CN219068052U - Frequency converter, compressor and heating ventilation equipment - Google Patents
Frequency converter, compressor and heating ventilation equipment Download PDFInfo
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- CN219068052U CN219068052U CN202223412685.XU CN202223412685U CN219068052U CN 219068052 U CN219068052 U CN 219068052U CN 202223412685 U CN202223412685 U CN 202223412685U CN 219068052 U CN219068052 U CN 219068052U
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Abstract
The utility model discloses a frequency converter, a compressor and heating and ventilation equipment, wherein the frequency converter comprises: the cabinet body is provided with a containing cavity, the containing cavity is configured to contain electronic devices, and the containing cavity is a cavity with an opening at the front side and a back plate at the back side; the second radiator is fixedly connected with at least one part of electronic devices in the accommodating cavity and is suitable for radiating the corresponding electronic devices in a heat conduction mode; the second radiator is arranged outside the accommodating cavity or at least a part of the second radiator is arranged in the accommodating cavity. The frequency converter can realize the installation and the matching of the second radiator relative to the cabinet body, so that the second radiator can effectively radiate the electronic device, the working temperature state of the electronic device is ensured to be stable, and the installation of the second radiator is convenient, flexible and selectable.
Description
Technical Field
The utility model relates to the technical field of frequency conversion equipment manufacturing, in particular to a frequency converter, a compressor with the frequency converter and heating ventilation equipment with the compressor.
Background
In the related art, the inside of converter is equipped with multiple type electron device, and electron device produces a large amount of heat in the use easily, and electron device when being in the higher operating condition of temperature for a long time, leads to the structural performance of electron device itself to worsen, and operational reliability reduces, has the room of improvement.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a frequency converter capable of effectively dissipating heat from electronic devices in a cabinet.
According to an embodiment of the present utility model, a frequency converter includes: the cabinet body is provided with a containing cavity, the containing cavity is configured to contain electronic devices, and the containing cavity is a cavity with an opening at the front side and a back plate at the back side; the second radiator is fixedly connected with at least one part of electronic devices in the accommodating cavity and is suitable for radiating the corresponding electronic devices in a heat conduction mode; the second radiator is arranged outside the accommodating cavity or at least a part of the second radiator is arranged in the accommodating cavity.
According to the frequency converter provided by the embodiment of the utility model, the second radiator can be matched with the cabinet body in a mounting way, so that the second radiator can effectively radiate heat of an electronic device, the working temperature state of the electronic device is ensured to be stable, and the second radiator is convenient, flexible and selectable in mounting.
According to some embodiments of the utility model, the housing cavity includes a first cavity and a second cavity, the first cavity configured as a closed air duct structure.
According to some embodiments of the utility model, the frequency converter further comprises: a first heat sink disposed within the first cavity; and an airflow driver configured to drive a heat dissipating airflow within the first cavity such that the heat dissipating airflow flows through the first heat sink and the electronic device within the first cavity.
According to some embodiments of the utility model, the first heat sink is an evaporator.
According to some embodiments of the utility model, the second heat sink is configured to heat transfer and dissipate heat from the electronics within the first cavity and/or the second cavity.
According to the frequency converter of some embodiments of the present utility model, the second radiator is disposed on the back surface of the cabinet body, and the second radiator is opposite to at least one of the first cavity and the second cavity in front-back direction.
According to some embodiments of the utility model, the second heat sink is disposed in the first cavity, opposite to a portion of the electronic devices in the second cavity, and adapted for heat transfer to dissipate heat; or, the second radiator is arranged in the second cavity, is opposite to part of electronic devices in the first cavity and is suitable for heat transfer to dissipate heat; or, a part of the second radiator is arranged in the first cavity, and the other part of the second radiator is arranged in the second cavity; or, the second heat sink is disposed between the first cavity and the second cavity.
According to some embodiments of the utility model, a first electronic device is disposed in the accommodating cavity, and the first electronic device is stacked with the second heat sink and adapted to dissipate heat by thermal conduction.
According to some embodiments of the utility model, the first electronic device is locked to the second heat sink.
