CN110010535B - Substrate carrying in/out device, processing device, and method for removing electricity from substrate carrying container - Google Patents
Substrate carrying in/out device, processing device, and method for removing electricity from substrate carrying container Download PDFInfo
- Publication number
- CN110010535B CN110010535B CN201811489876.1A CN201811489876A CN110010535B CN 110010535 B CN110010535 B CN 110010535B CN 201811489876 A CN201811489876 A CN 201811489876A CN 110010535 B CN110010535 B CN 110010535B
- Authority
- CN
- China
- Prior art keywords
- substrate
- container
- carrier
- port
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 33
- 230000005611 electricity Effects 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 238000003860 storage Methods 0.000 claims abstract description 19
- 238000005192 partition Methods 0.000 claims abstract description 14
- 238000007664 blowing Methods 0.000 claims abstract description 6
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000002245 particle Substances 0.000 abstract description 24
- 235000012431 wafers Nutrition 0.000 description 55
- 239000007789 gas Substances 0.000 description 52
- 230000032258 transport Effects 0.000 description 17
- 230000008569 process Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 239000000969 carrier Substances 0.000 description 4
- 230000007723 transport mechanism Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Automation & Control Theory (AREA)
Abstract
The invention provides a substrate carrying in/out device, a processing device and a method for removing electricity from a substrate carrying container, which can remove electricity from an inner surface of a FOUP and inhibit adhesion of particles to the inner surface of the FOUP. The substrate loading/unloading device according to one embodiment includes: a partition wall that divides the substrate transfer area and the container transfer area; a transfer port formed in the partition wall; and a gas supply mechanism for blowing ionized gas from the opening edge of the conveying port to the inside of the substrate storage container after the opening edge of the take-out port of the substrate storage container is tightly connected with the opening edge of the conveying port.
Description
Technical Field
The present invention relates to a substrate loading/unloading apparatus, a substrate processing apparatus, and a method for removing electricity from a substrate transport container.
Background
In a semiconductor manufacturing apparatus, there is known a lid opening/closing device for preventing particles in a conveyance area of a FOUP (Front Opening Unified Pod: front opening unified pod) from being mixed into a substrate conveyance area through a lid of the FOUP (see, for example, patent document 1).
The lid opening/closing device includes: a mounting table for mounting the FOUP such that a front surface of a cover of the FOUP faces a conveyance port opened and closed by an opening/closing door; a gas ejection port provided on a facing surface portion facing the FOUP; and an advancing and retreating mechanism for advancing and retreating the FOUP mounted on the carrying table relative to the opposite face. Further, when the distance from the gas outlet to the lid of the FOUP is 5mm or less, the flow rate of the purge gas flowing between the lid and the facing surface increases by supplying the purge gas to the lid, and the particles of the lid can be easily removed.
Patent document 1: japanese patent application laid-open No. 2012-204645
Disclosure of Invention
Problems to be solved by the invention
However, in the above-described apparatus, it is difficult to remove particles adhering to the inner surface of the FOUP. Particles adhering to the inner surface of the FOUP may adhere to a substrate stored in the FOUP and may be mixed into a substrate transfer area when the lid of the FOUP is detached.
Accordingly, an object of one embodiment of the present invention is to provide a substrate carry-in/out apparatus capable of removing electricity from the inner surface of a FOUP and suppressing adhesion of particles to the inner surface of the FOUP.
Solution for solving the problem
In order to achieve the above object, a substrate loading/unloading apparatus according to an embodiment of the present invention includes: a partition wall that divides the substrate transfer area and the container transfer area; a transfer port formed in the partition wall; and a gas supply mechanism for blowing ionized gas from the opening edge of the conveying port to the inside of the substrate storage container after the opening edge of the take-out port of the substrate storage container is tightly connected with the opening edge of the conveying port.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the disclosed substrate loading/unloading device, the inner surface of the FOUP can be de-electrified, and adhesion of particles to the inner surface of the FOUP can be suppressed.
Drawings
Fig. 1 is a schematic configuration diagram of a substrate processing apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention.
Fig. 3 is a longitudinal sectional view of the carrier and the opening and closing door.
Fig. 4 is a cross-sectional view of the carrier and the opening and closing door.
Fig. 5 is a perspective view of the conveyance port and the carrier.
Fig. 6 is a flowchart showing an example of a method of removing electricity from a carrier.
Fig. 7 is a process diagram (1) showing an example of a method for removing electricity from a carrier.
Fig. 8 is a process diagram (2) showing an example of a method for removing electricity from a carrier.
Fig. 9 is a process diagram (3) showing an example of a method for removing electricity from a carrier.
Fig. 10 is a process diagram (4) showing an example of a method for removing electricity from a carrier.
Fig. 11 is a process diagram (5) showing an example of a method for removing electricity from a carrier.
Description of the reference numerals
1: a substrate processing apparatus; 10: a housing; 11: a partition wall; 12: a conveying port; 22: a processing container; 27: a wafer transfer mechanism; 40: a carrier; 43: a take-out port; 44: an opening edge portion; 50: opening and closing the door; 60: a cover opening/closing mechanism; 70: a gas supply mechanism; 71: a gas supply pipe; 72: an ejection port; 73: a gas supply line; 74: a gas supply source; 75: an ionizer; 77: a potentiometer; 100: a control unit; s10: a carrier transport region; s20: a wafer transfer area; w: and (3) a wafer.
Detailed Description
The following describes specific embodiments with reference to the drawings. In the present specification and the drawings, substantially the same structures are denoted by the same reference numerals, and repetitive description thereof will be omitted.
(substrate processing apparatus)
A substrate processing apparatus including a substrate loading/unloading apparatus according to an embodiment of the present invention will be described. The substrate loading and unloading device according to the embodiment of the present invention can be applied to various substrate processing devices, but for ease of understanding, a case will be described in which a vertical heat processing device is used as an example of a substrate processing device.
Fig. 1 is a schematic configuration diagram of a substrate processing apparatus according to an embodiment of the present invention. Fig. 2 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention.
The substrate processing apparatus 1 is configured to be accommodated in a housing 10 that constitutes an outer housing of the apparatus. A carrier transport region S10 and a wafer transport region S20 are formed in the housing 10. The carrier transport region S10 and the wafer transport region S20 are partitioned by the partition wall 11. The partition 11 is provided with a transfer port 12 for transferring the wafer W by communicating the carrier transfer area S10 with the wafer transfer area S20. The conveyance port 12 is opened and closed by an opening and closing door 50 in accordance with FIMS (Front-Opening Interface Mechanical Standard: front opening interface mechanical standard) standard. The opening/closing door 50 is connected to a driving mechanism 51, and the opening/closing door 50 is configured to be movable in the front-rear direction and the up-down direction by the driving mechanism 51 to open and close the conveyance port 12. The structure around the conveyance port 12 and the opening/closing door 50 will be described later. The direction in which the carrier transport region S10 and the wafer transport region S20 are arranged is hereinafter referred to as the front-rear direction of the substrate processing apparatus 1.
The carrier transport region S10 is set to an atmospheric atmosphere. The carrier transport region S10 is a region for carrying the carrier 40 containing a semiconductor wafer (hereinafter referred to as "wafer W") as an example of a substrate into the substrate processing apparatus 1 or carrying the carrier out of the substrate processing apparatus 1. The carrier 40 may be, for example, a FOUP (Front-Opening Unified Pod). By keeping the cleanliness in the FOUP at a predetermined level, adhesion of foreign matter to the surface of the wafer W and formation of a natural oxide film can be prevented. The carrier conveyance area S10 includes a first conveyance area S11 and a second conveyance area S12 located behind the first conveyance area S11 (on the wafer conveyance area S20 side).
Two first tables 14 for placing carriers 40 are provided in the left-right direction of the first conveying area S11. A plurality of (for example, three) positioning pins 14a for positioning the carrier 40 are provided on the surface of the first mounting table 14 on which the carrier 40 is mounted.
In the second conveying region S12, two second tables 16 are arranged in the left-right direction so as to be aligned with the first tables 14. The second stage 16 is configured to be movable back and forth by the advance/retreat mechanism 17, and is configured to convey the carrier 40 between a delivery position for delivering the wafer W from the carrier 40 to the wafer conveyance area S20 and a receiving position for receiving the carrier 40 from the carrier conveyance mechanism 19. A plurality of (for example, three) positioning pins 16a for positioning the carrier 40 and a hook 16b for fixing the carrier 40 are provided on the surface of the second mounting table 16 for mounting the carrier 40.
A carrier storage section 18 for storing the carriers 40 is provided above the second conveying area S12. The carrier storage unit 18 includes, for example, two-layered racks, each of which can mount two carriers 40 in the left-right direction. The second conveying section S12 is provided with a carrier conveying mechanism 19 for conveying the carriers 40 between the first table 14, the second table 16, and the carrier storage section 18. The carrier transport mechanism 19 includes a guide portion 19a extending in the left-right direction and being vertically movable, a moving portion 19b moving in the left-right direction while being guided by the guide portion 19a, and an articulated arm 19c provided to the moving portion 19b, and transports the carrier 40 in the horizontal direction while holding the carrier 40.
The wafer transfer area S20 is an area in which the wafer W is taken out from the carrier 40 and various processes are performed. The wafer transfer region S20 is set to an inert gas atmosphere such as nitrogen (N) 2 ) Atmosphere to prevent the formation of an oxide film on the wafer W. The wafer transfer region S20 is provided with a vertical processing container 22 having a lower end opened as a furnace mouth.
A wafer boat 23 for holding a plurality of wafers W in a rack shape is placed on a lid 25 below the processing container 22 via a heat insulating portion 24. The lid 25 is supported by a lifting mechanism 26, and the wafer boat 23 is carried into the process container 22 or the wafer boat 23 is carried out of the process container 22 by the lifting mechanism 26.
A wafer transfer mechanism 27 is provided between the wafer boat 23 and the transfer port 12. The wafer transfer mechanism 27 is configured such that five arms 27c capable of freely advancing and retreating are provided on a moving body 27b, wherein the moving body 27b moves along a guide mechanism 27a extending in the left-right direction and rotates around a vertical axis, and the wafer transfer mechanism 27 transfers the wafers W between the wafer boat 23 and the carrier 40 on the second stage 16.
Fig. 3 is a longitudinal sectional view of the carrier 40 and the opening/closing door 50. Fig. 4 is a cross-sectional view of the carrier 40 and the opening and closing door 50. Fig. 5 is a perspective view of the conveyance port 12 and the carrier 40.
The carrier 40 includes a carrier body 41 as a container body and a cover 42. A plurality of support portions 41a for supporting the peripheral edge portion of the back surface side of the wafer W are provided on the left and right sides in the carrier body 41. A take-out port 43 for taking out the wafer W from the inside of the carrier 40 is formed in the front surface of the carrier body 41. Engaging grooves 44a are formed in the upper and lower sides of the inner peripheral side of the opening edge 44 of the take-out port 43.
A grip portion 41b is provided on the upper portion of the carrier body 41, and the grip portion 41b is gripped by the carrier transport mechanism 19 when the carrier transport mechanism 19 transports the carrier 40. A recess 45a and a groove 45b are provided in the lower portion of the carrier body 41. The recess 45a is fitted to the positioning pins 14a and 16a of the first mounting table 14 and the second mounting table 16. The groove 45b engages with the hook 16b of the second mounting table 16, thereby fixing the carrier body 41 to the second mounting table 16.
Inside the cover 42, a rotation portion 46 is provided on the left and right sides. A linear motion portion 47 extending in the vertical direction is provided above and below the rotation portion 46. The linear movement portion 47 is configured to be lifted up and down in accordance with the rotation of the rotation portion 46, and is switched between a state in which the tip of the linear movement portion 47 protrudes from the side surface of the cover 42 and a state in which the tip is retracted into the cover 42. Fig. 5 shows a state in which the tip of the straight movement portion 47 is retracted. The top end of the linear movement portion 47 is engaged with the engagement groove 44a of the carrier body 41, whereby the cover 42 is engaged with the carrier body 41. An opening 48 for inserting a latch key 69a into the inside of the cover 42 is provided in the front surface of the cover 42.
A recess 401 for alignment is formed in the front surface of the cover 42. Alignment pins (registration pins) 601 of the opposing plates 61 configured to face each other can be inserted into the alignment recesses 401 to perform alignment between the opposing plates 61 and the carrier 40. The alignment pin 601 may have the following structure: the cover 42 is formed in a tubular shape, and can be held by vacuum suction when inserted into the recess 401.
The seal member 13 is provided at a position where the opening edge 44 of the carrier body 41 abuts against the opening edge of the carrier port 12 on the carrier transport region S10 side.
The opening/closing door 50 is formed as a box body in which the peripheral edge portion of the opening/closing door 50 is curved toward the carrier conveying region S10 side. A seal member 52 is provided at the opening edge of the casing, and the opening/closing door 50 is tightly bonded to the opening edge of the conveyance port 12 via the seal member 52.
A cover opening and closing mechanism 60 for opening and closing the cover 42 is provided on the carrier conveyance area S10 side of the opening and closing door 50. The cover opening/closing mechanism 60 includes a facing plate 61 and an advancing/retreating mechanism 62 that moves the facing plate 61 in the front-rear direction. The facing plate 61 includes a facing surface 63 facing the front surface of the cover 42 mounted on the second mounting table 16.
A bar-shaped connecting portion 69 extends from the facing surface portion 63 in the thickness direction of the facing surface portion 63, and a round bar-shaped latch key 69a is provided at the tip of the connecting portion 69. By rotating the connecting portion 69 around its axis, the latch key 69a is also rotated. The latch key 69a is formed to be engageable with the turning portion 46 of the cover 42 and to turn the turning portion 46.
The gas supply mechanism 70 blows ionized gas from the opening edge of the carrier port 12 to the inside of the carrier 40 after the opening edge 44 of the take-out port 43 of the carrier 40 is tightly bonded to the opening edge of the carrier port 12. The gas supply mechanism 70 has a gas supply pipe 71, a discharge port 72, a gas supply line 73, a gas supply source 74, and an Ionizer (Ionizer) 75.
As shown in fig. 4, the gas supply pipe 71 is provided vertically on the side edge portion side of the transfer port 12. The gas supply pipe 71 is constituted by, for example, a shutoff filter (Break filter, english). The cutoff filter is a sintered body having a porous structure such as ceramic, and a plurality of pores communicate with each other to form a gas flow path in a three-dimensional mesh shape.
The gas supply pipe 71 has a discharge port 72 formed in the upper and lower sides thereof. The ejection port 72 is configured to be able to eject the gas supplied to the gas supply pipe 71 toward the carrier 40.
One end of the gas supply line 73 is connected to the gas supply pipe 71, and the other end is connected to the gas supply source 74.
The gas supply source 74 supplies N to the gas supply line 73 2 And (3) air. In addition, instead of N, other inert gases such as Ar may be used 2 And (3) air.
An ionizer 75 is provided on the gas supply line 73 to flow N through the gas supply line 73 2 And (5) ionizing the gas. The ionizer 75 may be, for example, a type using corona discharge, or a type using ionizing radiation such as soft X-rays or ultraviolet rays. In addition, a filter for removing particulates may be provided at a subsequent stage of the ionizer 75.
In the gas supply mechanism 70 having the above-described structure, N is supplied from the gas supply source 74 to the gas supply line 73 2 Gas, N supplied 2 The gas is ionized by the ionizer 75 and ejected from the ejection port 72 of the gas supply tube 71.
Specifically, for example, the ionized N is discharged from the discharge port 72 in a state in which the opening edge 44 of the carrier 40 is brought into close contact with the opening edge of the carrier conveying port 12 on the carrier conveying region S10 side, and the cover 42 is removed from the carrier 40 by the cover opening/closing mechanism 60 to open the discharge port 43 2 And (3) air. Thereby, ionized N 2 The gas flows entirely into the interior of the carrier 40. As a result, the inner surface of the carrier 40 is de-electrified, and adhesion of particles to the inner surface of the carrier 40 is suppressed. In addition, even in the case where particles are adhered to the inner surface of the carrier 40, the ionized N can be blown into the inside of the carrier 40 2 Gas to remove particulates.
In addition, for example, the ionized N may be ejected from the ejection port 72 in a state where the opening edge 44 of the carrier 40 is tightly bonded to the opening edge of the carrier conveying region S10 side of the conveying port 12 and the ejection port 43 of the carrier 40 is closed by the cover 42 2 And (3) air. In this case, the ionized N 2 The air is blown to the closed space surrounded by the carrier 40 (cover 42) and the opening and closing door 50. As a result, the enclosed space is covered with N 2 The gas is replaced, and the inner surface of the opening/closing door 50, the lid opening/closing mechanism 60, and the like on the wafer transfer region S20 side of the lid 42 forming the closed space are discharged.
A horizontally long exhaust port 76 is provided at the lower end of the conveyance port 12. The exhaust port 76 is for exhausting the gas ejected from the ejection port 72 of the gas supply pipe 71.
Further, a potentiometer 77 is provided on the inner surface of the lower part of the opening/closing door 50 in a portion curved toward the carrier conveyance area S10 side. When the conveyance port 12 is closed by the opening/closing door 50 and the lid 42 of the carrier 40 is opened by the lid opening/closing mechanism 60, the potentiometer 77 detects the potential of the static electricity charged on the inner surface of the carrier 40. As the potentiometer 77, for example, a noncontact surface potentiometer can be used. The position where the potentiometer 77 is provided may be any other position as long as it can detect the potential of the static electricity charged on the inner surface of the carrier 40.
The substrate processing apparatus 1 is provided with a control unit 100 configured by a computer, for example. The control unit 100 includes a program, a memory, a data processing unit constituted by a CPU, and the like. A command (each step) is programmed to transmit a control signal from the control unit 100 to each unit of the substrate processing apparatus 1 to perform each processing step described below. Controlling the advance and retreat of the second stage 16, the conveyance of the carrier 40, the advance and retreat of the cover opening/closing mechanism 60, the conveyance of the wafer W, the opening and closing of the cover 42, the opening and closing of the opening/closing door 50, and N based on the control signal 2 The supply of the gas to the cover 42, the turning on and off of the ionizer 75, and the like are performed to carry and process the wafer W. The program is stored in a computer storage medium such as a flexible disk, an optical disk, a hard disk, an MO (magneto optical disk), and a memory card, and is installed in the control section 100.
(method of removing electric power)
Next, an example of a method in which the control unit 100 controls each unit of the substrate processing apparatus 1 to charge off the inner surface of the carrier 40 will be described with reference to fig. 6 to 11. Fig. 6 is a flowchart showing an example of the method of removing the electricity from the carrier 40. Fig. 7 to 11 are process drawings showing an example of the method of removing the electricity from the carrier 40.
First, a wafer W in the carrier 40 is prepared (step ST 1). Specifically, after the carrier 40 is placed on the first stage 14 by an automatic transfer robot (not shown), the carrier 40 is transferred from the first stage 14 to the second stage 16 by the carrier transfer mechanism 19, and the carrier 40 is fixed to the second stage 16 by the hook 16b. Next, the second stage 16 is advanced toward the conveyance port 12 of the partition 11 by the advance/retreat mechanism 17. The carrier 40 moves forward to a transfer position for transferring the wafer W, and the opening edge 44 of the carrier 40 contacts the sealing member 13 around the transfer port 12 of the partition wall 11, thereby forming a closed space between the carrier 40 and the shutter 50. The latch key 69a of the cover opening/closing mechanism 60 is engaged with the rotating portion 46 in the cover 42. The latch key 69a is turned 90 degrees, and the engagement between the cover 42 and the carrier body 41 is released and the cover 42 is held by the latch key 69a. Then, the opposing plate 61 is retracted toward the opening/closing door 50 with the cover 42 held by the latch key 69a, and the removal opening 43 of the carrier body 41 is opened. The shutter 50 is lowered to retract from the transfer port 12 after retracting, and the carrier 40 is opened to the wafer transfer area S20 (see fig. 7).
Next, the wafer W in the carrier 40 is carried out (step ST 2). Specifically, the wafers W in the carrier 40 are sequentially taken out by the wafer carrier mechanism 27 and transferred to the wafer boat 23. When all the wafers W in the carrier 40 are taken out, the carrier 40 is empty (see fig. 8).
Next, the conveyance port 12 is closed by the opening/closing door 50 (step ST 3). Specifically, the retracted opening/closing door 50 is advanced after being lifted, and the conveyance port 12 is closed by the opening/closing door 50 (see fig. 9).
Then, the ionized N is blown to the inner surface of the carrier 40 2 Gas (step ST 4). Specifically, the ionizer 75 is started to operate, and ionized N is blown from the ejection port 72 into the carrier 40 2 Air (see fig. 10). Thereby, the inner surface of the carrier 40 is de-electrified, and adhesion of particles to the inner surface of the carrier 40 is suppressed. In addition, even in the case where particles are adhered to the inner surface of the carrier 40, the particles are ionized N by being blown into the inside of the carrier 40 2 The gas is removed. After a predetermined time has elapsed since the start of the operation of the ionizer 75, the operation of the ionizer 75 is stopped. For a prescribed time, for example, ionized N can be blown into the interior of the carrier 40 2 The charge amount of the inner surface of the carrier 40 is measured by the potentiometer 77 before the air is supplied, and a time is set to a prescribed time based on the measured charge amount and a blow time setting table which represents the charge amount and ionized N required for the charge removal stored in advance in the storage section is calculated 2 Relationship between blowing times of gas. Alternatively, instead of the predetermined time, for example, the ionized N may be blown to the inner surface of the carrier 40 2 The charge amount of the inner surface of the carrier 40 is measured by the potentiometer 77, and after the measured charge amount is equal to or less than a predetermined charge amount, the operation of the ionizer 75 is stopped. In addition, for example, it may also beThe ionized N is blown to the inner surface of the carrier 40 for a predetermined time 2 After that, the charge amount of the inner surface of the carrier 40 is measured by the potentiometer 77, and when the measured charge amount is equal to or less than the predetermined charge amount, the ionizer 75 is stopped, and when the measured charge amount is greater than the predetermined charge amount, the ionized N is blown again to the inner surface of the carrier 40 for a predetermined time 2 And (3) air. For example, an in-gas particle measuring device may be provided on the exhaust port 76 side, a change in the amount of particles contained in the gas discharged from the exhaust port 76 may be measured, and the operation of the ionizer 75 may be stopped based on the measured change in the amount of particles. For example, the timing of stopping the operation of the ionizer 75 may be determined by combining these methods.
Next, the take-out port 43 of the carrier 40 is closed by the cover 42 (step ST 5). Specifically, the removal opening 43 of the carrier body 41 is closed by the cover 42 by an operation opposite to the above-described operation, and the cover 42 is fixed to the carrier body 41 (see fig. 11).
Next, the second stage 16 is retracted, the carrier 40 is separated from the partition 11, and the carrier 40 is conveyed to the carrier storage unit 18 by the carrier conveying mechanism 19 and stored temporarily. On the other hand, the wafer boat 23 on which the wafers W are mounted is carried into the processing container 22, and the wafers W are subjected to CVD, annealing, oxidation, and the like. Thereafter, the carrier 40 temporarily stored in the carrier storage unit 18 is transported to the second mounting table 16 by the carrier transport mechanism 19, and the cover 42 is removed in the same process as described above, so that the removal port 43 of the carrier body 41 is opened. Then, the processed wafer W is accommodated in the carrier 40. At this time, since the inner surface of the carrier 40 is ionized N 2 Since the gas is de-energized and particles are hardly attached to the inner surface of the carrier 40, the attachment of particles to the processed wafer W can be suppressed.
In the above example, the cover 42 of the carrier 40 is closed after the ionizer 75 is stopped, but for example, N ionized may be blown to the inner surface of the carrier 40 2 Closing the cover at one side42. As a result, the inner surfaces of the lid body 42, the lid body opening and closing mechanism 60, and the opening and closing door 50, and the like, can be also de-energized, and adhesion of particles to the inner surfaces of the lid body 42, the lid body opening and closing mechanism 60, and the opening and closing door 50, and the like, on the wafer conveyance region S20 side can be suppressed. Even when particles adhere to the inner surfaces of the lid body 42, the lid body opening and closing mechanism 60, the opening and closing door 50, and the like, on the wafer transfer region S20 side, the ionized N can pass through the inner surface of the carrier 40 2 The gas removes particulates.
In addition, in the above example, the ionized N is blown into the carrier 40 immediately after the wafer W is carried out from the carrier 40 2 The case where the inner surface of the carrier 40 is dehumidified by air is described as an example, but the present invention is not limited thereto. For example, the ionized N may be blown into the carrier 40 before the wafer W subjected to the predetermined process in the process container 22 is carried into the carrier 40 2 Air to de-energize the inner surface of the carrier 40.
As described above, in the embodiment of the present invention, the gas supply mechanism 70 is provided to blow the ionized gas from the opening edge portion of the carrier 12 to the inside of the carrier 40 after the opening edge portion 44 of the take-out port 43 of the carrier 40 and the opening edge portion of the carrier 12 are tightly joined. Thereby, ionized N can be blown into the carrier 40 2 The gas can thus de-electrify the inner surface of the carrier 40, and inhibit adhesion of particles to the inner surface of the carrier 40. Therefore, particles can be prevented from adhering to the wafer W stored in the carrier 40 or from being mixed into the wafer transfer area S20 when the cover 42 of the carrier 40 is detached. In addition, even in the case where particles are adhered to the inner surface of the carrier 40, the ionized N can be blown into the inside of the carrier 40 2 Gas to remove particulates. Further, in the case where the carrier 40 is carried to the next process and the cover 42 is opened and closed, since the inner surface of the carrier 40 is de-electrified, even if particles are suspended in the region where the carrier 40 is placed in the next process, it is possible to suppress adhesion of particles to the inner surface of the carrier 40.
In the above embodiment, the carrier 40 is an example of the substrate storage container, the carrier transport region S10 is an example of the container transport region, and the wafer transport region S20 is an example of the substrate transport region. The ionizer 75 is an example of an ionization device.
The above description has been given of specific embodiments, but the above description is not intended to limit the invention, and various modifications and improvements can be made within the scope of the invention.
In the above embodiment, the case where the substrate is a semiconductor wafer has been described as an example, but the present invention is not limited thereto, and the substrate may be, for example, a glass substrate or an LCD substrate.
Claims (6)
1. A substrate carrying-in and carrying-out device comprises:
a partition wall that divides the substrate transfer area and the container transfer area;
a transfer port formed in the partition wall;
a gas supply mechanism configured to blow ionized gas from an opening edge portion of the transfer port to an inside of the substrate accommodating container after the opening edge portion of the take-out port of the substrate accommodating container is tightly bonded to the opening edge portion of the transfer port, the gas supply mechanism being configured to blow ionized gas to the inside of the substrate accommodating container in a state where the inside of the substrate accommodating container does not accommodate a substrate;
an opening/closing door formed as a case having a peripheral edge portion bent toward the container conveying area side, the peripheral edge portion being tightly bonded to an opening edge portion of the conveying port to close the conveying port;
a potentiometer provided on an inner surface of a lower part of the opening/closing door in a portion curved toward the container conveying region side, the potentiometer being configured to detect a potential of the inner surface of the substrate storage container; and
and a control unit that controls an operation of an ionization device for generating the ionized gas based on the potential of the inner surface of the substrate storage container detected by the potentiometer.
2. The substrate loading/unloading apparatus according to claim 1, wherein,
the gas supply mechanism includes:
a gas supply pipe formed in the partition wall and having an ejection port for ejecting the gas;
a gas supply line that communicates with the gas supply pipe and supplies the gas to the gas supply pipe; and
and an ionization device provided in the gas supply line to ionize the gas flowing in the gas supply line.
3. A substrate processing apparatus includes:
the substrate carry-in and carry-out apparatus according to claim 1 or 2;
a conveying mechanism arranged in the substrate conveying area and used for conveying the substrate; and
and a processing container provided in the substrate transfer area.
4. A method for removing electricity from a substrate container includes the steps of:
tightly bonding an opening edge of a take-out port of the substrate storage container with an opening edge of a conveying port formed in a partition wall dividing a substrate conveying area and a container conveying area;
closing the transfer port by an opening/closing door for opening and closing the transfer port, wherein the opening/closing door is formed as a case whose peripheral edge portion is curved toward the container transfer area side, and the transfer port is closed by tightly engaging the peripheral edge portion with an opening edge portion of the transfer port;
blowing ionized gas from an opening edge portion of the transfer port into the substrate accommodating container in a state where the transfer port is closed by the opening/closing door and no substrate is accommodated in the substrate accommodating container;
detecting a potential of an inner surface of the substrate storage container by a potentiometer provided on an inner surface of a lower part of a portion of the opening/closing door bent toward the container conveying region side; and
an operation of an ionization device for generating the ionized gas is controlled based on the electric potential of the inner surface of the substrate storage container detected by the potentiometer.
5. The method for removing electricity from a substrate container according to claim 4, wherein,
and a step of blowing the ionized gas from the opening edge of the conveyance port into the substrate container in a state where a cover for closing the take-out port of the substrate container is detached.
6. The method of removing electricity from a substrate container according to claim 4, comprising:
after the step of blowing the ionized gas from the opening edge of the conveyance port into the substrate storage container, the take-out port of the substrate storage container is closed by a lid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-234476 | 2017-12-06 | ||
| JP2017234476A JP6948927B2 (en) | 2017-12-06 | 2017-12-06 | How to remove static electricity from board loading / unloading devices, board processing devices, and board transport containers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110010535A CN110010535A (en) | 2019-07-12 |
| CN110010535B true CN110010535B (en) | 2024-03-26 |
Family
ID=66846728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811489876.1A Active CN110010535B (en) | 2017-12-06 | 2018-12-06 | Substrate carrying in/out device, processing device, and method for removing electricity from substrate carrying container |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6948927B2 (en) |
| KR (1) | KR102462916B1 (en) |
| CN (1) | CN110010535B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102140063B1 (en) | 2020-01-30 | 2020-08-03 | 주식회사 위드텍 | Particle measuring device for wafer carrier |
| KR102409487B1 (en) | 2022-04-19 | 2022-06-15 | 주식회사 위드텍 | Control device for supplying analysis gas to load port for semiconductor wafer FOUP and control method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351864A (en) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | Processing system and processing method |
| JP2010165741A (en) * | 2009-01-13 | 2010-07-29 | Hitachi High-Tech Control Systems Corp | Mini-environment substrate transport device, load port and method of eliminating electricity in substrate within transport container |
| JP2014207306A (en) * | 2013-04-12 | 2014-10-30 | 東京エレクトロン株式会社 | Method of atmosphere management within housing container |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4541232B2 (en) * | 2005-06-16 | 2010-09-08 | 東京エレクトロン株式会社 | Processing system and processing method |
| JP2012204645A (en) | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | Lid opening/closing device |
| JP5993252B2 (en) * | 2012-09-06 | 2016-09-14 | 東京エレクトロン株式会社 | Lid opening / closing device, heat treatment apparatus using the same, and lid opening / closing method |
| JP2014116441A (en) | 2012-12-10 | 2014-06-26 | Hitachi High-Tech Manufacturing & Service Corp | Semiconductor wafer processing apparatus and static elimination system |
-
2017
- 2017-12-06 JP JP2017234476A patent/JP6948927B2/en active Active
-
2018
- 2018-12-05 KR KR1020180155025A patent/KR102462916B1/en active IP Right Grant
- 2018-12-06 CN CN201811489876.1A patent/CN110010535B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351864A (en) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | Processing system and processing method |
| JP2010165741A (en) * | 2009-01-13 | 2010-07-29 | Hitachi High-Tech Control Systems Corp | Mini-environment substrate transport device, load port and method of eliminating electricity in substrate within transport container |
| JP2014207306A (en) * | 2013-04-12 | 2014-10-30 | 東京エレクトロン株式会社 | Method of atmosphere management within housing container |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102462916B1 (en) | 2022-11-03 |
| JP2019102727A (en) | 2019-06-24 |
| KR20190067106A (en) | 2019-06-14 |
| JP6948927B2 (en) | 2021-10-13 |
| CN110010535A (en) | 2019-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012204645A (en) | Lid opening/closing device | |
| JP5617708B2 (en) | Lid opening / closing device | |
| TWI278057B (en) | Enclosed container lid opening/closing system and enclosed container lid opening/closing method | |
| TW200832592A (en) | Substrate processing apparatus and manufacturing method for a semiconductor device | |
| EP3605598B1 (en) | Thin-plate substrate holding finger and transfer robot provided with said finger | |
| JP2009164213A (en) | Vacuum processing apparatus and vacuum processing method, and storage medium | |
| CN110010535B (en) | Substrate carrying in/out device, processing device, and method for removing electricity from substrate carrying container | |
| TW201512412A (en) | Magnetic annealing apparatus | |
| TWI790491B (en) | load port | |
| TWI606536B (en) | Substrate processing apparatus and substrate processing method | |
| WO2000003428A1 (en) | Substrate transfer device and operating method thereof | |
| JP5485056B2 (en) | Ion supply apparatus and processing system for target object provided with the same | |
| JP2003007801A (en) | Substrate processing device | |
| JP2005079250A (en) | Substrate processing apparatus | |
| JP2009267153A (en) | Substrate processing apparatus and method for manufacturing semiconductor device | |
| JP6191853B2 (en) | Load lock chamber | |
| JP2006351864A (en) | Processing system and processing method | |
| KR100650807B1 (en) | Substrate transporting apparatus, processing apparatus, processing system for substrate, transporting method, receiving apparatus and accommodating box | |
| JP2011159834A (en) | Substrate carrier device with gas replacement device, substrate carrier system, and replacement method | |
| TWI495032B (en) | Transfer mechanism for target item for processing, and processing system for target item for processing | |
| JP5807708B2 (en) | Lid opening / closing device | |
| JP4359109B2 (en) | Substrate processing apparatus and substrate processing method | |
| JP2005347667A (en) | Semiconductor fabrication device | |
| JP2009135210A (en) | Container lid opening/closing system and substrate processing method using the same | |
| JP2008100802A (en) | Substrate storage warehouse |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |