CN110050338A - 电子部件及其制造方法 - Google Patents
电子部件及其制造方法 Download PDFInfo
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- CN110050338A CN110050338A CN201780075385.XA CN201780075385A CN110050338A CN 110050338 A CN110050338 A CN 110050338A CN 201780075385 A CN201780075385 A CN 201780075385A CN 110050338 A CN110050338 A CN 110050338A
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Abstract
提供一种不易产生内置于树脂构造体的电子部件元件的位置偏离的电子部件。电子部件(16)具备:树脂构造体(11),具有相互对置的第1、第2面(11a、11b);电子部件元件(6),内置于树脂构造体(11),具有一个主面、与一个主面对置的另一个主面、和将一个主面与另一方主面连结的多个侧面,并在树脂构造体(11)中的第1面(11a)露出;和贯通电极(9、10),贯通了树脂构造体(11)以使得将树脂构造体(11)中的第1面(11a)和第2面(11b)连结,贯通电极(9、10)与电子部件元件(6)中的多个侧面之中至少一个侧面接触。
Description
技术领域
本发明涉及在树脂构造体内内置有电子部件元件的电子部件及其制造方法。
背景技术
以往,已知在树脂构造体中埋入有电子部件元件的部件内置型的电子部件。在下述的专利文献1记载的制造方法中,在基材上搭载半导体芯片。然后,赋予树脂材料以使得将半导体芯片埋入。使该树脂材料固化,形成树脂构造体。然后,将基材隔离。由此,获得在树脂构造体中内置有半导体芯片的电子部件。在该电子部件中,半导体芯片的与基材接触的部分露出。
在先技术文献
专利文献
专利文献1:JP特开2005-310954号公报
发明内容
发明要解决的课题
在获得如专利文献1记载的部件内置型的电子部件时,在形成树脂构造体之际,将电子部件元件配置于支承板,将该配置的支承板配置在模具内。然后,将热固化性树脂填充到模具内并进行压制。然后,通过加热使热固化性树脂固化,在剥离了支承板之后,获得包含电子部件元件和固化了的树脂的树脂构造体。但是,由于在模具内填充热固化性树脂时、在模具内压制热固化性树脂时的压力、或者对热固化性树脂进行加热固化时的固化收缩,有时产生内置于树脂构造体的电子部件元件的位置偏离。
本发明的目的在于,提供一种不易产生内置于树脂构造体的电子部件元件的位置偏离的电子部件的制造方法以及提高了电子部件元件的位置精度的电子部件。
用于解决课题的手段
本发明涉及的电子部件具备:树脂构造体,具有相互对置的第1面和第2面;电子部件元件,内置于所述树脂构造体,具有一个主面、对置的另一个主面、和将所述一个主面与所述另一个主面连结的多个侧面,并在所述树脂构造体中的所述第1面露出;和贯通电极,贯通了树脂构造体以使得将所述树脂构造体中的所述第1面和所述第2面连结,所述贯通电极与所述电子部件元件中的所述多个侧面之中至少一个所述侧面接触。
在本发明涉及的电子部件的某特定的方式中,设置有多个所述贯通电极,多个所述贯通电极与所述电子部件元件中的所述多个侧面之中的任一个所述侧面接触。在此情况下,能够更加提高电子部件元件的位置精度。
在本发明涉及的电子部件的其他特定的方式中,多个所述贯通电极之中至少一个贯通电极和其余的至少一个贯通电极与所述电子部件元件中的不同的所述侧面接触。在此情况下,能够更加提高电子部件元件的位置精度。
在本发明涉及的电子部件的另一特定的方式中,在所述电子部件元件中,所述多个侧面具有相互对置的一对所述侧面,所述至少一个贯通电极与一对所述侧面之中的一个所述侧面接触,所述其余的至少一个贯通电极与一对所述侧面之中的另一个所述侧面接触。在此情况下,能够进一步有效地提高电子部件元件的位置精度。
