CN115194342B - Taper controllable laser grooving device and method - Google Patents
Taper controllable laser grooving device and method Download PDFInfo
- Publication number
- CN115194342B CN115194342B CN202211134363.5A CN202211134363A CN115194342B CN 115194342 B CN115194342 B CN 115194342B CN 202211134363 A CN202211134363 A CN 202211134363A CN 115194342 B CN115194342 B CN 115194342B
- Authority
- CN
- China
- Prior art keywords
- laser
- light
- beams
- lens
- light beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a taper controllable laser grooving device and method. In the device, a laser emitting device is used for forming incident laser; the beam shaping system is arranged behind the laser emitting device and is used for shaping incident laser into multiple beams; the light beam translation system is arranged behind the light beam shaping system and used for translating and converting the multiple light beams to be in front of the light beam focusing system, wherein the light beam translation system comprises a first lens and a second lens, and the distance between the first lens and the second lens is adjustable; the light beam focusing system is arranged behind the light beam translation system and used for focusing the multi-light beam after translation conversion; the displacement platform is used for carrying a sample and driving the sample to move. The invention can sequentially carry out multi-beam shaping, translation transformation and focusing on incident laser, and control the taper of the processed groove body by adjusting the distance between the first lens and the second lens in the beam translation system, thereby greatly solving the problems of taper and a heat affected zone in the conventional laser grooving processing and improving the processing precision.
Description
Technical Field
The invention relates to the technical field of laser micro-nano machining, in particular to a taper-controllable laser grooving machining device and method.
Background
The laser has the characteristics of high brightness, strong directivity, high energy, dense distribution and the like, and after the laser irradiates the surface of a material, the material can absorb a large amount of photon energy in a short time to heat up so as to melt or even gasify the material, so that the laser can widely realize the material processing functions of material increase, material reduction, connection and the like. In recent years, with the continuous development of laser processing technology, laser processing begins to penetrate into a plurality of industries, and is complementary to the traditional processing technology, and even in some fields, the traditional processing technology is greatly replaced.
Among them, grooving is a typical type of material removal processing, and is a processing form in which a groove-like structure is formed on a material surface by a processing means. The traditional method is to cut the material from the surface to the inside by a cutter wheel to form a groove structure, and is realized by a chemical corrosion method. Obviously, the methods have certain defects and problems, and the mechanical method has large loss, low efficiency, high difficulty of chemical methods and large pollution, and has certain limitation on large-scale high-precision grooving processing. Laser has great advantages in these areas, which are not available in the conventional methods, and has been widely used in grooving processes in the fields of photovoltaics, semiconductors, and the like.
However, due to the focusing characteristics and energy distribution characteristics of the laser, direct grooving process results in a large taper and a narrow groove width, which is not consistent with the practical application requirements, so that the laser beam is usually required to be shaped to have the spatial distribution of the flat top light. There are three main approaches to this: masks, diffractive Optical Elements (DOEs), and Spatial Light Modulators (SLM). The flat top light is generated most simply by utilizing the mask, the formed groove type is better, but the energy utilization rate is low, and the groove width can not be changed after being shaped. Both DOE and SLM use the phase modulation principle to realize the modulation of incident light, but due to diffraction, the edge of the light beam is gradually reduced, and the taper and the heat affected zone are formed.
Patent CN212094854U utilizes DOE to shape laser into multiple beams, and the effect similar to flat-top light can also be realized by superposition of multiple beams, so that the flat edge when directly shaping into flat-top light can be avoided. However, the edges are still gaussian distributed, and although slightly better than the flat top, there will still be a machining taper. Moreover, because the shaped beams are not close to each other, the superimposed spot tops cannot be relatively flat, resulting in a wavy uneven ridge at the bottom of the groove.
Disclosure of Invention
The invention aims to provide a taper controllable laser grooving device and method aiming at the prior technical situation, which can solve the problems of taper and a heat affected zone in the existing laser grooving process to a great extent and improve the processing precision.
