CN110088714B - Transparent conductive film with carrier film and touch panel using the same - Google Patents
Transparent conductive film with carrier film and touch panel using the same Download PDFInfo
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- CN110088714B CN110088714B CN201680091549.3A CN201680091549A CN110088714B CN 110088714 B CN110088714 B CN 110088714B CN 201680091549 A CN201680091549 A CN 201680091549A CN 110088714 B CN110088714 B CN 110088714B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
Providing a protective film by controlling the moisture content of a transparent conductive film with a carrier film, thereby preventing the transparent conductive film from being electrically chargedA transparent conductive film with a carrier film, which has an abnormal resistance and has improved adhesion to a substrate to prevent peeling of the film, and a touch panel using the same. The transparent conductive film with a carrier film of the present invention comprises a transparent conductive film (20) and a carrier film (10), wherein the transparent conductive film (20) comprises a transparent resin film (3) and a transparent conductive film (4), the carrier film (10) comprises an adhesive layer (2) and a protective film (1) which are arranged on one side of the surface of the transparent conductive film (20) on which the transparent resin film (3) is formed, the transparent conductive film (4) is an indium tin composite oxide, and the water content of the protective film (1) is 1.0X10 for every 10mm X10 mm ‑3 g is less than or equal to g.
Description
Technical Field
The present invention relates to a carrier film-attached transparent conductive film including a transparent conductive film and a carrier film, and a touch panel using the same, and is particularly useful for preventing abnormal resistance and film peeling.
Background
In the field of touch panels and the like, in recent years, thinning of the transparent conductive film itself is strongly demanded. Examples of a typical touch panel include a resistive film type and a capacitive type. In recent years, in the case of capacitance type touch panels, polyethylene terephthalate (PET) has been widely used for a base film of a transparent conductive film, because of advantages such as flexibility, excellent processability, excellent impact resistance, and light weight.
As the base film becomes thinner, the need for a surface protective film attached to the side of the base film opposite to the transparent conductive layer via an adhesive layer increases for the purpose of ensuring the handleability of the base film at the stage of the manufacturing process. PET is generally widely used as a surface protective film as is the case with a base film.
On the other hand, for ITO (indium tin composite oxide) used for capacitive touch panel electrode applications, a low surface resistance value is required to form a pattern with high sensitivity/high resolution. Patent document 2 discloses a laminate in which a protective film is laminated on a transparent conductive film having PET as a film base material. In the case of using ITO as the transparent conductor layer, the ITO is crystallized by heating to reduce the resistance, and in this document, further, indium-based composite oxide having a large proportion of oxide of 4-valent metal element is deposited, and indium-based composite oxide having a small proportion of oxide of indium oxide or 4-valent metal element is deposited, whereby the ITO film is reduced in resistance.
Prior art literature
Patent literature
Patent document 1: WO2008-108255
Patent document 2: japanese patent application laid-open No. 2012-112031
Disclosure of Invention
Problems to be solved by the invention
However, since the PET film itself contains a large amount of moisture, the moisture affects the film, and thus crystallization of the transparent conductive film cannot be sufficiently performed. That is, since the moisture affects and inhibits the crystal growth of the transparent conductive film, not only the crystallization rate is slow, but also the resistance value of the transparent conductive film is abnormal such as an increase or a deviation of the resistance value occurs, and the adhesion between the transparent conductive film and the substrate is lowered, so that the film peeling occurs at the interface. According to the studies by the present inventors, the effect of the moisture content of such a film is particularly great in a case where the protective film is bonded to the transparent conductive film as well as the base material of the transparent conductive film.
Accordingly, an object of the present invention is to provide a transparent conductive film with a carrier film, which prevents an abnormal resistance value of the transparent conductive film by controlling the water content of a protective film of the transparent conductive film with a carrier film, and which improves adhesion between the transparent conductive film and a substrate to prevent peeling of the film, and a touch panel using the same.
Solution for solving the problem
The present inventors have made intensive studies to solve the above problems, and as a result, have found that the above object can be achieved by adopting the following configuration, and have completed the present invention.
That is, the transparent conductive film with a carrier film of the present invention is characterized by comprising: a transparent conductive film comprising a transparent resin film and a transparent conductive film, and a carrier film comprising an adhesive layer and a protective film, which are disposed on the side of the transparent conductive film on which the transparent resin film is formed, wherein the transparent conductive film is an indium tin composite oxide, and the protective film has a water content of 1.0X10 per 10mm X10 mm -3 g is less than or equal to g. The values of the physical properties in the present invention are measured by the methods used in examples and the like unless otherwise specified.
The transparent conductive film with carrier film of the present invention can prevent the abnormal resistance value of the transparent conductive film, and can improve the adhesion between the transparent conductive film and the substrate to prevent the peeling of the film. The mechanism of the abnormal resistance value and the film peeling has not been determined, but it is considered as follows. The abnormal resistance value is considered to be due to the influence of the water content of the protective film. The reason for this is considered to be that: in the transparent resin film, the substrate is degassed by annealing before sputtering the transparent conductive film, so that the transparent conductive film is formed with little moisture and little outgas, and the moisture of the protective film attached in the subsequent step directly affects the transparent conductive film that has been produced. Further, if the protective film contains a large amount of moisture, crystallization of the transparent conductive film does not proceed sufficiently, and not only a desired resistance value cannot be obtained, but also variation in-plane resistance value is deteriorated. This is thought to be because: the gas or the like generated when it comes into contact with moisture, plasma or the like adsorbed on the substrate acts as an impurity, thereby inhibiting crystal growth. For film peeling (adhesion), it is estimated as follows: by performing an oxidation reaction at the interface between the transparent conductive film and the substrate (transparent resin film or the like), a crystalline strain (lattice constant change) is locally generated in the vicinity of the interface, and the adhesion is reduced, and film peeling occurs. That is, it can be considered that: the interface between the transparent conductive film and the substrate is oxidized due to the influence of moisture, and thus the adhesion is reduced, and film peeling occurs.
The transparent resin film of the present invention preferably has: a 1 st cured resin layer provided on one side of the surface of the transparent conductive film, and a 2 nd cured resin layer provided on the opposite side of the surface of the transparent conductive film. Since the cured resin layers are formed on both sides of the transparent resin film, scratches are less likely to occur in the steps of forming the transparent conductive film, patterning, mounting to electronic devices, and the like.