According to some embodiments of the utility model, the second heat sink is laminated outside the back plate of the cabinet.
According to the frequency converter of some embodiments of the present utility model, the back plate is provided with a heat dissipation port, and the first electronic device is opposite to the heat dissipation port and is stacked with the second heat sink.
According to some embodiments of the utility model, the first electronic device is directly laminated on the surface of the second heat sink; or a heat conducting piece is arranged between the first electronic device and the second radiator, and the heat conducting piece is laminated between the first electronic device and the second radiator.
According to some embodiments of the utility model, the second heat sink is a parallel flow heat sink.
The utility model also provides a compressor.
According to the compressor of the embodiment of the utility model, the frequency converter of any embodiment is provided.
The utility model also provides heating and ventilation equipment.
According to the heating and ventilation equipment provided by the embodiment of the utility model, the compressor of any one of the embodiments is arranged.
The heating and ventilation device, the compressor and the frequency converter have the same advantages compared with the prior art, and are not described in detail herein.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a front side view of a frequency converter according to an embodiment of the utility model;
FIG. 2 is a rear side view of a frequency converter according to an embodiment of the utility model;
fig. 3 is a rear side view of a frequency converter according to an embodiment of the utility model (the second radiator is not mounted);
fig. 4 is an internal view of a frequency converter according to an embodiment of the utility model.
Reference numerals:
the frequency converter 100 is configured to convert,
the cabinet body 1, the back plate 11, the heat dissipation port 111, the accommodating cavity 12, the first cavity 121, the second cavity 122, the first radiator 13, the airflow driving piece 14, the second radiator 15, the front plate 16, the side plate 17, the connection support plate 18, the capacitor 21, the reactor 22, the contactor 23, the transformer 24, the diode 25, the filter plate 26 and the circuit breaker 27.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
The following describes a frequency converter 100 according to an embodiment of the present utility model with reference to fig. 1 to 4, in which a second radiator 15 that is mounted and matched with an electronic device is provided to radiate heat to the electronic device, so as to facilitate reducing structural stability of the electronic device and ensure that the electronic device is in a safe working state.
As shown in fig. 1 to 4, a frequency converter 100 according to an embodiment of the present utility model includes: a cabinet 1 and a second radiator 15. The cabinet 1 is provided with a containing cavity 12, the containing cavity 12 is configured to contain an electronic device, the containing cavity 12 is a cavity with an opening at a front side and a back plate 11 at a back side, in other words, the front side of the containing cavity 12 is an open side and the back side is at least partially closed by the back plate 11. An operator can install the electronic device in the accommodating cavity 12, so as to ensure that the environment where the electronic device is located is relatively closed, ensure the working state of the electronic device, and ensure the stable operation of the frequency converter 100. As shown in fig. 1, the cabinet body 1 further includes a front plate 16 and a side plate 17, where the front plate 16 and the back plate 11 are opposite to each other in the front-back direction, the side plate 17 includes four plate portions sequentially connected in the circumferential direction, and the side plate 17 is connected between the front plate 16 and the back plate 11 and distributed around the accommodating cavity 12.
The second heat sink 15 is fixedly connected to at least a portion of the electronic devices in the accommodating cavity 12, and is adapted to dissipate heat from the corresponding electronic devices by means of thermal conduction. The second radiator 15 may be a cooling fan, a liquid cooling plate, a micro-channel cooling plate or other cooling structures, and has a simple structure and is flexible and optional. In the specific installation, the electronic device and the second radiator 15 can be connected and fixed in a screw connection mode, or the second radiator 15 is fixed in the cabinet body 1 in a screw connection mode.
As shown in fig. 4, a plurality of electronic devices may be disposed in the accommodating chamber 12, and the electronic devices include a capacitor 21, a reactor 22, a contactor 23, a transformer 24, a diode 25, a filter board 26, a circuit breaker 27, and the like. Therefore, after a plurality of electronic devices are installed in the accommodating cavity 12, one, two or more electronic devices can be radiated by the second radiator 15, for example, the diode 25 and the filter plate 26 are radiated, so that the temperature states of the diode 25 and the filter plate 26 during operation are reduced, the situation that the electronic devices are overheated is avoided, and the operation safety of the frequency converter 100 is improved. The number of the second heat sinks 15 to be provided may be flexibly adjusted, such as one, two or more.
