CN110087828B - 信息处理装置及加工不良确定方法 - Google Patents

信息处理装置及加工不良确定方法 Download PDF

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Publication number
CN110087828B
CN110087828B CN201780078011.3A CN201780078011A CN110087828B CN 110087828 B CN110087828 B CN 110087828B CN 201780078011 A CN201780078011 A CN 201780078011A CN 110087828 B CN110087828 B CN 110087828B
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China
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feature amount
machining
processing
program
image
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CN201780078011.3A
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English (en)
Chinese (zh)
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CN110087828A (zh
Inventor
西胁健二
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN110087828A publication Critical patent/CN110087828A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Optics & Photonics (AREA)
  • Numerical Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
CN201780078011.3A 2017-06-06 2017-06-06 信息处理装置及加工不良确定方法 Active CN110087828B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/021000 WO2018225159A1 (fr) 2017-06-06 2017-06-06 Dispositif de traitement d'informations et procédé d'identification de défaut d'usinage

Publications (2)

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CN110087828A CN110087828A (zh) 2019-08-02
CN110087828B true CN110087828B (zh) 2020-09-08

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CN201780078011.3A Active CN110087828B (zh) 2017-06-06 2017-06-06 信息处理装置及加工不良确定方法

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JP (1) JP6366875B1 (fr)
CN (1) CN110087828B (fr)
WO (1) WO2018225159A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6677706B2 (ja) 2017-12-27 2020-04-08 ファナック株式会社 リンク情報生成装置、リンク情報生成方法及びリンク情報生成プログラム
JP7060535B2 (ja) 2019-02-27 2022-04-26 ファナック株式会社 工作機械の加工不良発生予測システム
JP7396857B2 (ja) * 2019-11-01 2023-12-12 ファナック株式会社 表示装置
JP7397102B2 (ja) * 2020-01-22 2023-12-12 ファナック株式会社 画像解析装置、制御装置、機械システム、画像解析方法、及び画像解析のためのコンピュータプログラム
JPWO2022153937A1 (fr) * 2021-01-12 2022-07-21
JP2022187256A (ja) * 2021-06-07 2022-12-19 株式会社キャプテン インダストリーズ ビデオカメラを用いた工作機械の異常検出装置
WO2023132039A1 (fr) * 2022-01-06 2023-07-13 三菱電機株式会社 Dispositif d'analyse de défaut d'usinage, système d'usinage, procédé d'analyse de défaut d'usinage et procédé d'usinage
JP7135225B1 (ja) * 2022-01-25 2022-09-12 Dmg森精機株式会社 工作機械、制御方法、および制御プログラム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04201050A (ja) * 1990-11-29 1992-07-22 Sanyo Mach Works Ltd 自動仕上げ加工装置
JPH10133728A (ja) * 1996-10-30 1998-05-22 Amada Co Ltd 製品検査データの自動フィードバック装置及びこの装置を用いた自動プログラム修正方法
JP2001075624A (ja) * 1999-07-01 2001-03-23 Mori Seiki Co Ltd Ｎｃ工作機械のツールパスデータ生成装置及びこれを備えた数値制御装置
JP5000104B2 (ja) * 2005-06-22 2012-08-15 浜松ホトニクス株式会社 半導体不良解析装置、不良解析方法、不良解析プログラム、及び不良解析システム
DE102009029061A1 (de) * 2008-09-05 2010-03-11 Mori Seiki Co., Ltd., Yamatokoriyama-shi Verfahren und Vorrichtung zur Bearbeitungszustandsprüfung
JP6695102B2 (ja) * 2015-05-26 2020-05-20 株式会社ディスコ 加工システム

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Publication number Publication date
WO2018225159A1 (fr) 2018-12-13
CN110087828A (zh) 2019-08-02
JP6366875B1 (ja) 2018-08-01
JPWO2018225159A1 (ja) 2019-06-27

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