CN109957350B - 各向异性导电膜、用于形成其的组合物及其应用 - Google Patents
各向异性导电膜、用于形成其的组合物及其应用 Download PDFInfo
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- CN109957350B CN109957350B CN201711341000.8A CN201711341000A CN109957350B CN 109957350 B CN109957350 B CN 109957350B CN 201711341000 A CN201711341000 A CN 201711341000A CN 109957350 B CN109957350 B CN 109957350B
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- C—CHEMISTRY; METALLURGY
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
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WO2014109303A1 (ja) * | 2013-01-11 | 2014-07-17 | 川崎化成工業株式会社 | アントラセン化合物及びその光重合増感剤としての用途 |
CN103998422A (zh) * | 2013-09-02 | 2014-08-20 | 北京英力科技发展有限公司 | 环戊二酮肟酯及其应用 |
CN104109486A (zh) * | 2013-04-19 | 2014-10-22 | 迪睿合电子材料有限公司 | 各向异性导电膜、连接方法及接合体 |
CN107011810A (zh) * | 2017-05-05 | 2017-08-04 | 江苏海川卓越密封材料有限公司 | 辐射固化密封胶组合物及其制备方法 |
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WO2014109303A1 (ja) * | 2013-01-11 | 2014-07-17 | 川崎化成工業株式会社 | アントラセン化合物及びその光重合増感剤としての用途 |
CN104109486A (zh) * | 2013-04-19 | 2014-10-22 | 迪睿合电子材料有限公司 | 各向异性导电膜、连接方法及接合体 |
CN103998422A (zh) * | 2013-09-02 | 2014-08-20 | 北京英力科技发展有限公司 | 环戊二酮肟酯及其应用 |
CN107011810A (zh) * | 2017-05-05 | 2017-08-04 | 江苏海川卓越密封材料有限公司 | 辐射固化密封胶组合物及其制备方法 |
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