pattern by etching method etc..But, if the thickness of Copper Foil is 12 [μm]
Hereinafter, then forming copper-clad laminated board when, it is easy to produce fold, be full of cracks, so
Know also to employ and form at the upper stacking ultrathin copper foil of supporter (hereinafter referred to as " carrier ")
The manufacture method of copper-clad laminated board of composite metallic material.
For the significant base plate for packaging of development of precise pattern, for further miniaturization,
Carry out by making that sandwich layer is thinning, even omit sandwich layer and make the trial of substrate thinner.Specially
In profit document 1～3, disclose by forming lamination on supporter and separating from supporter,
Thus eliminate the manufacture method of the substrate (hereinafter referred to as " coreless substrate ") of sandwich layer,
In patent documentation 1, disclose the manufacturer employing above-mentioned composite metallic material as supporter
Method.
About above-mentioned composite metallic material, in patent documentation 4～6, disclose on carrier every
The inorganic overlay film comprising chromium (Cr) etc. or there is the nitrogenous chemical combination of sub stituent (functional group)
The various peel plies such as the such organic overlay film of thing form Copper Foil, carry out separating with this peel ply and
The method that copper foil membrane is transferred on base material.
It addition, in patent documentation 7, disclose the structure as above-mentioned composite metallic material,
Carrier foils has barrier layer, the peel ply being made up of copper and employs acid plating
Cover composite metallic material and the manufacture thereof of the transfer printing layer being made up of the metal identical with peel ply of bath
Method.
No. 4273895 publications of [patent documentation 1] Japanese Patent No.
[patent documentation 2] Japanese Unexamined Patent Publication 2009-252827 publication
[patent documentation 3] Japanese Unexamined Patent Publication 2010-080595 publication
[patent documentation 4] Japanese Patent Publication 56-34115 publication
[patent documentation 5] Japanese Unexamined Patent Publication 11-317574 publication
[patent documentation 6] Japanese Unexamined Patent Publication 2000-315848 publication
[patent documentation 7] Japanese Unexamined Patent Publication 2012-115989 publication
Summary of the invention
In recent years, the use situation of base material of the high resin of glass transition temperature is employed relatively
Many, the condition of heating compression section becomes more harsh.Multiple disclosed in patent documentation 4～7
Closing in metal forming, generally, due to heating compression section, the peel strength of carrier rises,
So according to the condition situation of heating compression section, it is possible to because the peel strength mistake of carrier
Height, and be peeling bad (can not peel off), ultrathin copper foil itself is peeled away from base material
Undesirable condition.
On the other hand, in coreless substrate, in manufacture method disclosed in such as patent documentation 1
In, the repeated multiple times heating compression section carried out for forming lamination, if peeled off final
Time point in peel strength become too high, it is likely that be peeling bad, lamination and broken
The undesirable condition such as bad, even if it is therefore contemplated that repeated multiple times carrying out heating compression section but peel off strong
Spend the most stable composite metallic material.
The present invention is in view of above-mentioned and complete, even if its main purpose is to provide one
Heating compression section after also have the stable peel strength of low-level composite metallic material and
Its manufacture method.
The composite metallic material of the present invention is characterised by possessing:
Carrier, it is made up of metal forming；
Barrier layer, it is formed at the surface of described carrier；
Peel ply, it is formed at institute by with the film density of regulation by physics mode film build method
The metal stating barrier layer is constituted；And
Transfer printing layer, it is made up of the metal being formed at described peel ply by plating method,
Described barrier layer suppression metallic atom spreads to described carrier from described peel ply,
Constitute the metal of described peel ply and be and constitute the metal of described transfer printing layer to be identical element
Copper,
Adjust described film density, can peel off by described carrier, described from described transfer printing layer
The stacked film that barrier layer and described peel ply are constituted.
In the structure of the composite metallic material of the present invention, constitute peel ply and the gold of transfer printing layer
Genus is copper, close with the film reaching regulation by using physics mode film build method to adjust peel ply
Degree, even if also be able to realize low water after the heating compression section for forming printed base plate
The most fixed peel strength.
As the physics mode film build method forming peel ply, it may be preferred to use vacuum evaporation,
And the preferred film density of peel ply is more than 92 [%].In order to make peel strength low-level
The thickness of stable peel ply is preferably 0.2～0.5 [μm].
In the structure of the composite metallic material of the present invention, by arranging barrier layer, it is possible to press down
System constitutes peel ply, the metallic atom of transfer printing layer is diffused into carrier due to heating compression section
Side, so being not likely to produce the undesirable condition relevant with peeling off self.
Herein, described barrier layer is by by Ni (nickel), P (phosphorus), Co (cobalt), Mo
Monometallic that any one element of (molybdenum), Cr (chromium) groups of elements is constituted or by selected from described
Alloy, hydrate or the oxide that the two or more element of groups of elements is constituted, or, institute
State monometallic, alloy, hydrate, oxide complex constitute, its thickness be 0.05～
1000[mg/m2].Alternatively, it is also possible to the rear side at described carrier also forms same layer.
It addition, the metal forming of carrier can be preferably used Copper Foil.
Adhesive force about peel ply, it is possible to hundred lattice in JIS-D0202 (1988) are attached
The property test is evaluated.If hundred lattice tacks test residual rate be 10 [%] below, then
It is made up of carrier, described barrier layer and peel ply about peeling off after being formed at transfer printing layer
Stacked film needed for intensity (hereinafter referred to as " carrier peel strength "), implement 220 DEG C
Under carry out the heat run of 4 hours, with heat time heating time [hr] as X-axis, and with peel strength
[kN/m] is Y-axis, describe heat time heating time of peel strength dependent in the case of, base
In method of least square approximation linear function slope be 0.01 [kN/mhr] below, now
The carrier peel strength of (during heat run and before and after test) reaches 0.05 [kN/m] below.
