CN110012650A - Bendable phase-change heat plate and radiator - Google Patents
Bendable phase-change heat plate and radiator Download PDFInfo
- Publication number
- CN110012650A CN110012650A CN201910408796.7A CN201910408796A CN110012650A CN 110012650 A CN110012650 A CN 110012650A CN 201910408796 A CN201910408796 A CN 201910408796A CN 110012650 A CN110012650 A CN 110012650A
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- heat sink
- plate
- connecting portion
- bending part
- sink ontology
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- 238000005452 bending Methods 0.000 claims abstract description 68
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 230000003447 ipsilateral effect Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000009466 transformation Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention belongs to heat sink technology fields, more particularly to a kind of bendable phase-change heat plate and radiator, phase-change heat plate, including heat sink ontology, the side bending of the heat sink ontology forms bending part, it is provided with first connecting portion on the bending part, second connecting portion is provided on the heat sink ontology or bending part, the first connecting portion and second connecting portion match in shape；Radiator, including pedestal and above-mentioned phase-change heat plate, at least one piece of heat sink ontology is connected on pedestal, is provided with side plate on the pedestal, the side plate is located at the side of at least one piece heat sink ontology, and the side plate is connect with the bending part of adjacent heat sink ontology.The utility model has the advantages that radiator of the invention, the first connecting portion and second connecting portion of adjacent heat radiation plate ontology are successively engaged by clamping, convenient for assembly, and the bending part of multiple heat sink ontologies collectively forms the cover board of radiator, therefore radiator of the invention is not required to separately set cover board.
Description
Technical field
The invention belongs to heat sink technology field more particularly to a kind of bendable phase-change heat plates and radiator.
Background technique
Radiator is made of profile, cover board in the prior art, and the profile is the pedestal with multiple fins, each fin
Top be equipped with several positioning convex points, on fin, cover board is set cover plate lid in the position matched with fin top positioning convex point
There is through-hole.
With the fast development of electron electric power equipment, device performance and heat dissipation capacity constantly increase, and bring heat flow density point
The problem that cloth is uneven, local heat flux density is very big, heat is gathered in regional area, local temperature is excessively high.In order to solve this
A kind of problem, radiator using phase transformation temperature-uniforming plate (heat sink), replaces fin with phase transformation temperature-uniforming plate, to improve dissipating for radiator
Thermal energy power.
Phase transformation temperature-uniforming plate is the plank frame for having hollow cavity, by shell, the capillary structure of enclosure interior and phase
Matter of exchanging work composition, cavity is interior to be filled phase-change working substance and is in negative pressure state.When phase transformation temperature-uniforming plate works, plate absorbs heat, makes to steam
The liquid refrigerant of hair section expands rapidly vaporization, after moving to condensation segment cooling liquid, flows back into evaporator section under capillary action.
Existing radiator includes pedestal, phase transformation temperature-uniforming plate and cover board, the connection side of existing phase transformation temperature-uniforming plate bottom and pedestal
Formula is that inserted tooth connects, and at the top of phase transformation temperature-uniforming plate and the connection type of cover board is the cooperation of salient point and through-hole.Due to phase transformation temperature-uniforming plate
The limitation of flatness and rigidity during processing carries out in inserted tooth assembling process in phase transformation temperature-uniforming plate and pedestal, and phase transformation is equal
Micro-strain can occur for warm plate, and the deformation of every phase transformation temperature-uniforming plate is not consistent.The top of multi-disc phase transformation temperature-uniforming plate exists big
Positioning convex point is measured, is difficult to accurately match with the through-hole on cover board, is assembled extremely difficult.
Summary of the invention
Lead to positioning convex point positional shift to solve phase transformation temperature-uniforming plate process and assemble deformation of the existing technology, it is difficult to
The problem of cover board assembles, the present invention provide a kind of bendable phase-change heat plate and radiator.
In order to solve the above technical problems, the technical solution adopted in the present invention is as follows, and a kind of bendable phase-change heat plate, packet
Heat sink ontology is included, the side bending of the heat sink ontology forms bending part, is provided with first connecting portion on the bending part,
It is provided with second connecting portion on the heat sink ontology or bending part, the first connecting portion and second connecting portion phase in shape
Match.
Preferably, the first connecting portion and second connecting portion can be clamped in shape.Clamping connects jail convenient for assembly
It leans on.
Preferably, the first connecting portion includes the first connecting plate, the first card slot is offered on first connecting plate,
The second connecting portion includes the first buckle, and first buckle can be clamped in shape with the first card slot；It is opened on the bending part
Equipped with the holding tank that can accommodate first connecting portion in shape, the second connecting portion is located in holding tank.If needing two heat sinks
Ontology assembly, motherboard of the first connecting portion of a heat sink ontology as clamping, the second connection of another heat sink ontology
Public plate of the portion as clamping, convenient for assembly；The bending part of at least two pieces heat sink ontologies is sequentially connected when collectively forming cover board, is held
Slot of receiving makes cover board smooth.
Preferably, the first connecting portion includes the second connecting plate, the second connecting plate bending forms the second buckle,
The second connecting portion includes the second card slot, and second buckle can be clamped in shape with the second card slot.If needing two heat sinks
Ontology assembly, public plate of the first connecting portion of a heat sink ontology as clamping, the second connection of another heat sink ontology
Motherboard of the portion as clamping, manufacture and assembly easy to process.
Further, the side of the heat sink ontology is bent with flange, and the flange and bending part are in heat sink sheet
Body it is not ipsilateral.
Further, the bending part is spaced apart on the heat sink ontology, and the interval of the bending part forms scattered
The passage of heat；Or through there is several thermal vias on the bending part.Bending part is spaced apart on the heat sink ontology, just
In the Bending Processing of bending part, while improving local heat dissipation effect；Several thermal vias are evenly distributed on bending part, and heat dissipation is equal
Even, heat dissipation effect is more preferable.
A kind of radiator, the phase-change heat plate including pedestal and any of the above-described kind, at least one piece of heat sink ontology connect
It connects on pedestal, side plate is provided on the pedestal, the side plate is located at the side of at least one piece heat sink ontology, described
Side plate is connect with the bending part of adjacent heat sink ontology.
Preferably, the quantity of the heat sink ontology is at least two pieces, at least two pieces of heat sink ontologies are along its folding
Curved direction is set gradually, and the bending part of the adjacent heat sink ontology connects and composes top plate.At least two pieces of heat sink ontologies
Bending part, which is sequentially connected, collectively forms cover board, which is not required to separately set cover board；It and is single radiate originally when heat radiator body assembly
Body successively assembles, and assembly is easy, and heat sink ontology occurs deforming and is also convenient for finely tuning in assembling process, and existing cover board is multiple logical
Hole is difficult to accurately match simultaneously with a large amount of positioning convex points at the top of multi-disc phase transformation temperature-uniforming plate, assembles extremely difficult.
Preferably, the side plate is identical as the structure of heat sink ontology；
Alternatively, first connecting portion is provided on the bending part of the heat sink ontology adjacent with the side plate, described
One interconnecting piece includes the first connecting plate, offers the first card slot on first connecting plate, is provided on the side plate and first
The first buckle that card slot is engaged by clamping；
Alternatively, first connecting portion is provided on the bending part of the heat sink ontology adjacent with the side plate, described
One interconnecting piece includes the second connecting plate, and the second connecting plate bending forms the second buckle, offers and second on the side plate
Buckle the second card slot being engaged by clamping.
Further, the side of the heat sink ontology is bent with flange, and fluted, the heat dissipation is opened up on the pedestal
Plate ontology is connect by the side with flange with groove inserted tooth, and the top plate is oppositely arranged up and down with pedestal.Flange and heat dissipation
Plate ontology is adjacent to, for cooperating with groove inserted tooth, easy to process and assembly.
