KR20030079553A - Device for cooling to chip - Google Patents

Abstract

PURPOSE: A chip cooling device is provided to reduce manufacturing costs by cooling the CPU or PCB through the use of a heat pipe, while reducing noises caused due to the operation of the compressor. CONSTITUTION: A chip cooling device(1) comprises an evaporator(10) mounted on a PCB, and which permits the refrigerant having a phase converted into a liquid phase through the condensation of a condenser(20) to evaporate into a gas phase through the endothermic action for absorbing the heat transferred from the PCB; the condenser for converting the phase of the refrigerant into a liquid phase through the heat radiation of the refrigerant; and a refrigerant flow pipe(30) interposed between the evaporator and the condenser, and which allows for flow of refrigerant in such a manner that the phase of the refrigerant changes through the evaporation and condensing processes.

Description

Chip cooling device {Device for cooling to chip}

The present invention relates to a chip cooling device, and more particularly, to a compressor (CPU) or a PCB board that generates a lot of heat among electronic products in which a CPU (central processing unit) or a PCB (printed circuit board) with high speed operation is performed. Instead of cooling using a refrigeration cycle system consisting of a condenser, an expansion valve, and an evaporator, a heat pipe principle is used to heat the refrigerant from the evaporator by the heat generated from the CPU or the PCB board, and simultaneously flow into the condenser by a pressure difference. The present invention relates to a chip cooling device for cooling the CPU or the PCB board through an iterative circulation process in which the flowed refrigerant is condensed through heat radiation in the condenser and then flows back to the evaporator.

In the case of current electronic products, multifunctional electronic products are required to perform various functions in combination so that user's life patterns can be improved through various functions. In order to be able to do so, a PC function or a printed circuit board (PCB) or the like, which can be processed by a CPU (central processing unit), is incorporated in the product.

However, when using the various functions of the product by the user's needs, a high-speed processing of the CPU or a function conversion of the PCB board is performed so that the selected function can be executed in the product, and a lot of heat is applied to the CPU or the PCB board. This occurs, and the CPU or the PCB board heat generated as described above is cooled using a cooling device in which a refrigeration cycle is performed. The cooling process will be described in detail using the PCB board as an example.

First, the cooling device 100 for cooling the heat generated from the PCB board 50 will be described in detail. As shown in FIG. 1, it absorbs heat generated from the PCB board 50 in a gaseous state. Compressor 110 for pressurizing the evaporated low-temperature low-pressure refrigerant in the gas phase of high temperature and high pressure, and the condenser 120 is changed into a liquid state of room temperature and high pressure while the refrigerant pressurized in the compressor 110 condenses through a heat radiation action And, expansion valve 140 for reducing the refrigerant at room temperature and high pressure condensed in the condenser 120 to be suitable for the heat exchange of the evaporator 150, and is mounted on the PCB board 50 through the expansion valve 140 It consists of an evaporator 150 to be evaporated in the gaseous state through the endothermic action to absorb the heat generated by the heat generated in the PCB board 50, the PCB board using the cooling device 100 configured as described above Cooled 50 The cooling process is as follows.

As shown in FIG. 1, when heat is generated in the PCB board 50, heat is transferred to the evaporator 150 mounted on the PCB board 50, and decompressed from the expansion valve 140. The refrigerant introduced into the evaporator 150 is evaporated to a gaseous state in a low temperature low pressure state while absorbing heat transferred from the PCB board 50 and flows to the compressor 110.

In this way, the low-temperature, low-pressure gas phase refrigerant flowed to the compressor 110 is pressurized in the gas phase state of the high temperature and high pressure in the compressor 110 to be flowed to the condenser 120, introduced into the condenser 120 as described above The refrigerant is condensed while dissipating heat around the condenser 120 to be phase-changed into a liquid phase at room temperature and high pressure, and then flow to the expansion valve 140. The heat radiated around the condenser 120 is the condenser 120. It is emitted to the outside by the drive of the fan 130 installed on one side.

The liquid refrigerant of room temperature and high pressure flowed into the expansion valve 140 as described above is decompressed to a low pressure state so that heat exchange with the heat of the PCB board 50 in the evaporator 150 is performed well, and as described above, the evaporator ( Through the endothermic action to absorb the heat transferred from the PCB board 50 to the 150), the phase change to a low-temperature low-pressure gas phase state, and then flows back to the compressor to pressurized to a high temperature and high pressure state, The PCB board 50 is cooled.