In order to achieve the purpose, the invention adopts the following technical scheme:
a taper controllable laser grooving device comprises a laser emitting device, a beam shaping system, a beam translation system, a beam focusing system and a displacement table;
the laser emitting device is used for forming incident laser;
the beam shaping system is arranged behind the laser emitting device and is used for shaping incident laser into multiple beams;
the light beam translation system is arranged behind the light beam shaping system and used for translating and converting the multiple light beams to be in front of the light beam focusing system, wherein the light beam translation system comprises a first lens and a second lens, and the distance between the first lens and the second lens is adjustable;
the light beam focusing system is arranged behind the light beam translation system and used for focusing the translated multiple light beams;
the displacement platform is used for carrying a sample and driving the sample to move.
Further, the beam shaping system is a galvanometer.
Further, the beam shaping system is a DOE, and the DOE can shape the incident laser into at least 2 rows of multiple beams, and each row of multiple beams comprises at least 3 beams.
Furthermore, the laser emitting device comprises a laser and a beam expander, and laser emitted by the laser forms incident laser after being amplified by the beam expander.
Further, the laser emitted by the laser is a gaussian laser.
The laser grooving processing method with the controllable taper adopts the laser grooving processing device with the controllable taper, and comprises the following steps:
s1, carrying a sample to a displacement table;
s2, enabling the laser emitting system to form incident laser, shaping the incident laser into a plurality of beams of light after passing through the beam shaping system, translating and converting the plurality of beams of light to be in front of the beam focusing system after passing through the beam translation system, and focusing the beams of light through the beam focusing system;
and S3, driving the sample to move to a light beam focusing system through the displacement table, and moving according to a set path to perform laser grooving processing on the surface of the sample.
The invention has the beneficial effects that:
the invention carries out multi-beam shaping, translation transformation and focusing on incident laser in sequence through the beam shaping system, the beam translation system and the beam focusing system, controls the taper of a processed groove body by adjusting the distance between the first lens and the second lens in the beam translation system, can solve the problems of taper and a heat affected zone in the conventional laser grooving processing to a great extent, and improves the processing precision.
Drawings
Fig. 1 is a schematic structural view of a laser grooving apparatus according to embodiment 1 of the present invention;
FIG. 2 is a schematic diagram of the deflection, translation and focusing processes of a light beam in embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a laser grooving apparatus in embodiment 2 of the present invention;
FIG. 4 is a schematic view of multi-beam shaping in example 2 of the present invention;
FIG. 5 is a schematic diagram of a focused beam grooving process on a sample surface.
Description of the labeling: 1. the laser device comprises a laser device, 2, a beam expander, 3, a galvanometer, 4, a first lens, 5, a second lens, 6, a beam focusing system, 7, a reflector, 8, DOE,9 and a sample.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific examples described herein are intended to be illustrative only and are not intended to be limiting.
Example 1:
referring to fig. 1-2, a taper controllable laser grooving apparatus includes a laser emitting device, a beam shaping system, a beam translation system, a beam focusing system 6, and a displacement table.
The laser emitting device is used for forming incident laser.
Specifically, the laser emitting device includes a laser 1 and a beam expander 2, and the gaussian laser emitted by the laser 1 is amplified by the beam expander 2 to form incident laser.
The beam shaping system is arranged behind the laser emitting device and is used for shaping incident laser into multiple beams, namely the incident Gaussian laser is shaped into multiple beam superposition type approximately flat-top light spots through the beam shaping system.
Specifically, the beam shaping system is a galvanometer 3, and ultrahigh overlapping rate among beams is realized through high-speed scanning, so that approximately flat-top light spots are obtained. It is necessary to ensure that the overlap is greater than 50%.
The beam translation system is arranged behind the beam shaping system and used for translating and converting the multiple beams to be in front of the beam focusing system 6, wherein the beam translation system comprises a first lens 4 and a second lens 5, and the distance between the first lens 4 and the second lens 5 is adjustable.
The beam focusing system 6 is arranged behind the beam translation system and is used for focusing the translated multiple beams.
The displacement table is used for carrying the sample 9 and driving the sample 9 to move. The displacement table is a well-known prior art and not shown in the drawings, and the detailed structure thereof is not described herein.
The optical path of example 1 is further illustrated below:
as shown in fig. 1, laser emitted by a laser 1 enters a galvanometer 3 after being amplified by a beam expander 2, is deflected by the galvanometer 3, is subjected to translation transformation by a light path translation system arranged behind the galvanometer 3, and finally enters a light beam focusing system 6 for focusing. Wherein the mirror 7 receives the connection between the optical systems.