The transparent conductive film with a carrier film of the present invention preferably further comprises 1 or more optical adjustment layers between the 1 st cured resin layer and the transparent conductive film. Since the refractive index can be controlled by the optical adjustment layer, even when the ITO film is patterned, the difference in reflectance between the pattern formation portion and the pattern opening portion can be reduced, and the transparent conductive film pattern is not easily seen, so that the visibility of the display device such as a touch panel is good.
The thickness of the protective film in the present invention is preferably 1 μm to 150. Mu.m. The thinner the protective film, the more the moisture content of the protective film can be suppressed, and crystallization of the transparent conductive film can be sufficiently performed, so that it is possible to more reliably prevent abnormality in the resistance value of the transparent conductive film, and to further improve the adhesion between the transparent conductive film and the substrate, thereby preventing peeling of the film. In addition, by setting the above range, the ease of conveyance in the roll-to-roll method can be improved.
The protective film in the present invention is preferably formed of a cycloolefin resin or a polycarbonate resin. Thus, since the water content of the protective film can be further controlled by using a resin having a low water content to sufficiently crystallize the transparent conductive film, it is possible to more reliably prevent the abnormal resistance value of the transparent conductive film and to further improve the adhesion between the transparent conductive film and the substrate to prevent peeling of the film.
The water content of the protective film in the present invention is preferably 0.50% by weight or less. Thus, the protective film having a low water content can be used, and the water content of the protective film can be further controlled so that crystallization of the transparent conductive film is sufficiently performed, whereby abnormal resistance of the transparent conductive film can be more reliably prevented, and adhesion between the transparent conductive film and the substrate can be further improved to prevent peeling of the film.
In the present invention, it is preferable that a conductive layer is further provided on a side of the protective film opposite to the side on which the adhesive layer is formed. Thus, antistatic properties can be realized, and unnecessary electrical influence can be suppressed.
The touch panel of the present invention preferably comprises the aforementioned transparent conductive film with a carrier film. This can more reliably prevent the abnormal resistance value of the transparent conductive film, and can improve the adhesion between the transparent conductive film and the substrate to prevent peeling of the film, so that a stable pattern with high sensitivity and high resolution can be formed, and the quality such as the visibility of the display device such as a touch panel can be improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a transparent conductive film with a carrier film according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a transparent conductive film with a carrier film according to still another embodiment of the present invention.
Detailed Description
Embodiments of the transparent conductive film with a carrier film according to the present invention will be described below with reference to the drawings. However, portions unnecessary for the description are omitted in some or all of the drawings, and portions are shown in an enlarged or reduced form for the convenience of description. The terms indicating the positional relationship between the upper and lower parts are used for ease of description, and are not intended to limit the constitution of the present invention at all.
< transparent conductive film with Carrier film >
Fig. 1 is a cross-sectional view schematically showing an embodiment of a transparent conductive film with a carrier film of the present invention, and fig. 2 is a schematic cross-sectional view of a transparent conductive film with a carrier film of still another embodiment of the present invention. As shown in fig. 1, the transparent conductive film with a carrier film of the present invention is a transparent conductive film with a carrier film including a transparent conductive film 20 and a carrier film 10, wherein the transparent conductive film 20 includes a transparent resin film 3 and a transparent conductive film 4, and the carrier film 10 includes an adhesive layer 2 and a protective film 1 disposed on one side of the transparent conductive film 20 on the surface on which the transparent resin film 3 is formed. The protective film 1 may further include a conductive layer on the side opposite to the side on which the adhesive layer 2 is formed.
As shown in fig. 2, the transparent resin film 3 may have a 1 st cured resin layer 6 provided on one side of the surface of the transparent conductive film 4 and a 2 nd cured resin layer 5 provided on the opposite side of the surface of the transparent conductive film 4, or may have any cured resin layer on only one side. The 1 st cured resin layer 6 and the 2 nd cured resin layer 5 include layers functioning as an anti-blocking layer and a hard coat layer. The 1 st cured resin layer 6 and the transparent conductive film 4 may further have 1 optical adjustment layer 7 or 2 or more optical adjustment layers 7. In fig. 2, the transparent conductive film 20 has the 2 nd cured resin layer 5, the transparent resin film 3, the 1 st cured resin layer 6, the optical adjustment layer 7, and the transparent conductive film 4 in this order, but may be, for example, the transparent conductive film 20 having the 2 nd cured resin layer 5, the transparent resin film 3, the 1 st cured resin layer 6, and the transparent conductive film 4 in this order, and may be the transparent conductive film 20 having the transparent resin film 3, the optical adjustment layer 7, and the transparent conductive film 4 in this order, and any combination may be used.
The transparent conductive film with the support film has an arrival resistance value (surface resistance value) of preferably 100 to 130 Ω/≡s, more preferably 100 to 120 Ω/≡s, still more preferably 100 to 110 Ω/≡s when the film is crystallized from amorphous to crystalline. Thus, a stable pattern with high sensitivity and high resolution can be formed.
The transparent conductive film with a support film preferably has a standard deviation of 30 Ω/≡s, more preferably 20 Ω/≡s, still more preferably 10 Ω/≡s, of the reaching resistance value (surface resistance value) at the time of crystallization from amorphous to crystalline. Thus, a stable pattern with high sensitivity and high resolution can be formed.
< transparent conductive film >
The transparent conductive film has a transparent resin film and a transparent conductive film. The transparent conductive film may be a transparent resin film including a 1 st cured resin layer provided on one side of a surface of the transparent conductive film and a 2 nd cured resin layer provided on the opposite side of the surface of the transparent conductive film. The transparent conductive film may further include 1 or more optical adjustment layers between the 1 st cured resin layer and the transparent conductive film.
The thickness of the transparent conductive film is preferably in the range of 20 to 150. Mu.m, more preferably in the range of 25 to 100. Mu.m, and still more preferably in the range of 30 to 80. Mu.m. When the thickness of the transparent conductive film is less than the lower limit of the above range, the mechanical strength may be insufficient, and the operation of continuously forming the cured resin layer or the transparent conductive film by winding the film base material may be difficult. On the other hand, when the thickness exceeds the upper limit of the above range, the scratch resistance of the transparent conductive film or the like and the dotting property for the touch panel may not be improved.