However, in the case of the conventional chip cooling apparatus 100 that cools the heat of the PCB board 50 while forming a refrigeration cycle, the compressor 110, the condenser 120, and the expansion valve for cooling the heat of the PCB board 50 are provided. Since the 140 and the evaporator 150 occupy the installation space excessively, many constraints are placed on the installation of the cooling device 100, and the narrow space of the cooling device 100 configured as described above is particularly limited. There was also a problem that is very cumbersome to install around the PCB board 50.

Moreover, the compressor 110, which is the most important to achieve the refrigeration cycle, should be made compact so that it can be installed in a narrow space around the PCB board 50, but it is very useful for manufacturing the compressor 50 in a compact form. There is a difficult problem, and according to the above problems, there was a big problem that the manufacturing cost and the product cost for manufacturing the compact compressor 110 are very high.

In addition, as the noise generated by driving the motor (not shown) built in the compressor 110 is generated during the compression operation of the compact compressor 110, the consumer suffers from inconvenience due to the noise of the compressor 110. In addition, the noise of the compressor 110 affects each component of the electronic product, which causes a large problem of the electronic product.

The present invention has been made in order to solve the above problems, the CPU or PCB board which generates a lot of heat among electronic products in which a high-speed operation (CPU) or PCB (Printed Circuit Board) is built-in compressor Instead of cooling using a refrigeration cycle system consisting of a condenser, an expansion valve, and an evaporator, a heat pipe principle is used to heat the refrigerant from the evaporator by the heat generated from the CPU or the PCB board, and simultaneously flow into the condenser by a pressure difference. In addition, the flow of the refrigerant is condensed through the heat dissipation in the condensation unit is the purpose of cooling the CPU or PCB board through an iterative process to flow back to the evaporator.

In addition, in the case of the chip cooling device configured as described above, since it is a simple structure that is integrated with each other by injection molding of plastic material, the manufacturing cost can be significantly reduced compared to the cooling device using a conventional refrigeration cycle, in particular, the CPU generates a lot of heat Regardless of the confined space in which the PCB board is embedded, the cooling device of the present invention can be easily installed, thereby greatly reducing the excessive installation space occupied by the compressor, the condenser, the expansion valve, and the evaporator constituting the conventional refrigeration cycle. There is another purpose.

The object of the present invention can be solved by the chip cooling device of the present invention configured to cool the PCB board using the heat pipe principle, which will be described in detail with reference to the accompanying drawings.

1 is a system diagram of a conventional chip chiller for cooling a PCB board using a refrigeration cycle.

2 is a perspective view showing a chip cooling device of the present invention.

3 is a cross-sectional view of an evaporator that is a component of the present invention.

4 is a cross-sectional view of a condenser that is a component of the present invention.

5 is another embodiment of the present invention.

6 is a functional state diagram of the present invention.

Explanation of symbols on the main parts of the drawings

1. Chip Chiller 10, 10a. Evaporator 11. Evaporator Appearance

12. Refrigerant circulation guide plate 13. Refrigerant inlet 14. Refrigerant outlet

15. Refrigerant inlet pipe 16. Refrigerant outlet pipe

20, 20a. Condenser 21. Condenser Body 22. Condenser Tube

23. Vent 24. Conductor 25. Refrigerant inlet tube 26. Refrigerant outlet tube

30, 30a. Refrigerant flow tube 40. Condenser fan 50. PCB board

Figure 2 shows a perspective view of the chip cooling device of the present invention.

The chip cooling device 1 of the present invention is evaporated through the endothermic action of the refrigerant in the evaporator 10, from which heat is transferred from the PCB board 50, and simultaneously flows to the condensation unit 20 by a pressure difference. It is configured to cool the PCB board 50 using a heat pipe principle, such as condensation through heat radiation of the refrigerant flowing into the condenser 20, and circulating back to the evaporator 10 repeatedly.

Hereinafter, the chip cooling device of the present invention will be described in detail.

3 shows a cross-sectional view of an evaporator which is a component of the invention, and FIG. 4 shows a cross-sectional view of a condenser which is a component of the invention.

Prior to the detailed description of the chip cooling device 1 of the present invention, the heating material for cooling heat using the chip cooling device 1 of the present invention will be described with reference to the PCB board 50 as an example.

The chip cooling device 1 of the present invention is a PCB board 50 that generates a lot of heat in electronic products using a refrigeration cycle system consisting of a compressor 110, a condenser 120, an expansion valve 140, and an evaporator 150. ), Instead of the conventional cooling method of cooling), the refrigerant is evaporated in the evaporator 10 in which heat is transferred from the PCB board 50 and flows to the condensation unit 20 by the pressure difference. The refrigerant flowing into the condensation unit 20 is configured to cool the PCB board 50 through a circulation process condensed in a liquid state and flows back to the evaporation unit 10. The explanation is as follows.