The second heat sink 15 is disposed outside the accommodating cavity 12 or at least a portion of the second heat sink is disposed in the accommodating cavity 12. That is, in practical design, the second heat sink 15 may be installed outside the accommodating cavity, for example, fixed on a side of the back plate 11 facing away from the accommodating cavity 12, so that heat in the second heat sink 15 can be transferred into the accommodating cavity 12 through the back plate 11 to dissipate heat of the electronic device, or heat is diffused through a hole structure on the back plate 11; or, a similar notch area is arranged on the cabinet body 1, so that the second radiator 15 is arranged at the notch area, at least one part of the second radiator 15 can extend into the accommodating cavity 12 to be in contact with the electronic device, and the other part of the second radiator is positioned outside the accommodating cavity 12 to facilitate heat dissipation, heat exchange airflow transportation or external cooling pipeline connection.
According to the frequency converter 100 provided by the embodiment of the utility model, the second radiator 15 can be installed and matched relative to the cabinet body 1, so that the second radiator 15 can effectively radiate heat of electronic devices, the working temperature state of the electronic devices is ensured to be stable, and the second radiator 15 is convenient, flexible and selectable to install.
In some embodiments, as shown in fig. 4, the receiving chamber 12 includes a first chamber 121 and a second chamber 122, the first chamber 121 being configured as a closed duct structure. Wherein the first cavity 121 and the second cavity 122 are separated by a separation structure for achieving different accommodation, such as different electronic devices mounted in the first cavity 121 and the second cavity 122, respectively.
The first cavity 121 is formed into an air duct structure, for example, the first cavity 121 is an annular cavity, so that the first cavity 121 can realize the circulation flow of air flow, and in the process of circulation flow, the electronic device in the first cavity 121 can be cooled.
In some embodiments, as shown in fig. 4, the frequency converter 100 further includes: a first radiator 13 and an airflow driver 14.
The first heat radiator 13 is disposed in the first cavity 121, and the first heat radiator 13 can exchange heat with the air flow in the first cavity 121, so as to cool and cool the electronic device in the first cavity 121, reduce the working temperature of the electronic device, and improve the use safety of the frequency converter 100.
The airflow driving member 14 is configured to drive the heat radiation airflow in the first chamber 121 so that the heat radiation airflow flows through the first heat sink 13 and the electronic components in the first chamber 121. The airflow driving member 14 may be configured as a fan, a blower, etc. to drive the airflow in the first cavity 121 to circulate in the first cavity 121 through the airflow driving member 14, and in the flowing process, the temperature of the heat dissipation airflow is reduced by passing through the first heat sink 13, so as to flow to the electronic device, so as to continuously dissipate heat of the electronic device in the first cavity 121.
In some embodiments, the first radiator 13 is an evaporator, so that the first radiator 13 is disposed in the first cavity 121, and the heat absorption and refrigeration functions are realized in the evaporation process by utilizing the evaporation function of the first radiator 13, so that the heat absorption and refrigeration device is simple in structure and convenient to install.
Further, the second heat sink 15 is configured to heat transfer and dissipate heat from the electronic devices within the first cavity 121 and/or the second cavity 122. That is, in the actual installation, the second heat sink 15 may be installed in the first cavity 121 or at a position corresponding to the first cavity 121, so that the second heat sink 15 can realize the refrigeration effect on the electronic device in the first cavity 121 through the action of the airflow driving member 14, that is, the first heat sink 13 and the second heat sink 15 can jointly dissipate heat of the electronic device in the first cavity 121, thereby improving the heat dissipation effect; or, the second radiator 15 is installed in the second cavity 122 and then is installed at a position corresponding to the second cavity 122, so that the electronic device in the second cavity 122 is cooled; still alternatively, a portion of the second heat sink 15 is located within the first cavity 121 and another portion is located within the second cavity 122, or a portion of the second heat sink 15 is located at a position corresponding to the first cavity 121 and another portion is located at a position corresponding to the second cavity 122.
Therefore, flexible configuration of the second radiator 15 can be realized, and the second radiator 15 can cool and dissipate heat of corresponding electronic devices in different installation states, so that the cooling mode is richer.
In some embodiments, as shown in fig. 2, the second radiator 15 is disposed on the back of the cabinet 1, and the second radiator 15 is opposite to at least one of the first cavity 121 and the second cavity 122, so as to implement a heat exchange effect between the second radiator 15 and the first cavity 121 and/or the second cavity 122. The second radiator 15 can be arranged outside the accommodating cavity 12, so that the second radiator 15 can fully utilize the space outside the frequency converter 100, ensure the sufficient space inside the cabinet body 1, and realize reasonable configuration of internal electronic devices.
Specifically, the second radiator 15 may be disposed at a position opposite to the first cavity 121 outside the back plate 11, or the second radiator 15 may be disposed at a position opposite to the second cavity 122 outside the back plate 11, or a part of the second radiator 15 may be disposed at a position opposite to the first cavity 121 outside the back plate 11, and another part may be disposed at a position opposite to the second cavity 122 outside the back plate 11, so that the disposition position of the second radiator 15 is flexible and selectable.
In some embodiments, the second heat spreader 15 is disposed within the first cavity 121, such as by disposing the second heat spreader 15 within the first cavity 121 in opposition to the inner wall of the first cavity 121 and in opposition to a portion of the electronics within the second cavity 122 and adapted for heat transfer to dissipate heat. In this way, the air flow driving member 14 can drive the air flow in the first cavity 121 to circulate, and the heat dissipation air flow flows towards other positions in the first cavity 121 after heat exchange at the second radiator 15, so that cooling and heat dissipation of other electronic devices in the first cavity 121 are realized, meanwhile, the cooling capacity of the second radiator 15 can be transferred into the second cavity 122 through the cabinet body 1, and cooling and temperature reduction of the electronic devices in the second cavity 122 are realized, and therefore, cooling of the electronic devices in the first cavity 121 and the second cavity 122 can be simultaneously realized through the second radiator 15.
Alternatively, in other embodiments, the second heat sink 15 is disposed within the second cavity 122, such as by disposing the second heat sink 15 within the second cavity 122 and secured against an inner wall of the second cavity 122 and against a portion of the electronics within the first cavity 121 and adapted for heat transfer to dissipate heat. In this way, the second radiator 15 directly cools the electronic device in the second cavity 122, so as to realize direct cooling, meanwhile, the second radiator 15 is opposite to part of the electronic devices in the first cavity 121, and part of the cooling capacity of the second radiator 15 can diffuse towards the first cavity 121 through the cabinet body 1, further flow towards part of the electronic devices in the first cavity 121, so as to realize cooling of the electronic devices in the first cavity 121, thereby cooling the electronic devices in the first cavity 121 and the second cavity 122 through the second radiator 15.
Alternatively, in still other embodiments, a portion of the second heat sink 15 is disposed within the first cavity 121 and another portion is disposed within the second cavity 122 such that the second heat sink 15 can transfer cold directly into both the first cavity 121 and the second cavity 122. Namely, an open installation area is arranged between the first cavity 121 and the second cavity 122, the second radiator 15 is installed in the installation area, two sides of the second radiator 15 are exposed towards the inside of the first cavity 121 and the inside of the second cavity 122 respectively, direct diffusion of cold energy is achieved, direct cooling of electronic devices in the first cavity 121 and the inside of the second cavity 122 is achieved, and cooling efficiency is improved.
Or, the second heat sink 15 is disposed between the first cavity 121 and the second cavity 122, that is, a closed installation space is disposed between the first cavity 121 and the second cavity 122, the second heat sink 15 is installed in the installation space, and the second heat sink 15 is respectively directed to the first cavity 121 and the second cavity 122 through two side walls of the installation space to realize the diffusion of cold energy, thereby realizing the cooling of the electronic devices in the first cavity 121 and the second cavity 122. Wherein the second radiator 15 is in a relatively stable environment, a continuous cooling action of the second radiator 15 is ensured.
In some embodiments, the accommodating cavity 12 is provided with a first electronic device, and the first electronic device and the second heat sink 15 are stacked and adapted to dissipate heat through heat conduction, that is, the first electronic device may be directly contacted with the second heat sink 15, so that the second heat sink 15 can directly dissipate heat to the first electronic device, and heat exchange efficiency between the two is improved. As shown in fig. 4, the first electronic device may be the diode 25, that is, cooling and heat dissipation of the diode 25 are achieved.
In some embodiments, the first electronic device is locked on the second heat sink 15, so that the second heat sink 15 and the first electronic device are relatively fixed, for example, they may be fastened or screwed. In this way, the relative position of the two can be ensured to be fixed, and the second radiator 15 can continuously and effectively radiate heat to the first electronic device.
In some embodiments, the second heat sink 15 is stacked on the outer side of the back plate 11 of the cabinet body 1, meanwhile, the first electronic device is located on the inner side of the back plate 11, so that the second heat sink 15 diffuses heat into the accommodating cavity 12 through the back plate 11 to exchange heat with the first electronic device, and the second heat sink 15 does not occupy the space in the accommodating cavity 12 while realizing effective heat exchange, so as to avoid overcrowding of the electronic devices in the accommodating cavity 12. As shown in fig. 3, two connection brackets 18 are provided on the back plate 11, and the two connection brackets 18 are spaced apart in the up-down direction, whereby, when the second heat sink 15 is fixedly mounted to the back plate 11, the upper side portion and the lower side portion of the second heat sink 15 can be fixed by the connection members at the two connection brackets 18, respectively, as shown in fig. 2, by 6 screws.
Further, as shown in fig. 3, a heat dissipation port 111 may be disposed on the back plate 11, where the first electronic device is opposite to the heat dissipation port 111 and is stacked with the second heat sink 15, so that heat exchange between the second heat sink 15 and the first electronic device can be realized through the heat dissipation port 111, and heat transfer blocking of the back plate 11 is reduced, so that heat exchange efficiency of the second heat sink 15 to the first electronic device is enhanced.
In some embodiments, the first electronic device is directly stacked on the surface of the second heat sink 15, and the first electronic device is in direct contact with the second heat sink 15, so that heat generated by the first electronic device can be transferred to the second heat sink 15 through the contact surface, thereby realizing maximum heat exchange efficiency, improving installation compactness of the first electronic device and the second electronic device, reducing occupation of installation space, and facilitating arrangement of other structural members.
Or, in other embodiments, a heat conducting member is disposed between the first electronic device and the second heat sink 15, and the heat conducting member is stacked between the first electronic device and the second heat sink 15, so that heat is conducted between the first electronic device and the second heat sink 15 through the heat conducting member, heat transfer between the first electronic device and the second heat sink is achieved, and the heat conducting member and the second heat sink are mounted in a stacked manner, so that a larger contact area is formed between the heat conducting member and the first electronic device, and a larger contact area is formed between the heat conducting member and the second heat sink 15, thereby increasing a heat transfer area and improving a cooling effect on the electronic device.
In some embodiments, the second radiator 15 is a parallel flow radiator, where the heat exchange efficiency of the parallel flow radiator is high, and the overall structure is compact, so that it is beneficial to ensure the cooling and heat exchange effects on the electronic device, and at the same time, reduce the installation space occupied by the second radiator 15 on the frequency converter 100.
The utility model also provides a compressor.
According to the compressor provided with the frequency converter in any one of the embodiments, through the frequency converter 100, the second radiator 15 can be mounted and matched relative to the cabinet body 1, so that the second radiator 15 can effectively radiate heat of electronic devices, the working temperature state of the electronic devices is ensured to be stable, and the second radiator 15 is mounted conveniently, flexibly and optionally, so that the operation reliability of the compressor is ensured.
