CN110076460A - The controllable coupled laser processing unit (plant) of space multiple beam and method - Google Patents
The controllable coupled laser processing unit (plant) of space multiple beam and method Download PDFInfo
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- CN110076460A CN110076460A CN201910454335.3A CN201910454335A CN110076460A CN 110076460 A CN110076460 A CN 110076460A CN 201910454335 A CN201910454335 A CN 201910454335A CN 110076460 A CN110076460 A CN 110076460A
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- laser
- workpiece
- condenser lens
- power density
- space multiple
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a kind of controllable coupled laser processing unit (plant) of space multiple beam and methods.The controllable coupled laser processing method of space multiple beam includes: to provide at least two beam laser beams and be correspondingly arranged a condenser lens in the optical path of each laser beam, so that at least two beam laser beams by controlling can be each passed through corresponding condenser lens and juxtaposition, and then machining energy domain is formed in juxtaposition region, the part of workpiece to be processed is placed in the machining energy domain, and then realizes the working process to the workpiece to be processed；Wherein the power density of each laser beam is less than the ablation threshold of workpiece to be processed material, and the power density in the machining energy domain is greater than the ablation threshold of workpiece to be processed material.The controllable coupled laser processing method of space multiple beam of the invention can reduce the spatial volume in machining energy domain, realize high-resolution processing, have the advantages that high reliablity, controllability are high, equipment requirement is low etc..
Description
Technical field
The present invention relates to a kind of laser processings, in particular to can the space that influences of real high-resolution, high-precision, low-heat
The controllable coupled laser processing unit (plant) of multiple beam and method, belong to technical field of laser processing.
Background technique
Currently, conventional laser processing is in laser beam axial direction its machining resolution more difficult to control, reason is laser beam
After focusing near girdling the waist, there is working ability within the scope of certain space, so that laser processing is differentiated in work surface normal direction
Rate is not high, thus Precision Machining relatively difficult to achieve.Therefore, laser beam axial resolution is improved, is to realize compeling for laser precision machining
It is essential and asks.
When laser processing of materials, when power density reaches material ablation threshold, material is by ablated removal.Laser beam is through saturating
Mirror is maximum in place's power density with a tight waist after focusing, but power variable density is minimum in axial a certain range, so that there are one to have
Machining energy domain that is certain thickness, having ablator ability, causes machining resolution lower.
The common method for improving laser processing resolution ratio is, by incident ray and work surface normal in certain angle
Degree, but this may cause machined surface quality decline, and there is also limitations for practical operation, are not also suitable for complex geometric shapes
Processing.
Summary of the invention
The main purpose of the present invention is to provide a kind of controllable coupled laser processing unit (plant) of space multiple beam and methods, in turn
Overcome deficiency in the prior art.
For realization aforementioned invention purpose, the technical solution adopted by the present invention includes:
The embodiment of the invention provides a kind of controllable coupled laser processing unit (plant)s of space multiple beam comprising:
Laser light source, is used to provide at least two beam laser beams, and the power density of any laser beam is less than to be processed
The ablation threshold of workpiece material；
At least two condenser lens corresponding at least two beam laser beams, the condenser lens are separately positioned on
In the optical path of corresponding laser beam, wherein at least two beam laser beams by controlling can gather through corresponding condenser lens respectively
Defocused juxtaposition, and machining energy domain is formed in the juxtaposition region, the power density in the machining energy domain is big
In the ablation threshold of workpiece to be processed material.
The embodiment of the invention also provides a kind of controllable coupled laser processing unit (plant)s of space multiple beam comprising:
Laser light source, is used to provide N beam laser beam, and the power density of any laser beam is less than workpiece to be processed material
The ablation threshold of material, wherein N >=2；
N number of condenser lens corresponding with the N beam laser beam, the condenser lens are separately positioned on corresponding laser beam
Optical path on, wherein the N beam laser beam can by controlling respectively through corresponding condenser lens focusing after juxtaposition, and
Machining energy domain is formed in the juxtaposition region, the power density in the machining energy domain is greater than workpiece to be processed material
Ablation threshold, and the N-1 beam laser beam is close in the power respectively after corresponding condenser lens focuses in juxtaposition region
Degree is less than the ablation threshold of workpiece to be processed material.