在本发明涉及的电子部件的其他特定的方式中,还具备:布线,设置在所述树脂构造体中的所述第1面或所述第2面,与所述贯通电极电连接。
在本发明涉及的电子部件的又一其他特定的方式中,还具有设置在所述电子部件元件的至少所述多个侧面的扩散防止膜,所述贯通电极与所述扩散防止膜接触。在此情况下,能够有效地抑制贯通电极的材料向电子部件元件的扩散。
在本发明涉及的电子部件的另一特定的方式中,所述电子部件元件是Si半导体芯片,所述贯通电极与所述Si半导体芯片中的多个侧面之中的任一个侧面上的所述扩散防止膜接触。在此情况下,能够有效地抑制贯通电极的材料向Si半导体芯片的扩散。
在本发明涉及的电子部件的又一其他特定的方式中,还具备:其他电子部件元件,安装在所述树脂构造体的所述第1面或所述第2面。
在本发明涉及的电子部件的又一另外特定的方式中,在所述树脂构造体的所述第1面或第2面安装有其他电子部件。这样,在本发明中,也可以层叠多个本发明的电子部件。
本发明涉及的电子部件的制造方法,具备:使用粘着剂在金属片上临时固定电子部件元件的工序;形成抗蚀剂图案的工序,该抗蚀剂图案在与所述电子部件元件中的多个侧面之中的任一个所述侧面相接的部分具有开口,在该开口露出所述金属片;在所述抗蚀剂图案中的所述开口内通过镀覆形成金属膜,形成与所述电子部件元件的所述侧面接触的贯通电极的工序;将所述抗蚀剂图案剥离的工序;将树脂材料赋予到所述金属片上以使得将所述电子部件元件以及所述贯通电极密封的工序;使所述树脂材料固化,形成树脂构造体的工序;和除去所述金属片的工序。
在本发明涉及的电子部件的制造方法的某一特定的方式中,还具备在赋予了所述树脂材料之后进行压制的工序。
在本发明涉及的电子部件的制造方法的另一特定的方式中,在除去了所述金属片之后,使所述树脂构造体变薄,使所述贯通电极在所述树脂构造体的相互对置的第1面和第2面露出。
在本发明涉及的电子部件的制造方法的又一其他特定的方式中,还具备在所述树脂构造体的所述第1面或所述第2面设置布线以使得与所述贯通电极电连接的工序。
发明效果
根据本发明涉及的电子部件以及电子部件的制造方法,由于不易产生内置于树脂构造体的电子部件元件的位置偏离,因此能够有效地提高该电子部件元件的位置精度。
附图说明
图1的(a)以及图1的(b)是用于说明本发明的第1实施方式涉及的电子部件的制造方法的主视剖视图,图1的(c)是将电子部件元件放大示出的主视剖视图。
图2的(a)以及图2的(b)是用于说明本发明的第1实施方式涉及的电子部件的制造方法的主视剖视图。
图3的(a)以及图3的(b)是用于说明本发明的第1实施方式涉及的电子部件的制造方法的主视剖视图。
图4的(a)以及图4的(b)是用于说明本发明的第1实施方式涉及的电子部件的制造方法的主视剖视图。
图5是用于说明第1实施方式涉及的电子部件的制造方法的主视剖视图。
图6是用于说明在本发明的第1实施方式中获得的电子部件的主视剖视图。
图7的(a)以及图7的(b)是用于说明本发明的第2实施方式涉及的电子部件的制造方法的主视剖视图。
图8的(a)以及图8的(b)是用于说明本发明的第2实施方式涉及的电子部件的制造方法的主视剖视图。
图9的(a)以及图9的(b)是用于说明本发明的第2实施方式涉及的电子部件的制造方法的主视剖视图。
图10是用于说明本发明的变形例涉及的电子部件的部分切除放大主视剖视图。
图11是用于说明本发明的其他变形例涉及的电子部件的示意性俯视剖视图。
图12是本发明的第3实施方式涉及的电子部件的主视剖视图。
图13是本发明的第4实施方式涉及的电子部件的主视剖视图。
图14是本发明的第5实施方式涉及的电子部件的主视剖视图。
具体实施方式
以下,通过参照附图对本发明的具体的实施方式进行说明,从而明确本发明。
另外,预先指出的是,本说明书记载的各实施方式是例示性的,在不同的实施方式间能够进行结构的部分置换或组合。
(第1实施方式的电子部件的制造方法以及电子部件)
参照图1的(a)~图1的(c)~图6,对第1实施方式的电子部件的制造方法以及第1实施方式涉及的电子部件进行说明。
首先,准备图1的(a)所示的层叠体4。在层叠体4中,在由陶瓷、金属等构成的支承板1上,粘合了粘接材料2。粘接材料2是双面粘着型的粘接剂。在该粘接材料2上,粘附了金属片3。
金属片3由金属箔、金属膜构成。金属片3比有机材料硬。作为金属片3的材料,能够使用Cu、Al等适当的金属或者合金。
接着,如图1的(b)所示,使用临时固定用粘着剂5,将电子部件元件6临时固定到金属片3上。在本实施方式中,电子部件元件6是声表面波元件。图1的(c)是将上述电子部件元件6放大示出的主视剖视图。在电子部件元件6中,在作为电子部件元件主体的压电体6a的一个面设置有包含IDT电极6d的功能电极部。在该功能电极部设置有端子7a、7b。在电子部件元件6中,设置有树脂层6b以使得具有中空部A。端子7a、7b贯通了树脂层6b。
另外,上述电子部件元件6的压电体6a的与设置有IDT电极6d的一侧相反的面是电子部件元件6的一个主面6g,树脂层6b的外侧面是电子部件元件6的另一个主面6j。电子部件元件6具有矩形的平面形状。设置有多个侧面6e、6f、6h、6i,以使得将一个主面6g和另一个主面6j连结。另外,在图1的(c)中,仅图示了侧面6e、6f。
不过,作为电子部件元件6,声表面波元件的构造并不限定于图1的(c)所示的构造。
此外,电子部件元件6不限于弹性波元件,也可以是电容器、电感器等,如后述的变形例那样,也可以是半导体元件。
如图2的(a)所示,通过光致抗蚀剂的涂敷、曝光以及显影来设置抗蚀剂图案8。在抗蚀剂图案8中,设置有开口8a、8b。该开口8a、8b设置为与电子部件元件6的侧面6e、6f相接。此外,开口8a、8b在比电子部件元件6更靠上方处向内侧扩展。即,电子部件元件6的侧面6e、6f和一个主面6g所形成的角部以及一个主面6g的一部分在开口8a、8b露出。
接着,通过电解镀覆,使金属沉积在金属片3上。由此,图2的(b)所示的贯通电极9、10与金属片3设置为一体。贯通电极9、10通过在上述开口8a、8b内沉积金属而设置。因此,贯通电极9、10与电子部件元件6的侧面6e、6f相接。此外,贯通电极9、10设置为还到达一个主面6g的一部分。
上述贯通电极9、10能够由Cu、Ni等适当的金属或者合金形成。接着,通过溶剂除去抗蚀剂图案8。像这样,如图3的(a)所示,成为电子部件元件6被贯通电极9、10和金属片3夹着的状态。然后,将图3的(a)所示的构造配置到模具内,赋予树脂构造体用的树脂材料。作为树脂材料,优选使用热固化性树脂。将处于流动状态的树脂材料填充到模具内并进行压制,通过加热而固化。像这样,设置了图3的(b)所示的树脂构造体11。
在上述模具内,在填充树脂材料之际、填充树脂材料后进行压制之际、以及树脂材料的加热固化时,应力施加于电子部件元件6。因此,如前所述,在现有技术中,容易产生树脂构造体内的电子部件元件的位置偏离。
相对于此,在本实施方式中,由于电子部件元件6的侧面6e、6f与贯通电极9、10相接,因此上述应力所引起的电子部件元件6的位置偏离得到抑制。因此,能够有效地提高电子部件元件6在树脂构造体11内的位置精度。
特别是,在本实施方式中,贯通电极9与相互对置的侧面6e、6f的一个侧面6e相接,贯通电极10与另一个侧面6f相接。因此,电子部件元件6被贯通电极9和贯通电极10夹着,因此能够更加有效地抑制电子部件元件6的位置偏离。
而且,贯通电极9、10还到达电子部件元件6的一个主面6g的一部分,因此,由此也有效地抑制了电子部件元件6在树脂构造体11内的位置偏离。
不过,在本发明中,贯通电极也可以不到达电子部件元件6的一个主面6g。此外,优选设置多个贯通电极,但也可以设置为仅一个贯通电极与电子部件元件6的侧面接触。
此外,在本实施方式中,贯通电极9、10设置为与相互对置的侧面6e、6f分别接触,但也可以将贯通电极设置为与相互对置的侧面以外的不同的多个侧面接触。例如,如图11中示意性俯视剖视图所示,也可以设置与电子部件元件6的侧面6e相接的贯通电极9、和与将侧面6e、6f连结的侧面6h、6i接触的贯通电极10A、10B。
另外,在图11中,贯通电极10A、10B的横截面设为矩形的形状,但也可以使用横截面为圆形的贯通电极。
接着,将支承板1剥离。如图4的(a)所示,获得在树脂构造体11的单面侧残留了金属片3以及粘接材料2的构造。
接着,通过蚀刻等除去金属片3以及粘接材料2。
另外,在图4的(a)中,获得了在树脂构造体11的单面侧残留了金属片3以及粘接材料2的构造,但也可以在将支承板1剥离时,同时将支承板1和粘接材料2剥离。在该情况下,在图4的(a)的构造中,将不包含粘接材料2。
进而,对上述树脂构造体11的下表面以及上表面进行研磨。由此,如图4的(b)所示,电子部件元件6在树脂构造体11的第1面11a露出。而且,端子7a、7b也在第1面11a侧露出。另一方面,贯通电极9、10成为贯通了树脂构造体11以使得将树脂构造体11的第1面11a和第2面11b连结的状态。
接着,如图5所示,使树脂构造体11翻转。在该状态下,在第1面11a上设置布线12、13。布线12、13从树脂构造体11的第1面11a上到达电子部件元件6的树脂层6b的外侧面上。布线12与端子7a电连接。此外,布线12与贯通电极9电连接。布线13与端子7b连接。此外,布线13与贯通电极10电连接。
接着,如图6所示,在布线12、13上安装其他电子部件元件15。其他电子部件元件15具有电子部件元件主体15a、设置在电子部件元件主体15a的下表面的电极连接盘15b、15c、和金属凸块15d、15e。该金属凸块15d、15e与布线12、13接合。
电子部件元件15的构造没有特别限定,不仅能够用于声表面波元件,还能够用于利用声边界波等弹性波的弹性波元件等。此外,也可以是电容器、电感器等。进而,电子部件元件15也可以是半导体元件。
如上述那样,能够获得图6所示的第1实施方式的电子部件16。在第1实施方式的电子部件16中,如上所述,有效地提高了电子部件元件6在树脂构造体11内的位置精度。
(第2实施方式的电子部件的制造方法以及电子部件)
参照图7的(a)以及图7的(b)~图9的(a)以及图9的(b),对第2实施方式涉及的电子部件的制造方法进行说明。
首先,获得第1实施方式的图1的(b)所示的构造。到此为止,第2实施方式与第1实施方式的制造方法相同。
接着,在图1的(b)所示的构造中,在金属片3上设置图7的(a)所示的抗蚀剂图案21。抗蚀剂图案21通过涂敷光致抗蚀剂并进行曝光以及显影而获得。在该抗蚀剂图案21中,在之后设置贯通电极的部分设置有开口21a、21b。此外,在该抗蚀剂图案21中,在电子部件元件6的上表面未残留抗蚀剂。
另外,在进行了俯视的情况下,开口21a、21b是圆形的开口部。在抗蚀剂图案21中,抗蚀剂材料除了设置有开口21a、21b的部分以外与电子部件元件6的4个侧面接触。
接着,通过电解镀覆,使金属沉积到开口21a、21b内。即,利用金属片3,通过电解镀覆,使金属沉积到开口21a、21b内。
像这样,如图7的(b)所示,设置了贯通电极22、23。开口21a、21b的上端未到达侧面6e、6f的上端。因此,贯通电极22、23未接触侧面6e、6f的长度方向的整个区域。即,贯通电极22、23在从侧面6e、6f的中间高度位置起到侧面6e、6f的下端的区域中与电子部件元件6接触。像这样,在本发明中,贯通电极无需与电子部件元件的侧面的高度方向的整个区域接触。
在本实施方式中,贯通电极22、23也分别与电子部件元件6的侧面6e、6f接触。
此外,金属片3经由临时固定用粘着剂5而与电子部件元件6的下表面接触。
接着,使用溶剂除去抗蚀剂图案21。像这样,获得图8的(a)所示的构造。与第1实施方式的情况同样地,将该构造配置在模具内,并填充由热固化性树脂构成的树脂材料。然后,进行压制,并通过加热使其固化。像这样,获得图8的(b)所示的树脂构造体24。
在上述树脂材料的赋予、压制以及利用热进行固化之际,应力施加于电子部件元件6,但在本实施方式中,由于贯通电极22、23也与电子部件元件6接触,因此不易产生电子部件元件6的位置偏离。
接着,对树脂构造体24进行研磨,使贯通电极22、23露出,并且使作为电子部件元件主体的压电体6a的厚度变薄。像这样,如图9的(a)所示,树脂构造体24的厚度变薄,并且压电体6a的厚度也变薄。
以下,与第1实施方式同样地,除去支承板1、粘接材料2、金属片3、临时固定用粘着剂5。像这样,能够获得图9的(b)所示的电子部件25。在第2实施方式涉及的电子部件25中,有效地提高了树脂构造体24内的电子部件元件6的位置精度。
(变形例)
图10是用于说明本发明涉及的电子部件的变形例的部分切除放大主视剖视图。
在该变形例涉及的电子部件31中,在树脂构造体11内埋设有具有Si半导体芯片32a的电子部件元件32。在Si半导体芯片32a上,设置有构成了FET的栅极电极33等功能电极。栅极电极33通过布线34而与贯通电极35连接。贯通电极35贯通了树脂构造体11以使得将树脂构造体11的第1面11a和第2面11b连结。
在本实施方式中,电子部件31具有扩散防止膜32b。扩散防止膜32b设置为从电子部件元件32的侧面到达上表面以及下表面。该扩散防止膜32b设置为位于贯通电极35与Si半导体芯片32a之间。扩散防止膜32b为了防止构成了贯通电极35的金属向Si半导体芯片32a侧的扩散而设置。因此,扩散防止膜32b由相对于Si的扩散系数比构成了贯通电极35的金属小的材料构成。只要为这样的材料,则扩散防止膜32b可以为绝缘性材料,也可以为导电性材料。
像本实施方式这样,电子部件元件32也可以在侧面具有扩散防止膜32b。在该情况下,贯通电极35与Si半导体芯片32a的侧面不直接接触,而是经由扩散防止膜32b接触。即使在该情况下,由于贯通电极35的存在,也不易产生设置树脂构造体11之际的应力所引起的电子部件元件32的位置偏离。
另外,上述电子部件元件32具有Si半导体芯片32a,但也可以使用GaAs半导体芯片那样的其他半导体芯片。进而,电子部件元件32也可以不是半导体芯片而是压电元件。
(第3~第5实施方式)
图12是本发明的第3实施方式涉及的电子部件的主视剖视图。
在电子部件41中,在树脂构造体11的第2面11b上设置有端子电极42a~42c。在端子电极42a~42c上分别设置有金属凸块43a~43c。端子电极42a、42c分别与贯通电极9、10连接。端子电极42b在未图示的部分,与电子部件元件6或电子部件元件15电连接。
关于其他构造,电子部件41与电子部件16相同。因此,在电子部件41中,也不易产生树脂构造体11中的电子部件元件6的位置偏离。
在电子部件41中,能够使用金属凸块43a~43c容易地安装到印刷电路基板等。
图13是本发明的第4实施方式涉及的电子部件的主视剖视图。
在电子部件51中,在树脂构造体11的第1面11a设置有布线12、13。除了该布线12、13之外,还设置有布线52。布线52在未图示的部分与电子部件元件6电连接。电子部件元件6的端子7a、7b也在未图示的部分与布线52、布线12或布线13电连接。
在第1面11a上,层叠有多个绝缘层53a~53d。
在第2面11b上,也与电子部件41同样地设置有端子电极42a~42c。而且,在第2面11b上,也层叠有绝缘层54a~54d。另外,在端子电极42a、42c层叠有布线55a、55b。在该布线55a、55b上分别接合有金属凸块43a、43c。
电子部件51的其他构造与电子部件41相同。
像这样,在第1面11a上以及第2面11b上,也可以与布线12、13、端子电极42a、42b、42c或布线55a、55b等一起,设置多个绝缘层53a~53d、多个绝缘层54a~54d。
图14是本发明的第5实施方式涉及的电子部件的主视剖视图。
在电子部件61中,在电子部件51中的树脂构造体11的下方进一步层叠有另一个电子部件62。关于电子部件62的构造,与在电子部件51中位于电子部件元件15的下方的电子部件同样。因此,通过对同一部分标注同一参照编号从而省略其说明。
这样,在具有树脂构造体11的电子部件中,也可以在第1面11a以及第2面11b的至少一方进一步层叠按照本发明而构成的电子部件。
符号说明
1…支承板;
2…粘接材料;
3…金属片;
4…层叠体;
5…临时固定用粘着剂;
6…电子部件元件;
6a…压电体;
6b…树脂层;