As shown in fig. 2, when the galvanometer 3 performs high-speed scanning, the output beam thereof may be equivalent to multiple beams, and a certain off-angle exists between each beam of the multiple beams. After the translation transformation of the beam translation system composed of the first lens 4 and the second lens 5 and the focusing of the beam focusing system 6, a plurality of obliquely focused beams with an oblique angle with the optical axis are generated.
Example 2:
referring to fig. 3-4, a taper controllable laser grooving apparatus includes a laser emitting device, a beam shaping system, a beam translating system, a beam focusing system 6, and a displacement table.
The laser emitting device is used for forming incident laser.
Specifically, the laser emitting device includes a laser 1 and a beam expander 2, and the gaussian laser emitted by the laser 1 is amplified by the beam expander 2 to form incident laser.
The beam shaping system is arranged behind the laser emitting device and is used for shaping incident laser into multiple beams, namely the incident Gaussian laser is shaped into multiple beam superposition type approximately flat-top light spots through the beam shaping system.
Specifically, the beam shaping system is a DOE8, and the DOE8 can shape the incident laser light into at least 2 rows of multiple beams, and each row of multiple beams includes at least 3 beams. Since the overlapping of the spots cannot be realized by a single row of multiple beams, the DOE8 used needs to shape the incident laser into multiple rows of multiple beams, and the multiple rows of multiple beams are distributed at intervals.
The beam translation system is arranged behind the beam shaping system and used for translating and converting the multiple beams to be in front of the beam focusing system 6, wherein the beam translation system comprises a first lens 4 and a second lens 5, and the distance between the first lens 4 and the second lens 5 is adjustable.
The beam focusing system 6 is arranged behind the beam translation system and is used for focusing the translated multiple beams.
The displacement table is used for carrying the sample 9 and driving the sample 9 to move. The displacement table is a well-known prior art and not shown in the drawings, and the detailed structure thereof is not described herein.
As shown in fig. 3, laser light emitted by the laser 1 is amplified by the beam expander 2, enters the DOE8 for splitting to obtain multiple beams, and the multiple beams are subjected to translational transformation by a beam translation system arranged behind the multiple beams, and finally enter the beam focusing system 6 for focusing. Wherein the mirror 7 receives the connection between the optical systems.
With respect to embodiments 1 and 2, it is further noted that:
because the beam shaping system also deflects the light beams while shaping the light beams, namely, the deflection angle exists between the light beams, the light beams are not parallel light. Therefore, a set of beam translation system is needed to be arranged behind the system to translate the beam, and the shaped beam is transformed to the position in front of the final beam focusing system 6, meanwhile, the beam translation system has the function of adjusting the angle of the final focusing beam by changing the distance between the first lens 4 and the second lens 5, and can adapt to materials with different etching rates, which is an indispensable part in the system.
The deflected and translated multiple beams enter the beam focusing system 6 at respective angles and emerge at an oblique angle with respect to the optical axis. The included angle between the middle light ray of the middle light beam and the optical axis is 0 degrees, namely the included angle is vertically focused, the included angle between the middle light ray of the other light beams far away from the middle light beam and the optical axis is in direct proportion to the distance between the middle light beam and the optical axis, namely the farther the distance is, the larger the angle is, and the included angle between the outermost light ray and the optical axis at least needs to be 0 degrees.
The quasi-flat-top light beam formed by the method is formed by overlapping a plurality of non-parallel light beams, has higher overlapping rate and can generate the effect similar to a flat top. And peripheral beams are divergently distributed, the outermost beams only have focus positions to interact with the material in the processing process, and light at non-focus positions cannot contact with the material in the process of increasing the etching depth, so that the defects caused by energy distribution of Gaussian or shaped light spots in the processing process can be avoided, steep non-taper grooving edges are realized, and the taper can be regulated and controlled by adjusting the distance between two lenses in a beam translation system.