The embodiment of the invention also provides a kind of controllable coupled laser processing methods of space multiple beam comprising:
At least two beam laser beams are provided and are correspondingly arranged a condenser lens in the optical path of each laser beam, make this at least
Two beam laser beams by controlling can be each passed through corresponding condenser lens and juxtaposition, and then be formed in juxtaposition region
Machining energy domain,
The part of workpiece to be processed is placed in the machining energy domain, and then realizes the processing to the workpiece to be processed
Processing；Wherein the power density of each laser beam is less than the ablation threshold of workpiece to be processed material, the machining energy domain
Interior power density is greater than the ablation threshold of workpiece to be processed material.
Compared with prior art, the controllable coupled laser processing method of space multiple beam of the invention can reduce machining energy
The spatial volume in domain realizes high-resolution processing, has the advantages that high reliablity, controllability are high, equipment requirement is low etc..
Detailed description of the invention
Fig. 1 is that the light beam directly projected by laser light source forms the schematic illustration in machining energy domain after optically focused；
Fig. 2 is a kind of controllable coupled laser processing method principle signal of space multiple beam in an exemplary embodiments of the invention
Figure；
Fig. 3 is the structural schematic diagram in the machining energy domain of the different postures formed in an exemplary embodiments of the invention；
Fig. 4 be in an of the invention exemplary embodiments using the controllable coupled laser processing method of space multiple beam to workpiece into
The schematic illustration of row processing；
Fig. 5 a, Fig. 5 b, Fig. 5 c, Fig. 5 d are respectively the hot spot posture after single beam, dual-beam, three light beams, four light beam couplings
And its incoherent intensity map.
Specific embodiment
In view of deficiency in the prior art, inventor is studied for a long period of time and is largely practiced, and is able to propose of the invention
Technical solution.The technical solution, its implementation process and principle etc. will be further explained as follows.
Multiple beam controllable coupled laser processing method in space provided by the invention is by multi beam low energy, not working ability
Laser beam is coupled, alternatively, the laser beam of high-energy is divided into multiple laser beam (can be understood as aforementioned laser beam), beam splitting
Single beam laser afterwards does not have the ability of ablator, just has processing effect after the coupling of multiple laser beam, is coupled by multiple light beams
Mode, can reduce the space size in the machining energy domain of material ablation ability, can especially reduce work surface method
To thickness, to improve machining resolution, Precision Machining is realized, and can reduce heat affecting；And it can be made by Reasonable Regulation And Control
Multiple light beams coupling after, the volume and spatial attitude in machining energy domain will change, so as to some complex characteristics into
Row processing.
The embodiment of the invention provides a kind of controllable coupled laser processing unit (plant)s of space multiple beam comprising:
Laser light source, is used to provide at least two beam laser beams, and the power density of any laser beam is less than to be processed
The ablation threshold of workpiece material；
At least two condenser lens corresponding at least two beam laser beams, the condenser lens are separately positioned on
In the optical path of corresponding laser beam, wherein at least two beam laser beams by controlling can gather through corresponding condenser lens respectively
Defocused juxtaposition, and machining energy domain is formed in the juxtaposition region, the power density in the machining energy domain is big
In the ablation threshold of workpiece to be processed material.
In some more specific embodiments, the laser light source include at least two lasers, described at least two
Beam laser beam is directly projected by different lasers respectively.
In some more specific embodiments, the laser light source includes a laser, in the laser
Light source output end is additionally provided with spectroscope, and the light beam that at least two beam laser beams are directly projected by same laser is through described point
It is formed after light microscopic light splitting；The power density of the light beam wherein directly projected by the laser is greater than the ablation of workpiece to be processed material
Threshold value.
The embodiment of the invention also provides a kind of controllable coupled laser processing unit (plant)s of space multiple beam comprising:
Laser light source, is used to provide N beam laser beam, and the power density of any laser beam is less than workpiece to be processed material
The ablation threshold of material, wherein N >=2；
N number of condenser lens corresponding with the N beam laser beam, the condenser lens are separately positioned on corresponding laser beam
Optical path on, wherein the N beam laser beam can by controlling respectively through corresponding condenser lens focusing after juxtaposition, and
Machining energy domain is formed in the juxtaposition region, the power density in the machining energy domain is greater than workpiece to be processed material
Ablation threshold, and the N-1 beam laser beam is close in the power respectively after corresponding condenser lens focuses in juxtaposition region
Degree is less than the ablation threshold of workpiece to be processed material.