If the residual rate of hundred lattice tack tests is more than 10 [%], after heating, the lowest
Horizontal stable becomes difficulty, if slope is more than 0.01 [kN/mhr], the carrier stripping after heating
From intensity more than 0.05 [kN/m], then stripping itself becomes difficulty etc., adapts to print base
Problem will be become on plate.
The thickness that peel ply and transfer printing layer add up to be more than 0.2 [μm] and 12 [μm] below.As
Really thickness is thin, then the formation of overlay film becomes difficulty, and the stripping in peel ply becomes difficulty,
And if it exceeds 12 [μm], then the formation of precise pattern becomes difficulty.
Alternatively, it is also possible in the rear side of described carrier, also formed by described barrier layer,
That described peel ply and described transfer printing layer are constituted, same stacked film.
The manufacture method of the composite metallic material of the present invention is characterised by having: prepare by gold
Belong to the operation of the carrier that paper tinsel is constituted；The surface of at least side of described carrier is formed nonproliferation
Dissipate the operation of layer；The surface of described barrier layer forms stripping by physics mode membrane formation process
The operation of absciss layer；And form transfer printing layer by plating method on the surface of described peel ply
Operation.
By adjusting the film density of described peel ply under the formation condition of physics mode membrane formation process,
The peel strength low-level after heating compression section can be made stable, prevent peel strength
The undesirable condition that copper-clad laminated board caused by rising, printed base plate manufacture.
The copper-clad laminated board of the present invention is characterised by, by being engaged by described composite metallic material
To forming stacking tectosome on the base material of copper-clad laminated board, at described stacking structure for being formed
Make in the described peel ply of body, by peeling off described carrier, described barrier layer from transfer printing layer
And described peel ply, make described transfer printing layer retain on the substrate.
After the heating compression section for engaging, peeling off carrier, nonproliferation from transfer printing layer
Dissipate in the operation of layer and peel ply, it is possible to prevent from peeling off such undesirable condition, energy
Enough high finished product rate ground manufactures copper-clad laminated board.
It addition, form pattern by the transfer printing layer of the copper-clad laminated board to the present invention, it is possible to system
Make printed wiring board.
The coreless substrate of the present invention is characterised by, is formed by following operation: make compound gold
Belong to the carrier of paper tinsel and the operation of the support member laminating of coreless substrate；Lamination formation process, bag
Include and will be compressed in the described transfer printing layer side engagement of described composite metallic material by heating by resin structure
The insulating barrier become and the wiring conductive layer being made up of Copper Foil, afterwards to described wiring with leading
Electric layer forms pattern and forms the operation more than 1 time repeatedly of wiring；And at described transfer printing layer
The middle operation that described composite metallic material and described support member are peeled off.
In the manufacture process of coreless substrate, process, in peel ply even if repeatedly adding hot compression
Peel strength still low-level stable, it is possible to suppression is at described support member and compound gold
Belong to and the stripping process of paper tinsel occurs undesirable condition.
According to the composite metallic material of the present invention, by arranging barrier layer, make the film of peel ply
Density optimization, it is possible to make the peel strength low-level after heating compression section stable, energy
Enough prevent from heating peeling off that breakage bad, transfer printing layer is such, peel off caused by compression section
Undesirable condition caused by the rising of intensity.It addition, the composite metallic material of the application of the invention
Manufacture printed wiring board, coreless substrate, it is possible to prevent the undesirable condition in stripping process,
Improve productivity.
Accompanying drawing explanation
Fig. 1 is the profile of the composite metallic material of the first embodiment.
Fig. 2 is the variation of the composite metallic material of the first embodiment.
Fig. 3 is the process chart of the manufacture method of the composite metallic material representing the first embodiment.
Fig. 4 is the process profile corresponding with each operation of Fig. 3.
Fig. 5 is the dependent curve of heating treatment time representing peel strength.
Fig. 6 is the process chart of the manufacture method of the copper-clad laminated board representing the second embodiment.
Fig. 7 is the profile of the printed wiring board representing the 3rd embodiment.
Fig. 8 is the process chart of the manufacture method of the coreless substrate representing the 4th embodiment.
Fig. 9 is the process chart of the manufacture method of the coreless substrate representing the 4th embodiment.
Figure 10 is the profile of the coreless substrate representing the 4th embodiment.
[symbol description]
1: composite metallic material；2: carrier；3: barrier layer；4: peel ply；5: transfer
Layer；5a: the transfer printing layer of composition；6: base material；7: printed wiring board；8: become support
The material of body；9: the resin of coreless substrate；10: Copper Foil；11: lamination；12: centreless
Substrate；13: semiconductor element；14: centreless base plate for packaging.
Detailed description of the invention
Hereinafter, referring to the drawings, the embodiments of the present invention are described.But, each embodiment party
Formula and each embodiment the most not provide limited explanation in the identification of idea of the invention.
It addition, about parts same or of the same race, attached give identical reference marks, and sometimes omit
Explanation.
