CN115903248A - Laser beam splitting processing system and method with adjustable point number and intensity - Google Patents

Laser beam splitting processing system and method with adjustable point number and intensity Download PDF

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Publication number
CN115903248A
CN115903248A CN202211592692.4A CN202211592692A CN115903248A CN 115903248 A CN115903248 A CN 115903248A CN 202211592692 A CN202211592692 A CN 202211592692A CN 115903248 A CN115903248 A CN 115903248A
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beam splitting
laser
grating
wave plate
processing system
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吴春洲
刘继强
刘晓亮
代林茂
李晓春
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Changsha Lubang Photoelectric Technology Co ltd
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Changsha Lubang Photoelectric Technology Co ltd
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Abstract

A laser beam splitting processing system with adjustable point number and intensity sequentially comprises a laser generator, a beam expanding module, a beam splitting module and a focusing module along the advancing direction of laser; the beam expanding module is used for expanding the light beam emitted by the laser generator; the beam splitting module is used for finally splitting the laser into a plurality of beam splitting points and adjusting the number and the energy intensity of each beam splitting point; the focusing module is used for focusing the sub-beams emitted from the beam splitting module and comprises a reflecting mirror and a field lens; the beam splitting module comprises a wave plate and a subarea grating; and the wave plate is closer to the beam expanding module; the subregion grating is divided into a plurality of half areas, and the wire grid direction of each half area is different. According to the laser beam splitting processing system, the beam splitting module consisting of the wave plate and the partition grating can be used for splitting a single beam of laser, the number of beam splitting spots can be flexibly controlled, and meanwhile, the energy distribution among the beam splitting spots can be adjusted.

Description

Laser beam splitting processing system and method with adjustable point number and intensity
Technical Field
The invention relates to the technical field of laser processing equipment, in particular to a laser beam splitting processing system and method with adjustable point number and intensity.
Background
Laser processing refers to a processing process in which a laser beam is applied to the surface of an object to change the shape or properties of the object, and is essentially characterized in that the laser transmits energy to a material to be processed, so that the material to be processed undergoes physical or chemical changes (such as evaporation) to achieve the purpose of processing. The laser processing technology mainly has application forms of laser cutting, laser marking, laser welding, laser engraving, laser punching and the like, and plays an important role in the industries of machine manufacturing, automobiles, aerospace, electronic chips, buildings and the like.
In the existing laser processing equipment, a single-beam laser is mostly used for processing, and the equipment can only generate one processing point (namely a focus) on a workpiece, so that the processing efficiency is low. In order to be able to machine a plurality of different positions of a workpiece simultaneously, thereby increasing the efficiency, a machining device has been invented which can divide laser light into a plurality of beams; for example, CN103658975B discloses a laser beam splitting processing device, which includes a laser focusing and switching module, a laser beam splitting module, and a beam control module. The laser beam splitting processing device can process a single laser into multiple lasers through the laser beam splitting module, can perform laser focusing and high-speed switching of the spatial position of a laser focus through the laser focusing switching module, and realizes high-speed, high-efficiency and high-precision array laser processing by combining the two modules; meanwhile, through the light beam control module, the control content of the light beam motion track in laser processing is enriched, and the requirements of various processing environments and processing conditions can be met. Compared with the traditional laser processing, the technical scheme of the invention greatly improves the processing precision, the processing efficiency, the processing quality and the like. However, the invention has the following disadvantages: 1. in the using process of the processing device, the number of the laser beams cannot be adjusted at any time, after the device is assembled, the number of the laser beams is determined, namely the number (point number) of processing points is also determined, and if the point number is required to be changed, the current device needs to be disassembled to replace related parts; 2. in this invention, the energy intensity of each processing point is uniform, and the energy intensity of the laser beam cannot be flexibly distributed and adjusted to each processing point.
In view of this, the present application aims to provide a laser beam splitting processing system which can flexibly adjust the number of processing points and also adjust the energy intensity of each processing point.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a laser beam splitting processing system with adjustable point number and intensity.
The technical scheme of the invention is as follows: a laser beam splitting processing system with adjustable point number and intensity sequentially comprises a laser generator, a beam expanding module, a beam splitting module and a focusing module along the advancing direction of laser;
the beam expanding module is used for expanding the light beam emitted by the laser generator;
the beam splitting module is used for splitting the laser into a plurality of sub-beams (namely beam splitting points), and adjusting the number and the energy intensity of each sub-beam;
the focusing module is used for focusing the sub-beams emitted from the beam splitting module and comprises a reflecting mirror and a field lens;
the beam splitting module comprises a wave plate and a subarea grating; and the wave plate is closer to the beam expanding module; the partitioned grating is divided into a plurality of areas, and the direction of the wire grid of each area is different.
Furthermore, the partition grating is divided into two areas, namely two half areas, and the directions of the wire grids of the two half areas are perpendicular to each other, so that the formed divided beams are simple, and the quantity, the position and the intensity of the laser beam splitting points can be conveniently regulated and controlled subsequently.
Further, the direction of the fast axis of the wave plate remains the same as the direction of the boundary of the two halves in the segmented grating.
Further, the wave plate is a 1/4 wave plate; the fast axis direction of the 1/4 wave plate is the vertical direction; the partitioned grating is divided into a left half area and a right half area in a halving mode, and the boundary of the two half areas is kept vertical. Of course, the fast axis direction of the 1/4 wave plate can be made to be the horizontal direction; and the partitioned grating is divided into an upper half area and a lower half area in a halving way, and the boundary of the two half areas is kept horizontal, so that the setting effect is completely the same as that of the scheme.
Furthermore, the subarea grating moves through the adjusting mechanism, so that the laser passing through the wave plate irradiates to different positions of the subarea grating. The adjusting mechanism can adopt any support structure capable of driving the partition grating to move up, down, left and right, for example, the existing X and Y moving platform mechanism can be adopted.
Further, the laser generator may generate laser light of different polarization states.
Furthermore, the partitioned grating can also be divided into four half areas, the directions of the wire grids of every two adjacent half areas are mutually vertical, namely, the center of the partitioned grating is provided with a crossed boundary line, and the whole partitioned grating is in a shape of Chinese character 'tian'.
Furthermore, the partitioned grating is divided into at least 5 half areas, each half area is arranged in a circle, and boundary lines of the adjacent half areas pass through the center point of the partitioned grating.
The invention utilizes the beam splitting principle of the grating, and specifically comprises the following steps:
1. when the linear polarization laser light source irradiates in a liquid crystal grating area, the emergent light spot is two light beams with a certain included angle, and the included angle between the two light beams and the horizontal direction satisfies the formula: dsin θ = λ;
2. when the circularly polarized laser light source irradiates in a liquid crystal grating area, the emergent light spot is a light beam forming a certain included angle with the horizontal direction, and the included angle meets the formula dsin theta = lambda.
The invention also provides a using method of the laser beam splitting processing system; the following use cases are included:
s1, after laser sequentially passes through a beam expanding module and a wave plate, formed incident light spots are only irradiated on one half area of a partitioned grating; at the moment, the number of beam splitting points or the intensity ratio of the beam splitting points is adjusted by controlling the included angle between the polarization direction of the laser and the fast axis of the wave plate;
s2, when the laser sequentially passes through the beam expanding module and the wave plate, formed incident light spots are simultaneously irradiated on different half areas of the partitioned grating; at the moment, the quantity of beam splitting points or the intensity ratio of the beam splitting points is adjusted by controlling the included angle between the polarization direction of the laser and the fast axis of the wave plate and the distribution area of the incident light spots on different half areas of the segmented grating.
For convenience of explanation of specific working principles, the following conditions are assumed here: the laser adopts linearly polarized laser, and the wave plate adopts 1/4 wave plate, and the fast axle direction of wave plate is the direction of hardening, and the subregion grating divide into two left and right half districts, and the wire grid in half district on the left side sets up to the level, and the wire grid in half district on the right side sets up to the perpendicular.