The embodiment of the invention also provides a kind of controllable coupled laser processing methods of space multiple beam comprising:
At least two beam laser beams are provided and are correspondingly arranged a condenser lens in the optical path of each laser beam, make this at least
Two beam laser beams by controlling can be each passed through corresponding condenser lens and juxtaposition, and then be formed in juxtaposition region
Machining energy domain,
The part of workpiece to be processed is placed in the machining energy domain, and then realizes the processing to the workpiece to be processed
Processing；Wherein the power density of each laser beam is less than the ablation threshold of workpiece to be processed material, the machining energy domain
Interior power density is greater than the ablation threshold of workpiece to be processed material.
In some more specific embodiments, at least two beam laser beams are respectively from different laser light sources.
In some more specific embodiments, at least two beam laser beams are swashed by what same laser source directly projected
Light beam is formed after being divided, and the power density of the laser beam directly projected by the laser source is greater than the burning of workpiece to be processed material
Lose threshold value.
In some more specific embodiments, the controllable coupled laser processing method of space multiple beam further include:
Described add is adjusted by least one of the parameter of change laser beam, quantity, spatial distribution form, the parameter of condenser lens
The volume and/or spatial attitude of work energy domain.
Further, the controllable coupled laser processing method of the space multiple beam be can based on the space multiple beam
Control what coupled laser processing unit (plant) was realized.
It will be described in detail as follows in conjunction with principle of the attached drawing to technical solution of the present invention,
The machining energy domain formed after the light beam line focus directly projected by laser light source is not as shown in Figure 1, when being divided i.e.
The light beam directly projected by laser light source, laser beam focus post-processing energy domain is larger, laser beam power density I in the energy domain
Greater than material ablation threshold Ith；A kind of principle of the controllable coupled laser processing method of space multiple beam is as shown in Figure 2；Multiple beam coupling
When conjunction, by taking two beam laser beams as an example, the power density (I of single beam laser beam after light splitting1, I2) it is less than material ablation threshold Ith, light
Only make I in overlapping region or the region that partly overlaps after beam coupling1+I2> Ith, so that machining energy domain space volume be made to reduce, add
Work point resolution improves, and the space distribution modes by changing lens parameter, number of beams and light beam, thus it is possible to vary machining energy
The spatial attitude (structure in the machining energy domain of different postures is as shown in Figure 3) in domain, from the essence being advantageously implemented to different characteristic
Close processing.
Specifically, a kind of material processing of the controllable coupled laser processing of space multiple beam is as shown in Figure 4.
Specifically, multiple laser beam is obtained first with various lasers, alternatively, utilizing spectroscope or other light splitting technologies
The light beam that same laser projects is divided into multiple laser beam, in figure only by taking two beams as an example；
Multiple laser beam is conducted to lens and is focused coupling arrival material surface, carries out material removal process.
Specifically, general power it is equal (general power 1000W, if i.e. dual-beam, then each light beam be 500W, uniformly point
With) in the case where, hot spot posture and its incoherent intensity map are respectively as shown in Fig. 5 a- Fig. 5 d after the coupling of the laser beam of different number
(simulation result that Fig. 5 a- Fig. 5 d is ZEMAX software), by Fig. 5 a- Fig. 5 d as it can be seen that the high region of intensity concentrates on center after coupling
Region can change the size and posture of energy domain by coupling.
It should be noted that laser beam, before focusing, because beam diameter is big, power density distribution is uneven, and laser beam exists
Neighbouring power density with a tight waist after focusing is larger, and there is working ability in a tight waist region of the laser beam only after its focusing；This
The practical invention of comparison in to(for) the power density of laser beam and the ablation threshold of workpiece to be processed material is that laser beam is focusing
The comparison of the ablation threshold of the power density and workpiece to be processed material in region with a tight waist (region for having working ability) afterwards, it is preceding
The machining energy domain stated is also the region with a tight waist and another laser beam focus posterior cord lumbar region domain by an at least laser beam after focusing
What juxtaposition was formed；For example, heretofore described, " power density of any laser beam is less than workpiece to be processed material
Ablation threshold ", substantially refer to " power density in the region with a tight waist after any laser beam focus be less than workpiece to be processed material
Ablation threshold ", " ablation threshold that the power density of the light beam directly projected by the laser is greater than workpiece to be processed material ",
Substantially " power density in the region with a tight waist after being focused by the light beam that the laser directly projects is greater than workpiece to be processed material
Ablation threshold ".
The controllable coupled laser processing method of a kind of space multiple beam provided by the present invention, for being deposited in existing laser processing
Machining resolution it is small, heat affecting is big, depth capability is poor the problems such as, can be realized reduce machining energy domain space volume,
Machining energy domain space posture is controlled, and has cost of implementation low, the small advantage of technological difficulties is high complete to laser accurate is realized
Property processing, complex characteristic processing, the Precision Machining of especially difficult-to-machine material is of great importance.
It should be appreciated that the technical concepts and features of above-described embodiment only to illustrate the invention, its object is to allow be familiar with this
The personage of item technology cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all
Equivalent change or modification made by Spirit Essence according to the present invention, should be covered by the protection scope of the present invention.
Claims (9)
1. a kind of controllable coupled laser processing unit (plant) of space multiple beam, characterized by comprising:
Laser light source, is used to provide at least two beam laser beams, and the power density of any laser beam is less than workpiece to be processed
The ablation threshold of material；
At least two condenser lens corresponding at least two beam laser beams, the condenser lens are separately positioned on correspondence
In the optical path of laser beam, wherein at least two beam laser beams can by controlling respectively through corresponding condenser lens focusing after
Juxtaposition, and form machining energy domain in the juxtaposition region, the power density in the machining energy domain be greater than to
The ablation threshold of workpieces processing material.
2. the controllable coupled laser processing unit (plant) of space multiple beam according to claim 1, it is characterised in that: the laser light source
Including at least two lasers, at least two beam laser beams are directly projected by different lasers respectively.
3. the controllable coupled laser processing unit (plant) of space multiple beam according to claim 1, it is characterised in that: the laser light source
Including a laser, it is additionally provided with spectroscope at the light source output end of the laser, at least two beam laser beams are by same
The light beam that one laser directly projects is formed after spectroscope light splitting；The function of the light beam wherein directly projected by the laser
Rate density is greater than the ablation threshold of workpiece to be processed material.
4. a kind of controllable coupled laser processing unit (plant) of space multiple beam, characterized by comprising:
Laser light source, is used to provide N beam laser beam, and the power density of any laser beam is less than workpiece to be processed material
Ablation threshold, wherein N >=2；
N number of condenser lens corresponding with the N beam laser beam, the condenser lens are separately positioned on the light of corresponding laser beam
On the road, wherein the N beam laser beam can be by controlling in the juxtaposition after the focusing of corresponding condenser lens respectively, and in institute
It states juxtaposition region and forms machining energy domain, the power density in the machining energy domain is greater than the burning of workpiece to be processed material
Threshold value is lost, and the N-1 beam laser beam is small in the power density respectively after corresponding condenser lens focuses in juxtaposition region
In the ablation threshold of workpiece to be processed material.
5. a kind of controllable coupled laser processing method of space multiple beam, it is characterised in that:
At least two beam laser beams are provided and are correspondingly arranged a condenser lens in the optical path of each laser beam, make at least two beams
Laser beam by controlling can be each passed through corresponding condenser lens and juxtaposition, and then formed and processed in juxtaposition region
Energy domain,
The part of workpiece to be processed is placed in the machining energy domain, and then is realized to the processing of the workpiece to be processed
Reason；Wherein the power density of each laser beam is less than the ablation threshold of workpiece to be processed material, in the machining energy domain
Power density be greater than workpiece to be processed material ablation threshold.
6. the controllable coupled laser processing method of space multiple beam according to claim 5, it is characterised in that: at least two beams
Laser beam is respectively from different laser light sources.
7. the controllable coupled laser processing method of space multiple beam according to claim 5, it is characterised in that: at least two beams
Laser beam is formed after being divided by the laser beam that same laser source directly projects, and the laser beam directly projected by the laser source
Power density is greater than the ablation threshold of workpiece to be processed material.