(the first embodiment)
<structure of composite metallic material>
First, the structure of the composite metallic material in the following description present invention.Fig. 1 is to represent this
The diagrammatic sectional view of one example of the composite metallic material in invention.Composite metallic material 1 is by becoming
The carrier 2 of the supporter of stacked film, the barrier layer 3 formed on the surface of carrier 2, shape
Become the peel ply 4 on the surface of barrier layer 3 and be formed at the surface of peel ply 4
On transfer printing layer 5 constitute.About carrier 2, as long as have the heating compression section of imagination
In thermostability and become the example of supporter of the stacked film that layer thereon is formed, then
It is not particularly limited.For example, it is possible to enumerate by rolling method, electrolysis formed Copper Foil,
The metal formings such as copper alloy foil.It is made up of described barrier layer 3, peel ply 4, transfer printing layer 5
Stacked film is formed at least one side of carrier but it also may be formed at two sides.
In the case of using Copper Foil as carrier 2, for the viewpoint of operability, preferably make
The thickness of this Copper Foil becomes 9～300 [μm], and then more preferably 18～35 [μm].Its reason
For, if carrier is less than 9 [μm], then it is prone to produce fold, be full of cracks, so being difficult to be used as
Carrier, and if it exceeds 300 [μm], the most well-pressed and be difficult to operate.It addition,
In the case of making the low roughness of surface roughness of formed transfer printing layer 5, by carrier 2
Surface roughness is RzJIS:1.0 [μm] such rolling Copper Foil, special electrolytic copper foil below
As carrier 2.It addition, RzJIS refers to described in JIS-B0601 (2013)
10 mean roughness.
Barrier layer 3 is the film formed on the surface of carrier 2, is to prevent due to rear
The heat treatment step in face and make composition peel ply 4, the metallic atom of transfer printing layer 5 be diffused into load
Side (or phase counterdiffusion) and arrange.As such material, can enumerate by Ni,
Monometallic that any one element of P, Co, Mo, Cr groups of elements is constituted or by from described unit
Alloy that the two or more element selected in element group is constituted or hydrate or oxide,
Or described monometallic, alloy, hydrate, the complex etc. of oxide.
The thickness of barrier layer 3 is preferably 0.05～1000 [mg/m2].It addition, with adhering to
Amount (quality of per unit area) represents that the reason of thickness is, the thickness of barrier layer 3
The thinnest, so being difficult to directly measure.
In the case of the thickness of barrier layer is the thinnest, it is impossible to play sufficient non-proliferation merit
Energy.That is, its reason is, in formation printed wiring board or when adding hot compression of coreless substrate,
Constitute peel ply 4, the metallic atom of transfer printing layer 5 diffuses easily into carrier 2 side, and peels off
Become difficulty.It addition, about its thickness, according to formed barrier layer metal kind and
Suitably adjust.But, if thickness is more than 1000 [mg/m2], then cause overlay film to be formed
Cost increase, so the most preferred.
Peel ply 4 is formed by vacuum vapour deposition.About peel ply 4, by making shape
Become constrained optimization, even if also will not be peeling bad etc. after heating compression section,
Can peel off by carrier 2, barrier layer 3 from transfer printing layer 5 in peel ply 4 and peel off
The stacked film that layer 4 is constituted.Herein, the thickness of peel ply 4 as described later, preferably 0.2～
0.5[μm].If less than 0.2 [μm], then the function as peel ply 4 deteriorates, so not
Preferably.It addition, along with thickening more than 0.5 [μm], cause the cost increase that overlay film is formed,
And the function as peel ply deteriorates.
Vacuum vapour deposition is suitable for the method that peel ply is formed.As described later, by making steaming
Plating exports (electric wire power) from 45 [kW] of conventional condition to 35 [kW] the lowest output
Changing, the film density of stripping film 4 becomes more than 92 [%], becomes the finest and close film.
Herein, during film density is defined as the density (proportion) of film that formed by evaporation and substrate
The ratio of density (bulk density) (proportion).
By making the formation condition optimization of stripping film 4, about the clinging force of peel ply 4,
Residual rate in hundred lattice tacks tests became 10 [%] below, with at 220 DEG C 4 hours
Heat time heating time [hr] is X-axis, and with peel strength [kN/m] as Y-axis, describes to peel off
Intensity to heat time heating time dependent in the case of, approximation linear function based on method of least square
Slope become 0.01 [kN/mhr] below, it is possible to make carrier peel strength now become
0.05 [kN/m] is below.Therefore, when manufacturing copper-clad laminated board, printed base plate etc., prevent
Bad etc. in stripping process.
Transfer printing layer 5 is the layer of the conductor becoming the base material constituting printed wiring board, uses conduction
The metal that property is high.Specifically, preferably copper.
But, because transfer printing layer 5 is likely to adhere to upper part peel ply 4, need note
The adjustment of meaning thickness.That is, the thickness added up to about peel ply 4 and transfer printing layer 5, due to
The when of being transferred to the base material constituting printed wiring board, the precise pattern to circuit impacts,
So the total of thickness preferably becomes 0.2～12 [μm].Its reason is, less than 0.2 [μm]
When, the formation of overlay film becomes difficulty, and the stripping function deterioration of peel ply 4.Separately
Outward, if it exceeds 12 [μm], then the formation of precise pattern becomes difficulty.It addition, about anti-
Diffusion layer 3, is also attached to the situation of peel ply 4, but the result of investigation shows that it adheres to
Amount does not becomes problem.
Fig. 2 is the figure of the variation representing the first embodiment.That is, at the compound gold of Fig. 1
In the case of belonging to paper tinsel, in the face of the side of carrier 2, only define stacked film, but Fig. 2 is
The example of same stacked film is defined in the two sides of carrier 2.
<manufacture method of composite metallic material>
It follows that the manufacture method of above-mentioned composite metallic material is described.
Fig. 3 is the figure of the operation of the manufacture method representing above-mentioned composite metallic material.Fig. 4 be with
The process profile that each operation of Fig. 3 is corresponding.
-operation S1-
First, as carrier 2, it is ready to pass through rolling method, the metal forming of electrolysis formation.
(Fig. 4 (a)) is set to use the untreated electrolytic copper foil obtained by electrolysis (not herein
Carry out the Copper Foil of surface process).It addition, set its thickness for example, 18 [μm].
-operation S2-
It follows that form barrier layer 3 on the surface of carrier 2.(Fig. 4 (b)) has
For body, prepare the plating bath for forming barrier layer, this plating bath impregnates carrier
The surface of 2 and on the surface of carrier 2, form barrier layer 3 by plating.Barrier layer 3
By the monometallic being made up of any one element of Ni, P, Co, Mo, Cr groups of elements or by
The alloy constituted selected from the two or more element of described groups of elements or hydrate or oxidation
Thing or described monometallic, alloy, hydrate, the complex composition of oxide, but herein
Represent the example that the composite bed being made up of Ni, P, Cr is formed as barrier layer.It addition,
Its thickness for example, 286 [mg/m2]。
-operation S3-
It follows that form peel ply 4 on the surface of barrier layer 3.(Fig. 4 (c))
The forming method of this peel ply 4 is preferably vacuum vapour deposition, and the evaporation making formation peel ply is defeated
Going out is 35 [kW], and the thickness of peel ply is 0.2 [μm], and the metal constituting peel ply 4 is preferred
For the metal unit identical with the metal being formed in ensuing operation S4 the transfer printing layer 5 formed
Element.
-operation S4-
It follows that form transfer printing layer 5 on the surface of peel ply 4.(Fig. 4 (d)) turns
The formation of print layer 5, it is possible to use the film build method of the chemical applying plating method, such as
Electrodeposition bath.About transfer printing layer 5, if it is considered that use copper, then consider industrial
In the case of mass-produced, the plating bath of acidity, such as copper sulfate plating bath are preferably used.
As copper sulfate plating bath, such as contain sulphuric acid 100 [g/L] and five water sulphuric acid by being impregnated into
The electrolyte of copper 250 [g/L] the rated current that is energized, form transfer printing layer 5, make rule
Fixed thickness.By this operation, composite metallic material 1 i.e. completes.
By aftermentioned detailed experiment, specify that by utilizing thing according to the adjustment of its membrance casting condition
The film density of the peel ply 4 that reason mode membrane formation process is formed, it is possible to adjust and utilize as chemical
Membrane formation process representative plating method formed transfer printing layer 5 and the peel strength of peel ply 4.
Even if it addition, remain peel ply 4 on the surface of transfer printing layer 5 as residue, due to
Peel ply 4 is made up of the metallic element identical with transfer printing layer 5, so without baneful influence.
Furthermore, it is contemplated that aftermentioned printed wiring board or the manufacture of coreless substrate, as further
Operation, in order to improve and constitute the base material 6 of printed wiring board or become the material of supporter
The clinging force of material 8, it is also possible to roughening treatment is implemented on the surface for transfer printing layer 5.
In this case, for the transfer printing layer 5 formed on carrier 2, at copper sulfate-sulphuric acid
In solution, near critical current density, carry out catholyte, by dendritic crystalline or fine
The copper powder of shape, forms roughening face.By base material or the kind of the material becoming supporter
Class, required adhesive force, adjust the surface roughness in roughening face.Surface roughness is preferably
RzJIS:6 [μm] below, if it is considered that form the finest precise pattern, the most more preferably
For RzJIS:2 [μm] below.It addition, RzJIS refers in JIS-B0601 (2013)
10 mean roughness recorded.
And then, it is also possible in order to prevent dispersing of copper powder, for implementing turning of roughening treatment
Print layer 5, carries out cladding process as required.
The when of stating printed wiring board 7 or coreless substrate 11 after fabrication, result from manufacture work
Heating compression section in sequence, etching work procedure etc., have base material 6 or become the material of supporter
8 and transfer printing layer 5 combination reduce situation.Therefore, for the purpose of maintenance bonding state,
Process as coating, it is also possible to implement further to utilize Zn (zinc), Cr (chromium), Co
The dissimilar metal such as (cobalt), Mo (molybdenum), Ni (nickel), P (phosphorus), W (tungsten)
Coating processes, utilizes the chromic acid of the solution containing dichromic acid ion and processes, utilizes containing benzo
The organic rust preventing process etc. of the solution of triazole, silane coupling agent or their derivatives.
Furthermore, it is contemplated that the manufacture of coreless substrate 11, in order to by carrier 2 also with become support
The material 8 of body is fitted, it is also possible to be also carried out at above-mentioned roughening treatment, cladding for carrier 2
Reason, coating process.
Hereinafter, specific embodiment is illustrated in greater detail.
(embodiment 1)
First, it is ready to pass through the untreated electrolytic copper foil that known method is formed, as
Carrier 2 (operation S1).On the surface of this carrier, formation is made up of Ni, P, Cr
Composite bed, as barrier layer 3 (operation S2).
It follows that in order to form peel ply 4, by vacuum vapour deposition, make evaporation export into
It is 30 [kW], and defines the layers of copper (operation S3) of thickness 0.2 [μm].And then, for
Form transfer printing layer 5 in its surface, on the carrier defining peel ply 4, by public affairs
The sulphuric acid known/copper sulfate plating bath, defines the transfer being made up of the Copper Foil of thickness 4.8 [μm]
Layer 5 (operation S4).It addition, peel ply 4 is layers of copper, if so at copper sulfate plating
Bath impregnates for a long time, then exists to dissolve to react and develop into the worry that peel ply 4 dissolves, institute
So that the electro-deposition operation of transfer printing layer 5 the most also must be initially formed within 5 points.
Finally, in the case of base material is resin, with the bonding force of raising with transfer printing layer 5 it is
Purpose, implements roughening treatment for transfer printing layer 5.In the case of Gai, in roughening treatment,
The copper powder making dendritic crystalline or fine shape separates out.
As known roughening treatment, it is possible to by such as Japanese Unexamined Patent Publication 1-246393
Method disclosed in number publication, makes the copper powder of fine shape separate out.
It follows that on the surface of transfer printing layer 5 defining coated copper, utilize successively
The coating of Ni processes, utilizes the zinc chromate of Zn-Cr to process, silane coupling agent process, obtains
Composite metallic material 1.
(embodiment 2)
In described embodiment 1, barrier layer is changed to the composite bed being made up of Ni, P,
In addition, in the same manner as described embodiment 1, composite metallic material 1 has been obtained.
(embodiment 3)
In described embodiment 1, it is changed to barrier layer to be made up of Co, Mo, Cr
Composite bed, in addition, has obtained composite metallic material 1 in the same manner as described embodiment 1.
(embodiment 4)
In described embodiment 1, making peel ply is to export with the evaporation of 35 [kW], thickness
It is the layers of copper of 0.5 [μm], in addition, by method similarly to Example 1, is formed
Composite metallic material 1.
(embodiment 5)
In described embodiment 4, the thickness making barrier layer is 421.6 [mg/m2], except this
In addition, composite metallic material 1 has been obtained in the same manner as described embodiment 4.
(embodiment 6)
In described embodiment 1, the thickness making transfer printing layer 5 is 1.3 [μm], in addition,
Composite metallic material 1 has been obtained in the same manner as described embodiment 1.
(embodiment 7)
In described embodiment 1, the thickness making transfer printing layer 5 is 11.8 [μm], in addition,
Composite metallic material 1 has been obtained in the same manner as described embodiment 1.
(comparative example 1)
In described embodiment 1, define barrier layer 3, but in comparative example 1, not
Form barrier layer 3, in addition, obtain compound gold in the same manner as described embodiment 1
Belong to paper tinsel 1.
(comparative example 2)
In described embodiment 1, define peel ply 4, but in comparative example 2, non-shape
Become peel ply 4, in addition, obtain composite metallic material 1 in the same manner as described embodiment 1.
(comparative example 3)
In described embodiment 1, peel ply 4 by vacuum vapour deposition with 30 [kW]
Evaporation output and the layers of copper of thickness 0.2 [μm] that formed, but in comparative example 3, utilize with
45 [kW] of past evaporation output, define the layers of copper of thickness 0.2 [μm], in addition,
Composite metallic material 1 has been obtained in the same manner as described embodiment 1.
(comparative example 4)
In described embodiment 2, peel ply 4 by vacuum vapour deposition with 30 [kW]
Evaporation output and the layers of copper of thickness 0.2 [μm] that formed, but in comparative example 4, utilize with
45 [kW] of past evaporation output, define the layers of copper of thickness 0.2 [μm], in addition,
Composite metallic material 1 has been obtained in the same manner as described embodiment 2.
(comparative example 5)
In described embodiment 3, peel ply 4 by vacuum vapour deposition with 30 [kW]
Evaporation output and the layers of copper of thickness 0.2 [μm] that formed, but in comparative example 5, utilize with
The output of 45 [kW] of past evaporation output, defines the layers of copper of thickness 0.2 [μm], except this
In addition, composite metallic material 1 has been obtained in the same manner as described embodiment 3.
(comparative example 6)
In described embodiment 1, the thickness making peel ply 4 is 0.2 [μm], but is comparing
In example 6, the thickness of peel ply 4 is made to become 0.01 [μm], in addition, with described enforcement
Example 1 has similarly obtained composite metallic material 1.
(comparative example 7)
In described embodiment 1, the thickness making peel ply 4 is 0.2 [μm], but is comparing
In example 7, the thickness making peel ply 4 is 0.7 [μm], in addition, with described embodiment 1
Similarly obtain composite metallic material 1.
(comparative example 8)
In described embodiment 1, peel ply 4 by vacuum vapour deposition with 30 [kW]
The layers of copper of the thickness 0.2 [μm] that evaporation exports and formed, but in comparative example 8, make evaporation
Time evaporation be output as 55 [kW] of high output, and define the layers of copper of thickness 0.2 [μm],
In addition, composite metallic material 1 has been obtained in the same manner as described embodiment 1.
In Table 1, the manufacturing conditions of above-mentioned sample is summed up.It addition, in Table 1, in the lump
The film density of peel ply under each sample manufacturing conditions, hundred lattice tack test residuals are recorded in ground
Rate, the heat run result (including the slope relative to heat time heating time) of peel strength.
It addition, the film density (%) in table 1 is formed with by above-mentioned each membrance casting condition
The ratio definition of the proportion of the same metal element in the proportion of film (peel ply) and substrate,
It is defined for the consistency of the film formed is carried out the index of quantification.Therefore, film
Density 100 [%] is the proportion identical with substrate, it is believed that mean its value closer to
100%, the compactness of film is the highest.
[table 1]
The calculating of barrier layer hundred lattice tack residual rate is as mentioned above according to JIS-D0202
(1988) hundred lattice tack test methods in.
Peel strength is according to the test method peeling intensity in JIS-C6481 (1996).
It addition, relative to the slope of heat time heating time, as described previously for temperature 220 DEG C
Lower 4 hours interior peel strength [kN/m] heat time heating time [hr] dependency is approximated once
The slope [kN/mhr] of function, is that the stability to peel strength carries out quantification and obtains.
Mean if its value is little, then peel strength is little the most stable relative to its change heat time heating time.
Fig. 5 is dependent curve heat time heating time representing peel strength, in the longitudinal axis (Y-axis)
Middle expression peel strength [kN/m], represents heat time heating time [hr] in transverse axis (X-axis), makees
For example, it is respectively directed to embodiment 1 and comparative example 3, depicts determination data and near
Straight line like linear function.Understand compared to comparative example 3, in embodiment 1, approximate one
The slope (being later abbreviated as " slope ") of secondary function is greatly reduced (improvement), peels off strong
Degree improves.
In Table 1, it is to be understood that the film density of all conditions in embodiment 1～6 represents
The high level of more than 92 [%], at the bar making the evaporation during film forming of peel ply be output as low output
Under part, become fine and close film.And then, it is to be understood that hundred lattice tack tests of these conditions
Residual rate good and be 10 [%] below, and the peel strength in heat run is
0.05 [kN/m] value below, slope is also that 0.01 [kN/mhr] makes heat treated low below
Horizontal stable, it is ensured that good fissility.By the film of so use densification as peel ply,
Hundred lattice tack tests, the heat run of peel strength all can get good result.Therefore,
Can eliminate and peel off the problems such as bad.
On the other hand, it is known that in the film forming of the condition of comparative example 3,4,5,8, i.e. peel ply
Time evaporation output more higher than embodiment 1～6 in the case of, the film density of peel ply is low to be arrived
80 [%] level, and hundred lattice tacks test residual rate is high.Understand under these conditions,
The peel strength of heat run is the highest, and then slope also illustrates that big value, and shortcoming is for heating
The stability processed.
It addition, under conditions of comparative example 6,7, the evaporation output during film forming of peel ply with
Embodiment 1～6 is similarly low output, so while film density is high, but hundred lattice tack examinations
Test residual rate high.And then, in the heat run of peel strength, peel strength is high, and its
Slope is also big, and the stability for heat treated also deteriorates.I.e., it is known that the film of peel ply
Thicker than thin or blocked up, hundred lattice tack test residual rates, peel strength all deteriorate.According to reality
The result executing example 1～6 understands, and needs to be set at least than 0.01 [μm] thickness of peel ply
Thicker and thinner than 0.7 [μm], preferably 0.2～0.5 [μm].
It addition, according to hundred lattice tack test residuals in comparative example 1 (without barrier layer)
The result of the heat run of rate and peel strength, it is obviously desirable to the existence of barrier layer, and
And the result of the heat run according to the peel strength in comparative example 2 (without peel ply), aobvious
So need the existence of peel ply.
It addition, in above embodiment and comparative example, as the formation side of peel ply 4
Method, only describes vacuum vapour deposition, but the invention is not restricted to this, as long as obtaining the film of necessity
Density, then can also use known physics mode membrane formation process, such as sputtering method, from
Sub-galvanoplastic replace vacuum vapour deposition.
The manufacture method of (the second embodiment)-copper-clad laminated board-
It follows that explanation uses the method that composite metallic material 1 manufactures copper-clad laminated board.Figure
6 is to represent transfer composite metallic material 1 on the base material 6 of printed wiring board, manufactures copper clad layers
The figure of the operation of lamination.
As shown in Fig. 6 (a), first, make composite metallic material 1 and constitute printed wiring board
Base material 6 is right in opposite directions, makes both be close to afterwards.It follows that as shown in Fig. 6 (b), logical
Cross and add hot compression when being close to, form composite metallic material 1 and the stacking structure of base material 6
Make body.
It follows that as shown in Fig. 6 (c), by from above-mentioned lit-par-lit structure body peel carrier 2,
Barrier layer 3 and peel ply 4, become the state of transfer printing layer 5 of having fitted on base material 6,
Copper-clad laminated board i.e. completes.The transfer printing layer 5 alternatively, it is also possible to fit on the two sides of base material 6
And become two sides copper-clad laminated board.
About peeling intensity (peel strength) when above-mentioned lit-par-lit structure body peels carrier,
Slope based on the heat treated carrying out 4 hours at 220 DEG C be 0.01 [kN/mhr] below,
Carrier peel strength now be 0.05 [kN/m] below, it is possible to suppress peeling-off not
Good etc..It addition, also have a part for barrier layer 3 peeling off when to become on peel ply
For the situation of residue, but the result of investigation, its amount is the slightest, it is thus identified that no problem.
The manufacture method of (the 3rd embodiment)-printed wiring board-
Above-mentioned copper-clad laminated board can be used to manufacture printed wiring board.Fig. 7 is to represent upper
State formation circuit pattern in copper-clad laminated board, manufacture the profile of the appearance of printed wiring board.
As it is shown in fig. 7, formed the transfer printing layer 5a of composition by etching method etc., thus complete
It is formed with the printed wiring board 7 of circuit pattern.Alternatively, it is also possible to as required and then stacking
Composite bed lamination, forms the printed wiring board of multi-ply construction.
The manufacture method of (the 4th embodiment)-coreless substrate-
Above-mentioned composite metallic material 1 can be used to manufacture coreless substrate 11.Hereinafter, it is described
Method.Fig. 8 is to represent laminating composite metallic material 1 on the material 8 become supporter, comes
Manufacture the figure of the operation of coreless substrate 11, but this figure is only an example, the invention is not restricted to
This manufacture method.
As shown in Fig. 8 (a), first, make composite metallic material 1 and become the material of supporter
8 is right in opposite directions, makes both fit and become supporter afterwards.Now, with become supporter
Material 8 face in opposite directions be carrier 2 side.
It follows that as shown in Fig. 8 (b), in composite metallic material 1, with become support
The opposite side in face of material 8 laminating of body, i.e. transfer printing layer side, by the resin of coreless substrate
9 and Copper Foil 10 in opposite directions and to and add hot compression, thus cambium layer stack.
It follows that as shown in Fig. 8 (c), utilize etching method etc., the resin to coreless substrate
On Copper Foil 10 form pattern, carry out circuit formation, surface process, interlayer dielectric formed
And interlayer connects, and then stacking resin/Copper Foil is repeated and adds the operation of hot compression, profit
Lamination 11 is formed by known multi-layer sheet manufacture method.
It follows that as shown in Fig. 9 (a), by peel ply 4, lamination 11 is peeled off, and
Obtain coreless substrate 12.Now, about the transfer printing layer 5 subsidiary in coreless substrate 12 side, both
Can remove comprehensively can also form circuit, select aptly, represent such as in transfer herein
Layer 5 is formed the example of circuit.
It follows that as shown in Fig. 9 (b), be mounted and sealed in coreless substrate 12 and partly lead
Body member 13, centreless base plate for packaging 14 i.e. completes.Alternatively, it is also possible to as shown in Figure 10,
Laminating composite metallic material 1 on the two sides of material 8 becoming supporter, manufactures on two sides
Centreless base plate for packaging 14.
Intensity is peeled when peeling off about making above-mentioned coreless substrate, little based at 220 DEG C 4
Time the slope of heat treated be 0.01 [kN/mhr] below, carrier peel strength now is
0.05 [kN/m] is below, it is possible to prevent to peel off bad etc..
Claims (14)
1. a composite metallic material, it is characterised in that possess:
Carrier, it is made up of metal forming；
Barrier layer, it is formed at the surface of described carrier；
Peel ply, it is formed at institute by with the film density of regulation by physics mode film build method
The metal stating barrier layer is constituted；And
Transfer printing layer, it is made up of the metal being formed at described peel ply by plating method,
Described barrier layer suppression metallic atom spreads to described carrier from described peel ply,
Constitute the metal of described peel ply and be and constitute the metal of described transfer printing layer to be identical element
Copper,
Adjust described film density, can peel off by described carrier, described from described transfer printing layer
The stacked film that barrier layer and described peel ply are constituted.
2. composite metallic material as claimed in claim 1, it is characterised in that
Described film density is more than 92%.
3. composite metallic material as claimed in claim 1 or 2, it is characterised in that
The thickness of described peel ply is 0.2～0.5 μm.
4. the composite metallic material as described in any one in claims 1 to 3, its feature
It is,
Described physics mode film build method is vacuum vapour deposition
。
5. the composite metallic material as described in any one in Claims 1-4, its feature
It is,
Described barrier layer by
The monometallic that is made up of any one element of the groups of elements of Ni, P, Co, Mo, Cr or
Alloy, hydrate or the oxide being made up of the two or more elements selected from described groups of elements,
Or, described monometallic or the alloy, hydrate or the oxidation that are made up of two or more elements
The complex of thing is constituted.
6. the composite metallic material as described in any one in claim 1 to 5, its feature
It is,
The thickness of described barrier layer is 0.05～1000mg/m2。
7. the composite metallic material as described in any one in claim 1 to 6, its feature
It is,
Described metal forming is Copper Foil.
8. the composite metallic material as described in any one in claim 1 to 7, its feature
It is,
The tack of peel ply after being formed about described peel ply, based on
In the hundred lattice tack tests of JIS-D0202 (1988), residual rate is less than 10%.
9. the composite metallic material as described in any one in claim 1 to 8, its feature
It is,
The peel strength of carrier after being formed about described transfer printing layer is little with at 220 DEG C 4
Time heat time heating time [hr] be X-axis, and be that Y-axis is to describe with peel strength [kN/m]
State heat time heating time of peel strength dependent in the case of, approximation one based on method of least square
The slope of secondary function is below 0.01kN/mhr, and carrier peel strength is below 0.05kN/m.
10. the composite metallic material as described in any one in claim 1 to 9, its feature
It is,
The thickness that described peel ply and described transfer printing layer add up to is below 0.2～12 μm.
11. 1 kinds of composite metallic materials as described in any one in claim 1 to 10
Manufacture method, it is characterised in that including:
Prepare the operation of the carrier being made up of metal forming；
At least one side surface at described carrier forms the operation of barrier layer；
Formed the operation of peel ply by physics mode membrane formation process on the surface of described barrier layer；
And
Formed the operation of transfer printing layer by plating method on the surface of described peel ply.
12. 1 kinds of copper-clad laminated boards, it is by following formation:
Composite metallic material described in any one in claim 1 to 10 is joined to for
Formed on the base material of copper-clad laminated board, and form stacking tectosome,
And at the described peel ply of described lit-par-lit structure body by described carrier, described barrier layer
Peel off with described transfer printing layer with described peel ply, make described transfer printing layer retain on the substrate.
13. 1 kinds are formed by the transfer printing layer of described copper-clad laminated board is formed circuit pattern
Printed wiring board.
The manufacture method of 14. 1 kinds of coreless substrates, it is characterised in that formed by following operation:
Make carrier and the nothing of composite metallic material described in any one in claim 1 to 10
The operation of the support member laminating of core substrate；
Lamination formation process, wherein, by add hot compression by the insulating barrier that is made up of resin with
And the wiring conductive layer being made up of Copper Foil is engaged in the described transfer printing layer of described composite metallic material
Side, and including, be then repeated 1 times above described wiring conductive layer is formed pattern and
Form the operation of wiring；And
In described transfer printing layer, the operation that described composite metallic material and described support member are peeled off.
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|---|---|---|---|
| JP2015-048328 | 2015-03-11 | ||
| JP2015048328A JP5859155B1 (en) | 2015-03-11 | 2015-03-11 | Composite metal foil, method for producing the same, and printed wiring board |
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| CN105979710B CN105979710B (en) | 2018-12-28 |
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| JP (1) | JP5859155B1 (en) |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110650588A (en) * | 2019-08-01 | 2020-01-03 | 诚亿电子（嘉兴）有限公司 | Copper foil laminating method of laminating machine without replacing copper foil |
| CN111295055A (en) * | 2018-12-10 | 2020-06-16 | 广州方邦电子股份有限公司 | Preparation method of composite metal foil |
| CN111286736A (en) * | 2018-12-10 | 2020-06-16 | 广州方邦电子股份有限公司 | Preparation method of metal foil with carrier |
| WO2020119339A1 (en) * | 2018-12-10 | 2020-06-18 | 广州方邦电子股份有限公司 | Metal foil having carrier and preparation method therefor |
| CN111682002A (en) * | 2019-03-11 | 2020-09-18 | 古德系统有限公司 | Heat radiation plate |
| CN112969581A (en) * | 2018-11-20 | 2021-06-15 | 三井金属矿业株式会社 | Laminated body |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017149811A1 (en) | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | Copper foil with carrier, production method for coreless support with wiring layer, and production method for printed circuit board |
| JP6471140B2 (en) * | 2016-11-30 | 2019-02-13 | 福田金属箔粉工業株式会社 | Composite metal foil, copper-clad laminate using the composite metal foil, and method for producing the copper-clad laminate |
| KR20210093849A (en) * | 2018-11-20 | 2021-07-28 | 미쓰이금속광업주식회사 | Metal foil with carrier and method for manufacturing millimeter wave antenna substrate using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101137A (en) * | 2003-09-24 | 2005-04-14 | Hitachi Chem Co Ltd | Substrate for supporting circuit formation, and substrate for packaging semiconductor element and its manufacturing method |
| CN101827495A (en) * | 2009-03-04 | 2010-09-08 | 福田金属箔粉工业株式会社 | Composite metal foil and manufacturing method thereof and printed wiring board |
| CN102233699A (en) * | 2010-04-29 | 2011-11-09 | 南亚塑胶工业股份有限公司 | Extremely thin copper foil using ultralow ridge copper foil as carrier and manufacturing method of extremely thin copper foil |
| CN102555333A (en) * | 2010-11-04 | 2012-07-11 | 福田金属箔粉工业株式会社 | Composite Metal Foil, Manufacturing Method Thereof And Printed Wiring Board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010012750A (en) * | 2008-07-07 | 2010-01-21 | Nitto Denko Corp | Method for manufacturing wiring circuit board base sheet |
-
2015
- 2015-03-11 JP JP2015048328A patent/JP5859155B1/en active Active
-
2016
- 2016-03-10 CN CN201610137357.3A patent/CN105979710B/en active Active
- 2016-03-11 TW TW105107613A patent/TWI660837B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101137A (en) * | 2003-09-24 | 2005-04-14 | Hitachi Chem Co Ltd | Substrate for supporting circuit formation, and substrate for packaging semiconductor element and its manufacturing method |
| CN101827495A (en) * | 2009-03-04 | 2010-09-08 | 福田金属箔粉工业株式会社 | Composite metal foil and manufacturing method thereof and printed wiring board |
| CN102233699A (en) * | 2010-04-29 | 2011-11-09 | 南亚塑胶工业股份有限公司 | Extremely thin copper foil using ultralow ridge copper foil as carrier and manufacturing method of extremely thin copper foil |
| CN102555333A (en) * | 2010-11-04 | 2012-07-11 | 福田金属箔粉工业株式会社 | Composite Metal Foil, Manufacturing Method Thereof And Printed Wiring Board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112969581A (en) * | 2018-11-20 | 2021-06-15 | 三井金属矿业株式会社 | Laminated body |
| CN112969581B (en) * | 2018-11-20 | 2023-08-11 | 三井金属矿业株式会社 | Laminate body |
| CN111295055A (en) * | 2018-12-10 | 2020-06-16 | 广州方邦电子股份有限公司 | Preparation method of composite metal foil |
| CN111286736A (en) * | 2018-12-10 | 2020-06-16 | 广州方邦电子股份有限公司 | Preparation method of metal foil with carrier |
| WO2020119339A1 (en) * | 2018-12-10 | 2020-06-18 | 广州方邦电子股份有限公司 | Metal foil having carrier and preparation method therefor |
| CN111682002A (en) * | 2019-03-11 | 2020-09-18 | 古德系统有限公司 | Heat radiation plate |
| CN111682002B (en) * | 2019-03-11 | 2023-04-25 | 古德系统有限公司 | Heat radiation plate |
| CN110650588A (en) * | 2019-08-01 | 2020-01-03 | 诚亿电子（嘉兴）有限公司 | Copper foil laminating method of laminating machine without replacing copper foil |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI660837B (en) | 2019-06-01 |
| TW201636207A (en) | 2016-10-16 |
| CN105979710B (en) | 2018-12-28 |
| JP5859155B1 (en) | 2016-02-10 |
| JP2016168687A (en) | 2016-09-23 |
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