(transparent resin film)
The transparent resin film is not particularly limited as long as it is transparent in the visible light region, and various plastic films having transparency can be used. Examples of the material include polyester resins, cycloolefin resins, polycarbonate resins, acetate resins, polyethersulfone resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins, polyvinyl chloride resins, polyvinylidene chloride resins, polystyrene resins, polyvinyl alcohol resins, polyarylate resins, and polyphenylene sulfide resins. From the viewpoint of improving visibility, polyester-based resins, cycloolefin-based resins, and polycarbonate-based resins are more preferable, and cycloolefin-based resins or polycarbonate-based resins as amorphous resins are particularly preferable from the viewpoints of high transparency, low water absorption, moisture barrier properties, thermal stability, isotropy, and the like.
The polyester resin is preferably a polyethylene terephthalate resin, a polyethylene naphthalate resin, or the like in terms of mechanical properties and heat resistance.
The cycloolefin resin is not particularly limited as long as it is a resin having a unit containing a monomer including a cyclic olefin (cycloolefin). The cycloolefin resin used in the transparent resin film may be any of cycloolefin polymer (COP) and cycloolefin copolymer (COC). The cycloolefin copolymer is an amorphous cycloolefin resin that is a copolymer of a cycloolefin and an olefin such as ethylene.
The cyclic olefin includes polycyclic cyclic olefins and monocyclic cyclic olefins. Examples of the polycyclic cyclic olefin include norbornene, methylnorbornene, dimethylnorbornene, ethylnorbornene, butylnorbornene, dicyclopentadiene, dihydrodicyclopentadiene, methyldicyclopentadiene, dimethyldicyclopentadiene, tetracyclododecene, methyltetracyclododecene, dimethyltetracyclododecene, tricyclopentadiene, and tetracyclopentadiene. Examples of the monocyclic cyclic olefin include cyclobutene, cyclopentene, cyclooctene, cyclooctadiene, cyclooctatriene, and cyclododecatriene.
The cycloolefin resin can be obtained as a commercially available product, and examples thereof include "ZEONOR" manufactured by Zeon Corporation, "ARTON" manufactured by JSR Corporation, "polymers co., ltd" manufactured by TOPAS, "APEL" manufactured by mitsunobu chemical Corporation, and the like.
The polycarbonate resin is not particularly limited, and examples thereof include aliphatic polycarbonate, aromatic polycarbonate, aliphatic-aromatic polycarbonate, and the like. Specifically, examples of Polycarbonates (PC) using bisphenols include bisphenol A polycarbonate, branched bisphenol A polycarbonate, foamed polycarbonate, copolycarbonate, block copolycarbonate, polyester carbonate, polyphosphonate carbonate, diethylene glycol bis allyl carbonate (CR-39), and the like. The polycarbonate resin also contains a bisphenol a polycarbonate blend, a polyester blend, an ABS blend, a polyolefin blend, a styrene-maleic anhydride copolymer blend, and the like blended with other components. Examples of the commercial products of the polycarbonate resin include "OPCON" manufactured by Hui and Co., ltd., and "Panlite" manufactured by Di Kagaku Co., ltd., and "Iupilon (polycarbonate containing an ultraviolet absorber) manufactured by Mitsubishi gas chemical Co., ltd.).
The transparent resin film may be subjected to etching treatment such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, and the like in advance on the surface to improve adhesion to a cured resin layer, a transparent conductive film, and the like formed on the transparent resin film. The surface of the transparent resin film may be cleaned by solvent cleaning, ultrasonic cleaning, or the like as necessary before the cured resin layer or the transparent conductive film is formed.
The thickness of the transparent resin film is preferably in the range of 20 to 150 μm, more preferably in the range of 25 to 100 μm, and even more preferably in the range of 30 to 80 μm, from the viewpoints of producing a transparent conductive film or the like having high transparency and excellent appearance quality and improving the ease of conveyance in the roll-to-roll method. When the thickness of the transparent resin film is less than the lower limit of the above range, the mechanical strength may be insufficient, and the operation of continuously forming the cured resin layer or the transparent conductive film by winding the film base material into a roll may be difficult. On the other hand, when the thickness exceeds the upper limit of the above range, the scratch resistance of the transparent conductive film or the like and the dotting property for the touch panel may not be improved.
The water content of the transparent resin film is preferably 5.0X10 every 10mm X10 mm -3 g is less than or equal to 3.0X10 s per 10mm X10 mm -3 g is not more than g, more preferably 1.0X10 at 10mm X10 mm -3 g is less than or equal to g. This can further control the water content of the transparent resin film and sufficiently crystallize the transparent conductive film, and thus can more reliably prevent the abnormal resistance value of the transparent conductive film and further improve the adhesion between the transparent conductive film and the substrate to prevent peeling of the film.
The moisture content of the transparent resin film is preferably 0.50% by weight or less, more preferably 0.40% by weight or less, and still more preferably 0.30% by weight or less.
(cured resin layer)
The cured resin layer includes a 1 st cured resin layer provided on one side of the transparent conductive film of the transparent resin film and a 2 nd cured resin layer provided on the other side of the transparent conductive film. In the case where the transparent resin film is brittle and is liable to cause scratches, it is preferable to form the 1 st cured resin layer and the 2 nd cured resin layer on both sides of the transparent resin film as described above, because scratches are liable to be caused in each step of forming the transparent conductive film, patterning the transparent conductive film, mounting the transparent conductive film to an electronic device, and the like.
The cured resin layer is a layer obtained by curing a curable resin or the like. The resin used may be any resin having sufficient strength and transparency as a film after the formation of the cured resin layer, and examples thereof include a thermosetting resin, an ultraviolet-curable resin, an electron beam-curable resin, and a two-component hybrid resin. Among these, an ultraviolet curable resin that can efficiently form a cured resin layer by a simple processing operation through a curing treatment by ultraviolet irradiation is suitable.
Examples of the ultraviolet curable resin include various resins such as polyester, acrylic, urethane, amide, silicone, and epoxy resins, including ultraviolet curable monomers, oligomers, and polymers. The ultraviolet curable resin preferably used is an acrylic resin, an epoxy resin, or a urethane resin, and more preferably an acrylic resin or a urethane resin.
The cured resin layer may contain particles. By blending the particles in the cured resin layer, ridges can be formed on the surface of the cured resin layer, and blocking resistance can be appropriately imparted to the transparent conductive film.