8. the controllable coupled laser processing method of space multiple beam according to claim 5, it is characterised in that further include: by changing
Become at least one of the parameter of laser beam, quantity, spatial distribution form, parameter of condenser lens to adjust the machining energy
The volume and/or spatial attitude in domain.
9. the controllable coupled laser processing method of space multiple beam according to claim 5, it is characterised in that: the space is more
The controllable coupled laser processing method of light beam is based on multiple beam controllable coupled laser in space of any of claims 1-3
What the controllable coupled laser processing unit (plant) of space multiple beam in processing unit (plant) or claim 4 was realized.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524120A (en) * | 2019-09-19 | 2019-12-03 | 贵州宝康智能装备有限公司 | A kind of body laser inner carving engraving machine |
| CN110899961A (en) * | 2019-11-22 | 2020-03-24 | 武汉数字化设计与制造创新中心有限公司 | Laser three-dimensional precise flexible processing platform with double lasers |
| CN111644750A (en) * | 2020-06-18 | 2020-09-11 | 长江存储科技有限责任公司 | Laser marking method, device and system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6169631B1 (en) * | 1998-05-19 | 2001-01-02 | Seagate Technology Llc | Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing |
| CN1824518A (en) * | 2005-02-22 | 2006-08-30 | 三星Sdi株式会社 | Laser irradiation device and laser induced thermal imaging method |
| CN101013200A (en) * | 2007-02-12 | 2007-08-08 | 苏州德龙激光有限公司 | Laser precision finishing optical system |
| CN205271138U (en) * | 2015-12-22 | 2016-06-01 | 武汉铱科赛科技有限公司 | Accurate laser beam machining device based on pivot angle compression |
| CN105633791A (en) * | 2014-10-27 | 2016-06-01 | 中国科学院大连化学物理研究所 | Restrained-shrinkage multi-optical-path Raman laser |
| CN107627038A (en) * | 2017-11-08 | 2018-01-26 | 钦成科技有限公司 | Process the laser system of non-circular hole |
| US20180259779A1 (en) * | 2017-03-09 | 2018-09-13 | Asato TAMURA | Optical processing apparatus, method for processing an object |
| CN108695145A (en) * | 2017-04-04 | 2018-10-23 | 株式会社迪思科 | processing method |
-
2019
- 2019-05-28 CN CN201910454335.3A patent/CN110076460B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6169631B1 (en) * | 1998-05-19 | 2001-01-02 | Seagate Technology Llc | Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing |
| CN1824518A (en) * | 2005-02-22 | 2006-08-30 | 三星Sdi株式会社 | Laser irradiation device and laser induced thermal imaging method |
| CN101013200A (en) * | 2007-02-12 | 2007-08-08 | 苏州德龙激光有限公司 | Laser precision finishing optical system |
| CN105633791A (en) * | 2014-10-27 | 2016-06-01 | 中国科学院大连化学物理研究所 | Restrained-shrinkage multi-optical-path Raman laser |
| CN205271138U (en) * | 2015-12-22 | 2016-06-01 | 武汉铱科赛科技有限公司 | Accurate laser beam machining device based on pivot angle compression |
| US20180259779A1 (en) * | 2017-03-09 | 2018-09-13 | Asato TAMURA | Optical processing apparatus, method for processing an object |
| CN108695145A (en) * | 2017-04-04 | 2018-10-23 | 株式会社迪思科 | processing method |
| CN107627038A (en) * | 2017-11-08 | 2018-01-26 | 钦成科技有限公司 | Process the laser system of non-circular hole |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524120A (en) * | 2019-09-19 | 2019-12-03 | 贵州宝康智能装备有限公司 | A kind of body laser inner carving engraving machine |
| CN110899961A (en) * | 2019-11-22 | 2020-03-24 | 武汉数字化设计与制造创新中心有限公司 | Laser three-dimensional precise flexible processing platform with double lasers |
| CN111644750A (en) * | 2020-06-18 | 2020-09-11 | 长江存储科技有限责任公司 | Laser marking method, device and system |
| CN111644750B (en) * | 2020-06-18 | 2021-10-26 | 长江存储科技有限责任公司 | Laser marking method, device and system |
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