CN109957774A - 成膜装置、成膜方法及有机el显示装置的制造方法 - Google Patents

成膜装置、成膜方法及有机el显示装置的制造方法 Download PDF

Info

Publication number
CN109957774A
CN109957774A CN201811009948.8A CN201811009948A CN109957774A CN 109957774 A CN109957774 A CN 109957774A CN 201811009948 A CN201811009948 A CN 201811009948A CN 109957774 A CN109957774 A CN 109957774A
Authority
CN
China
Prior art keywords
substrate
bearing part
supporting
film formation
bearing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811009948.8A
Other languages
English (en)
Chinese (zh)
Inventor
柏仓一史
石井博
细谷映之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AOI Co Ltd
Canon Tokki Corp
Original Assignee
AOI Co Ltd
Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AOI Co Ltd, Tokki Corp filed Critical AOI Co Ltd
Publication of CN109957774A publication Critical patent/CN109957774A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201811009948.8A 2017-12-26 2018-08-31 成膜装置、成膜方法及有机el显示装置的制造方法 Pending CN109957774A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0180325 2017-12-26
KR1020170180325A KR102010158B1 (ko) 2017-12-26 2017-12-26 성막장치, 성막방법 및 이를 사용한 유기 el 표시 장치의 제조방법

Publications (1)

Publication Number Publication Date
CN109957774A true CN109957774A (zh) 2019-07-02

Family

ID=67023186

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811009948.8A Pending CN109957774A (zh) 2017-12-26 2018-08-31 成膜装置、成膜方法及有机el显示装置的制造方法

Country Status (3)

Country Link
JP (1) JP7120545B2 (https=)
KR (1) KR102010158B1 (https=)
CN (1) CN109957774A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113005398A (zh) * 2019-12-20 2021-06-22 佳能特机株式会社 成膜装置、成膜方法及电子器件的制造方法
CN116043181A (zh) * 2017-11-29 2023-05-02 佳能特机株式会社 成膜装置及使用其的有机el显示装置的制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7057335B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板保持装置、基板処理装置、基板保持方法、成膜方法、及び電子デバイスの製造方法
JP7057337B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板剥離装置、基板処理装置、及び基板剥離方法
JP7299202B2 (ja) * 2020-09-30 2023-06-27 キヤノントッキ株式会社 成膜装置、基板吸着方法、及び電子デバイスの製造方法
JP7744140B2 (ja) 2021-02-26 2025-09-25 キヤノントッキ株式会社 成膜装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004176124A (ja) * 2002-11-27 2004-06-24 Ulvac Japan Ltd アライメント装置、成膜装置及びアライメント方法
WO2010106958A1 (ja) * 2009-03-18 2010-09-23 株式会社アルバック 位置合わせ方法、蒸着方法
CN109837510A (zh) * 2017-11-29 2019-06-04 佳能特机株式会社 成膜装置及使用其的有机el显示装置的制造方法
CN109837519A (zh) * 2017-11-29 2019-06-04 佳能特机株式会社 成膜装置、成膜方法及有机el显示装置的制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05343507A (ja) * 1992-06-10 1993-12-24 Fujitsu Ltd 静電吸着方法
JP2000243816A (ja) * 1999-02-22 2000-09-08 Hitachi Electronics Eng Co Ltd 基板チャック装置
WO2005091683A1 (en) 2004-03-22 2005-09-29 Doosan Dnd Co., Ltd. Substrate depositing method and organic material depositing apparatus
JP2014120740A (ja) 2012-12-19 2014-06-30 Tokyo Electron Ltd 基板処理装置、及び基板の張り付け又は剥離方法
WO2016067159A1 (en) 2014-10-28 2016-05-06 Semiconductor Energy Laboratory Co., Ltd. Functional panel, method for manufacturing the same, module, data processing device
KR102091560B1 (ko) 2015-06-12 2020-03-20 가부시키가이샤 아루박 기판 보지 장치, 성막 장치 및 기판 보지 방법
KR102490641B1 (ko) * 2015-11-25 2023-01-20 삼성디스플레이 주식회사 증착 장치 및 증착 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004176124A (ja) * 2002-11-27 2004-06-24 Ulvac Japan Ltd アライメント装置、成膜装置及びアライメント方法
WO2010106958A1 (ja) * 2009-03-18 2010-09-23 株式会社アルバック 位置合わせ方法、蒸着方法
CN109837510A (zh) * 2017-11-29 2019-06-04 佳能特机株式会社 成膜装置及使用其的有机el显示装置的制造方法
CN109837519A (zh) * 2017-11-29 2019-06-04 佳能特机株式会社 成膜装置、成膜方法及有机el显示装置的制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116043181A (zh) * 2017-11-29 2023-05-02 佳能特机株式会社 成膜装置及使用其的有机el显示装置的制造方法
CN116043181B (zh) * 2017-11-29 2025-08-22 佳能特机株式会社 成膜装置及使用其的有机el显示装置的制造方法
CN113005398A (zh) * 2019-12-20 2021-06-22 佳能特机株式会社 成膜装置、成膜方法及电子器件的制造方法
CN113005398B (zh) * 2019-12-20 2023-04-07 佳能特机株式会社 成膜装置、成膜方法及电子器件的制造方法

Also Published As

Publication number Publication date
JP7120545B2 (ja) 2022-08-17
KR102010158B1 (ko) 2019-08-12
KR20190078432A (ko) 2019-07-04
JP2019117922A (ja) 2019-07-18

Similar Documents

Publication Publication Date Title
CN109837504B (zh) 成膜装置、成膜方法、以及电子设备制造方法
CN109837510B (zh) 成膜装置及使用其的有机el显示装置的制造方法
CN109837505B (zh) 成膜装置、成膜方法以及有机el显示装置的制造方法
JP7429723B2 (ja) 成膜装置、成膜方法、及び電子デバイス製造方法
CN109972084B (zh) 成膜装置、成膜方法、以及电子设备的制造方法
CN109837506B (zh) 成膜装置、成膜方法以及有机el显示装置的制造方法
CN109957774A (zh) 成膜装置、成膜方法及有机el显示装置的制造方法
JP7138757B2 (ja) 成膜装置、及び電子デバイスの製造方法
CN109972083A (zh) 静电吸盘、成膜装置、基板吸附/剥离方法、成膜方法以及电子设备的制造方法
KR102128888B1 (ko) 성막 장치, 성막 방법, 및 전자 디바이스 제조방법
JP7241048B2 (ja) 基板支持装置および成膜装置
CN109913842B (zh) 静电吸盘装置、掩模安装装置、成膜装置、成膜方法及电子设备的制造方法
CN109957775B (zh) 静电吸盘、成膜装置、基板的保持及分离方法、成膜方法
CN109972085B (zh) 静电吸盘、成膜装置、基板的吸附方法、成膜方法以及电子设备的制造方法
JP2021098884A (ja) 成膜装置、成膜方法及び電子デバイスの製造方法
KR20210029899A (ko) 흡착 장치, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
KR102050688B1 (ko) 마스크 부착장치, 성막장치, 성막방법, 및 전자 디바이스의 제조방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190702

WD01 Invention patent application deemed withdrawn after publication