The utility model also provides heating and ventilation equipment.
According to the heating and ventilation equipment provided by the embodiment of the utility model, the compressor of any one of the embodiments is arranged.
The heating and ventilation device, the compressor and the frequency converter have the same advantages compared with the prior art, and are not described in detail herein.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
In the description of the utility model, a "first feature" or "second feature" may include one or more of such features. In the description of the present utility model, "plurality" means two or more.
In the description of the utility model, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by another feature therebetween.
In the description of the utility model, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (15)
1. A frequency converter, comprising:
the cabinet body is provided with a containing cavity, the containing cavity is configured to contain electronic devices, and the containing cavity is a cavity with an opening at the front side and a back plate at the back side;
the second radiator is fixedly connected with at least one part of electronic devices in the accommodating cavity and is suitable for radiating the corresponding electronic devices in a heat conduction mode;
the second radiator is arranged outside the accommodating cavity or at least a part of the second radiator is arranged in the accommodating cavity.
2. The frequency converter of claim 1, wherein the receiving cavity comprises a first cavity and a second cavity, the first cavity configured in a closed air duct configuration.
3. The frequency converter of claim 2, further comprising:
a first heat sink disposed within the first cavity;
and an airflow driver configured to drive a heat dissipating airflow within the first cavity such that the heat dissipating airflow flows through the first heat sink and the electronic device within the first cavity.
4. A transducer according to claim 3, wherein the first heat sink is an evaporator.
5. The frequency converter of claim 2, wherein the second heat sink is configured to heat transfer heat dissipation with electronics within the first cavity and/or the second cavity.
6. The frequency converter according to claim 2, wherein the second heat sink is provided on a back surface of the cabinet body, and the second heat sink is opposite to at least one of the first cavity and the second cavity in front-rear direction.
7. The frequency converter of claim 2, wherein the second heat sink is disposed within the first cavity opposite a portion of the electronics within the second cavity and adapted for heat transfer to dissipate heat;
or, the second radiator is arranged in the second cavity, is opposite to part of electronic devices in the first cavity and is suitable for heat transfer to dissipate heat;
or, a part of the second radiator is arranged in the first cavity, and the other part of the second radiator is arranged in the second cavity;
or, the second heat sink is disposed between the first cavity and the second cavity.
8. A transducer according to claim 1, wherein a first electronic component is arranged in the receiving cavity, the first electronic component being laminated with the second heat sink and adapted to dissipate heat by thermal conduction.
9. The frequency converter of claim 8, wherein the first electronic device is locked to the second heat sink.
10. The frequency converter of claim 8, wherein the second heat sink is laminated outside a back plate of the cabinet.
11. The frequency converter according to claim 10, wherein the back plate is provided with a heat sink, and the first electronic device is opposite to the heat sink and stacked with the second heat sink.
12. The frequency converter of claim 11, wherein the first electronic device is directly laminated to a surface of the second heat sink; or a heat conducting piece is arranged between the first electronic device and the second radiator, and the heat conducting piece is laminated between the first electronic device and the second radiator.
13. The frequency converter of claim 1, wherein the second heat sink is a parallel flow heat sink.
14. A compressor, characterized in that a frequency converter according to any one of claims 1-13 is provided.
15. A heating and ventilation apparatus, characterized in that a compressor as claimed in claim 14 is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223412685.XU CN219068052U (en) | 2022-12-16 | 2022-12-16 | Frequency converter, compressor and heating ventilation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223412685.XU CN219068052U (en) | 2022-12-16 | 2022-12-16 | Frequency converter, compressor and heating ventilation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219068052U true CN219068052U (en) | 2023-05-23 |
Family
ID=86367562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223412685.XU Active CN219068052U (en) | 2022-12-16 | 2022-12-16 | Frequency converter, compressor and heating ventilation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219068052U (en) |
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2022
- 2022-12-16 CN CN202223412685.XU patent/CN219068052U/en active Active
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