1. In case of S1
1) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 0 degree or 90 degrees, the light spot can form two beam splitting points with equal intensity after passing through the subarea grating;
2) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 45 degrees or-45 degrees, only one beam splitting point appears after the light spot passes through the subarea grating;
3) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is other values except 0 °, 90 °, 45 °, and 45 °, the light spot can form two beam splitting points with different intensities after passing through the segmented grating, and the intensity distribution between the two beam splitting points can be different along with the difference of the angle.
2. In case of S2
1) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 0 degree or 90 degrees, and incident light spots are evenly distributed in the left subarea and the right subarea, the laser can be divided into four beam splitting spots after passing through the subarea grating, and the four beam splitting spots can be divided into two beam splitting spot groups according to positions; wherein, two beam splitting points on the same horizontal line are horizontal groups, two beam splitting points on the same vertical line are vertical groups, and the intensity distribution between the horizontal groups and the vertical groups can be adjusted by controlling the deviation distance between the center of an incident light spot and the boundary of the segmented grating; for example, when the center of the incident spot is offset to the left of the dividing line, the sum of the energies of the two beam spots in the vertical group will be larger than the sum of the energies of the two beam spots in the horizontal group, and vice versa.
2) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 45 degrees or-45 degrees, and incident light spots are evenly distributed in the left subarea and the right subarea, the laser can be divided into two subarea spots after passing through the subarea grating; the intensity distribution ratio between the two beam-splitting spots can be adjusted by controlling the offset distance between the center of the incident spot and the boundary of the segmented grating.
3) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is other values (except 0 degrees, 90 degrees, 45 degrees and 45 degrees), and the incident light spots are evenly distributed in the left and right subareas, the laser is divided into four subarea spots after passing through the subarea grating; and the four beam splitting points can be divided into two sub-groups of beam splitting points according to positions, and the distribution ratio of the energy intensity among the beam splitting points in the same sub-group of beam splitting points is different along with the difference of the angles.
In summary, the present invention can adjust the number of beam splitting points and the distribution of energy intensity among the beam splitting points by adjusting the polarization state of the laser line.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the laser beam splitting processing system, the beam splitting module consisting of the wave plate and the partition grating can split a single beam of laser, the single beam is changed into a plurality of split beams (namely split beam spots), and the plurality of split beam lasers can form a plurality of processing points after being focused by the focusing module, so that the purpose of processing a plurality of positions on a workpiece at the same time is achieved;
2. the laser beam splitting processing system can flexibly control the number of beam splitting points, does not need to disassemble a processing device when in use, only needs to adjust the polarization state of laser or the position of the subarea grating, and is convenient to adjust;
3. the laser beam splitting processing system can also adjust the energy distribution among the beam splitting points, namely, the intensity of each beam splitting point can be flexibly adjusted.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the positions of beam forming spots generated when the incident light spot is only irradiated on the left half area and the corresponding angle is 0 ° or 90 ° in embodiment 1 of the present invention;
FIG. 3 is a schematic diagram of the positions of the beam spots when the incident light spot is only irradiated in the left half area and the corresponding angle is 45 degrees in the embodiment 1 of the present invention;
FIG. 4 is a schematic diagram showing the positions of the time-division spots when the incident light spot is irradiated only on the left half area and the corresponding angle is-45 ° in embodiment 1 of the present invention;
fig. 5 is a schematic diagram of the positions of beam forming spots generated when the incident light spot irradiates only the right half region and the corresponding angle is 0 ° or 90 ° in embodiment 1 of the present invention; (ii) a
Fig. 6 is a schematic position diagram of the time-division spot when the incident light spot only irradiates on the right half area and the corresponding angle is 45 ° in embodiment 1 of the present invention;
FIG. 7 is a schematic diagram showing the positions of the time-division spots when the incident light spot is irradiated only in the right half area and the corresponding angle is-45 ° in embodiment 1 of the present invention;
fig. 8 is a schematic position diagram of beam splitting spots generated when the incident light spot is uniformly irradiated on two half areas and the corresponding angle is 0 ° or 90 ° in embodiment 1 of the present invention;
fig. 9 is a schematic diagram of positions of beam forming spots generated when the incident light spot is uniformly irradiated on two half areas and the corresponding angle is 45 ° in embodiment 1 of the present invention;
FIG. 10 is a schematic diagram showing the positions of beam forming spots generated when the incident light spot is uniformly irradiated on two half areas and the corresponding angle is-45 ° in embodiment 1 of the present invention;
FIG. 11 is a schematic view of a segmented grating in embodiment 2 of the present invention;
in the figure: 1-laser generator, 2-beam expander, 3-1/4 wave plate, 4-partition grating, 5-reflector, 6-field lens and 7-processing surface.
Detailed Description
The present invention will be described in further detail below with reference to specific examples, wherein methods or features not specifically described are known in the art.
Example 1
As shown in fig. 1-7, embodiment 1 is a laser beam splitting system with adjustable number and intensity, and sequentially includes a laser generator 1, a beam expander 2, a beam splitting module, and a focusing module along the forward direction of laser; the focusing module comprises a reflector and a field lens, and the beam splitting module comprises a wave plate and a subarea grating 4; the wave plate is 1/4 wave plate 3 to the setting is in the position that is close to the beam expanding module, and the fast axle direction of 1/4 wave plate is vertical direction, subregion grating 4 is liquid crystal subregion grating 4, and the subregion album of books is divided into half left district and half right district, and the wire grid direction mutually perpendicular of two half districts, and wherein the wire grid of half left district is the level setting, and the wire grid of half right district is perpendicular setting.
In this embodiment, the laser generator 1 can generate laser beams with different polarization states, and the division grating 4 moves through the adjusting mechanism, that is, the adjusting mechanism can adjust the vertical height and the horizontal left and right positions of the division grating 4, so that the laser beams passing through the wave plate irradiate different positions of the division grating 4.
When the laser beam splitting processing system in this embodiment is used, a single laser beam can be split into a plurality of beam splitting points by the beam splitting module, and the plurality of beam splitting points can form a plurality of processing points on the processing surface 7 through the cooperation of the reflecting mirror 5 and the field lens 6, so that the processing efficiency is improved.
The application method and principle of the laser beam splitting processing system in this embodiment can be described in the following cases:
situation one, laser only irradiates on a certain half area of the partitioned grating
The position of the subarea grating 4 is controlled by the adjusting mechanism, so that after laser emitted by the laser generator 1 sequentially passes through the beam expander 2 and the 1/4 wave plate 3, formed incident light spots only irradiate on one half area of the subarea grating 4; at the moment, the number of beam splitting points or the intensity ratio of the beam splitting points is adjusted by controlling the included angle between the polarization direction of the laser and the fast axis of the wave plate;
in this case, the principle of adjusting the number and intensity of beam splitting points by the laser beam splitting processing system in this embodiment is described in detail as follows:
if the incident spot only strikes the left half of the segmented grating 4:
1) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 0 degree or 90 degrees, the light spot can be divided into two beam splitting points A and two beam splitting points B with equal intensity after passing through the segmented grating 4, the two beam splitting points are on the same vertical line, and the specific distribution position is shown in fig. 2;
2) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 45 degrees, only one beam splitting point A appears, and the distribution position is shown in FIG. 3;
3) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is-45 degrees, only one beam splitting point B appears; the distribution positions are shown in FIG. 4;
4) When the angle formed by the polarization direction of the laser light and the fast axis direction of the wave plate is other than the above-mentioned terms (for example, between 45 ° and-45 °), two beam splitting points a and B are also present, and the distribution positions of the beam splitting points are also shown in fig. 2, but the intensity distribution between the two beam splitting points may be different according to the angle (i.e., the angle formed by the polarization direction of the laser light and the fast axis direction of the wave plate).
If the incident light spot only illuminates the right half of the segmented grating 4:
1) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 0 degree or 90 degrees, the light spot can be divided into two beam splitting points C and two beam splitting points D with equal intensity after passing through the subarea grating 4, the two beam splitting points are on the same horizontal line, and the specific distribution positions are shown in fig. 5;
2) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 45 degrees, only one beam splitting point C appears, and the distribution position is shown in FIG. 6;
3) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is-45 degrees, only one beam splitting point D appears; the distribution positions are shown in FIG. 7;
4) When the angle formed by the polarization direction of the laser light and the fast axis direction of the wave plate is other than the above-mentioned terms (for example, between 45 ° and-45 °), two beam splitting points C and D are also present, and the distribution positions of the beam splitting points are also shown in fig. 5, but the intensity distribution between the two beam splitting points may be different according to the angle (i.e., the angle formed by the polarization direction of the laser light and the fast axis direction of the wave plate).
l case two, laser irradiates on two half areas of the partitioned grating simultaneously
The position of the subarea grating 4 is controlled by the adjusting mechanism, so that the formed incident light spots can be simultaneously irradiated on different half areas of the subarea grating 4 after the laser sequentially passes through the beam expanding module and the wave plate; at this time, the number of beam splitting points or the intensity ratio of the beam splitting points is adjusted by controlling the included angle between the polarization direction of the laser and the fast axis of the wave plate and the distribution area of the incident light spot on different half areas of the segmented grating 4.
In this case, the principle of adjusting the number and intensity of beam splitting points by the laser beam splitting processing system in this embodiment is described in detail as follows:
1) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 0 degree or 90 degrees, and incident light spots are evenly distributed in the left subarea and the right subarea, the laser can be divided into four beam splitting spots after passing through the subarea grating 4, and the four beam splitting spots can be divided into two beam splitting spot groups according to positions; wherein, the two beam spots C and D on the same horizontal line are horizontal groups, and the two beam spots a and B on the same vertical line are vertical groups, at this time, the intensities of the four beam spots are all the same, and the distribution positions are as shown in fig. 8.
The intensity distribution between the horizontal group and the vertical group can be adjusted by controlling the deviation distance between the center of the incident light spot and the boundary of the segmented grating 4; for example, by deviating the center of the incident spot to the left of the dividing line, the sum of the energies of the two beam spots a and B in the vertical group will be larger than the sum of the energies of the two beam spots C and D in the horizontal group, and vice versa.
2) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is 45 degrees, and the incident light spots are evenly distributed in the left and right subareas, the laser is divided into two beam splitting spots, namely a beam splitting spot A and a beam splitting spot C, after passing through the subarea grating 4, and the distribution positions are shown in FIG. 9.
The intensity distribution ratio between the two beam split spots can now be adjusted by controlling the deviation distance between the center of the incident spot and the boundary of the segmented grating 4.
3) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is-45 degrees and incident light spots are evenly distributed in the left subarea and the right subarea, the laser can be divided into two beam splitting spots, namely a beam splitting point B and a beam splitting point D after passing through the subarea grating 4; and the distribution positions are as shown in fig. 10.
At this time, the intensity distribution ratio between the two divided spots can be adjusted by controlling the deviation distance between the center of the incident spot and the boundary of the divided grating 4.
4) When the angle formed by the polarization direction of the laser and the fast axis direction of the wave plate is other values (for example, between 45 ° and-45 °) than the above items, and the incident light spots are evenly distributed in the left and right subareas, the laser is divided into four subarea spots after passing through the subarea grating 4; and the distribution positions of the four beam splitting points are also shown in fig. 8.
At this time, the energy sum of the two sub-groups of the four beam splitting points is equal, but at this time, the distribution ratio of the energy intensity between the beam splitting points within the same sub-group of beam splitting points is different according to the angle, that is, the energy between the beam splitting point a and the beam splitting point B is equal to the length, and the energy between the beam splitting point C and the beam splitting point D is equal to the length.
In summary, the laser beam splitting processing system in this embodiment can adjust the number of beam splitting points and the distribution of laser energy intensity among the beam splitting points by adjusting the polarization state of the laser or the position of the incident light spot on the segmented grating.
Example 2
As shown in fig. 11, the present embodiment is different from embodiment 1 only in that the segmented grating 4 is divided into four half areas, and the directions of the gratings in each two adjacent half areas are perpendicular to each other, that is, the segmented grating has a cross-shaped boundary line in the center, and the whole segmented grating is in a shape of "field".