As the particles, particles having transparency such as various metal oxides, glass, plastic, and the like can be used without particular limitation. Examples thereof include inorganic particles such as silica, alumina, titania, zirconia, and calcium oxide, crosslinked or uncrosslinked organic particles made of various polymers such as polymethyl methacrylate, polystyrene, polyurethane, acrylic resin, acrylic-styrene resin such as acrylic-styrene copolymer, benzoguanamine, melamine, and polycarbonate, and silicone particles. The particles may be used by appropriately selecting 1 or 2 or more, and organic particles are preferable. The organic particles are preferably acrylic resins and acrylic-styrene resins from the viewpoint of refractive index.
The diameter of the particles is not particularly limited, and may be appropriately set in consideration of the relationship between the protrusion degree of the ridge of the cured resin layer and the thickness of the flat region other than the ridge. The diameter of the particles is preferably 0.1 to 5 μm, more preferably 0.5 to 4 μm, from the viewpoint of sufficiently imparting blocking resistance to the transparent conductive film and sufficiently suppressing the increase in haze. In the present specification, "diameter" means the particle diameter indicating the maximum value of particle distribution, and is obtained by measurement under predetermined conditions (Sheath liquid: ethyl acetate, measurement mode: HPF measurement, measurement mode: total count) using a flow type particle image analyzer (manufactured by Sysmex corporation, product name "FPTA-3000S"). The measurement sample was obtained by diluting the particles with ethyl acetate to 1.0 wt% and uniformly dispersing the particles with an ultrasonic cleaner.
The content of the particles is preferably 0.05 to 1.0 part by weight, more preferably 0.1 to 0.5 part by weight, and still more preferably 0.1 to 0.2 part by weight, based on 100 parts by weight of the solid content of the resin composition. If the content of the particles in the cured resin layer is small, it is difficult to form a bulge sufficient to impart blocking resistance and slipperiness to the surface of the cured resin layer. On the other hand, when the content of the particles is too large, the haze of the transparent conductive film tends to be high and visibility tends to be low due to light scattering by the particles. In addition, if the content of the particles is too large, streaks may be generated at the time of formation of the cured resin layer (at the time of application of the solution), and visibility may be impaired, and the electric characteristics of the transparent conductive film may become uneven.
The cured resin layer was obtained as follows: a resin composition containing each curable resin and, if necessary, particles, a crosslinking agent, an initiator, a sensitizer, and the like is applied to a transparent resin film, and when the resin composition contains a solvent, the solvent is dried, and curing is performed by applying either heat, active energy rays, or both, thereby obtaining a cured resin layer. For the heat, known means such as an air circulation oven and an IR heater may be used, but the method is not limited thereto. Examples of the active energy ray include ultraviolet rays, electron beams, and gamma rays, and are not particularly limited.
The cured resin layer can be formed by a coating method such as a wet coating method, a gravure coating method, or a bar coating method, a vacuum evaporation method, a sputtering method, or an ion plating method using the above-described materials. For example, in the case of forming indium oxide (ITO) containing tin oxide as the transparent conductive film, if the surface of the cured resin layer as the base layer is smooth, the crystallization time of the transparent conductive film can be shortened. From the above-described viewpoints, the cured resin layer is preferably formed into a film by a wet coating method.
The thickness of the cured resin layer is preferably 0.5 μm to 5 μm, more preferably 0.7 μm to 3 μm, and most preferably 0.8 μm to 2 μm. When the thickness of the cured resin layer is in the above range, scratch, film wrinkles during curing shrinkage of the cured resin layer, and deterioration in visibility of the touch panel or the like can be prevented.
(optical adjustment layer)
The optical adjustment layer may be further provided between the 1 st cured resin layer and the transparent conductive film by 1 or more layers. In the case where the 1 st cured resin layer is not formed, 1 or more optical adjustment layers may be included between the transparent resin film and the transparent conductive film. The optical adjustment layer is used for the following purposes: an increase in transmittance of the transparent conductive film; when patterning the transparent conductive film, the difference in transmittance and reflectance between the pattern portion of the residual pattern and the opening portion of the non-residual pattern can be reduced, and a transparent conductive film excellent in visibility can be obtained.
The optical adjustment layer preferably contains a binder resin and microparticles. The binder resin contained in the optical adjustment layer includes an acrylic resin, a urethane resin, a melamine resin, an alkyd resin, a silicone polymer, an organosilane condensate, and the like, and an ultraviolet curable resin containing an acrylic resin is preferable.
The refractive index of the optical adjustment layer is preferably 1.6 to 1.8, more preferably 1.61 to 1.78, and still more preferably 1.62 to 1.75. This reduces the transmittance and reflectance differences, and provides a transparent conductive film excellent in visibility.
The optical adjustment layer may have fine particles having an average particle diameter of 1nm to 500 nm. The content of the fine particles in the optical adjustment layer is preferably 0.1 to 90 wt%. The average particle diameter of the fine particles used in the optical adjustment layer is preferably in the range of 1nm to 500nm, more preferably 5nm to 300nm, as described above. The content of the fine particles in the optical adjustment layer is more preferably 10 to 80 wt%, and still more preferably 20 to 70 wt%. By incorporating fine particles in the optical adjustment layer, the refractive index of the optical adjustment layer itself can be easily adjusted.
Examples of the inorganic oxide forming the fine particles include fine particles of silicon oxide (silica), hollow nano-silica, titanium oxide, aluminum oxide, zinc oxide, tin oxide, zirconium oxide, niobium oxide, and the like. Among these, fine particles of silicon oxide (silica), titanium oxide, aluminum oxide, zinc oxide, tin oxide, zirconium oxide, niobium oxide, and more preferably zirconium oxide are preferable. The number of these may be 1 alone or 2 or more.
The optical adjustment layer may contain other inorganic substances. Examples of the inorganic substance include NaF (1.3) and Na 3 AlF 6 (1.35)、LiF(1.36)、MgF 2 (1.38)、CaF 2 (1.4)、BaF 2 (1.3)、BaF 2 (1.3)、LaF 3 (1.55), ceF (1.63), etc. (the values in brackets indicate refractive indices).
The optical adjustment layer can be formed by a coating method such as a wet coating method, a gravure coating method, or a bar coating method, a vacuum evaporation method, a sputtering method, or an ion plating method using the above-described materials. For example, when indium oxide (ITO) containing tin oxide is formed as the transparent conductive film, if the surface of the optical adjustment layer as the base layer is smooth, the crystallization time of the transparent conductive layer can be shortened. From the above-described viewpoints, the optical adjustment layer is preferably formed by a wet coating method.