The chip cooling device, as shown in Figure 2, is mounted on the upper PCB board 50, the heat transferred to the liquid phase phase change from the PCB board 50 through the condensation action in the condenser 20 An evaporator 10 which evaporates to a gaseous state through an endothermic action of absorbing heat;

A condenser 20 which phase changes into a liquid state while condensing through a heat radiation action of the refrigerant flowing from the evaporator 10;

Mounted between the evaporator 10 and the condenser 20 to the refrigerant flow pipe 30 through which the refrigerant flows to achieve a phase change through the evaporation process and the condensation process while circulating the evaporator 10 and the condenser 20 Consists of.

Among these, the evaporator 10, as shown in Fig. 2 and 3, the outer body 11 formed of a hollow rectangular body; The refrigerant evaporated through the endothermic action formed to have a predetermined length inside the exterior body 11 and absorbs heat transferred from the PCB board 50 to the upper side of the exterior body 11 to open the refrigerant flow pipe 30. A refrigerant circulation guide plate 12 for circulating flow through the condenser 20 and preventing the evaporated refrigerant from flowing backwards under the exterior body 11; The refrigerant inlet 13 and the refrigerant outlet 14 formed through the one side surface of the exterior body 11 so that the refrigerant flows through the refrigerant flow pipe 30 condensed and evaporated flows out.

In addition, the condenser 20, as shown in Fig. 2 and 4, the outer body 21 formed of a hollow rectangular body; It is integrally formed in the exterior body 21, and the refrigerant heat generated as the refrigerant evaporated from the evaporator 10 and introduced through the refrigerant flow pipe 30 is condensed through a heat dissipation action around the exterior body 21. A condensation tube (22) for dissipating heat; It consists of a plurality of vents (23) formed through both sides of the exterior body 21 so that the refrigerant heat radiated around the exterior body 21 to the outside, in particular the bottom surface of the condenser 20 When the refrigerant flowing into the condenser 20 is condensed to form a phase change from the gas phase to the liquid phase, a conductor 24 made of steel or copper is installed to quickly release heat radiated to the outside.

In addition, the evaporator 10, the condenser 20, and the refrigerant flow pipe 30 have a structure in which injection molding is made of a plastic material to integrate them, and the evaporator 10 and the condenser 20 are connected through the refrigerant flow pipe 30. As the refrigerant constituting the phase change while circulating, water, methyl alcohol, or the like is used.

5 is an embodiment showing another embodiment of the present invention, which is, as shown in Figure 5, the evaporator 10 and the condenser 20, the refrigerant flow pipe 30 formed integrally formed with each other are separated from each other In particular, the evaporator 10a and the condenser 20a, which are separated from each other, have refrigerant inlet tubes 15 and 25 through which liquid and gaseous refrigerants are introduced, and refrigerant outlet tubes 16 through which gaseous and liquid refrigerants flow out. (26) are formed, respectively, the refrigerant flow pipe (30a) is assembled to the refrigerant inlet pipe (15) 25 and the refrigerant outlet pipe (16) 26 of the evaporator (10a) and the condenser (20a). to be.

Hereinafter, the operation of the chip cooling device of the present invention will be described in detail.

Figure 6 shows the operating state of the chip cooling device of the present invention.

When heat is generated in the PCB board 50 due to the functional conversion and operation processing of the electronic product, the heat is transferred to the evaporator 10 mounted on the PCB board 50, the PCB board as described above When the refrigerant condensed in the liquid state is introduced into the evaporator 10 through which the heat of 50 is transferred, the refrigerant passes through an endothermic action of absorbing heat transferred from the PCB board 50. At the same time as evaporated in the gaseous state, after rising through the space between the predetermined length of the refrigerant circulation induction plate 12 and the evaporator exterior body 11 formed in the evaporator 10, and through the refrigerant flow pipe 30, the condenser ( 20) in a circulating flow.

In this case, in the case of the refrigerant circulation induction plate 12, the refrigerant evaporated while absorbing the heat transferred from the PCB board 50, rises above the exterior body 11, and passes through the refrigerant flow pipe 30 to condenser 20. At the same time to the circulation flow to the), and serves to prevent the evaporated refrigerant flows back to the lower portion of the outer body (11).

As such, the refrigerant introduced into the condenser 20 through the refrigerant flow pipe 30 condenses while radiating heat around the condenser exterior body 21 through the flow of the condenser tube 22 integrally formed in the condenser 20. And phase change from the gaseous state to the liquid state, and the heat radiated as described above is vented through both sides of the condenser exterior body 21 by driving the fan 40 installed at one side of the condenser 20. 23 is discharged to the outside, in the case of the fan 40, the heat dissipation action by heat exchange with the refrigerant in the condenser 20 is made more smoothly, and at the same time, the heat dissipation in the condenser 20 The heat is discharged to the outside through a plurality of vents (23) formed through both sides of the condenser 20, the condenser also by the conductor 24 mounted on the bottom of the condenser 20 Radiated from 20 This is to be quickly released to the outside.

As described above, the refrigerant condensed in the liquid state in the condenser 20 flows to the evaporator 10 through the refrigerant flow pipe 30 again and exchanges heat again with the heat transferred from the PCB board 50. Cooling the PCB board 50 through.

As described above, the chip cooling apparatus 1 of the present invention can be applied to a large PC capable of arithmetic processing by a CPU (central processing unit) or any electronic product having a printed circuit board (PCB) 50 embedded therein. It is to be revealed.

The chip cooling device of the present invention is a CPU (Central Processing Unit) or a PCB (Printed Circuit Board) is a high-speed operation of the CPU or PCB board that generates a lot of heat in the electronics built-in the compressor, condenser, expansion valve, Instead of cooling using a refrigeration cycle system consisting of an evaporator, the refrigerant is evaporated in the evaporator by heat generated from the CPU or PCB board using the heat pipe principle, and simultaneously flows into the condenser by a pressure difference. By condensing through the heat dissipation in the condensation unit and flows back to the evaporation unit, there is an excellent effect of cooling the CPU or PCB board.

In addition, in the case of the chip cooling device configured as described above, since it is a simple structure that is integrated with each other by injection molding of a plastic material, compared to the cooling device using a conventional refrigeration cycle, the production cost is significantly reduced, and heat is generated a lot. Regardless of the confined space in which the CPU or PCB board is built, the cooling device of the present invention can be easily installed. Accordingly, a compressor, a condenser, an expansion valve, and an evaporator constituting a conventional refrigeration cycle are installed. There is also an excellent effect that can be reduced.

Furthermore, in the case of the chip cooling cooler of the present invention, since only the evaporation process and the condensation process of the coolant cool the heat generated in the CPU or the PCB board, it is possible to prevent noise caused by the compressor driving in the conventional cooling system. It also works.

Claims (7)

Heat is evaporated through the endothermic action of the refrigerant in the evaporator, where heat is transferred from the PCB board, and flows to the condenser by the pressure difference. A chip chiller, configured to cool the PCB board using a pipe principle. According to claim 1, wherein the chip cooling device is mounted on top of the PCB board evaporated in the gas phase state through the endothermic action to absorb the heat transferred from the PCB board to the refrigerant phase change into a liquid state through the condensation action in the condenser An evaporator to make; A condenser which phase changes into a liquid state while condensing through the heat radiation of the refrigerant flowing from the evaporator; And a refrigerant flow pipe mounted between the evaporator and the condenser and configured to allow a refrigerant to flow through the evaporation process and the condensation process while circulating the evaporator and the condenser. According to claim 2, wherein the evaporator and the outer body formed of hollow fiber body; The refrigerant evaporated through the endothermic action formed to have a predetermined length inside the exterior body and absorbs heat transferred from the PCB board to the upper portion of the exterior body to be circulated to the condenser through the refrigerant flow pipe, A refrigerant circulation guide plate for preventing the evaporated refrigerant from flowing back to the lower portion of the exterior body; And a coolant inlet port and a coolant outlet port formed through one side of the exterior body so that the refrigerant condensed and evaporated in communication with the coolant flow pipe can flow in and out. 3. The condenser of claim 2, wherein the condenser comprises: an outer body formed of hollow fiber bodies; A condensation tube integrally formed in the exterior body and configured to radiate the heat of the refrigerant generated around the exterior body by the heat of the refrigerant evaporated from the evaporator and introduced into the refrigerant flow pipe through a heat radiation action; Chip cooling device, characterized in that composed of a plurality of vents penetrating through both sides of the outer body so that the heat of the refrigerant radiated around the outer body can be discharged to the outside. The method of claim 4, wherein the bottom surface of the condenser is configured to be equipped with a conductor made of steel or copper material for quickly dissipating heat to the outside when the refrigerant flowing into the condenser condensed in the liquid phase in the gas phase to form a phase change Chip chiller made. The chip cooling apparatus according to any one of claims 2 to 4, wherein the evaporator, the condenser, and the refrigerant flow tube are injection molded of a plastic material and integrated with each other. 7. The chip cooling apparatus according to claim 2 or 6, wherein the evaporator, the condenser, and the refrigerant flow pipe formed integrally with each other are configured to be separated from each other.