The advantage of this embodiment 2 is that it is more convenient to adjust, because the subregion grating has 4 half districts can two liang of combinations, has carried out corresponding concatenation with the structure in two embodiments 1 equivalently, has richened the compound mode of half district, adjusts more nimble changeable during consequently in-service use. For example, the first quadrant, the second quadrant and the fourth quadrant in fig. 11, two combinations may be formed.
In some embodiments, the segmented grating may be divided into 5-8 regions or more, and the wire grid directions of adjacent regions are different by more than 30 degrees, so that when the incident light spot irradiates on the boundary line of adjacent regions, the beam splitting points have enough space to be easily distinguished, and the subsequent utilization is convenient.
While the invention has been described with reference to specific embodiments, it will be appreciated by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A laser beam splitting processing system with adjustable point number and intensity sequentially comprises a laser generator, a beam expanding module, a beam splitting module and a focusing module along the advancing direction of laser; the method is characterized in that: the beam splitting module comprises a wave plate and a subarea grating; the wave plate is close to the beam expanding module, the partition grating is divided into a plurality of areas, and the directions of the wire grids in the two adjacent areas are different.
2. The laser beam splitting processing system with adjustable point number and intensity according to claim 1, characterized in that: the partitioned grating is divided into two areas, namely two half areas, and the directions of the wire grids of the two half areas are mutually vertical.
3. The laser beam splitting processing system with adjustable point number and intensity according to claim 2, characterized in that: the direction of the fast axis of the wave plate is kept the same as the direction of the boundary of the two half areas in the partitioned grating.
4. The laser beam splitting processing system with adjustable point number and intensity according to claim 3, characterized in that: the wave plate is a 1/4 wave plate; and the fast axis direction of the 1/4 wave plate is the vertical direction.
5. The laser beam splitting processing system with adjustable point number and intensity according to claim 4, characterized in that: the partitioned grating is divided into a left half area and a right half area in a halving mode, and the boundary of the two half areas is kept vertical.
6. The laser beam splitting processing system with adjustable point number and intensity according to claim 3, characterized in that: the wave plate is a 1/4 wave plate; and the fast axis direction of the 1/4 wave plate is the horizontal direction.
7. The laser beam splitting processing system with adjustable point number and intensity according to claim 6, characterized in that: the partitioned grating is divided into an upper half area and a lower half area in a halving mode, and the boundary of the two half areas is kept horizontal.
8. The laser beam splitting processing system with adjustable point number and intensity according to claim 1, characterized in that: the partitioned grating moves through the adjusting mechanism, so that the laser passing through the wave plate irradiates different positions of the partitioned grating; the laser generator is used for generating laser with different polarization states.
9. The laser beam splitting processing system with adjustable point number and intensity according to claim 1, characterized in that: the partitioned grating is divided into four areas, and the directions of the wire grids of every two adjacent areas are mutually vertical.
10. A method of using the laser beam splitting processing system of any of claims 1-9, comprising the following use cases:
s1, after laser sequentially passes through a beam expanding module and a 1/4 wave plate, formed incident light spots are only irradiated on one area of the partitioned grating; at the moment, the number of beam splitting points or the intensity ratio of the beam splitting points is adjusted by controlling the included angle between the polarization direction of the laser and the fast axis of the wave plate;
s2, after the laser sequentially passes through the beam expanding module and the 1/4 wave plate, formed incident light spots are simultaneously irradiated on different half areas of the partitioned grating; at this time, the number of beam splitting points or the intensity ratio of the beam splitting points is adjusted by controlling the included angle between the polarization direction of the laser and the fast axis of the wave plate and the distribution area of the incident light spots on different areas.
CN202211592692.4A 2022-12-13 2022-12-13 Laser beam splitting processing system and method with adjustable point number and intensity Pending CN115903248A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117239527A (en) * 2023-11-14 2023-12-15 拉普拉斯新能源科技股份有限公司 Laser device, laser processing system and processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117239527A (en) * 2023-11-14 2023-12-15 拉普拉斯新能源科技股份有限公司 Laser device, laser processing system and processing method
CN117239527B (en) * 2023-11-14 2024-04-12 拉普拉斯新能源科技股份有限公司 Laser device, laser processing system and processing method

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