CN110024113A - 集成电路封装结构及方法 - Google Patents

集成电路封装结构及方法 Download PDF

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Publication number
CN110024113A
CN110024113A CN201680090828.8A CN201680090828A CN110024113A CN 110024113 A CN110024113 A CN 110024113A CN 201680090828 A CN201680090828 A CN 201680090828A CN 110024113 A CN110024113 A CN 110024113A
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China
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chip
pin
substrate
fine
additional
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CN110024113B (zh
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胡川
刘俊军
郭跃进
爱德华·鲁道夫·普莱克
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Shenzhen Xiuyuan Electronic Technology Co ltd
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Shenzhen Xiuyuan Electronic Technology Co ltd
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Abstract

一种集成电路封装结构及方法，其中集成电路封装结构包括：基板(100)，所述基板(100)设有电路层(110)以及精细连线(210)；芯片(400)，所述芯片(400)设有精细引脚(420)、以及芯片引脚(410)；所述基板(100)设有至少两个所述芯片(400)，至少一个所述芯片(400)的所述芯片引脚(410)与所述电路层(110)电连接，所述电路层(110)上设有绝缘补丁(200)，所述绝缘补丁(200)上设有精细连线(210)，所述芯片(400)的精细引脚(420)与所述精细连线(210)电连接、至少两个所述芯片(400)通过所述精细连线(210)直接电连接。传输速度快、提高芯片性能。

Description

PCT国内申请，说明书已公开。

Claims (18)

  1. PCT国内申请，权利要求书已公开。
CN201680090828.8A 2016-11-30 2016-11-30 集成电路封装结构及方法 Active CN110024113B (zh)

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