6d…IDT电极;
6e、6f…侧面;
6g…一个主面;
6h、6i…侧面;
6j…另一个主面;
7a、7b…端子;
8…抗蚀剂图案;
8a、8b…开口;
9、10、10A、10B…贯通电极;
11…树脂构造体;
11a…第1面;
11b…第2面;
12、13…布线;
15…电子部件元件;
15a…电子部件元件主体;
15b、15c…电极连接盘;
15d、15e…金属凸块;
16…电子部件;
21…抗蚀剂图案;
21a、21b…开口;
22、23…贯通电极;
24…树脂构造体;
25…电子部件;
31…电子部件;
32…电子部件元件;
32a…Si半导体芯片;
32b…扩散防止膜;
33…栅极电极;
34…布线;
35…贯通电极;
41、51、61、62…电子部件;
42a~42c…端子电极;
43a~43c…金属凸块;
52、55a、55b…布线;
53a~53d…绝缘层;
54a~54d…绝缘层。
Claims (13)
1.一种电子部件,具备:
树脂构造体,具有相互对置的第1面和第2面;
电子部件元件,内置于所述树脂构造体,具有一个主面、对置的另一个主面、和将所述一个主面与所述另一个主面连结的多个侧面,并在所述树脂构造体中的所述第1面露出;和
贯通电极,贯通了树脂构造体以使得将所述树脂构造体中的所述第1面和所述第2面连结,
所述贯通电极与所述电子部件元件中的所述多个侧面之中至少一个所述侧面接触。
2.根据权利要求1所述的电子部件,其中,
设置有多个所述贯通电极,
多个所述贯通电极与所述电子部件元件中的所述多个侧面之中的任一个所述侧面接触。
3.根据权利要求2所述的电子部件,其中,
多个所述贯通电极之中至少一个贯通电极和其余的至少一个贯通电极与所述电子部件元件中的不同的所述侧面接触。
4.根据权利要求3所述的电子部件,其中,
在所述电子部件元件中,所述多个侧面具有相互对置的一对所述侧面,
所述至少一个贯通电极与一对所述侧面之中的一个所述侧面接触,
所述其余的至少一个贯通电极与一对所述侧面之中的另一个所述侧面接触。
5.根据权利要求1~4中任一项所述的电子部件,其中,
还具备:布线,设置在所述树脂构造体中的所述第1面或所述第2面,与所述贯通电极电连接。
6.根据权利要求1~5中任一项所述的电子部件,其中,
还具有设置在所述电子部件元件的至少所述多个侧面的扩散防止膜,所述贯通电极与所述扩散防止膜接触。
7.根据权利要求6所述的电子部件,其中,
所述电子部件元件是Si半导体芯片,
所述贯通电极与所述Si半导体芯片中的多个侧面之中的任一个侧面上的所述扩散防止膜接触。
8.根据权利要求1~6中任一项所述的电子部件,其中,
还具备:其他电子部件元件,安装在所述树脂构造体的所述第1面或所述第2面。
9.根据权利要求1~8中任一项所述的电子部件,其中,
在所述树脂构造体的所述第1面或第2面安装有其他电子部件。
10.一种电子部件的制造方法,具备:
使用粘着剂在金属片上临时固定电子部件元件的工序;
形成抗蚀剂图案的工序,该抗蚀剂图案在与所述电子部件元件中的多个侧面之中的任一个所述侧面相接的部分具有开口,在该开口露出所述金属片;
在所述抗蚀剂图案中的所述开口内通过镀覆形成金属膜,形成与所述电子部件元件的所述侧面接触的贯通电极的工序;
将所述抗蚀剂图案剥离的工序;
将树脂材料赋予到所述金属片上以使得将所述电子部件元件以及所述贯通电极密封的工序;
使所述树脂材料固化,形成树脂构造体的工序;和
除去所述金属片的工序。
11.根据权利要求10所述的电子部件的制造方法,其中,
还具备在赋予了所述树脂材料之后进行压制的工序。
12.根据权利要求10或11所述的电子部件的制造方法,其中,
在除去了所述金属片之后,使所述树脂构造体变薄,使所述贯通电极在所述树脂构造体的相互对置的第1面和第2面露出。
13.根据权利要求12所述的电子部件的制造方法,其中,
还具备在所述树脂构造体的所述第1面或所述第2面设置布线以使得与所述贯通电极电连接的工序。
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