CN109945327A - A kind of mainboard and air-conditioning - Google Patents
A kind of mainboard and air-conditioning Download PDFInfo
- Publication number
- CN109945327A CN109945327A CN201910225623.1A CN201910225623A CN109945327A CN 109945327 A CN109945327 A CN 109945327A CN 201910225623 A CN201910225623 A CN 201910225623A CN 109945327 A CN109945327 A CN 109945327A
- Authority
- CN
- China
- Prior art keywords
- condenser pipe
- mainboard
- transferring medium
- capillary
- heat transferring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004378 air conditioning Methods 0.000 title claims abstract description 13
- 238000001704 evaporation Methods 0.000 claims abstract description 27
- 230000008020 evaporation Effects 0.000 claims abstract description 27
- 239000011159 matrix material Substances 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 abstract description 10
- 230000002708 enhancing effect Effects 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The invention belongs to electrical accessorie field, being related to a kind of mainboard and air-conditioning, mainboard includes the matrix equipped with chip；Constitute the evaporation tube and condenser pipe of heat transferring medium closed circuit, wherein evaporation tube protrudes into matrix and extends along the edge of chip, and condenser pipe is set to the outside of matrix；The capillary being arranged in series between the liquid inlet of evaporation tube and the outlet end of condenser pipe.By being arranged in series capillary between the outlet end of condenser pipe and the liquid inlet of evaporation tube, when the liquid heat transferring medium positioned at condenser pipe being made to enter capillary, it is partially converted to gaseous state, form the heat transferring medium with gas-liquid two-phase, gaseous heat transferring medium promotes the mobility of heat transferring medium entirety, enhancing heat transferring medium is exchanged with the heat of matrix, improves the heat dissipation effect of mainboard.
Description
Technical field
The present invention relates to electrical accessorie technical field, in particular to a kind of mainboard and air-conditioning.
Background technique
Under summer high temperature environment, the chip cooling of mainboard is bad, is easy to appear failure.It is inevitable when mainboard breaks down
The operation that will affect whole device, particularly with the mainboard of air-conditioning, the bad refrigeration raising frequency that will lead to that radiates is slow, difficult, control logic
It easily reports an error, refrigerating capacity is insufficient, and operation power consumption is big, causes user and complains.In this case, it is usually set on the matrix of mainboard
The pipeline of heat transferring medium can be transmitted by, which setting, radiates, but its heat dissipation effect is still up for improving.
Summary of the invention
The embodiment of the invention provides a kind of mainboard and air-conditionings, to improve the heat dissipation effect of mainboard.For the reality to disclosure
The some aspects for applying example have a basic understanding, and simple summary is shown below.The summarized section is not extensive overview,
It is not intended to identify key/critical component or describes the protection scope of these embodiments.Its sole purpose is with simple shape
Some concepts are presented in formula, in this, as the preamble of following detailed description.
According to the first aspect of the embodiments of the present disclosure, a kind of mainboard is provided, comprising:
Matrix equipped with chip；
Constitute the evaporation tube and condenser pipe of heat transferring medium closed circuit, wherein the evaporation tube protrudes into described matrix and edge
The edge of the chip extends, and the condenser pipe is set to the outside of described matrix；
The capillary being arranged in series between the liquid inlet of the evaporation tube and the outlet end of the condenser pipe.
In some optional embodiments, the condenser pipe is equipped with the heat dissipation knot for radiating to the condenser pipe
Structure.
In some optional embodiments, the radiator structure is inflation plate.
In some optional embodiments, the through-hole for causing air flow through is opened up in the plate face of the inflation plate.
In some optional embodiments, the bore ratio of the condenser pipe and the capillary is 2.00~3.75.
In some optional embodiments, the outflow pipeline section of the condenser pipe and the intercapillary angle are α, 90 °
180 ° of≤α <.
In some optional embodiments, the outflow pipeline section of the condenser pipe and the intercapillary angle are α, α=
90°。
According to the second aspect of an embodiment of the present disclosure, a kind of air-conditioning is provided, including any one of aforementioned alternative embodiment provides
Mainboard.
Technical solution provided in an embodiment of the present invention can include the following benefits:
By being arranged in series capillary between the outlet end of condenser pipe and the liquid inlet of evaporation tube, make positioned at condenser pipe
When liquid heat transferring medium enters capillary, it is partially converted to gaseous state, forms the heat transferring medium with gas-liquid two-phase, gaseous heat exchange
Medium promotes the mobility of heat transferring medium entirety, and enhancing heat transferring medium is exchanged with the heat of chip edge, improves mainboard
Heat dissipation effect.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is a kind of structural schematic diagram of mainboard shown according to an exemplary embodiment；
Fig. 2 is a kind of structural schematic diagram of air-conditioner outdoor unit shown according to an exemplary embodiment.
Wherein, 1, matrix；10, chip；21, condenser pipe；22, evaporation tube；3, capillary；4, inflation plate；5, shell；6, axis
Flow fan.
Specific embodiment
The following description and drawings fully show the specific embodiment of this paper, to enable those skilled in the art to reality
Trample them.The part of some embodiments and feature can be included in or replace part and the feature of other embodiments.This
The range of the embodiment of text includes equivalent obtained by the entire scope of claims and all of claims
Object.Herein, term " includes " or any other variant thereof is intended to cover non-exclusive inclusion, so that including a system
Structure, device or the equipment of column element not only include those elements, but also including other elements that are not explicitly listed, or
Person is to further include for this structure, device or the intrinsic element of equipment.Each embodiment herein is in a progressive manner
Description, each embodiment focuses on the differences from other embodiments, same and similar portion between each embodiment
Dividing may refer to each other.
The orientation or positional relationship of the instructions such as term " on ", "lower", "vertical", "horizontal", "inner", "outside" herein is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description and is described herein with simplified, rather than indication or suggestion
Signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to this
The limitation of invention.In description herein, unless otherwise specified and limited, term " connection " be shall be understood in a broad sense, for example, can be with
It is that mechanical connection or electrical connection, the connection being also possible to inside two elements can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and for the ordinary skill in the art, can understand specifically containing for above-mentioned term as the case may be
Justice.
Herein, term "and/or" is a kind of incidence relation of description object, indicates may exist three kinds of relationships.For example,
A and/or B is indicated: A or B, or, these three relationships of A and B.
Fig. 1 is a kind of structural schematic diagram of mainboard shown according to an exemplary embodiment.As shown in Figure 1, a kind of mainboard,
Matrix 1 including being equipped with chip 10；Constitute the evaporation tube 22 and condenser pipe 21 of heat transferring medium closed circuit, wherein evaporation tube 22
It protrudes into matrix 1 and extends along the edge of chip 10, condenser pipe 21 is set to the outside of matrix 1；It is arranged in series entering in evaporation tube 22
Capillary 3 between liquid end and the outlet end of condenser pipe 21.
Heat transferring medium is flowed to evaporation tube 22, and the heat absorption that chip 10 is generated becomes gaseous state, then flows to condensation
Heat release is become into liquid in pipe 21, by circulating between evaporation tube 22 and condenser pipe 21, is realized to chip 10
Heat dissipation.Capillary 3 is arranged between the liquid inlet of evaporation tube 22 and the outlet end of condenser pipe 21, when liquid heat transferring medium from
After the outlet end outflow of condenser pipe 21, into capillary 3, part heat transferring medium is converted to gaseous state, in this way, it is mixed to form air-liquid state
The heat transferring medium of conjunction, gaseous heat transferring medium can promote the mobility of heat transferring medium entirety, make the circulation power of heat transferring medium
Enhancing, so as to improve heat transferring medium to the efficient heat transfer of chip 10, promotes the heat dissipation performance of mainboard.
In actual use, the orientation adjustment of mainboard is located to the top of evaporation tube 22 for condenser pipe 21, in this way, when heat exchange
When medium enters capillary 3 from the outlet end of condenser pipe 21, gravity can enhance the mobilization dynamic of heat transferring medium, make heat transferring medium
Flow velocity increases, heat transfer effect enhancing.
Optionally, matrix 1 is PCB printed circuit board.
Optionally, the material of evaporation tube 22 and condenser pipe 21 is aluminium or copper.The material of capillary 3 is that aluminium, copper or plastic cement are soft
Pipe.In this way, the throttling expansion and pipeline arrangement of refrigerant can be taken into account, is conducive to heat transferring medium and exchanges heat with the external world.
In an embodiment of the invention, the bore ratio of condenser pipe 21 and capillary 3 is 2.00~3.75.If in pipe
Diameter ratio is higher than 3.75, then is unfavorable for the circulation of heat transferring medium；If bore ratio is lower than 2.00, it is unfavorable for the vapour of heat transferring medium
Change.Therefore, in the range of the embodiment, the heat transferring medium of the air-liquid state mixing of appropriate ratio is advantageously formed, can be promoted
The mobility of heat transferring medium entirety, and can effectively be exchanged heat with chip 10.
Optionally, the inflow pipeline section of evaporation tube 22 is protruded into from the one end at the edge of matrix 1, flows out pipeline section from the same of matrix 1
The other end at one edge stretches out, and the inflow pipeline section and outflow pipeline section of evaporation tube 22 bend in opposite directions and connect along the same edge of chip 10
It is logical.It is exchanged in this way, being conducive to heat transferring medium in evaporation tube 22 and carrying out heat with the edge of chip 10, also, avoids occupying matrix 1
Other components can be set in the two sides in the space near surface, 1 surface of matrix.
Optionally, evaporation tube 22 and capillary 3 form U-shaped structure.In this way, being saved on the basis of guaranteeing heat transfer effect empty
Between occupy.
Optionally, the inflow pipeline section of condenser pipe 21 and outflow pipeline section are straight tube and parallel arrangement.In this way, guaranteeing to exchange heat
Space hold is saved on the basis of effect.
In an embodiment of the invention, condenser pipe 21 is equipped with the radiator structure for radiating to condenser pipe 21.
Radiator structure can promote the heat dissipation of condenser pipe 21.Optionally, radiator structure is heat sink.Optionally, heat sink
For aluminum.The heat sink good heat dissipation effect of aluminum, and be not easy to be corroded.Optionally, condenser pipe 21 is protruded into from the edge of heat sink
Heat sink.In this way, being not take up the space near the plate face of heat sink.
Optionally, radiator structure is inflation plate 4.Inflation plate 4 can preferably be exchanged heat with condenser pipe 21.Optionally,
Inflation plate 4 is in series on condenser pipe 21.The plank frame of inflation plate 4 is smaller to space hold.Optionally, the edge of inflation plate 4
Equipped with line entry and tube outlet, the inflow pipeline section of condenser pipe 21 is connected to line entry, flows out pipeline section and tube outlet connects
It is logical.In this way, condenser pipe 21 is avoided to occupy the space on the outside of the plate face of inflation plate 4.
Optionally, the plate face of inflation plate 4 opens up the through-hole for causing air flow through.Air is flowed through from through-hole, and accelerating will
The heat loss that inflation plate 4 absorbs is in air.Optionally, the aperture of through-hole is 1mm~3mm.If aperture is lower than 1mm,
It is unfavorable for inflation plate 4 and transfers heat to air, if aperture is higher than 3mm, the mechanical strength of inflation plate 4 is impacted.
It is exchanged in this way, being conducive to inflation plate 4 and carrying out heat with air.
In one embodiment of the invention, part evaporation tube 22 is embedded in matrix 1.The part of insertion matrix 1 is used for and core
Piece 10 exchanges heat.
In one embodiment of the invention, the angle between outflow pipeline section and the capillary 3 of condenser pipe 21 is α, 90 °≤
180 ° of α <.When adjusting mainboard position to capillary 3 is vertical state, the effuser section of condenser pipe 21 is located at the upper of capillary 3
Side, flows out the heat transferring medium of pipeline section under the influence of gravity, can have sufficient power to flow into capillary 3.
In one embodiment of the invention, the angle between outflow pipeline section and the capillary 3 of condenser pipe 21 is α, α=
90°.When adjusting mainboard position to capillary 3 is vertical state, the outflow pipeline section of condenser pipe 21 is horizontality, is conducive to flow
The heat transferring medium for entering pipeline section flows to effuser section.Optionally, the inflow pipeline section of condenser pipe 21 and outflow pipeline section are straight tube and put down
Row.When adjusting mainboard position to capillary 3 is vertical state, the outflow pipeline section and inflow pipeline section of condenser pipe 21 are horizontal
State, the heat transferring medium for facilitating flow into pipeline section flows to effuser section, and the heat transferring medium for flowing out pipeline section can flow into capillary 3；
In addition, it is easily installed mainboard inside whole device, it is smaller to the occupancy in space.
Optionally, the inflow pipeline section of evaporation tube 22 is straight tube and parallel with outflow pipeline section, and matrix 1 is located at evaporation tube 22
Same plane.Optionally, the inflow pipeline section of condenser pipe 21 is straight tube and parallel, condenser pipe 21 and inflation plate 4 with outflow pipeline section
It is generally aligned in the same plane.In this way, it is possible to reduce occupancy of the mainboard to space.
According to a kind of air-conditioning provided in this embodiment, the mainboard provided including any one of aforementioned embodiment.Air-conditioning uses should
Mainboard, mainboard are easy to radiate, and air-conditioning can be prevented because mainboard radiates, and bad appearance refrigeration raising frequency is slow, difficult, and control logic easily reports an error,
Phenomena such as refrigerating capacity is insufficient, and operation power consumption is big, meets the use demand of user；Also, the mainboard is smaller to space hold, fits
For being arranged inside air-conditioning.
Fig. 2 is a kind of structural schematic diagram of air-conditioner outdoor unit shown according to an exemplary embodiment.As shown in Fig. 2, this
Open embodiment additionally provides a kind of air-conditioner outdoor unit, the mainboard provided including any one of aforementioned embodiment.In air-conditioner outdoor unit
The mainboard is set, mainboard is since heat dissipation effect is preferable, and air-conditioning can be prevented because mainboard radiates, and bad appearance refrigeration raising frequency is slow, difficult,
Phenomena such as control logic easily reports an error, and refrigerating capacity is insufficient, and operation power consumption is big, meets the use demand of user；Also, the mainboard pair
Space hold is smaller, suitable for the inside of air-conditioner outdoor unit is arranged in.
Optionally, empty outer outdoor unit includes shell 5, and mainboard is set in shell 5, further includes aerofoil fan 6 in shell 5.
Optionally, mainboard is set on the circulation path of the air-flow of the generation of aerofoil fan 6.In this way, the wind that aerofoil fan 6 is blown out can increase
By force to the heat dissipation effect of mainboard.
The invention is not limited to the structures for being described above and being shown in the accompanying drawings, and can not depart from its model
It encloses and carry out various modifications and change.The scope of the present invention is limited only by the attached claims.
Claims (8)
1. a kind of mainboard characterized by comprising
Matrix equipped with chip；
Constitute the evaporation tube and condenser pipe of heat transferring medium closed circuit, wherein the evaporation tube protrudes into described matrix and along described
The edge of chip extends, and the condenser pipe is set to the outside of described matrix；
The capillary being arranged in series between the liquid inlet of the evaporation tube and the outlet end of the condenser pipe.
2. mainboard according to claim 1, which is characterized in that the condenser pipe is equipped with for carrying out to the condenser pipe
The radiator structure of heat dissipation.
3. mainboard according to claim 2, which is characterized in that the radiator structure is inflation plate.
4. mainboard according to claim 3, which is characterized in that open up in the plate face of the inflation plate for causing air flow through
Through-hole.
5. mainboard according to claim 1, which is characterized in that the bore ratio of the condenser pipe and the capillary is
2.00~3.75.
6. mainboard according to claim 1, which is characterized in that between the outflow pipeline section and the capillary of the condenser pipe
Angle be α, 180 ° of 90 °≤α <.
7. mainboard according to claim 6, which is characterized in that between the outflow pipeline section and the capillary of the condenser pipe
Angle be α, α=90 °.
8. a kind of air-conditioning, which is characterized in that including mainboard such as according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910225623.1A CN109945327B (en) | 2019-03-25 | 2019-03-25 | Mainboard and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910225623.1A CN109945327B (en) | 2019-03-25 | 2019-03-25 | Mainboard and air conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109945327A true CN109945327A (en) | 2019-06-28 |
| CN109945327B CN109945327B (en) | 2024-08-16 |
Family
ID=67011582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910225623.1A Active CN109945327B (en) | 2019-03-25 | 2019-03-25 | Mainboard and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109945327B (en) |
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| CN106895728A (en) * | 2017-04-27 | 2017-06-27 | 长沙理工大学 | Horizontal variable-diameter serial and parallel channel plate type pulsating heat pipe |
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| US20180010831A1 (en) * | 2016-07-11 | 2018-01-11 | Hill Phoenix, Inc. | Valve and capillary tube system for refrigeration systems |
| CN108253829A (en) * | 2018-01-30 | 2018-07-06 | 中国科学院理化技术研究所 | Micro-channel array auxiliary driving loop heat pipe |
| CN109088128A (en) * | 2018-08-28 | 2018-12-25 | 中国电子科技集团公司第十六研究所 | A kind of battery two phase heat-radiation device and its heat dissipating method based on heat pipe principle |
-
2019
- 2019-03-25 CN CN201910225623.1A patent/CN109945327B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10197125A (en) * | 1996-12-27 | 1998-07-31 | Sharp Corp | Freezer and refrigerator |
| KR20030079553A (en) * | 2002-04-04 | 2003-10-10 | 엘지전자 주식회사 | Device for cooling to chip |
| KR100512116B1 (en) * | 2004-12-17 | 2005-09-02 | 박윤종 | A refrigerator unit |
| CN201571152U (en) * | 2009-11-13 | 2010-09-01 | 深圳创维－Rgb电子有限公司 | Radiating structure of liquid crystal display television |
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| US20180010831A1 (en) * | 2016-07-11 | 2018-01-11 | Hill Phoenix, Inc. | Valve and capillary tube system for refrigeration systems |
| CN206504504U (en) * | 2017-01-06 | 2017-09-19 | 合肥美的电冰箱有限公司 | Evaporator assemblies and the refrigeration plant with it |
| CN106895728A (en) * | 2017-04-27 | 2017-06-27 | 长沙理工大学 | Horizontal variable-diameter serial and parallel channel plate type pulsating heat pipe |
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| CN108253829A (en) * | 2018-01-30 | 2018-07-06 | 中国科学院理化技术研究所 | Micro-channel array auxiliary driving loop heat pipe |
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| CN109945327B (en) | 2024-08-16 |
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