JP2010165741A - Mini-environment substrate transport device, load port and method of eliminating electricity in substrate within transport container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To sufficiently eliminate static electricity charged in a substrate accommodated by an FOUP. <P>SOLUTION: In a side plate 102 of a load port 10 which constitutes a mini-en apparatus 1, an FOUP communicating opening 103 is formed in a position in which an FOUP 3 is mounted. In the proximity of the FOUP communicating opening 103, an ion air discharge nozzle 16 is provided, which orients an ion air discharge hole toward the FOUP communicating opening 103. If a mini-en control device 13 detects the mounting of an FOUP 3 to an FOUP mounted stand 100, an ionizer 15 is driven, and ion air is discharged from the ion air discharge nozzle 16 toward the FOUP communicating opening 103, that is, the interior of the mounted FOUP 3. Then, after a predetermined time period, or when the electrostatic potential of a wafer 31 detected by an electrostatic potential sensor becomes lower than or equal to a predetermined voltage potential, the drive of the ionizer 15 is stopped, the discharge of the ion air from the ion air discharge nozzle 16 is stopped. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides a mini-machine that takes out a substrate stored in a transfer container from a transfer container that hermetically stores a thin substrate such as a silicon wafer in a clean environment and transfers the taken-out substrate to a substrate processing apparatus. The present invention relates to an environment substrate transfer device, a load port thereof, and a method for removing electricity from a substrate in a transfer container.

  An integrated circuit is manufactured by subjecting a wafer (substrate) made of single crystal silicon or the like to various fine processing processes such as impurity implantation, film formation, and etching. Then, the manufacturing apparatus (hereinafter referred to as a substrate processing apparatus) was managed so that the amount of airborne fine particles such as dust in the air would be a predetermined amount or less in order to improve the manufacturing yield in the fine processing. Installed in a clean room.

  In recent years, the concept of mini-environment has been introduced in order to achieve a higher degree of cleanliness more economically. According to the concept, the space for maintaining a higher degree of cleanliness is intended to be limited to a space as small as possible, such as an internal space of a substrate processing apparatus or a space related to substrate transport that connects a plurality of substrate processing apparatuses. .

  In integrated circuit manufacturing factories that have realized the concept of mini-environment, a wafer transfer container called FOUP (Front Opening Unified Pod) for hermetically storing wafers, and substrate processing equipment that removes wafers from FOUP without exposing them to the outside air A mini-environment substrate transfer device for transferring inward is used.

  That is, in a manufacturing factory such as an integrated circuit, for example, every 25 wafers to be processed are stored in a FOUP and transferred from one substrate processing apparatus to another substrate apparatus. A wafer supply / discharge port portion with respect to the substrate processing apparatus is covered with a casing for isolating the outside air, and a mini-environment substrate transfer apparatus including a transfer robot is provided therein. The wafer stored in the FOUP is taken out of the FOUP by the transfer robot without being exposed to the outside air, and is transferred into the substrate processing apparatus.

  By the way, a wafer in the process of manufacturing an integrated circuit or the like often generates static electricity during the process or transfer process and is charged. For example, if the wafer stored in the FOUP is charged, it is discharged when the transfer robot of the mini-environment substrate transfer device tries to attract or hold the wafer in the FOUP with the robot hand. Circuit elements formed on the wafer may be destroyed, and the transfer robot may malfunction or fail.

  Therefore, in the conventional mini-environment substrate transport apparatus, for example, as disclosed in Patent Document 1, an ionizer is provided in addition to a fan filter unit provided on the ceiling of the mini-environment substrate transport apparatus. The discharged ionized air (hereinafter referred to as ion air) discharges the transfer robot in the mini-environment substrate transfer apparatus and the wafer in the FOUP.

JP 2002-118161 A (paragraph 0064 to paragraph 0066, FIG. 4 etc.)

  However, in the mini-environment substrate transfer device disclosed in Patent Document 1, since the ionizer is attached to the ceiling, ion air simply flows from top to bottom in the housing. Therefore, there is a problem that ion air does not reach the inside of the FOUP and the static electricity charged on the wafer (substrate) in the FOUP cannot be sufficiently removed. Therefore, it has not been possible to sufficiently prevent the destruction of circuit elements formed on the wafer due to the discharge of static electricity charged on the wafer (substrate) and the malfunction or failure of the transfer robot.

  In view of the above-described problems of the prior art, the present invention is a mini-environment capable of sufficiently discharging static electricity charged on a substrate (wafer) in a transport container by spreading ion air into the transport container (FOUP). It is an object of the present invention to provide a substrate transfer device, a load port, and a method for removing electricity from a substrate in a transfer container.

  In order to achieve the above-mentioned object, in the mini-environment substrate transfer device of the present invention, a part of the casing is mounted on a side plate that is a part of the outer wall of the casing and a transfer container mounted on which the substrate transfer container is mounted. Container, an opening formed in the side plate that comes into contact with the transport container mounted on the transport container mounting section, and a transport container lateral lid that opens and closes the lateral cover of the transport container mounted on the transport container mounting section through the opening And an opening / closing mechanism, and an ion air discharge means for discharging ion air toward the opening in the vicinity of the opening formed in the side plate inside the casing of the load port. It shall be provided.

  In the mini-environment substrate transport apparatus of the present invention, when the transport container storing the substrate is mounted on the transport container mounting portion of the load port, the transport container lateral lid opening / closing mechanism causes the opening to be formed in the side plate. The horizontal lid of the transport container can be opened from the inside of the housing. In that case, since the internal space of the housing of the mini-environment substrate transfer device and the internal space of the transfer container communicate with each other through the opening, the opening from the ion air discharge means provided in the vicinity of the opening The ion air can be supplied to the inside of the transfer container by discharging the ion air toward. Therefore, it is possible to sufficiently eliminate the charge of the substrate stored in the transfer container.

  According to the present invention, when the transport container of the substrate is mounted on the transport container mounting portion of the load port, it is possible to sufficiently remove static electricity charged on the substrate stored in the transport container.

The figure which showed the example of the schematic structure of the miniene apparatus which concerns on embodiment of this invention with the external appearance perspective view. The figure which showed the example of the schematic structure inside the miniene apparatus which concerns on embodiment of this invention with the side view. The figure which showed the example of the schematic structure inside the miniene apparatus which concerns on embodiment of this invention with the top view. The figure which showed the example of the structure of the load port attached to the housing | casing of the miniene apparatus which concerns on embodiment of this invention with the front view from the housing | casing inner side. The figure which showed the example of the structure of the load port with the perspective view. The figure which showed the example of the structure of a mini-ene control apparatus. The figure which showed the example of the processing flow of the drive control of the ionizer by a miniene control apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In the present embodiment, the mini-environment substrate transfer device is abbreviated as “mini-en device”. In the present embodiment, it is assumed that the substrate to be transported by the mini-en device is a wafer made of silicon or the like in the process of manufacturing an integrated circuit.

  First, the schematic structure of the mini-en device will be described with reference to FIGS. Here, FIG. 1 is a perspective view showing an example of a schematic structure of a mini-en device according to an embodiment of the present invention, and FIG. 2 is a side view showing an example of a schematic structure inside the mini-ene device. FIG. 3 is a top view showing an example of the schematic structure inside the mini-en device.

  As shown in FIGS. 1, 2, and 3, the mini-en device 1 is provided such that one surface of the housing 11 is in contact with the substrate processing apparatus 2. Here, the substrate processing apparatus 2 is an apparatus that performs processes such as impurity implantation, film formation, etching, cleaning, and inspection on the wafer 31 in the process of manufacturing an integrated circuit.

  Further, inside the housing 11 of the mini-en device 1, there are a filter fan unit 12 (not shown in FIG. 3), a mini-en control device 13 (not shown in FIG. 2), a transfer robot 14, an ionizer 15, and an ion air discharge nozzle 16 ( As described above, the illustration is omitted in FIG. Here, the filter fan unit 12 includes a blower fan 121 and a high-performance dust filter (not shown), and supplies clean downflow air with a predetermined degree of cleanliness inside the housing 11.

  Moreover, the load port 10 is normally attached to the outer wall of the surface facing the surface of the housing 11 with which the substrate processing apparatus 2 contacts. An opening (not shown) for attaching the load port 10 is provided in the outer wall portion of the housing 11, and the opening is closed by attaching the load port 10. Therefore, the load port 10 substantially constitutes a part of the outer wall of the housing 11. In FIG. 1, three load ports 10 are attached.

  The lower part of the load port 10 is configured by a FOUP mounting base 100 for mounting the FOUP 3, and the upper part thereof is configured by a side plate 102 that closes the opening of the housing 11.

  The FOUP 3 is a transport container that hermetically stores the wafer 31, and is used to transport the wafer 31 processed by a certain substrate processing apparatus 2 to another substrate processing apparatus 2. The external specifications of the FOUP 3 are standardized by SEMI (Semiconductor Equipment and Materials International), and according to this, a slot for storing a plurality of wafers 31 (for example, 25 sheets) is provided in the FOUP 3. In addition, an opening for taking in and out the wafer 31 and a horizontal lid 30 for closing the opening are provided on one side surface of the FOUP 3.

  The FOUP mounting base 100 is provided with a FOUP fixing plate 101 on which the FOUP 3 is placed and fixed, and a plate moving mechanism 104 that moves the FOUP fixing plate 101 toward or away from the side plate 102. Yes.

  A protrusion is formed at a predetermined position on the upper surface of the FOUP fixing plate 101, and a recess that engages with the protrusion is formed at a predetermined position on the bottom surface of the FOUP 3 (not shown). Therefore, when the FOUP 3 is placed on the FOUP fixing plate 101, the FOUP 3 is fixed to the FOUP fixing plate 101 by engaging the protrusions and the recesses with each other. At this time, the FOUP 3 is placed and fixed on the FOUP fixing plate 101 so that the surface on which the horizontal lid 30 is provided faces the side plate 102.

  When the FOUP 3 is placed and fixed on the FOUP fixing plate 101, the plate moving mechanism 104 moves the FOUP fixing plate 101 toward the side plate 102 to place and fix the FOUP 3 on the FOUP fixing plate 101. Is pressed against the side plate 102. Hereinafter, pressing the FOUP 3 against the side plate 102 as described above is referred to as mounting the FOUP 3 on the FOUP mounting base 100.

  On the other hand, when the FOUP 3 is mounted on the FOUP mounting base 100, the side plate 102 is formed with a FOUP communication opening 103 at a portion where the FOUP 3 contacts. Further, the load port 10 includes a port door 105 for closing the FOUP communication opening 103 when the FOUP 3 is not mounted on the FOUP mounting base 100.

  In this case, the key cover for opening the horizontal cover 30 is provided in the horizontal cover 30 of the FOUP 3, and a protruding key is provided outside the port door 105 (not shown). That is, when the FOUP 3 is pressed against the side plate 102, the protruding key provided on the outside of the port door 105 blocking the FOUP communication opening 103 is inserted into the key hole provided on the lateral cover 30 of the FOUP 3. In this state (not shown), the side cover 30 of the FOUP 3 can be opened from the port door 105 side, that is, from the inside of the housing 11 by the key.

  Therefore, the load port 10 includes a FOUP horizontal lid opening / closing mechanism (not shown) as a mechanism for opening and closing the horizontal lid 30 of the FOUP 3 from the inside of the housing 11. As will be described later, the FOUP horizontal lid opening / closing mechanism opens and closes the FOUP 3 horizontal lid 30 and the port door 105 together. However, the FOUP horizontal lid opening / closing mechanism allows the FOUP horizontal lid opening / closing mechanism to be opened and closed. When the port door 105 is opened, the internal space of the FOUP 3 and the internal space of the housing 11 of the mini-en device 1 are in communication with each other through the FOUP communication opening 103.

  Referring to FIG. 3, the load port 10 on the right side is not mounted with the FOUP 3 and the port door 105 is closed. The center load port 10 is mounted with the FOUP 3, and the side cover 30 and the port of the FOUP 3. A state in which the door 105 is opened is depicted in the load port 10 on the left side where the FOUP 3 is mounted and the side cover 30 and the port door 105 of the FOUP 3 are closed.

  The transfer robot 14 includes a robot hand 141 that sucks and holds the wafer 31 from the back surface or holds the edge of the wafer 31, and the robot hand 141 can freely rotate and expand and contract in a horizontal plane and vertically. It can be moved up and down. Further, the transfer robot 14 includes a robot traveling track 142 provided on the floor of the housing 11 in parallel to the wall surface of the housing 11 to which the load port 10 is attached. The support of the robot hand 141 is a robot traveling track. 142 can be moved freely.

  Accordingly, when the horizontal cover 30 and the port door 105 of the FOUP 3 are opened by the FOUP horizontal lid opening / closing mechanism, the transfer robot 14 inserts the robot hand 141 into the FOUP 3 through the FOUP communication opening 103 and the robot hand 141. Thus, the wafer 31 can be adsorbed or held freely.

  Therefore, the transfer robot 14 inserts the robot hand 141 into the FOUP 3, sucks or grips the wafer 31, removes the wafer 31 from the FOUP 3, and further removes the taken wafer 31 from the substrate processing apparatus 2. To 21. On the other hand, the transfer robot 14 sucks or grips the processed wafer 31 placed on the substrate transfer table 21 by the robot hand 141 and transfers it to the FOUP 3.

  In this embodiment, the ionizer 15 and the ion air discharge nozzle 16 are attached to the load port 10 that hits the inside of the housing 11. Here, the ionizer 15 includes, for example, an air pump and a discharge needle, ionizes the compressed air by applying a high voltage to the discharge needle under an atmosphere of compressed air generated by the air pump, and the ionized compressed air ( Hereinafter, ion air) is discharged from the ion air discharge nozzle 16.

  At this time, the ion air discharge nozzle 16 is provided in the vicinity of the FOUP communication opening 103 so that the ion air discharge port faces the FOUP communication opening 103. Accordingly, the ion air discharged from the ion air discharge nozzle 16 is supplied into the FOUP 3 through the FOUP communication opening 103. As a result, the ion air reaches the inside of the FOUP 3, and the static electricity of the wafer 31 housed in the FOUP 3 is well removed.

  Next, the structure of the load port 10 according to the embodiment of the present invention will be described in detail with reference to FIGS. 4 and 5. 4 is a diagram showing an example of the structure of the load port 10 attached to the casing 11 of the mini-en device 1 in a front view from the inside of the casing 11. FIG. 5 is an example of the structure of the load port 10. FIG. The following description partially overlaps with the above description.

  As shown in FIG. 4, a load port mounting opening 111 is provided in advance on the side wall of the housing 11 of the mini-en device 1 at a position where the load port 10 is mounted. It is attached to the housing 11 so as to close the port attachment opening 111. Further, a FOUP communication opening 103 is formed in the side plate 102 of the load port 10, and the FOUP communication opening 103 is normally closed by a port door 105 of the load port 10.

  4 depicts a state in which the port door 105 is opened and is further slid to the lower retracted position. As described above, the horizontal cover 30 of the FOUP 3 is opened together with the port door 105. Therefore, in FIG. 4, the wafer 31 stored in the FOUP 3 is shown through the FOUP communication opening 103. Yes. Here, the retreat position of the port door 105 is set to a position that does not cause an obstacle when the robot hand 141 of the transfer robot 14 moves the wafer 31 in and out of the FOUP 3.

  Next, as newly shown in FIGS. 4 and 5, the load port 10 includes a FOUP lateral lid opening / closing mechanism 106 that opens and closes the lateral lid 30 and the port door 105 of the FOUP 3. That is, the FOUP horizontal lid opening / closing mechanism 106 supports the port door 105, and when the FOUP 3 is not mounted on the FOUP mounting base 100, the port door 105 is pressed against the side plate 102 of the FOUP communication opening 103 to communicate with the FOUP. The opening 103 is closed. When the FOUP 3 is mounted on the FOUP mounting base 100, the FOUP lateral lid opening / closing mechanism 106 unlocks the key of the lateral lid 30 of the FOUP 3, and the port door 105 supports the lateral lid 30 in the state where the port is opened. The door 105 and the horizontal lid 30 are moved in a direction away from the side plate 102, and further moved to a lower retreat position. As a result, the internal space of the FOUP 3 communicates with the internal space of the housing 11.

  An ionizer 15 is attached to both sides of the load port 10, and an ion air discharge nozzle 16 that discharges ion air generated by the ionizer 15 is provided in the vicinity of both sides of the FOUP communication opening 103. At this time, since a plurality of ion air discharge ports are provided in the ion air discharge nozzle 16 toward the FOUP communication opening 103, the ion air discharged from the ion air discharge nozzle 16 can be spread into the FOUP 3.

  It should be noted that the ionizer 15 and the ion air discharge nozzle 16 are provided at positions that do not hinder the movement when the port door 105 moves away from the side plate 102 and moves to the lower retreat position.

  Further, as shown in FIGS. 4 and 5, an electrostatic potential sensor 17 is attached to an upper position of the port door 105. The electrostatic potential sensor 17 detects the electrostatic potential charged on the wafer 31 stored in the FOUP 3 when the horizontal cover 30 and the port door 105 of the FOUP 3 are opened and the port door 105 moves to a predetermined retracted position. Measure by the principle of induction.

  Here, the electrostatic potential sensor 17 is attached to the upper position of the port door 105. However, the attachment position is in the vicinity of the FOUP communication opening 103, and the robot hand 141 of the transfer robot 14 removes the wafer 31 from the FOUP 3. It may be anywhere as long as it does not become an obstacle when taking in and out.

  Next, a method for driving the ionizer 15 in the mini-en device 1 will be described. Here, FIG. 6 is a diagram showing an example of the configuration of the mini-ene control device 13, and FIG. 7 is a diagram showing an example of a processing flow of drive control of the ionizer 15 by the mini-ene control device 13.

  As shown in FIG. 6, the mini-en control device 13 according to the present embodiment includes a central processing unit (CPU) 131, a storage unit 132 including an integrated circuit RAM (Random Access Memory), a hard disk device, and the like. An input / output IF (Interface) unit 133 connected to the ionizer driving unit 151, the electrostatic potential sensor 17, and the like, a communication unit 134 connected to the transport robot control unit 140, the load port control unit 107, and the like are included.

  Here, the ionizer driving unit 151 is configured to be included in the ionizer 15, and controls on / off of the ionizer driving according to a signal supplied from the input / output IF unit 133. That is, when the ionizer driving unit 151 receives an ionizer driving on signal, the ionizer driving unit 151 generates ion air by driving the air pump and applying a high voltage to the discharge needle. When the ionizer drive-off signal is received, the generation of ion air is stopped by stopping the application of a high voltage to the discharge needle for driving the air pump.

  The transfer robot control unit 140 is configured to be included in the transfer robot 14 and appropriately drives and controls the robot hand 141 and the like based on a predetermined format message or data transmitted from the communication unit 134. The position information and data indicating the control state are transmitted to the communication unit 134. Similarly, the load port control unit 107 is configured to be included in the load port 10 and appropriately controls driving of the FOUP horizontal lid opening / closing mechanism 106 and the like based on a message or data in a predetermined format transmitted from the communication unit 134. At the same time, data indicating the driving state is transmitted to the communication unit 134.

  The communication specification between the communication unit 134 and the transfer robot control unit 140 or the load port control unit 107 may be wired communication such as Ethernet (registered trademark), or Bluetooth (registered trademark). The wireless communication specification may be used. Further, the communication unit 134 and the input / output IF unit 133 are not particularly distinguished, and both may be the same communication unit 134 or the input / output IF unit 133.

  The storage unit 132 stores various programs and data for controlling the transport robot 14, the FOUP horizontal lid opening / closing mechanism 106, the ionizer 15, and the like. The CPU 131 reads out and executes the program and data from the storage unit 132, thereby realizing predetermined functions given in advance to the transfer robot 14, the FOUP horizontal lid opening / closing mechanism 106, the ionizer 15, and the like.

  The ionizer drive control process is a process for controlling the start and stop of the drive of the ionizer 15, as shown in FIG. When the CPU 131 detects the opening of the horizontal cover 30 of the FOUP 3 (step S11), the CPU 131 starts driving the ionizer 15 (step S12).

  Here, the CPU 131 detects the opening of the horizontal cover 30 of the FOUP 3 by receiving the message “opening of the horizontal cover” transmitted from the load port control unit 107 via the communication unit 134. When the FOUP horizontal lid opening / closing mechanism 106 finishes moving the FOUP horizontal lid 30 and the port door 105 together to the predetermined retraction position, the load port control unit 107 displays a message “Opening of the horizontal lid”. Transmit to the communication unit 134.

  When the CPU 131 starts driving the ionizer 15, the CPU 131 transmits a signal instructing driving of the ionizer 15 to the ionizer driving unit 151 via the input / output IF unit 133. When receiving the signal, the ionizer driving unit 151 drives the air pump of the ionizer 15 and applies a high voltage to the discharge needle. As a result, ion air is discharged from the ion air discharge nozzle 16.

  Next, the CPU 131 determines whether or not the control mode for driving the ionizer 15 is time control (step S13). Here, it is assumed that the control mode for driving the ionizer 15 includes time control and potential control, and the control mode is set in advance using buttons, switches, or the like provided in the mini-en control device 13. It shall be.

  Therefore, when the control mode is time control (Yes in step S13), the CPU 131 sets a predetermined time in an elapsed timer incorporated therein (step S14). Here, the predetermined time refers to the time until the static electricity charged on the wafer 31 stored in the FOUP 3 is discharged when ion air is discharged from the ion air discharge nozzle 16, and is determined experimentally in advance. It is.

  Next, the CPU 131 determines whether or not the set time set in the timer has elapsed (step S15). If it has not elapsed (No in step S15), the CPU 131 waits until it elapses. (Yes in step S15), the drive of the ionizer 15 is stopped (step S18).

  When the CPU 131 stops driving the ionizer 15, the CPU 131 transmits a signal instructing to stop driving the ionizer 15 to the ionizer driving unit 151 via the input / output IF unit 133. When receiving the signal, the ionizer driving unit 151 stops driving the air pump of the ionizer 15 and applying a high voltage to the discharge needle. As a result, the discharge of ion air from the ion air discharge nozzle 16 is stopped.

  On the other hand, if the control mode of driving of the ionizer 15 is not time control (No in step S13), that is, if it is potential control, the CPU 131 passes through the input / output IF unit 133 and the electrostatic potential sensor 17. Then, the potential detected by the electrostatic potential sensor 17 is acquired (step S16), and it is determined whether or not the potential is equal to or lower than a predetermined threshold (step S17). As a result of the determination, if the potential is not less than or equal to the predetermined threshold value (No in step S17), it means that the electrostatic potential charged on the wafer 31 is high. A potential is acquired from the electric potential sensor 17.

  On the other hand, if the potential acquired from the electrostatic potential sensor 17 is equal to or lower than the predetermined threshold value (Yes in step S17), it is determined that the static electricity charged on the wafer 31 has been removed, and the drive of the ionizer 15 is stopped. (Step S18), the discharge of ion air from the ion air discharge nozzle 16 is stopped.

  As described above, according to this embodiment, the ion air discharge nozzle 16 is provided in the vicinity of the FOUP communication opening 103, and the ion air is discharged from the ion air discharge nozzle 16 toward the FOUP communication opening 103, that is, toward the inside of the FOUP 3. As a result, the ion air reaches the inside of the FOUP 3, and the static electricity of the wafer 31 stored in the FOUP 3 can be sufficiently removed.

  Accordingly, it becomes possible to prevent the destruction of circuit elements formed on the wafer due to the discharge of static electricity charged on the wafer 31 and the malfunction / failure of the transfer robot 14, so that an integrated circuit or the like formed on the wafer 31 can be prevented. The production yield and the reliability of the operation of the transfer robot 14 can be improved.

  Further, according to the present embodiment, the ionizer 15 always generates ion air and does not always release ion air from the ion air discharge nozzle 16, but the period for driving the ionizer 15 is controlled by the mini-en control device 13 in the FOUP 3. A period until the predetermined time elapses after the horizontal lid 30 is opened, or until the electrostatic potential of the wafer 31 stored in the FOUP 3 detected by the electrostatic potential sensor 17 becomes equal to or lower than the predetermined potential. Limited to the period. Therefore, the time for which the ionizer 15 is driven is greatly reduced as compared with the case where the ionizer 15 is always driven.

  Generally, since a high voltage is applied to the discharge needle of the ionizer 15, it is consumed in proportion to the application time. Therefore, although the discharge needle has a predetermined life, in the present embodiment, since the high voltage application time is shortened, the life is extended. As a result, in the mini-en device 1 of the present embodiment, the number of times that the discharge needle of the ionizer 15 is replaced within a predetermined period (for example, one year) can be reduced. This means that the maintenance cost of the mini-en device 1 can be reduced.

  In this embodiment, since the ionizer 15 is driven and ion air is discharged from the ion air discharge nozzle 16, the downflow of clean air from the ceiling is disturbed, and dust is easily rolled up from the transport robot 14 or the floor. . The dust causes a decrease in manufacturing yield of an integrated circuit or the like formed on the wafer 31. However, in the present embodiment, the period during which the ionizer 15 is driven, that is, the period during which ion air is discharged from the ion air discharge nozzle 16, is limited to the period during which static electricity charged on the wafer 31 is removed by the control by the mini-en control device 13. Therefore, it is realized that the influence of dust winding is minimized.

  Then, the modification about embodiment described above is demonstrated.

  In the embodiment described above, the mini-en control device 13 performs drive control of the ionizer 15 illustrated in FIG. 7, but the load port control unit 107 may perform drive control of the ionizer 15. Since the load port control unit 107 is usually configured to include a microprocessor including a CPU and a storage unit, the CPU controls the drive of the ionizer 15 corresponding to FIG. It is easy.

  In this case, the ionizer 15, the ion air discharge nozzle 16, and the electrostatic potential sensor 17 are attached to the load port 10 as shown in FIG. That is, it is assumed that the load port 10 includes an ionizer 15, an ion air discharge nozzle 16, and an electrostatic potential sensor 17.

  When the load port 10 is configured in this way, the same effect as the above-described embodiment can be obtained only by the configuration of the load port 10. That is, even if the housing 11 of the mini-en device 1, the mini-en control device 13, the transfer robot 14, etc. are conventionally commercially available, if the load port is replaced with the load port 10 of the modified example of the present embodiment. The same effects as those of the above-described embodiment can be obtained.

  As an opposite modification, the ionizer 15, the ion air discharge nozzle 16, and the electrostatic potential sensor 17 may be attached to the side wall of the housing 11 instead of being attached to the load port 10 (not shown). In this case, the drive control of the ionizer 15 is performed by the mini-en controller 13 as in the above-described embodiment.

  In the mini-en device 1 according to the modified example of the embodiment, even if the load port 10 is replaced with a commercially available load port, the same effect as the above-described embodiment can be obtained.

  In the above-described embodiment and its modifications, the substrate transferred by the transfer robot 14 in the mini-en device 1 is a silicon wafer in the process of manufacturing an integrated circuit or the like, but is not limited thereto. The substrate may be a liquid crystal display substrate or an organic EL (Electro-Luminescence) display substrate that is being manufactured.

1 Mini-en equipment 2 Substrate processing equipment 3 FOUP
DESCRIPTION OF SYMBOLS 10 Load port 11 Housing | casing 12 Filter fan unit 13 Miniene control device 14 Transfer robot 15 Ionizer 16 Ion air discharge nozzle 17 Electrostatic potential sensor 21 Substrate delivery table 30 Horizontal lid 31 Wafer 100 FOUP mounting table 101 FOUP fixed plate 102 Side plate 103 FOUP communication Opening portion 104 Plate moving mechanism 105 Port door 106 FOUP horizontal lid opening / closing mechanism 107 Load port control portion 111 Load port mounting opening portion 121 Blower fan 131 CPU
132 Storage Unit 133 Input / Output IF Unit 134 Communication Unit 140 Transfer Robot Control Unit 141 Robot Hand 142 Robot Travel Trajectory 151 Ionizer Drive Unit

Claims (9)

A housing that is provided in contact with a substrate processing apparatus that performs predetermined processing on the substrate, and that isolates outside air;
A transfer robot that is provided inside the housing, takes out the substrate from a transfer container that stores the substrate, and transfers the taken-out substrate to the substrate processing apparatus;
A mini-environment substrate transfer device comprising:
An opening that communicates the inside of the housing and the inside of the transport container when the transport container is mounted is provided in a portion of the side wall of the housing where the transport container is mounted,
A mini-environment substrate transport apparatus, wherein ion air discharge means for discharging ion air toward the opening is provided in the vicinity of the opening inside the housing. A housing that is provided in contact with a substrate processing apparatus that performs predetermined processing on the substrate, and that isolates outside air;
A side plate that is attached to the housing and forms a part of a side wall of the housing, a transport container mounting portion on which a transport container storing a substrate to be processed by the substrate processing apparatus is mounted, and the transport container mounting portion A transport container that opens and closes an opening formed in the side plate that is in contact with the transport container mounted on the container and a lateral cover of the transport container mounted on the transport container mounting part from the inside of the housing through the opening. A load port having a lateral lid opening and closing mechanism;
Provided inside the casing, and when the horizontal lid of the transfer container is opened by the transfer container horizontal lid opening / closing mechanism, the substrate stored in the transfer container is taken out of the transfer container, and the taken-out substrate is A transfer robot for transferring to a substrate processing apparatus;
A mini-environment substrate transfer device comprising:
A mini-environment substrate transport apparatus comprising ion air discharge means for discharging ion air toward the opening in the vicinity of the opening inside the casing of the side plate of the load port. A control device for controlling the start and stop of ion air discharge in the ion air discharge means;
The control device causes the ion air discharge means to start releasing the ion air when it detects the opening of the horizontal lid of the transfer container, and then discharges the ion air to the ion air discharge means when a predetermined time has elapsed. The mini-environment substrate transfer apparatus according to claim 2, wherein: An electrostatic potential sensor that is provided in the vicinity of the opening inside the housing of the side plate of the load port, and that detects the electrostatic potential charged in the substrate housed in the transfer container;
A control device for controlling start and stop of ion air discharge by the ion air discharge means;
And further,
When the controller detects the opening of the horizontal lid of the transport container, the control device causes the ion air discharge means to start discharging the ion air, and then the potential detected by the electrostatic potential sensor becomes a predetermined potential or less. 3. The mini-environment substrate transfer apparatus according to claim 2, wherein the ion air discharge means stops the discharge of the ion air. A housing that is provided in contact with a substrate processing apparatus that performs predetermined processing on the substrate, and that isolates outside air;
A transfer robot that is provided inside the housing, takes out the substrate from a transfer container that stores the substrate, and transfers the taken-out substrate to the substrate processing apparatus;
A load port used for a mini-environment substrate transfer device comprising:
A side plate attached to the housing and constituting a part of a side wall of the housing;
A transport container mounting portion on which the transport container is mounted;
An opening formed in the side plate in contact with the transport container mounted on the transport container mounting section;
A transport container lateral cover opening and closing mechanism for opening and closing the lateral cover of the transport container mounted on the transport container mounting part from the inside of the housing through the opening;
A load port comprising ion air discharge means for discharging ion air toward the opening in the vicinity of the opening inside the casing of the side plate. A control device for controlling the start and stop of ion air discharge in the ion air discharge means;
The control device causes the ion air discharge means to start releasing the ion air when it detects the opening of the horizontal lid of the transfer container, and then discharges the ion air to the ion air discharge means when a predetermined time has elapsed. The load port according to claim 5, wherein the load port is stopped. An electrostatic potential sensor that is provided in the vicinity of the opening and detects the electrostatic potential charged on the substrate housed in the transfer container;
A control device for controlling start and stop of ion air discharge by the ion air discharge means;
And further,
When the controller detects the opening of the horizontal lid of the transport container, the control device causes the ion air discharge means to start discharging the ion air, and then the potential detected by the electrostatic potential sensor becomes a predetermined potential or less. 6. The load port according to claim 5, wherein when the ion air is released, the ion air discharge unit stops the discharge of the ion air. A housing that is provided in contact with a substrate processing apparatus that performs predetermined processing on the substrate, and that isolates outside air;
A side plate that is attached to the housing and forms a part of a side wall of the housing, a transport container mounting portion on which a transport container storing a substrate to be processed by the substrate processing apparatus is mounted, and the transport container mounting portion A transport container that opens and closes an opening formed in the side plate that is in contact with the transport container mounted on the container and a lateral cover of the transport container mounted on the transport container mounting part from the inside of the housing through the opening. A load port having a lateral lid opening and closing mechanism;
Provided inside the casing, and when the horizontal lid of the transfer container is opened by the transfer container horizontal lid opening / closing mechanism, the substrate stored in the transfer container is taken out of the transfer container, and the taken-out substrate is A transfer robot for transferring to a substrate processing apparatus;
Ion air discharge means provided near the opening of the side plate inside the housing of the load port, and discharges ion air toward the opening;
A control device for controlling start and stop of ion air discharge by the ion air discharge means;
A method for neutralizing a substrate in a transport container in a mini-environment substrate transport apparatus comprising:
The control device causes the ion air discharge means to start releasing the ion air when it detects the opening of the horizontal lid of the transfer container, and then discharges the ion air to the ion air discharge means when a predetermined time has elapsed. The method of neutralizing the substrate in the transport container is characterized by stopping the operation. A housing that is provided in contact with a substrate processing apparatus that performs predetermined processing on the substrate, and that isolates outside air;
A side plate that is attached to the housing and forms a part of a side wall of the housing, a transport container mounting portion on which a transport container storing a substrate to be processed by the substrate processing apparatus is mounted, and the transport container mounting portion A transport container that opens and closes an opening formed in the side plate that is in contact with the transport container mounted on the container and a lateral cover of the transport container mounted on the transport container mounting part from the inside of the housing through the opening. A load port having a lateral lid opening and closing mechanism;
Provided inside the casing, and when the horizontal lid of the transfer container is opened by the transfer container horizontal lid opening / closing mechanism, the substrate stored in the transfer container is taken out of the transfer container, and the taken-out substrate is A transfer robot for transferring to a substrate processing apparatus;
An electrostatic potential sensor that is provided in the vicinity of the opening inside the housing of the side plate of the load port, and that detects the electrostatic potential charged in the substrate housed in the transfer container;
Ion air discharge means provided near the opening inside the casing of the side plate of the load port, and discharges ion air toward the opening;
A control device for controlling start and stop of ion air discharge by the ion air discharge means;
A method for neutralizing a substrate in a transport container in a mini-environment substrate transport apparatus comprising:
When the controller detects the opening of the horizontal lid of the transport container, the control device causes the ion air discharge means to start discharging the ion air, and then the potential detected by the electrostatic potential sensor becomes a predetermined potential or less. When this occurs, the ion air discharging means stops the discharge of the ion air.

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