The utility model has the advantages that when bendable phase-change heat plate of the invention and radiator, heat sink ontology and pedestal inserted tooth assemble,
There is heat sink ontology the side of flange to be embedded in groove, and the first connecting portion and second connecting portion of adjacent heat radiation plate ontology are clamped,
Because the first connecting portion and second connecting portion of adjacent heat radiation plate are successively engaged by clamping, convenient for assembling, and multiple heat sink ontologies
Bending part collectively forms the cover board of radiator, therefore radiator of the invention is not required to separately set cover board, solves prior art presence
Cover board on multiple through-holes and multi-disc phase transformation temperature-uniforming plate at the top of a large amount of positioning convex points be difficult to the problem of assembling；Folding of the invention
Curved formula phase-change heat plate and radiator, adjacent heat radiation ontology are supported each other by way of clamping, so that the knot of radiator
Structure is more reliable and more stable.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the phase-change heat plate of the embodiment of the present invention 1；
Fig. 2 is the schematic perspective view of two phase-change heat plates cooperation of the embodiment of the present invention 1；
Fig. 3 is the schematic perspective view of the radiator of the embodiment of the present invention 1；
Fig. 4 is the schematic cross-sectional view of the radiator of the embodiment of the present invention 1；
Fig. 5 is another angle schematic perspective view of the radiator of the embodiment of the present invention 1；
Fig. 6 is the partial enlargement diagram of A in Fig. 5；
Fig. 7 is the schematic perspective view of the phase-change heat plate of the embodiment of the present invention 2；
Fig. 8 is the schematic perspective view of two phase-change heat plates cooperation of the embodiment of the present invention 2；
Fig. 9 is the schematic perspective view of the radiator of the embodiment of the present invention 2；
Figure 10 is the schematic cross-sectional view of the radiator of the embodiment of the present invention 2；
Figure 11 is another angle schematic perspective view of the radiator of the embodiment of the present invention 2；
Figure 12 is the partial enlargement diagram of B in Figure 11；
Figure 13 is the schematic perspective view of the radiator of the embodiment of the present invention 3；
Figure 14 is the schematic perspective view of the radiator of the embodiment of the present invention 4；
In figure: 1, heat sink ontology, 11, bending part, 12, first connecting portion, the 121, first connecting plate, the 122, first card
Slot, the 123, second connecting plate, the 124, second buckle, 13, second connecting portion, the 131, first buckle, the 132, second card slot, 14, appearance
Receive slot, 151, heat dissipation channel, 152 thermal vias, 16, top plate, 17, flange, 2, pedestal, 21, groove, 3, side plate.
Specific embodiment
Embodiment 1
As depicted in figs. 1 and 2, a kind of bendable phase-change heat plate, including heat sink ontology 1, the heat sink ontology 1
Side bending forms bending part 11, and the bending part 11 and heat sink ontology 1 are perpendicular, are provided with first on the bending part 11
Interconnecting piece 12 is provided with second connecting portion 13, the first connecting portion 12 and second on the heat sink ontology 1 or bending part 11
Interconnecting piece 13 matches in shape.It is installed for the ease of the inserted tooth of the heat sink, the side of the heat sink ontology 1, which is bent with, to be turned over
Side 17, the flange 17 and bending part 11 are located at the not ipsilateral of heat sink ontology 1, and in the present embodiment, bending part 11 is located at heat dissipation
The upside of plate ontology 1, flange 17 are located at the downside of heat sink ontology 1.
For the ease of assembling between two heat sink ontologies 11, the first connecting portion 12 and second connecting portion 13 are in shape
It can clamping.The present embodiment, the first connecting portion 12 include the first connecting plate 121, and the is offered on first connecting plate 121
One card slot 122, the second connecting portion 13 include the first buckle 131, and first buckle 131 and the first card slot 122 are in shape
It can clamping.The holding tank 14 that can accommodate first connecting portion 12, the second connecting portion are offered in shape on the bending part 11
13 are located in holding tank 14.
As illustrated in figures 3-6, a kind of radiator, including pedestal 2 and above-mentioned phase-change heat plate, at least one piece of heat dissipation
Plate ontology 1 is connected on pedestal 2, and the heat sink ontology 1 is vertically arranged with pedestal 2, the present embodiment, the heat sink ontology 1
Quantity be four pieces, four pieces of heat sink ontologies 1 are set gradually along its bending direction, one of the adjacent heat radiator body 1
First buckle 131 of heat radiator body is caught in the first card slot 122 of another heat radiator body 1, and the first of the heat radiator body 1 connects
Socket part 12 is located in the holding tank 14 of another heat radiator body 1, and the bending part 11 of the adjacent heat sink ontology 1 connects and composes top
Plate 16, the bending part 11 of four pieces of heat sink ontologies 1 collectively form cover board, the first connecting portion of a heat radiator body 1 12
In in the holding tank 14 of another heat radiator body 1 guarantee cover board it is smooth；
It is assembled for the ease of heat sink and pedestal 2, opens up fluted 21 on the pedestal 2, the heat sink ontology 1 passes through
Side with flange 17 is connect with 21 inserted tooth of groove, and the top plate 16 is oppositely arranged with about 2 pedestal；
In order to improve the radiator stability and beauty, side plate 3 is provided on the pedestal, the side plate 3 passes through bolt
It is connect with pedestal 2, the side plate 3 is located at the side of four pieces of heat sink ontologies 1, the side plate 3 and adjacent heat sink sheet
The bending part 11 of body 1 connects.Specifically, is provided on the bending part 11 of the heat sink ontology 1 adjacent with the side plate 3
One interconnecting piece 12, the first connecting portion 12 include the first connecting plate 121, offer the first card on first connecting plate 121
Slot 122 is provided with the first buckle 131 being engaged by clamping with the first card slot 122 on the side plate 3.
Assembling process is as follows:
First rim plate 3, side plate 3 is fixed by bolts on pedestal 2, then successively assembles each heat dissipation from side plate 3 according to sequence
Plate ontology 1, in assembling process the direction of bending part 11 towards side plate 3, heat sink ontology 1 by side with flange 17 with
The connection of 21 inserted tooth of groove, 131 clamping of the first buckle of the first card slot 122 and side plate 3 of first heat sink ontology 1, second
131 clamping of the first buckle of first card slot 122 of heat sink ontology 1 and first heat sink ontology 1, until n-th of heat sink
131 clamping of the first buckle of the first card slot 122 and (n-1) a heat sink ontology 1 of ontology 1, completes the assembly of the radiator,
The bending part 11 of n heat sink ontology 1 collectively forms cover board, therefore the radiator of the present embodiment is not required to separately set cover board.
Embodiment 2
As shown in Figure 7 and Figure 8, in the present embodiment, phase-change heat plate the difference from embodiment 1 is that, it is described first connect
Socket part 12 includes the second connecting plate 123, and 123 bending of the second connecting plate forms the second buckle 124, the second connecting portion 13
Including the second card slot 132, second buckle 124 can be clamped in shape with the second card slot 132.
As shown in figs. 9 to 12, in the present embodiment, radiator the difference from embodiment 1 is that, opened up on the side plate 3
There is the second card slot 132 being engaged by clamping with the second buckle 124.For the ease of the installation of side plate 3, the side plate 3 passes through inserted tooth and bottom
Seat 2 connects.
Embodiment 3
As shown in figure 13, in the present embodiment, phase-change heat plate the difference from example 2 is that, in order to improve the phase transformation
The heat dissipation effect of heat sink, the bending part 11 are spaced apart on the heat sink ontology 1, the interval shape of the bending part 11
At heat dissipation channel 151.Bending part 11 is spaced apart on the heat sink ontology 1, convenient for the Bending Processing of bending part 11, simultaneously
Heat dissipation channel 151 improves local heat dissipation effect.
Embodiment 4
As shown in figure 14, in the present embodiment, phase-change heat plate the difference from example 2 is that, in order to improve the phase transformation
The heat dissipation effect of heat sink, through there is several thermal vias 152 on the bending part 11, several thermal vias 152 are uniformly
It is distributed on bending part 11, uniformly, heat dissipation effect is more preferable for phase-change heat plate heat dissipation.
Claims (10)
1. a kind of bendable phase-change heat plate, it is characterised in that: including heat sink ontology (1), the one of the heat sink ontology (1)
Side bending forms bending part (11), is provided with first connecting portion (12) on the bending part (11), the heat sink ontology (1) or
It is provided on bending part (11) second connecting portion (13), the first connecting portion (12) and second connecting portion (13) phase in shape
Match.
2. bendable phase-change heat plate according to claim 1, it is characterised in that: the first connecting portion (12) and second
Interconnecting piece (13) can be clamped in shape.
3. bendable phase-change heat plate according to claim 2, it is characterised in that: the first connecting portion (12) includes the
One connecting plate (121) offers the first card slot (122) on first connecting plate (121), and the second connecting portion (13) includes
First buckle (131), first buckle (131) can be clamped in shape with the first card slot (122)；It is opened on the bending part (11)
Equipped with the holding tank (14) that can accommodate first connecting portion (12) in shape, the second connecting portion (13) is located at holding tank (14)
It is interior.
4. bendable phase-change heat plate according to claim 2, it is characterised in that: the first connecting portion (12) includes the
Two connecting plates (123), the second connecting plate (123) bending form the second buckle (124), and the second connecting portion (13) includes
Second card slot (132), second buckle (124) can be clamped in shape with the second card slot (132).
5. bendable phase-change heat plate according to any one of claims 1 to 4, it is characterised in that: the heat sink ontology
(1) side is bent with flange (17), and the flange (17) and bending part (11) are located at the not ipsilateral of heat sink ontology (1).
6. bendable phase-change heat plate according to any one of claims 1 to 4, it is characterised in that: the bending part (11)
It is spaced apart on the heat sink ontology (1), the interval of the bending part (11) forms heat dissipation channel (151)；Or it is described
Running through on bending part (11) has several thermal vias (152).
7. a kind of radiator, it is characterised in that: including pedestal (2) and the described in any item phase-change heat plates of claim 1~6,
At least one piece of heat sink ontology (1) is connected on pedestal (2), is provided on the pedestal side plate (3), the side plate (3)
Positioned at the side of at least one piece heat sink ontology (1), the bending part of the side plate (3) and adjacent heat sink ontology (1)
(11) it connects.
8. radiator according to claim 7, it is characterised in that: the quantity of the heat sink ontology (1) is at least two pieces,
At least two pieces of heat sink ontologies (1) set gradually along its bending direction, and the bending part of the adjacent heat sink ontology (1)
(11) top plate (16) are connected and composed.
9. radiator according to claim 7 or 8, it is characterised in that: the knot of the side plate (3) and heat sink ontology (1)
Structure is identical；
Alternatively, being provided with first connecting portion on the bending part (11) of the heat sink ontology (1) adjacent with the side plate (3)
(12), the first connecting portion (12) includes the first connecting plate (121), offers the first card on first connecting plate (121)
Slot (122) is provided with the first buckle (131) being engaged by clamping with the first card slot (122) on the side plate (3)；
Alternatively, being provided with first connecting portion on the bending part (11) of the heat sink ontology (1) adjacent with the side plate (3)
(12), the first connecting portion (12) includes the second connecting plate (123), and the second connecting plate (123) bending forms the second card
It detains (124), the second card slot (132) being engaged by clamping with the second buckle (124) is offered on the side plate (3).
10. radiator according to claim 7 or 8, it is characterised in that: the side of the heat sink ontology (1) is bent with
Flange (17) opens up fluted (21) on the pedestal (2), and the heat sink ontology (1) passes through the side with flange (17)
It is connect with groove (21) inserted tooth, the top plate (16) is oppositely arranged up and down with pedestal (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910408796.7A CN110012650A (en) | 2019-05-16 | 2019-05-16 | Bendable phase-change heat plate and radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910408796.7A CN110012650A (en) | 2019-05-16 | 2019-05-16 | Bendable phase-change heat plate and radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110012650A true CN110012650A (en) | 2019-07-12 |
Family
ID=67177182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910408796.7A Pending CN110012650A (en) | 2019-05-16 | 2019-05-16 | Bendable phase-change heat plate and radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110012650A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212550A (en) * | 2020-01-13 | 2020-05-29 | 深圳市飞荣达科技股份有限公司 | Heat dissipation device and communication product |
| CN112696965A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Adopt 3D heat dissipation module of samming plate structure |
| TWI808404B (en) * | 2020-07-01 | 2023-07-11 | 訊凱國際股份有限公司 | Heat exchanger fin and manufacturing method of the same |
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| JP2001110958A (en) * | 1999-10-13 | 2001-04-20 | Mizutani Denki Kogyo Kk | Heat sink for electronic component |
| CN2706864Y (en) * | 2004-03-26 | 2005-06-29 | 鸿富锦精密工业（深圳）有限公司 | Stacked fin type radiator |
| CN201336785Y (en) * | 2008-12-30 | 2009-10-28 | 索士亚科技股份有限公司 | Radiator |
| CN102006761A (en) * | 2009-08-28 | 2011-04-06 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN207741055U (en) * | 2018-01-31 | 2018-08-17 | 昆山科默精密机械有限公司 | A kind of turbulent flow radiator |
| CN109729700A (en) * | 2019-01-14 | 2019-05-07 | 常州常发制冷科技有限公司 | The processing method of phase transformation temperature-uniforming plate, radiator and the temperature-uniforming plate |
| CN210274942U (en) * | 2019-05-16 | 2020-04-07 | 常州恒创热管理有限公司 | Bending type phase change heat dissipation plate and radiator |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110958A (en) * | 1999-10-13 | 2001-04-20 | Mizutani Denki Kogyo Kk | Heat sink for electronic component |
| CN2706864Y (en) * | 2004-03-26 | 2005-06-29 | 鸿富锦精密工业（深圳）有限公司 | Stacked fin type radiator |
| CN201336785Y (en) * | 2008-12-30 | 2009-10-28 | 索士亚科技股份有限公司 | Radiator |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212550A (en) * | 2020-01-13 | 2020-05-29 | 深圳市飞荣达科技股份有限公司 | Heat dissipation device and communication product |
| CN111212550B (en) * | 2020-01-13 | 2021-07-20 | 深圳市飞荣达科技股份有限公司 | Heat dissipation device and communication product |
| TWI808404B (en) * | 2020-07-01 | 2023-07-11 | 訊凱國際股份有限公司 | Heat exchanger fin and manufacturing method of the same |
| CN112696965A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Adopt 3D heat dissipation module of samming plate structure |
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