CN111212550A - Heat dissipation device and communication product - Google Patents
Heat dissipation device and communication product Download PDFInfo
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- CN111212550A CN111212550A CN202010033104.8A CN202010033104A CN111212550A CN 111212550 A CN111212550 A CN 111212550A CN 202010033104 A CN202010033104 A CN 202010033104A CN 111212550 A CN111212550 A CN 111212550A
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- temperature
- plate
- temperature equalizing
- heat
- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation device and a communication product, wherein the heat dissipation device comprises a temperature equalizing unit, the temperature equalizing unit comprises a first temperature equalizing plate, a second temperature equalizing plate and a connecting plate for connecting the first temperature equalizing plate and the second temperature equalizing plate, pipelines are arranged on the first temperature equalizing plate and the second temperature equalizing plate respectively, a vacuum sealing cavity is arranged on the pipelines, a phase change working medium is filled in the vacuum sealing cavity, a first bending part is arranged at one end of the first temperature equalizing plate, which is far away from the connecting plate, and a second bending part is arranged at one end of the second temperature equalizing plate, which is far away from the connecting plate. Through setting the temperature-uniforming plate into a shape of Chinese character 'ji', very big increase the thermal contact area of the phase transition temperature-uniforming plate of great wall type and base, reduced the cogged boss of heat dissipation base, both reduced heat transfer contact thermal resistance, improved heat dispersion, alleviateed heat abstractor's weight, through the form of sharing the chamber pipeline, reduced heat abstractor's the difference in temperature, improve the holistic temperature uniformity of device.
Description
Technical Field
The invention relates to the technical field of heat dissipation devices, in particular to a heat dissipation device and a communication product.
Background
The heat pipe is a high-efficiency heat transfer element, and the heat transfer efficiency and the heat flux density are high. At present, the tubular micro heat pipe has been widely used in a device thermal management system, but the heat transfer area and the structure thereof are limited based on one-dimensional heat transfer. The phase change temperature equalizing plate enables the phase change process of the working liquid to be two-dimensional or even three-dimensional heat transfer, and the heat source can also be in direct contact with the heat pipe, so that the temperature of a discrete local heat source hot area can be controlled strongly. The phase-change temperature-equalizing plate is a plate structure with a hollow cavity and consists of a shell, a pipeline inside the shell and a phase-change working medium, and the phase-change working medium is filled in the cavity and is in a negative pressure state. When the phase-change temperature-equalizing plate works, the flat plate absorbs heat, so that the liquid working medium at the evaporation section is rapidly expanded and vaporized, moves to the condensation section for cooling and liquefaction, and then flows back to the evaporation section under the gravity of the heat pipe.
With the rapid development of miniaturization, integration and high efficiency of power electronic equipment and devices, the performance and heat dissipation capacity of the devices are continuously increased, and the problems of uneven heat flow density distribution, extremely high local heat flow density, heat accumulation in local areas and overhigh local temperature are brought. These issues present new challenges to the thermal design of power electronics devices, requiring thermal management systems to meet the requirements of high performance, high compactness, high reliability, and high flexibility.
The phase-change temperature-equalizing plate in the prior art is independent, and the temperature equalization between adjacent teeth is poor. The heat dissipation cover plate is heavy. The edge of the phase-change temperature-uniforming plate in the prior cog technology is embedded into a groove of a heat dissipation base in an interference fit manner through a cog process, and the process has the following defects: the tooth and the heat dissipation base have small heat contact area and large thermal contact resistance, which is not beneficial to heat dissipation. The cog process needs to be provided with a protrusion in the groove structure of the heat dissipation base, and is not beneficial to weight reduction. The interference fit process of the cog is difficult to control, the process of the cog is poor in manufacturability, the production efficiency is low, and the assembly precision cannot be effectively guaranteed.
Disclosure of Invention
In view of the above, the present invention is proposed to provide a heat sink and a communication product that overcome or at least partially solve the above problems.