The actual laser grooving process is carried out by adopting the embodiment 1 or 2, and comprises the following steps:
s1, carrying a sample 9 to a displacement table;
s2, enabling the laser emitting system to form incident laser, shaping the incident laser into a plurality of beams of light after passing through the beam shaping system, translating and converting the plurality of beams of light after passing through the beam translation system to be in front of the beam focusing system 6, and focusing the beams of light through the beam focusing system 6;
and S3, driving the sample 9 to move to the light beam focusing system 6 through the displacement table, and moving according to a set path to perform laser grooving processing on the surface of the sample 9.
In either embodiment 1 or 2, the focusing beams generated by the two schemes are schematically shown in FIG. 5 during grooving process. Focusing a focused light beam on the surface of a sample 9, wherein the optical axis of the focused light beam is vertical to the surface of the sample 9, except that a central light beam is vertical to the surface of the sample 9 (is coincident with the optical axis), other external light beams have a certain angle with the optical axis, and the included angle between the outermost light beam and the optical axis needs to be ensured to be at least 0 degrees, so that only a focus position can generate interaction with a material in the processing process, and light at a non-focus position cannot contact with the material in the process of increasing the etching depth, which means that a processing area has a sharp edge and has a definite size almost irrelevant to laser energy, and the defects of conicity and a heat affected area caused by the energy distribution of Gaussian spots in the processing process can be avoided.
The present invention is not limited to the above embodiments, and those skilled in the art can implement the present invention in other various embodiments according to the disclosure of the present invention, so that all designs and concepts of the present invention can be changed or modified without departing from the scope of the present invention.
Claims (4)
1. The utility model provides a controllable laser fluting processingequipment of tapering which characterized in that: the device comprises a laser emitting device, a beam shaping system, a beam translation system, a beam focusing system and a displacement table;
the laser emitting device is used for forming incident laser;
the beam shaping system is arranged behind the laser emergent device and is used for shaping incident laser into multiple beams, wherein the beam shaping system is a galvanometer, and ultrahigh overlapping rate among the beams is realized through high-speed scanning, and the overlapping rate is more than 50%, so that flat-topped light spots are obtained;
the light beam translation system is arranged behind the light beam shaping system and is used for translating and converting multiple light beams to be in front of the light beam focusing system, wherein the light beam translation system comprises a first lens and a second lens, and the distance between the first lens and the second lens is adjustable;
the light beam focusing system is arranged behind the light beam translation system and is used for focusing the translated multiple light beams;
the displacement platform is used for carrying a sample and driving the sample to move.
2. The taper controllable laser grooving apparatus according to claim 1, wherein: the laser emitting device comprises a laser and a beam expander, and laser emitted by the laser forms incident laser after being amplified by the beam expander.
3. The taper-controllable laser grooving apparatus according to claim 2, wherein: the laser emitted by the laser is Gaussian laser.
4. A taper controllable laser grooving processing method is characterized in that: the taper-controllable laser grooving apparatus according to any one of claims 1 to 3, comprising the steps of:
s1, carrying a sample to a displacement table;
s2, enabling the laser emitting system to form incident laser, shaping the incident laser into a plurality of beams of light after passing through the beam shaping system, translating and converting the plurality of beams of light to be in front of the beam focusing system after passing through the beam translation system, and focusing the beams of light through the beam focusing system;
and S3, driving the sample to move to a light beam focusing system through the displacement table, and moving according to a set path to perform laser grooving processing on the surface of the sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211134363.5A CN115194342B (en) | 2022-09-19 | 2022-09-19 | Taper controllable laser grooving device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211134363.5A CN115194342B (en) | 2022-09-19 | 2022-09-19 | Taper controllable laser grooving device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115194342A CN115194342A (en) | 2022-10-18 |