The thickness of the optical adjustment layer is preferably 40nm to 150nm, more preferably 50nm to 130nm, and still more preferably 70nm to 120nm. If the thickness of the optical adjustment layer is too small, a continuous coating film is not easily formed. If the thickness of the optical adjustment layer is too large, the transparency of the transparent conductive film tends to be lowered, and cracks tend to be easily generated.
(transparent conductive film)
The transparent conductive film may be provided on the transparent resin film, and is preferably provided on the 1 st cured resin layer or the optical adjustment layer provided on one surface side of the transparent resin film. The constituent material of the transparent conductive film is not particularly limited as long as it contains an inorganic substance, and a metal oxide of at least 1 metal selected from the group consisting of indium, tin, zinc, gallium, antimony, titanium, silicon, zirconium, magnesium, aluminum, gold, silver, copper, palladium, and tungsten can be suitably used. The metal oxide may further contain metal atoms shown in the above group as required. For example, indium tin composite oxide (ITO), tin oxide containing Antimony (ATO), and the like are preferably used.
The thickness of the transparent conductive film is not particularly limited, and is not particularly limited in order to obtain a transparent conductive film having a surface resistance of 1X 10 3 The thickness of the continuous film having excellent conductivity such as Ω/≡is preferably 10nm or more. When the film thickness is too large, the transparency is reduced, etc., and therefore, the film thickness is preferably in the range of 15 to 35nm, more preferably 20 to 30 nm. If the thickness of the transparent conductive film is less than 10nm, the resistance of the film surface becomes high, and it is difficult to form a continuous coating film. In addition, if the thickness of the transparent conductive film exceeds 35nm, there are cases where the transparency is lowered or the like.
The method for forming the transparent conductive film is not particularly limited, and a conventionally known method can be used. Specifically, for example, a dry method such as a vacuum vapor deposition method, a sputtering method, or an ion plating method can be exemplified. In addition, an appropriate method may be adopted depending on the required film thickness.
The transparent conductive film may be crystallized by performing a thermal annealing treatment (for example, at 80 to 150 ℃ for about 10 to 90 minutes in an air atmosphere) as needed. By crystallizing the transparent conductive film, not only is the resistance of the transparent conductive film reduced, but also the transparency and durability are improved. The means for converting the amorphous transparent conductive film into a crystalline form is not particularly limited, and an air circulation oven, an IR heater, or the like can be used.
For definition of "crystalline", a transparent conductive film having a transparent conductive film formed on a transparent resin film was immersed in hydrochloric acid at 20 ℃ and 5 wt% concentration for 15 minutes, then washed with water and dried, and the inter-terminal resistance between 15mm was measured by a tester, and when the inter-terminal resistance exceeded 10kΩ, it was noted that conversion of the ITO film into crystalline was completed. The surface resistance value can be measured by the 4-terminal method according to JIS K7194.
In addition, the transparent conductive film may be patterned by etching or the like. The patterning of the transparent conductive film can be performed by using a conventionally known photolithography technique. As the etching liquid, an acid can be suitably used. Examples of the acid include inorganic acids such as hydrogen chloride, hydrogen bromide, sulfuric acid, nitric acid, phosphoric acid, organic acids such as acetic acid, mixtures thereof, and aqueous solutions thereof. For example, in a transparent conductive film used for a capacitive touch panel or a matrix resistive touch panel, the transparent conductive film is preferably patterned in a stripe shape. In the case where the transparent conductive film is patterned by etching, if crystallization of the transparent conductive film is performed first, patterning by etching may become difficult. Therefore, the annealing treatment of the transparent conductive film is preferably performed after patterning the transparent conductive film.
< Carrier film >
The carrier film includes an adhesive layer and a protective film disposed on the side of the transparent conductive film on which the transparent resin film is formed, and the transparent conductive film and the carrier film are bonded to each other to form a carrier film-attached transparent conductive film. When the carrier film is peeled from the transparent conductive film with the carrier film, the adhesive layer may be peeled together with the protective film, or only the protective film may be peeled.
(protective film)
The protective film is peeled off and discarded when being laminated with other films such as a wavelength plate and a polarizing plate, and the material for forming the protective film is the same as the material for the transparent resin film, for example, in consideration of handling properties such as winding by a roll, water content, and the like. From the viewpoint of improving visibility, polyester-based resins, cycloolefin-based resins, and polycarbonate-based resins are more preferable, and cycloolefin-based resins or polycarbonate-based resins as amorphous resins are particularly preferable from the viewpoints of high transparency, low water absorption, moisture barrier properties, thermal stability, isotropy, and the like. The polyester resin, the cycloolefin resin, and the polycarbonate resin are selected from the transparent resin films described above in consideration of the moisture content, for example. Thus, the protective film having a low water content can be used, and the water content of the protective film can be further controlled so that crystallization of the transparent conductive film is sufficiently performed, whereby abnormal resistance of the transparent conductive film can be more reliably prevented, and adhesion between the transparent conductive film and the substrate can be further improved to prevent peeling of the film.
The protective film may be subjected to etching treatment such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, oxidation, and the like in advance on the surface in the same manner as the transparent resin film, to improve adhesion to an adhesive layer or the like on the protective film. The surface of the protective film may be cleaned by solvent cleaning, ultrasonic cleaning, or the like as needed before the adhesive layer is formed.
The water content of the protective film is preferably 1.0X10 per 10mm X10 mm -3 g is less than or equal to 0.9X10 g per 10mm X10 mm -3 g is less than or equal to g, more preferably 0.5X10 at every 10mm X10 mm -3 g is less than or equal to g. Since the actual measurement value of the moisture amount varies depending on the environment, it is preferable that the above range be satisfied at the time point of being supplied to the sputtering film formation and crystallization process. This prevents the abnormal resistance value of the transparent conductive film, and improves the adhesion between the transparent conductive film and the substrate to prevent the film from peeling. In addition, this eliminates the need for a degassing treatment before film formation by a heating step or the like as a pretreatment for removing moisture, and thus improves the production efficiency.
The water content (water content) of the protective film is preferably 0.50% by weight or less, more preferably 0.40% by weight or less, and still more preferably 0.30% by weight or less. Thus, the protective film having a low water content can be used, and the water content of the protective film can be further controlled so that crystallization of the transparent conductive film is sufficiently performed, whereby abnormal resistance of the transparent conductive film can be more reliably prevented, and adhesion between the transparent conductive film and the substrate can be further improved to prevent peeling of the film.
The thickness of the protective film is preferably 1 to 150. Mu.m, more preferably 2 to 120. Mu.m, still more preferably 5 to 100. Mu.m. The thinner the protective film, the more the moisture content of the protective film can be suppressed, and crystallization of the transparent conductive film can be sufficiently performed, so that it is possible to more reliably prevent abnormality in the resistance value of the transparent conductive film, and to further improve the adhesion between the transparent conductive film and the substrate, thereby preventing peeling of the film. By setting the above range, the ease of conveyance in the roll-to-roll method can be improved. In addition, from the viewpoint of preventing breakage of the transparent conductive film laminate in the roll-to-roll method, the thickness of the protective film is preferably equal to or greater than the thickness of the transparent resin film.
(conductive layer)
From the viewpoint of antistatic property, it is preferable that a conductive layer is further provided on the side of the protective film opposite to the side on which the adhesive layer is formed. The conductive layer may be preferably formed by coating a conductive composition including a conductive polymer.
Examples of the conductive polymer contained in the conductive composition include polyacetylene-based polymers, polyparaphenylene-based polymers, polyaniline-based polymers, polythiophene-based polymers, polyparaphenylene-based polymers, polypyrrole-based polymers, polyphenylene-based polymers, and polyester-based polymers modified with acrylic polymers. The conductive polymer preferably contains 1 or more polymers selected from the group consisting of polyacetylene-based polymers, poly-p-phenylene-based polymers, polyaniline-based polymers, polythiophene-based polymers, poly-p-phenylene-vinyl-based polymers, and polypyrrole-based polymers.
More preferably, a polythiophene-based polymer is used as the conductive polymer. When the polythiophene-based polymer is used, a conductive layer excellent in transparency and chemical stability can be formed. Specific examples of the polythiophene-based polymer include polythiophene; poly (3-C) such as poly (3-hexylthiophene) 1-8 Alkyl-thiophene); poly (3, 4-ethylenedioxythiophene) (PEDOT), poly (3, 4-propylenedioxythiophene), poly [3,4- (1, 2-cyclohexylene) dioxythiophene)]Isopoly (3, 4- (cyclo) alkylene dioxythiophenes); polythiophene acetylene, and the like.
The conductive layer may be formed by any suitable method. The conductive composition is, for example, a dispersion liquid containing the conductive polymer and any appropriate solvent (for example, water) and dispersing the conductive polymer in the solvent. The dispersion concentration of the conductive polymer in the dispersion is preferably 0.01 to 50 wt%, more preferably 0.01 to 30 wt%.
As a method for applying the conductive composition, any suitable method can be used. Examples thereof include bar coating (bar coating), roll coating, gravure coating, bar coating (rod coating), slit nozzle coating (slot orifice coating), curtain coating, spray coating (comma coating), and comma coating. The drying temperature is typically 50℃or higher, preferably 90℃or higher, and more preferably 110℃or higher. The drying temperature is preferably 200℃or lower, more preferably 180℃or lower. The drying time is preferably 1 minute to 1 hour, more preferably 1 minute to 30 minutes, and still more preferably 1 minute to 10 minutes.
The thickness of the conductive layer is preferably 1nm to 500nm, more preferably 1nm to 400nm, and still more preferably 1nm to 300nm. When the amount is within this range, a conductive layer with well controllable electrical characteristics is formed.
The conductive composition may further contain any appropriate additive as required. Specific examples of the additives include dispersion stabilizers, surfactants, and defoaming agents. The kind and amount of the additive to be used may be appropriately set according to the purpose.
(adhesive layer)
The pressure-sensitive adhesive layer may be used without particular limitation as long as it has transparency. Specifically, for example, a binder containing a base polymer such as an acrylic polymer, a silicone polymer, a polyester, a polyurethane, a polyamide, a polyvinyl ether, a vinyl acetate/vinyl chloride copolymer, a modified polyolefin, an epoxy polymer, a fluorine polymer, a rubber polymer such as a natural rubber or a synthetic rubber can be suitably selected and used. In particular, an acrylic adhesive is preferably used because it is excellent in optical transparency, exhibits moderate wettability, cohesion, adhesion and other adhesive properties, and is excellent in weather resistance, heat resistance and the like.
The method for forming the pressure-sensitive adhesive layer is not particularly limited, and the following methods are exemplified: a method of applying the adhesive composition to a release liner, drying the composition, and transferring the dried composition to a substrate film (transfer method); a method of directly coating an adhesive composition on a protective film and drying (direct writing method); a method using coextrusion, and the like. In the adhesive, a tackifier, a plasticizer, a filler, an antioxidant, an ultraviolet absorber, a silane coupling agent, and the like may be suitably used as needed.
The thickness of the adhesive layer is preferably 5 μm to 100. Mu.m, more preferably 10 μm to 50. Mu.m, still more preferably 15 μm to 35. Mu.m.
< touch Panel >
The transparent conductive film obtained by peeling the carrier film or the protective film from the transparent conductive film with the carrier film is suitable for use as a transparent electrode of an electronic device such as a touch panel of a capacitive type, a resistive type, or the like.
In forming the touch panel, other substrates such as glass and polymer films may be bonded to one or both of the main surfaces of the transparent conductive film via a transparent adhesive layer. For example, a laminate may be formed in which a transparent substrate is bonded to the surface of the transparent conductive film on the side where the transparent conductive film is not formed via a transparent adhesive layer. The transparent substrate may be composed of 1 substrate film or may be a laminate of 2 or more substrate films (for example, a laminate of transparent adhesive layers). The hard coat layer may be provided on the outer surface of the transparent substrate bonded to the transparent conductive film. As the pressure-sensitive adhesive layer used for bonding the transparent conductive film to the substrate, any pressure-sensitive adhesive layer may be used without particular limitation as long as it has transparency as described above.
Examples
The present invention will be described in detail with reference to examples, but the present invention is not limited to the examples provided below, as long as the gist of the present invention is not exceeded.
< evaluation >
(1) Measurement of thickness
For the thickness, an object having a thickness of 1 μm or more was measured with a microgauge thickness meter (manufactured by Mitutoyo Corporation). The thickness of less than 1 μm was measured by using an instantaneous multiple photometry system (MCPD 2000 manufactured by Otsuka electronics Co., ltd.). A sample for cross-section observation was prepared by using FB-2000A (manufactured by Hitachi High-Technologies Corporation) for a nano-scale thickness such as the thickness of an ITO film, and the film thickness was measured by using HF-2000 (manufactured by Hitachi High-Technologies Corporation) for cross-section TEM observation. The results of the evaluation are shown in table 1.
(2) Determination of Water content and Water fraction (Water content)
The protective film was cut out into a 10mm×10mm ≡sample, placed in a heating and vaporizing device (Mitsubishi Chemical Analytech co., ltd., VA-200 type), a carrier gas heated at 150 ℃ was introduced into a titration cell (Mitsubishi Chemical Analytech co., ltd., CA-200 type), and the amount of water released during heating was measured by karl fischer method (vaporizing method), and the water content and water fraction were measured. The water content is the amount of water per 1g, and can be calculated in the same manner as the water content. The water content and the water content were also measured for the transparent resin film by the same method as described above. The results of the evaluation are shown in table 1.
(3) Measurement of reached resistance
The measured values of the reached resistances when the transparent conductive film with the carrier film was subjected to heat treatment at 120℃for 20, 30, and 40 minutes by using a hot air circulation oven. The surface resistance was measured by the four terminal method according to JIS K7194. The results of the evaluation are shown in table 1.
(4) Standard deviation of surface resistance value
In the measurement of the above-mentioned reached resistance value, the surface resistance value of the transparent conductive film with a carrier film was measured at 5 points at 15cm intervals in the width direction and heat-treated at 120℃for 30 minutes, and the standard deviation thereof was determined. The results of the evaluation are shown in table 1.
(5) Crystallization rate
The crystallization rate of the amorphous transparent conductive film was evaluated by the transition to the electric resistance value. Here, a transparent conductive film (reference example 1) without a protective film was used as a reference value of crystallization rate. The results of the evaluation are shown in table 1.
O: the crystallization rate is the same as the reference value
X: crystallization rate is lower than reference value
(6) Adhesion of
The measurement was carried out in accordance with JIS K-5600. After the transparent conductive film with the carrier film was subjected to a heating treatment at 130℃for 90 minutes by using a heated air circulation oven, the sample was cut out to 5cm square, and 11 scratches were formed on the transparent conductive film (ITO) surface at about 1mm intervals by using a cutter, thereby forming 100 lattices. After a cellophane tape (manufactured by Sekisui corporation, # 252) was attached thereto and the tape was peeled off rapidly by swiping the tape 10 times after pressing by a squeegee, the occurrence of peeling of 1/4 or more areas of 1 lattice was counted, and the presence or absence of peeling of the transparent conductive film was confirmed. The direction of blade pressure bonding and peeling was changed and repeated 2 times, and the cellophane tape was rotated by 90 ° for the 2 nd pressure bonding. The results of the evaluation are shown in table 1.
O: no peeling (less than 5/100), and good adhesion
X: has peeling (greater than 5/100), poor adhesion
Example 1
(formation of cured resin layer)
A2 nd cured resin layer having a thickness of 1 μm was formed by applying a curable resin composition containing 100 parts by weight of an ultraviolet-curable resin composition (trade name "UNIDC (registered trademark)" manufactured by DIC Corporation) RS29-120 and a urethane-based polyfunctional polyacrylate) and 0.2 part by weight of spherical particles of crosslinked acrylic/styrene (SSX 105 manufactured by water-logging resin Corporation) having a diameter of 3 μm to one surface of a polycycloolefin film (trade name "ZEONOR" (registered trademark) manufactured by Zeon Corporation) having a thickness of 50 μm, and irradiating ultraviolet rays from the surface thereof. The 1 st cured resin layer was formed on the other surface of the polycycloolefin film in the same manner as above except that the spherical particles were not contained, and the thickness was 1. Mu.m.
(formation of optical adjustment layer)
As the optical adjustment layer, an ultraviolet curable composition (trade name "OPSTAR Z7412" manufactured by JSR corporation) containing zirconia particles having a refractive index of 1.62 was applied to one side of the 1 st cured resin layer of the polycycloolefin film having cured resin layers formed on both sides thereof to form a coating layer. Then, after drying at 80℃for 3 minutes, the coating layer was immediately irradiated with ultraviolet rays from the side where the coating layer was formed by an ozone type high-pressure mercury lamp (80W/cm, 15cm condensing type: cumulative light amount 300 mj) to form an optical adjustment layer so that the thickness became 0.1. Mu.m.
(formation of transparent conductive film)
A parallel flat-plate type coiling-type magnetron sputtering device is provided with 90:10 weight ratio of indium oxide to tin oxide, and vacuum-exhausting by vacuum-exhausting while conveying the substrate until the partial pressure of water becomes 5×10 - 4 Pa. Thereafter, while the substrate was conveyed at a conveying speed of 7.7 m/min and a conveying tension of 40 to 120N, a film was formed on the optical adjustment layer (1 st cured resin layer) by DC sputtering at an output of 12.5kW to form an ITO film having a thickness of 22 nm. The surface resistance of the obtained ITO was measured by the four-terminal method, and found to be 300 Ω/≡.
(formation of support film)
An acrylic polymer having a weight average molecular weight of 60 ten thousand was obtained by usual solution polymerization at butyl acrylate/acrylic acid=100/6 (weight ratio). An epoxy-based crosslinking agent (trade name "tetra C (registered trademark)", mitsubishi gas chemical system) was added to 100 parts by weight of the acrylic polymer to prepare an acrylic adhesive. The acrylic adhesive was coated on one side of a polycycloolefin film (trade name "ZEONOR (registered trademark)", manufactured by Zeon Corporation) having a thickness of 50 μm as a protective film, and heated at 150 ℃ for 90 seconds to form an adhesive layer having a thickness of 10 μm. Then, a silicone-treated surface of a PET release liner (thickness: 25 μm) having a silicone-treated surface was bonded to the surface of the adhesive layer, and the resulting film was stored at 50℃for 2 days, thereby producing a carrier film with a release liner. In use, the release liner is removed and a carrier film is used.
(formation of transparent conductive film with Carrier film)
A protective film with an adhesive layer of a carrier film is laminated on the side of the transparent conductive film where the transparent conductive film is not formed, and a transparent conductive film with a carrier film is produced.
Examples 2 to 6
A transparent conductive film with a carrier film was produced in the same manner as in example 1 except that the base materials and thicknesses of the transparent resin film and the protective film were changed as shown in table 1 in example 1. For the base materials shown in table 1, polyethylene terephthalate film (T612E 25, mitsubishi resin co.) was used for PET, and polycarbonate resin (trade name "Panlite" manufactured by monarch) was used for PC.
Comparative example 1
In example 1, a transparent conductive film with a carrier film was produced in the same manner as in example 1, except that a polyethylene terephthalate film (manufactured by mitsubishi resin co., ltd., T612E 25) was used as the protective film instead of the polycycloolefin film.
Comparative examples 2 to 3
A transparent conductive film with a carrier film was produced in the same manner as in example 1 except that the base material and the thickness of the protective film were changed as shown in table 1 in example 1. For the base materials shown in table 1, polyethylene terephthalate film (T612E 25, mitsubishi resin co.) was used for PET, and polycarbonate resin (trade name "puree-ACE" manufactured by imperial) was used for PC.
Reference example 1
In example 1, no carrier film was formed, and only a transparent conductive film was produced.
TABLE 1
(results and examination)
The transparent conductive films with carrier films of examples 1 to 6 were heated at 120℃for about 20 minutes to complete crystallization from amorphous to crystalline, and the variation in the arrival resistance (surface resistance) was small, and the arrival resistance was low. The crystallization rate was also good with respect to the standard (reference example 1). In addition, the adhesion to the transparent conductive film was also high, and film peeling did not occur. On the other hand, the transparent conductive films with carrier films of comparative examples 1 to 3 did not crystallize from amorphous to crystalline even after being heated at 120℃for about 40 minutes, and the variation in the reached resistance value (surface resistance value) was large and the reached resistance value was high. The crystallization rate was also slow relative to the standard (reference example 1). In addition, adhesion to the transparent conductive film is also low, and film peeling occurs.
Description of the reference numerals
1. Protective film
2. Adhesive layer
3. Transparent resin film
4. Transparent conductive film
5 nd 2 nd cured resin layer
6 1 st cured resin layer
7. Optical adjustment layer
10. Carrier film
20. Transparent conductive film
Claims (6)
1. A carrier film-carrying transparent conductive film comprising: a transparent conductive film and a carrier film,
The transparent conductive film includes a transparent resin film and a transparent conductive film,
the carrier film comprises an adhesive layer and a protective film which are arranged on one side of the transparent conductive film on which the transparent resin film is formed,
the thickness of the protective film is 1-150 mu m,
the water content of the protective film is 0.50 wt% or less,
the transparent conductive film is indium tin composite oxide,
the water content of the protective film is 1.0X10 every 10mm×10mm -3 g is less than or equal to g.
2. The carrier film-equipped transparent conductive film according to claim 1, wherein the transparent resin film has: a 1 st cured resin layer provided on one side of the surface of the transparent conductive film, and a 2 nd cured resin layer provided on the opposite side of the surface of the transparent conductive film.
3. The transparent conductive film with carrier film according to claim 2, further comprising 1 or more optical adjustment layers between the 1 st cured resin layer and the transparent conductive film.
4. The transparent conductive film with a carrier film according to claim 1 or 2, wherein the protective film is formed of a cycloolefin resin or a polycarbonate resin.
5. The transparent conductive film with carrier film according to claim 1 or 2, further comprising a conductive layer on a side of the protective film opposite to the side on which the adhesive layer is formed.
6. A touch panel comprising the transparent conductive film with carrier film according to any one of claims 1 to 5.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/087225 WO2018109867A1 (en) | 2016-12-14 | 2016-12-14 | Transparent conductive film with carrier film, and touch panel using transparent conductive film |
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| Publication Number | Publication Date |
|---|---|
| CN110088714A CN110088714A (en) | 2019-08-02 |
| CN110088714B true CN110088714B (en) | 2023-05-16 |
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| CN201680091549.3A Active CN110088714B (en) | 2016-12-14 | 2016-12-14 | Transparent conductive film with carrier film and touch panel using the same |
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| Country | Link |
|---|---|
| KR (1) | KR20190094172A (en) |
| CN (1) | CN110088714B (en) |
| WO (1) | WO2018109867A1 (en) |
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| CN113226744A (en) * | 2018-12-27 | 2021-08-06 | 柯尼卡美能达株式会社 | Laminated film for supporting transparent conductive layer |
| US20220371310A1 (en) * | 2019-10-18 | 2022-11-24 | Showa Denko K.K. | Transparent conducting film laminate and processing method thereof |
| CN113409994B (en) * | 2021-08-20 | 2021-12-14 | 江苏软讯科技有限公司 | Conductive film, touch structure and manufacturing method of touch structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008055691A (en) * | 2006-08-30 | 2008-03-13 | Jsr Corp | Optical film roll and its manufacturing method |
| JP2016107504A (en) * | 2014-12-05 | 2016-06-20 | 日東電工株式会社 | Transparent conductive film laminate and application of the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3590530B2 (en) * | 1998-09-10 | 2004-11-17 | グンゼ株式会社 | Touch panel |
| JP5506011B2 (en) | 2007-03-02 | 2014-05-28 | 日東電工株式会社 | Transparent conductive film with pressure-sensitive adhesive layer and method for producing the same |
| JP5122670B2 (en) | 2010-11-05 | 2013-01-16 | 日東電工株式会社 | Method for producing transparent conductive film |
-
2016
- 2016-12-14 KR KR1020197016555A patent/KR20190094172A/en not_active Application Discontinuation
- 2016-12-14 CN CN201680091549.3A patent/CN110088714B/en active Active
- 2016-12-14 WO PCT/JP2016/087225 patent/WO2018109867A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008055691A (en) * | 2006-08-30 | 2008-03-13 | Jsr Corp | Optical film roll and its manufacturing method |
| JP2016107504A (en) * | 2014-12-05 | 2016-06-20 | 日東電工株式会社 | Transparent conductive film laminate and application of the same |
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| Publication number | Publication date |
|---|---|
| WO2018109867A1 (en) | 2018-06-21 |
| KR20190094172A (en) | 2019-08-12 |
| CN110088714A (en) | 2019-08-02 |
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