In order to solve the problems, the invention discloses a heat dissipation device which comprises a temperature equalizing unit, wherein the temperature equalizing unit comprises a first temperature equalizing plate, a second temperature equalizing plate and a connecting plate for connecting the first temperature equalizing plate and the second temperature equalizing plate, pipelines are arranged on the first temperature equalizing plate and the second temperature equalizing plate respectively, a vacuum sealing cavity is arranged on each pipeline, a phase change working medium is filled in the vacuum sealing cavity, a first bending part is arranged at one end, far away from the connecting plate, of the first temperature equalizing plate, and a second bending part is arranged at one end, far away from the connecting plate, of the second temperature equalizing plate.
Further, the connecting plate is provided with at least one through hole.
Furthermore, a common-cavity channel communicated with the first temperature-uniforming plate and the second temperature-uniforming plate is arranged on the connecting plate.
Further, the first bending part and the second bending part are in the same plane.
Further, the first bending part and the second bending part are parallel to the connecting plate.
Further, the first temperature equalizing plate and the second temperature equalizing plate are both perpendicular to the connecting plate.
Further, the portable electronic device comprises a base, and the first bending part and the second bending part are connected with the base.
Further, the temperature-equalizing device comprises at least two temperature-equalizing units.
Further, the temperature equalizing unit is integrally formed or connected through a connecting piece.
The invention discloses a communication product comprising the heat dissipation device.
The invention has the following advantages: through setting the temperature-uniforming plate into a shape of Chinese character 'ji', very big increase the thermal contact area of the phase transition temperature-uniforming plate of great wall type and base, reduced the cogged boss of heat dissipation base, both reduced heat transfer contact thermal resistance, improved heat dispersion, alleviateed heat abstractor's weight, through the form of sharing the chamber pipeline, reduced heat abstractor's the difference in temperature, improve the holistic temperature uniformity of device.
Drawings
FIG. 1 is a block diagram of a heat dissipation device according to the present invention;
FIG. 2 is a side view of a heat dissipation device in accordance with an embodiment of the present invention;
FIG. 3 is a side view of a heat dissipation device in accordance with an embodiment of the present invention;
fig. 4 is a side view of a heat dissipation device in an embodiment of the invention.
1 first temperature equalizing plate, 2 second temperature equalizing plate, 3 connecting plates, 4 pipelines, 5 bases, 11 first bending parts, 12 second bending parts and 31 through holes
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
One of the core ideas of the invention is to provide a heat dissipation device, which comprises a temperature equalizing unit, wherein the temperature equalizing unit comprises a first temperature equalizing plate 1, a second temperature equalizing plate 2 and a connecting plate 3 for connecting the first temperature equalizing plate 1 and the second temperature equalizing plate 2, pipelines 4 are respectively arranged on the first temperature equalizing plate 1 and the second temperature equalizing plate 2, a vacuum sealed cavity is arranged on each pipeline 4, a phase change working medium is filled in the vacuum sealed cavity, a first bent part 11 is arranged at one end of the first temperature equalizing plate 1, which is far away from the connecting plate 3, and a second bent part 12 is arranged at one end of the second temperature equalizing plate 2, which is far away from the connecting plate 3. Through setting the temperature-uniforming plate to be the style of calligraphy of several, very big increase the thermal contact area of great wall type phase transition temperature-uniforming plate and base 5, reduced radiating base 5's cogged boss, both reduced heat transfer contact thermal resistance, improved heat dispersion, alleviateed heat abstractor's weight, through the form of sharing chamber pipeline 4, reduced heat abstractor's the difference in temperature, improved the holistic temperature uniformity of device.
Referring to fig. 1, the heat dissipation device of the present invention may specifically include a temperature equalizing unit, where the temperature equalizing unit includes a first temperature equalizing plate 1, a second temperature equalizing plate 2, and a connecting plate 3 connecting the first temperature equalizing plate 1 and the second temperature equalizing plate 2, the first temperature equalizing plate 1 and the second temperature equalizing plate 2 are both provided with a pipeline 4, the pipeline 4 is provided with a vacuum sealed cavity, a phase change working medium is filled in the vacuum sealed cavity, one end of the first temperature equalizing plate 1, which is far away from the connecting plate 3, is provided with a first bending portion 11, and one end of the second temperature equalizing plate 2, which is far away from the connecting plate 3, is provided with a second bending portion 12. The pipeline 4 is a high-efficiency heat transfer element, and the heat transfer efficiency and the heat flux density are high. At present, the tubular micro heat pipe has been widely used in a device thermal management system, but the heat transfer area and the structure thereof are limited based on one-dimensional heat transfer. The phase change temperature equalizing plate enables the phase change process of the working liquid to be two-dimensional or even three-dimensional heat transfer, and the heat source can also be in direct contact with the heat pipe, so that the temperature of a discrete local heat source hot area can be controlled strongly. The phase-change temperature-equalizing plate is a plate structure with a hollow cavity and consists of a shell, a pipeline inside the shell and a phase-change working medium, and the phase-change working medium is filled in the cavity and is in a negative pressure state. When the phase-change temperature-equalizing plate works, the flat plate absorbs heat, so that the liquid working medium at the evaporation section is rapidly expanded and vaporized, moves to the condensation section for cooling and liquefaction, and then flows back to the evaporation section under the gravity of the heat pipe. By adopting the n-shaped phase-change temperature-equalizing plate, the thermal contact area between the great-wall type phase-change temperature-equalizing plate and the base 5 is greatly increased, the cog bosses of the heat-radiating base 5 are reduced, the heat transfer contact thermal resistance is reduced, the heat radiating performance is improved, the weight of the heat radiating device is reduced, the temperature difference of the heat radiating device is reduced through the form of the common-cavity pipeline 4, and the integral temperature equalizing performance of the device is improved.
In the present embodiment, the connection plate 3 is provided with at least one through hole 31. Through set up through-hole 31 on connecting plate 3, set up radiating through-hole 31 as the addendum of great wall type phase transition temperature-uniforming plate, above-mentioned connecting plate 3 can replace the heat dissipation apron, and above-mentioned through-hole 31 again can the reduce cost, the weight reduction.
In this embodiment, the connecting plate 3 is provided with a common-cavity channel for communicating the first temperature-uniforming plate 1 and the second temperature-uniforming plate 2. The great wall type phase change temperature-uniforming plate is provided with a pipeline 4 of a sealed vacuum cavity, the form of the pipeline 4 can be set to be single-sided or double-sided according to specific requirements, and the plate-type forming of the temperature-uniforming plate is realized by adopting processes such as hot rolling inflation, welding inflation or stamping welding. The vacuum cavity in the great wall type phase change temperature-uniforming plate is filled with phase change working medium, a common cavity channel or a plurality of common cavity channels are arranged between adjacent vertical heat dissipation temperature-uniforming plates for uniform temperature heat dissipation, and the common cavity channels are respectively communicated with the pipelines 4 on the first temperature-uniforming plate 1 and the second temperature-uniforming plate 2 so as to reduce the temperature difference between the adjacent temperature-uniforming plates and improve the uniform temperature of the whole heat dissipation device.
In the present embodiment, the first bent portion 11 and the second bent portion 12 are in the same plane.
In the present embodiment, the first bent portion 11 and the second bent portion 12 are both parallel to the connection plate 3. The plate-type forming of the uniform temperature plate is realized by adopting the processes of hot rolling inflation, welding inflation or stamping welding and the like. The parallel refers to relative parallel relationship, and a certain deviation may exist in the actual processing process.
In the present embodiment, the first temperature-uniforming plate 1 and the second temperature-uniforming plate 2 are parallel to each other and perpendicular to the connection plate 3. The vertical refers to relative vertical relationship, and a certain deviation may exist in the actual processing process.
In the embodiment, the base 5 is included, and the first bending portion 11 and the second bending portion 12 are connected to the base 5. The heat dissipation device in the embodiment comprises a temperature equalizing unit, the temperature equalizing unit comprises a first temperature equalizing plate 1, a second temperature equalizing plate 2 and a connecting plate 3 for connecting the first temperature equalizing plate 1 and the second temperature equalizing plate 2, pipelines 4 are arranged on the first temperature equalizing plate 1 and the second temperature equalizing plate 2, the pipelines 4 are provided with vacuum sealing cavities, phase change working media are injected into the vacuum sealing cavities, a first bending part 11 is arranged at one end, away from the connecting plate 3, of the first temperature equalizing plate 1, and a second bending part 12 is arranged at one end, away from the connecting plate 3, of the second temperature equalizing plate 2. The pipeline 4 is a high-efficiency heat transfer element, and the heat transfer efficiency and the heat flux density are high. At present, the tubular micro heat pipe has been widely used in a device thermal management system, but the heat transfer area and the structure thereof are limited based on one-dimensional heat transfer. The phase change temperature equalizing plate enables the phase change process of the working liquid to be two-dimensional or even three-dimensional heat transfer, and the heat source can also be in direct contact with the heat pipe, so that the temperature of a discrete local heat source hot area can be controlled strongly. The phase-change temperature-equalizing plate is a plate structure with a hollow cavity and consists of a shell, a pipeline inside the shell and a phase-change working medium, and the phase-change working medium is filled in the cavity and is in a negative pressure state. When the phase-change temperature-equalizing plate works, the flat plate absorbs heat, so that the liquid working medium at the evaporation section is rapidly expanded and vaporized, moves to the condensation section for cooling and liquefaction, and then flows back to the evaporation section under the gravity of the heat pipe. By adopting the n-shaped phase-change temperature-equalizing plate, the thermal contact area between the great-wall type phase-change temperature-equalizing plate and the base 5 is greatly increased, the cog bosses of the heat-radiating base 5 are reduced, the heat transfer contact thermal resistance is reduced, the heat radiating performance is improved, the weight of the heat radiating device is reduced, the temperature difference of the heat radiating device is reduced through the form of the common-cavity pipeline 4, and the integral temperature equalizing performance of the device is improved.
In the present embodiment, the base 5, the first bent portion 11 and the second bent portion 12 are formed by riveting or welding. The bottom plane of the great wall type phase-change temperature-uniforming plate is jointed with the heat-radiating base 5 by riveting, welding and other processes, compared with the prior art, the heat contact area of the temperature-uniforming plate and the heat-radiating base 5 is increased, the cog bosses of the heat-radiating base 5 are reduced, the heat transfer contact resistance is reduced, the heat-radiating performance is improved, and the weight of the heat-radiating base 5 is reduced.
Referring to fig. 2-4, in the present embodiment, at least two temperature equalizing units are included. The heat dissipation device in a specific embodiment may be formed by combining a plurality of temperature equalizing units, may also be formed by integrally forming the plurality of temperature equalizing units, and may also be formed by welding the plurality of temperature equalizing units and a single temperature equalizing unit, which are integrally formed.
In this embodiment, the temperature equalizing units are integrally formed or connected by a connecting member.
The application discloses a heat abstractor adopts great wall plate shape can be integrated into one piece, also can be a plurality of nearly style of calligraphy combinations, or a plurality of great wall plate type combinations, or a plurality of great wall plate types and nearly style of calligraphy combination form. And a vacuum common-cavity pipeline is arranged between the adjacent phase-change temperature-equalizing plates. And the temperature equalization design is realized. The connecting plate 3 is provided with a heat-dissipating through hole 31 instead of a heat-dissipating cover plate, so that the cost is reduced and the weight is also reduced. The joint design between the bottom plane of the phase-change temperature-equalizing plate and the heat-radiating base 5 has the advantages of large thermal contact area, small thermal resistance and good overall structural strength, thereby not only improving the heat transfer efficiency, but also reducing the weight of the heat-radiating base 5.
The application also discloses a communication product comprising the heat dissipation device in any embodiment.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is provided for the heat dissipation device and the communication product provided by the present invention, and the principle and the implementation of the present invention are explained by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. The utility model provides a heat dissipation device, its characterized in that, includes the samming unit, the samming unit includes first samming board, second samming board and connects first samming board with the connecting plate of second samming board, first samming board with all be equipped with the pipeline on the second samming board, the pipeline is equipped with vacuum seal cavity, it has the phase transition working medium to annotate in the vacuum seal cavity, first samming board is kept away from the one end of connecting plate is equipped with first kink, the second samming board is kept away from the one end of connecting plate is equipped with the second kink.
2. The heat dissipating device of claim 1, wherein the connecting plate is provided with at least one through hole.
3. The heat dissipation device of claim 1, wherein the connection plate is provided with a common-cavity channel for communicating the first temperature-uniforming plate and the second temperature-uniforming plate.
4. The heat dissipating device of claim 1, wherein the first bent portion and the second bent portion are in the same plane.
5. The heat dissipating device of claim 1, wherein the first bent portion and the second bent portion are parallel to the connecting plate.
6. The heat dissipating device of claim 1, wherein the first vapor chamber and the second vapor chamber are perpendicular to the connecting plate.
7. The heat dissipating device of claim 1, further comprising a base, wherein the first bending portion and the second bending portion are connected to the base.
8. The heat dissipating device of claim 7, comprising at least two of said temperature equalizing units.
9. The heat dissipation device of claim 8, wherein the temperature equalizing units are integrally formed or connected by a connecting member.
10. A communication product comprising a heat dissipation device as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010033104.8A CN111212550B (en) | 2020-01-13 | 2020-01-13 | Heat dissipation device and communication product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010033104.8A CN111212550B (en) | 2020-01-13 | 2020-01-13 | Heat dissipation device and communication product |
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| Publication Number | Publication Date |
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| CN111212550A true CN111212550A (en) | 2020-05-29 |
| CN111212550B CN111212550B (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010033104.8A Active CN111212550B (en) | 2020-01-13 | 2020-01-13 | Heat dissipation device and communication product |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111765788A (en) * | 2020-07-16 | 2020-10-13 | 深圳市飞荣达科技股份有限公司 | Novel phase change temperature-uniforming plate |
| CN112696965A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Adopt 3D heat dissipation module of samming plate structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2770285Y (en) * | 2004-12-22 | 2006-04-05 | 珍通科技股份有限公司 | Equalized temperature plate radiator |
| CN208547276U (en) * | 2018-03-20 | 2019-02-26 | 吴德坚 | A kind of superconductive temperature equalizing radiator |
| CN110012650A (en) * | 2019-05-16 | 2019-07-12 | 常州恒创热管理有限公司 | Bendable phase-change heat plate and radiator |
| CN209926945U (en) * | 2019-02-27 | 2020-01-10 | 常州恒创热管理有限公司 | Bent plate type heat pipe |
-
2020
- 2020-01-13 CN CN202010033104.8A patent/CN111212550B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2770285Y (en) * | 2004-12-22 | 2006-04-05 | 珍通科技股份有限公司 | Equalized temperature plate radiator |
| CN208547276U (en) * | 2018-03-20 | 2019-02-26 | 吴德坚 | A kind of superconductive temperature equalizing radiator |
| CN209926945U (en) * | 2019-02-27 | 2020-01-10 | 常州恒创热管理有限公司 | Bent plate type heat pipe |
| CN110012650A (en) * | 2019-05-16 | 2019-07-12 | 常州恒创热管理有限公司 | Bendable phase-change heat plate and radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111765788A (en) * | 2020-07-16 | 2020-10-13 | 深圳市飞荣达科技股份有限公司 | Novel phase change temperature-uniforming plate |
| CN112696965A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Adopt 3D heat dissipation module of samming plate structure |
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| Publication number | Publication date |
|---|---|
| CN111212550B (en) | 2021-07-20 |
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