| CN115194342B true CN115194342B (en) | 2022-12-13 |
Family
ID=83573379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211134363.5A Active CN115194342B (en) | 2022-09-19 | 2022-09-19 | Taper controllable laser grooving device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115194342B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115401342B (en) * | 2022-11-02 | 2023-03-03 | 武汉引领光学技术有限公司 | Crack induction method for laser cutting of transparent brittle material |
| CN115609162B (en) * | 2022-12-19 | 2023-03-07 | 扬州艾镭激光设备有限公司 | Automatic increase formula laser marking machine |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6487022B1 (en) * | 2001-08-24 | 2002-11-26 | Terabeam Corporation | Transmitter using uniform intensity transmission for a wireless optical communication system |
| JP2003114400A (en) * | 2001-10-04 | 2003-04-18 | Sumitomo Electric Ind Ltd | Laser optical system and laser machining method |
| CN203265914U (en) * | 2012-10-12 | 2013-11-06 | 张立国 | Large-breadth micropore high-speed hole-drilling system |
| CN103235489B (en) * | 2013-05-15 | 2015-01-07 | 中国科学院光电技术研究所 | Variable-cycle multi-beam interference photoetching method |
| CN103824762A (en) * | 2013-12-12 | 2014-05-28 | 苏州德龙激光股份有限公司 | Laser annealing device |
| CN103645563A (en) * | 2013-12-25 | 2014-03-19 | 苏州德龙激光股份有限公司 | Laser shaping device |
| CN104174994B (en) * | 2014-07-31 | 2016-06-01 | 北京万恒镭特机电设备有限公司 | light-dividing device and method thereof |
| CN204154996U (en) * | 2014-10-30 | 2015-02-11 | 北京润和微光科技有限公司 | A kind of is the optical system of flat top beam by Gauss beam reshaping |
| CN107433396B (en) * | 2017-07-14 | 2018-10-09 | 中国科学院微电子研究所 | A kind of device and method of laser processing wafer |
| CN109175728B (en) * | 2018-09-30 | 2021-02-23 | 大族激光科技产业集团股份有限公司 | Device and method for laser cutting of low-temperature co-fired ceramic |
| CN111822850A (en) * | 2020-07-17 | 2020-10-27 | 西安交通大学 | Multi-beam laser amplification scanning processing system and method based on light field regulation |
| CN112782799B (en) * | 2021-01-07 | 2022-04-22 | 北京润和微光科技有限公司 | Diffractive optical element and system for generating a focused flat-topped light spot beam |
-
2022
- 2022-09-19 CN CN202211134363.5A patent/CN115194342B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN115194342A (en) | 2022-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115194342B (en) | Taper controllable laser grooving device and method | |
| CN110125536B (en) | Laser processing device and method for removing thin film material | |
| CN112782799B (en) | Diffractive optical element and system for generating a focused flat-topped light spot beam | |
| CN102380709B (en) | Flattened Gaussian beam picopulse laser processing system | |
| CN105750729A (en) | Laser processing device with linear array optical lens assembly with micro cylindrical lenses in cylindrical distribution | |
| CN104690432A (en) | Precision laser cutting and micro-hole machining device | |
| CN109967881A (en) | A kind of laser cleaning-texturing combined machining method | |
| CN210967462U (en) | Adjustable broadband laser processing optical system | |
| CN103645563A (en) | Laser shaping device | |
| CN110681992A (en) | Adjustable broadband laser processing optical system and processing method | |
| CN102759800A (en) | Method for preparing microlens array beam shaper through femtosecond laser reinforced chemical etching | |
| CN111347172A (en) | Laser cutting method and system for terminal short circuit ring of liquid crystal display device | |
| CN115453767A (en) | Point-ring distributed laser optical system and using method | |
| CN110076460B (en) | Space multi-beam controllable coupling laser processing device and method | |
| CN113523577A (en) | PERC battery piece high-speed laser grooving method and device based on rotating mirror and PERC battery piece | |
| CN117600685A (en) | Method for ultra-fast laser rapid modification of hard and brittle material ingot | |
| CN103848392B (en) | The manufacture method of the black silicon of large area that a kind of micro structure cycle is controlled | |
| CN216485792U (en) | Flat-top light shaping laser scanning device based on plano-convex lens | |
| CN212083832U (en) | Laser grooved optical system, laser and equipment with laser | |
| CN115903248A (en) | Laser beam splitting processing system and method with adjustable point number and intensity | |
| US20190189831A1 (en) | Processing method for removing film and apparatus for removing film | |
| CN213560528U (en) | Laser processing device of capillary structure | |
| CN113960783A (en) | Flat-top light shaping laser scanning device based on plano-convex lens and working method | |
| CN210427969U (en) | ZOOM cutting device based on adjustable annular light spot of aspherical mirror | |
| CN210243981U (en) | Laser linear light spot shaping optical system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |