CN1099826C - 单元部件在印刷电路板上的安装结构 - Google Patents

单元部件在印刷电路板上的安装结构 Download PDF

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CN1099826C
CN1099826C CN97125890A CN97125890A CN1099826C CN 1099826 C CN1099826 C CN 1099826C CN 97125890 A CN97125890 A CN 97125890A CN 97125890 A CN97125890 A CN 97125890A CN 1099826 C CN1099826 C CN 1099826C
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printed board
pcb
mounting
assembly
circuit board
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CN1186410A (zh
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渡边英树
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10871Leads having an integral insert stop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明提供了一种单元部件在印刷电路板上的安装结构,在单元部件的印刷电路板的配设侧,及在焊接接合区上焊接安装脚,因而易于向印刷电路板安装单元部件,而且修理、更换单元部件时,不用卸下印刷电路板即可以进行,操作简单、容易。

Description

单元部件在印刷电路板上的安装结构
本发明涉及一种组装便携式电话机等的电子机器中的收发报RF单元等的单元部件的安装结构。
请参阅图5、图6,该图所示为组装在现有便携式电话机等的电子机器中的单元部件的安装结构,该结构是这样的,在可以焊接的金属制的框体30上,设有从四角向下方延伸的安装脚31,该安装脚31的下端设有连接部32。
在上述框体30内,图中未示,包括设有各种电气部件的印刷电路板,及安装插头33的收发报RF单元的单元部件P。
请参阅图5、图6所示,在便携式电话机等的电子机器K的外壳34内安装有印刷电路板35,在其下面侧形成有导电图形(图中未示),在该导电图形上连接各种电气部件(图中未示),而形成为所希望的电路。
印刷电路板35,在相对单元部件P的框体30的连接部32的位置设有孔36,在没有导电图形的一面侧,配置设有插座37,该插座37的端子部与反面侧形成有导电图形连接。
单元部件P的插头33插入插座37内,同时将框体30的连接部32组合在印刷电路板35的孔36中,从而使连接部32通过孔36,然后,翻转印刷电路板35,在印刷电路板35的导电图形上焊接该连接部32,将单元部件P的印刷电路板35载置在相对外壳34的侧壁34a的导电图形侧,且位于外壳34的安装台34b上,以螺钉38与外壳34相固定。
电子机器K在使用中,当单元部件P发生焊锡剥落,而需要修理或更换单元部件P时,需卸下螺钉38,将印刷电路板35拆卸至外壳34外。
然后,再焊开框体30的连接部32与印刷电路板35的焊锡,取出单元部件P进行修理。
修理之后,将上述的单元部件P的插头33插入插座37,同时连接部32插通在孔36中,再翻转焊接印刷电路板35。
接着,将印刷电路板35以螺钉38固定在外壳34上,如此进行修理或更换单元部件P。
上述现有的单元部件的安装结构,其是将单元部件P配设在没有导电图形的一侧面,框体30的连接部32插通在印刷电路板35的孔36中,再翻转印刷电路板35进行焊接,因此单元部件P的插入和焊接十分麻烦,且花费操作时间。
再者,其具有插头33和插座37,该插头33和插座37大多数为偏移正规的安装位置,在组合装配插头33和插座37时,连接部32与孔36不相一致,而不能相互插通,给装配操作带来很多麻烦。
另外,现有的单元部件P在进行修理、更换时,必须取下印刷电路板35,这样给安装带来很多麻烦,当取下单元部件P时,焊锡会堵塞孔36,则再次插入单元部件P时会造成困难,且花费装配作业时间。
由此可见,上述现有的单元部件的安装结构仍存在有诸多的缺陷,而亟待加以改进。有鉴于上述现有的单元部件的安装结构存在的弊端,本发明人基于丰富的实务经验及专业知识,经过不断的研究、设计,并经反复试作样品及改进后,终于创设出本发明。
本发明的主要目的在于,克服现有的单元部件的安装结构存在的缺陷,而提供一种新型结构的单元部件的安装结构,使其在向单元部件的印刷电路板的配设侧,及在焊接接合区上焊接安装脚,易于向印刷电路板安装单元部件,而且修理、更换单元部件时,不用卸下印刷电路板即可以进行,而可减少作业时间,使操作简单、容易。
本发明的目的是由以下技术方案实现的。依据本发明提出的一种单元部件在印刷电路板上的安装结构,其特征在于:单元部件具有包封电子部件的金属外壳,所述金属外壳具有安装脚,所述安装脚放在印刷电路板上要安装单元部件的一个侧面上设置的焊接接合区中,所述安装脚和所述印刷电路板上的一个侧面上设置的所述焊接接合区焊接在一起。
本发明的目的还可由以下技术措施来进一步实现。前述的单元部件的安装结构,其中所述的安装脚的端部设有凸部,该凸部嵌合在上述印刷电路板设置的凹部中。
本发明与现有技术相比具有明显的优点和积极效果。由以上的技术方案可知,本发明单元部件的安装结构,由于其在单元部件的印刷电路板的配设侧,及在焊接接合区上焊接安装脚,使得向印刷电路板安装单元部件容易,而且修理、更换单元部件时,不用卸下印刷电路板即可以进行,从而使操作简单、容易。
再者,借由安装脚的凸部嵌合在印刷电路板的凹部,可以决定向印刷电路板安装的单元部件的位置,而能够临时定位,使焊接作业容易。
本发明的具体结构由以下实施例及其附图详细给出。
图1是本发明单元部件的安装结构,及在电子机器中安装单元部件的主要结构剖面图。
图2是本发明单元部件的安装结构,及其向单元部件的印刷电路板安装前的立体图。
图3是本发明单元部件的安装结构,及其向单元部件的印刷电路板安装后的立体图。
图4是本发明单元部件的安装结构的另一实施例,及其向单元部件的印刷电路板安装前的立体图。
图5是现有的单元部件的安装结构,及在电子机器中组装单元部件的主要结构剖面图。
图6是现有的单元部件的安装结构,及其向单元部件的印刷电路板安装前的立体图。
以下结合附图及较佳实施例,对依据本发明提出的新型结构的单元部件的安装结构的具体结构、特征及其功效,进行详细说明。
如图1至图3所示,为本发明单元部件的安装结构的一实施例。本实施例例举了一种适用于向一个电子机器的便携式电话机内装置入单元部件中的收发报RF单元。
用可以焊接的金属板形成单元部件P的框体1,该框体1从四角向下方各延伸设有安装脚2,在框体1内,图中未示,收容设有安装各种电气部件的印刷电路板5,同时,安装有插头3。
在电子机器K的外壳4内安装有印刷电路板5,在其上面形成有导电图形6,且还形成有除了露出部分的焊接接合区7之外的绝缘性的保护膜8。
该焊接结合区7,在图中仅表示为设在对应框体1的安装脚2的位置,但其也可以设在多处,在该焊接接合区7上焊接连接各种电气部件(图中未示),同时焊接连接插座9,而形成所需要的电路。
如图3所示,该单元部件P通过插头3插入插座9中,同时框体1的安装脚2的下部载置在印刷电路板5上的焊接接合区7上。
然后,将安装脚2的外侧面与焊接接合区7焊接,这样单元部件P就被安装在印刷电路板5上。
如图1所示,装有上述结构的单元部件P的印刷电路板5,其没有导电图形的一侧载置在相对于外壳4的侧壁4a的内面,且位于外壳4的安装台4b上,并以螺钉10安装固定在外壳4内。
电子机器K在使用中,当单元部件P发生焊接剥离等故障,而需要修理该单元部件P或更换单元部件P时,该印刷电路板5可不动,只是将框体1的安装脚2与焊接接合区7之间的焊锡焊开,取出单元部件P即可进行修理。
然后,向插座9内插入单元部件P的插头3,同时在焊接接合区7上载置安装脚2,通过在安装脚2的外侧面与焊接接合区7进行焊接,即可以进行单元部件P的修理及更换。
图4为本发明的另一实施例,该实施例在框体1的安装脚2的下端部设有凸部2a,其定位在印刷电路板5的焊接接合区7上,该焊接接合区7相对于上述凸部2a设有凹部5a,在该凹部5a内嵌合凸部2a,从而可在印刷电路板5上决定框体1的位置,假如框体1安装好,则在安装脚2的外侧端面2b与焊接接合区7相焊接。
也可以通过配置其它部件,适宜地选择安装脚2的焊接处。
其它结构与上述的实施例相同,相同的部件使用相同的符号,在此不再赘述。
在上述实施例中,印刷电路板5在其两面均形成有导电图形6而使用当然也是可以的。

Claims (2)

1.一种单元部件在印刷电路板上的安装结构,其特征在于:单元部件具有包封电子部件的金属外壳,所述金属外壳具有安装脚,所述安装脚放在印刷电路板上要安装单元部件的一个侧面上设置的焊接接合区中,所述安装脚和所述印刷电路板上的一个侧面上设置的所述焊接接合区焊接在一起。
2.根据权利要求1所述的单元部件在印刷电路板上的安装结构,其特征在于:所述的安装脚的端部设有凸部,该凸部嵌合在设置于上述印刷电路板的凹部中。
CN97125890A 1996-12-25 1997-12-24 单元部件在印刷电路板上的安装结构 Expired - Fee Related CN1099826C (zh)

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JP35620196A JP3410312B2 (ja) 1996-12-25 1996-12-25 ユニット部品の取付構造
JP356201/1996 1996-12-25
JP356201/96 1996-12-25

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US5907478A (en) 1999-05-25
MY117033A (en) 2004-04-30
JPH10190186A (ja) 1998-07-21
JP3410312B2 (ja) 2003-05-26
CN1186410A (zh) 1998-07-01
KR100270761B1 (ko) 2001-01-15
KR19980064571A (ko) 1998-10-07

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