CN213951677U

CN213951677U - Clothes treatment equipment

Info

Publication number: CN213951677U
Application number: CN202022021090.6U
Authority: CN
Inventors: 伍亚; 倪华; 张文昊; 苏恺之
Original assignee: Wuxi Little Swan Electric Co Ltd
Current assignee: Wuxi Little Swan Electric Co Ltd
Priority date: 2020-09-15
Filing date: 2020-09-15
Publication date: 2021-08-13
Anticipated expiration: 2030-09-15

Abstract

The embodiment of the application provides clothes treatment equipment which is provided with an airflow circulating channel and comprises a base, a heat pump system, a cylinder assembly and a circuit board, wherein the base is provided with an accommodating space, and the accommodating space is positioned on the airflow circulating channel; the heat pump system comprises a compressor, an evaporator and a condenser; the evaporator and the condenser are arranged in the accommodating space; the barrel component is arranged above the base; the circuit board is electrically connected with the compressor, and the circuit board is arranged in an area between the upper part of the accommodating space and the lower part of the cylinder assembly. The clothes treatment equipment of the embodiment of the application has the advantages that the circuit board is arranged in the region between the upper portion of the containing space and the lower portion of the cylinder assembly, the distance between the region and the compressor and the motor in the related art is far, the heat dissipation influence of the compressor and the motor on the circuit board can be weakened, the heat dissipation condition of the circuit board is improved, the space between the cylinder assembly and the containing space can be fully utilized, and the structure of the clothes treatment equipment is compact.

Description

Clothes treatment equipment

Technical Field

The application relates to the technical field of clothes care, in particular to a clothes treatment device.

Background

Taking the heat pump dryer as an example, a circuit board is additionally configured on the compressor of the heat pump system. In the correlation technique, the circuit board is placed in the edge of base, because motor and compressor have been placed to base edge, motor and compressor produce more heat in the course of the work, produce great harmful effects to the heat dissipation of circuit board.

SUMMERY OF THE UTILITY MODEL

In view of the above, embodiments of the present application are expected to provide a laundry treating apparatus capable of improving heat dissipation conditions of a circuit board.

In order to achieve the above object, an embodiment of the present application provides a laundry treating apparatus having an airflow circulation passage, the laundry treating apparatus including a base, a heat pump system, a drum assembly, and a circuit board, the base being provided with an accommodating space, the accommodating space being located on the airflow circulation passage; the heat pump system comprises a compressor, an evaporator and a condenser; the evaporator and the condenser are disposed in the accommodating space; the barrel assembly is arranged above the base; the circuit board is electrically connected with the compressor, and the circuit board is arranged in an area between the upper part of the accommodating space and the lower part of the cylinder assembly.

In some embodiments, the circuit board is arranged horizontally; and/or the base is provided with a cover plate for closing the accommodating space, and the circuit board is supported on the top surface of the cover plate.

In some embodiments, the laundry treating apparatus further includes a heat radiating member disposed on the circuit board to radiate heat from the circuit board.

In some embodiments, the heat pump system has a first refrigerant pipe between the condenser outlet and the compressor inlet, the first refrigerant pipe routed through the heat sink to dissipate heat from the heat sink.

In some embodiments, the circuit board and the heat sink are located above the evaporator; a part of pipe sections of the evaporator are led out of the evaporator to the upper part of the accommodating space, and the heat dissipation pieces are in heat conduction contact.

In some embodiments, a portion of the tube section of the evaporator leads from a side of the evaporator facing away from the compressor.

In some embodiments, a side of the heat dissipation member facing away from the circuit board is provided with a groove through which the first refrigerant pipe passes.

In some embodiments, a layer of thermally conductive material is filled between the outer surface of the first refrigerant tube and the corresponding inner wall of the groove.

In some embodiments, a flow passage is formed in the heat sink and is located in a refrigerant flow path between the condenser outlet to the compressor inlet to bring refrigerant into heat conductive contact with the heat sink.

In some embodiments, the compressor is a variable frequency compressor, the circuit board is a variable frequency control board, a variable frequency chip for controlling the variable frequency compressor is arranged on the variable frequency control board, and the heat dissipation member is arranged at the position of the variable frequency chip.

According to the clothes treatment equipment provided by the embodiment of the application, the circuit board is arranged in the area between the upper part of the accommodating space and the lower part of the barrel assembly, and the distance between the area and the compressor and the motor in the related art is relatively long, so that the heat dissipation influence of the compressor and the motor on the circuit board can be weakened, and the heat dissipation condition of the circuit board is improved; in addition, the space between the drum assembly and the accommodating space can be fully utilized, so that the structure of the clothes treatment equipment is more compact.

Drawings

Fig. 1 is a partial structural view of a laundry treating apparatus according to an embodiment of the present application;

FIG. 2 is a schematic view of the structure of FIG. 1 with the cartridge assembly omitted;

FIG. 3 is a schematic view of the structure of FIG. 2 from another perspective;

FIG. 4 is a schematic diagram showing the positional relationship among the evaporator, the condenser and the heat sink in FIG. 3;

fig. 5 is a schematic view illustrating the heat sink and the circuit board according to an embodiment of the present application;

fig. 6 is a schematic diagram of a heat pump system, wherein the arrows indicate the direction of flow of the refrigerant.

The reference numbers illustrate the heat pump system 10; a first refrigerant pipe 101; a second refrigerant pipe 102; a compressor 11; a condenser 12; an expansion valve 13; an evaporator 14; a cartridge assembly 20; a base 30; an accommodating space 301; a cover plate 31; a circuit board 40; a heat sink 50; groove 501

Detailed Description

It should be noted that, in the present application, technical features in examples and embodiments may be combined with each other without conflict, and the detailed description in the specific embodiment should be understood as an explanation of the gist of the present application and should not be construed as an improper limitation to the present application.

In the description of the embodiments of the present application, the "up", "down", "height direction" orientation or positional relationship is based on the orientation or positional relationship shown in fig. 1. In fig. 1, the upper side is "upper" and the lower side is "lower". It is to be understood that such directional terms are merely for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present application.

The embodiment of the application provides a clothes treatment device, which is used for drying clothes, and particularly, the clothes treatment device is provided with an air circulation channel, and air flow in the air circulation channel performs drying treatment on the clothes.

Referring to fig. 1 to 3, the laundry treating apparatus includes a base 30, a drum assembly 20, a heat pump system 10, a heat sink 50, and a circuit board 40.

Referring to fig. 3, the base 30 is provided with an accommodating space 301, and the accommodating space 301 is located on the airflow circulating channel, that is, the accommodating space 301 is a relatively closed space, and except for the air inlet and the air outlet, the rest positions are basically sealed to ensure that the airflow circulating channel maintains a certain air pressure. The heat pump system 10 includes a compressor 11, an evaporator 14, and a condenser 12; the evaporator 14 and the condenser 12 are disposed in the accommodating space 301, that is, the evaporator 14 and the condenser 12 are enclosed in the accommodating space 301. The drum assembly 20 is disposed above the base 30, and it should be noted that the drum assembly 20 has a laundry treatment chamber, and the laundry treatment chamber is located on the air circulation passage. The circuit board 40 is electrically connected to the compressor 11, and the circuit board 40 is disposed in a region between the upper side of the accommodating space 301 and the lower side of the barrel assembly 20.

In the clothes treatment device of the embodiment of the application, the circuit board 40 is arranged in the region between the upper part of the accommodating space 301 and the lower part of the cylinder assembly 20, and because the distance between the region and the compressor and the motor in the related art is relatively long, the heat dissipation influence of the compressor and the motor on the circuit board 40 can be weakened, and the heat dissipation condition of the circuit board 40 is improved; in addition, the space between the drum assembly 20 and the accommodating space 301 can be fully utilized, so that the structure of the laundry treating apparatus is more compact.

In an embodiment, with reference to fig. 6, the heat pump system 10 further includes an expansion valve 13, the compressor 11, the condenser 12, the expansion valve 13, and the evaporator 14 are sequentially connected in series, and the compressor 11 and the condenser 12, the condenser 12 and the expansion valve 13, and the expansion valve 13 and the evaporator 14 are respectively connected by corresponding refrigerant pipelines.

The specific type of the refrigerant is not limited, and can be selected and determined according to the actual use condition. In another embodiment, the expansion valve 13 may be a capillary tube.

The working principle of the heat pump system 10 is as follows: the compressor 11 sucks low-pressure gaseous refrigerant, the refrigerant is discharged at high pressure after being compressed by the compressor 11, the discharged high-pressure refrigerant enters the condenser 12, is cooled by air at normal temperature, and is condensed into high-pressure liquid (meanwhile, heat is transferred to surrounding air); the high-pressure liquid refrigerant passes through the expansion valve 13 for throttling and pressure reduction, then is changed into a low-pressure low-temperature gas-liquid two-phase mixture, and then enters the evaporator 14, the liquid refrigerant therein is evaporated and refrigerated in the evaporator 14 (simultaneously absorbs heat in ambient air), and the generated low-pressure gas refrigerant is sucked by the compressor 11 again and then is pressurized, and the process is repeated and continuously circulated. The heat exchange is realized.

The working process of the clothes processing equipment is as follows: the condenser 12 heats the circulating air in the airflow circulating channel to generate dry air at about 40-65 ℃, and the dry air enters the clothes processing cavity under the action of the impeller; in the clothes treating chamber, the dry air flows over the surface of the wet clothes to exchange heat and humidity with the wet clothes, absorbs moisture in the clothes, changes into high-temperature high-humidity air, is discharged out of the clothes treating chamber, passes through the evaporator 14, is cooled into low-temperature low-humidity air, passes through the condenser 12, and is heated into high-temperature dry air to enter the next cycle. The clothes are continuously and efficiently dried by the circulation operation.

The heat pump type clothes treatment equipment realizes high utilization of energy, realizes low energy consumption, simultaneously the drying temperature of the heat pump system 10 is far lower than the heating temperature of the electric heating element, and ensures the drying quality of clothes.

In one embodiment, the circuit board 40 is horizontally disposed, so that the space occupied by the circuit board 40 in the height direction of the laundry treating apparatus can be reduced as much as possible. It will be appreciated that the circuit board 40 may also be disposed at an angle to the horizontal so long as it does not interfere with the cartridge assembly 20.

The supporting manner of the circuit board 40 is not limited, and in an exemplary embodiment, referring to fig. 1 and fig. 2, the base 30 has a cover plate 31 for closing the top side of the accommodating space 301, and the circuit board 40 is supported on the top surface of the cover plate 31. That is, the cover plate 31 supports the circuit board 40. It is understood that in other embodiments, additional brackets may be disposed on the base 30 to support the circuit board 40, that is, there is a gap between the bottom side of the circuit board 40 and the top surface of the cover plate 31.

In order to facilitate heat dissipation of the circuit board 40, referring to fig. 1 to 4, the clothes treatment apparatus further includes a heat dissipation member 50, referring to fig. 5, the heat dissipation member 50 is disposed on the circuit board 40 to dissipate heat of the circuit board 40. The specific material of the heat sink 50 is not limited as long as it has good thermal conductivity, for example, one or more of silver, copper, and aluminum. It should be noted that the heat sink may be made of pure metal or alloy.

In some embodiments, heat sink 50 is embedded in a copper plate on an aluminum alloy substrate, which combines low cost, light weight, and thermal conductivity.

In one embodiment, the heat pump system 10 has a first refrigerant pipe 101, the first refrigerant pipe 101 is located between the outlet of the condenser 12 and the inlet of the compressor 11, and the first refrigerant pipe 101 is routed through the radiator 50 to radiate heat from the radiator 50.

It will be appreciated that the heat pump system 10 also has a second refrigerant line 102, the second refrigerant line 102 being located between the outlet of the compressor 11 and the inlet of the condenser 12.

The material of the first refrigerant pipe 101 and the second refrigerant pipe 102 is not limited. Illustratively, copper or aluminum copper is used.

It will be appreciated that the refrigerant exiting the outlet of the condenser 12 is already at a relatively low temperature, typically lower than the temperature of the circuit board 40, and therefore may also be used to dissipate heat from the heat sink 50.

In the embodiment of the present application, the temperature of the refrigerant in the first refrigerant pipe 101 between the outlet of the condenser 12 and the inlet of the compressor 11 is low, and therefore, the temperature of the corresponding first refrigerant pipe 101 is also low. Adopt first refrigerant pipe 101 to cool off heat sink 50, can make full use of the cold volume of first refrigerant pipe 101 and cool off heat sink 50, and then realize the effective cooling to circuit board 40, can cancel radiator fan among the prior art, simplify the structure for the structure of clothing treatment facility is compacter.

It should be noted that the first refrigerant pipe 101 passes through the heat sink 50 means that the first refrigerant pipe 101 passes through the heat sink 50 during the pipe arrangement process, wherein the first refrigerant pipe 101 may be in contact with the heat sink 50 or may be closely spaced from the heat sink 50.

For example, in one embodiment, the heat sink 50 is in thermal contact with the first refrigerant pipe 101, so that efficient heat conduction between the heat sink 50 and the first refrigerant pipe 101 is performed, and the heat dissipation efficiency of the heat sink 50 is improved.

In another embodiment, the heat sink 50 is spaced from the first refrigerant pipe 101 by a distance of not more than 5 mm. That is, there is no direct contact between the heat radiating member 50 and the first refrigerant pipe 101, but a small distance is provided to ensure heat radiation between the heat radiating member 50 and the first refrigerant pipe 101 to achieve heat transfer.

In an embodiment, referring to fig. 5, a groove 501 is formed on the heat sink 50, and the first refrigerant pipe 101 passes through the groove 501, so that the heat exchange area between the heat sink 50 and the first refrigerant pipe 101 can be increased, and the heat dissipation effect of the heat sink 50 is further improved. It should be noted that, in the radial direction of the first refrigerant pipe 101, the first refrigerant pipe 101 may be completely embedded in the groove 501, or may be only partially embedded in the groove 501, and this is not limited herein.

In one embodiment, a heat conducting material layer is filled between the outer surface of the first refrigerant pipe 101 and the corresponding inner wall of the groove 501, and the heat conducting material layer can fill the gap between the first refrigerant pipe 101 and the inner wall of the groove 501 and can transfer heat, so that the heat conducting effect between the first refrigerant pipe 101 and the inner wall of the groove 501 is enhanced. The specific material of the heat conductive material layer is not limited, and for example, includes, but is not limited to, heat conductive silicone grease.

In order to further increase the heat exchange area between the first refrigerant pipe 101 and the heat sink 50, in an embodiment, the groove 501 is curved and bent, and the first refrigerant pipe 101 is fitted into the groove 501, that is, the portion of the first refrigerant pipe 101 in the groove 501 is also curved and bent, so that the effective contact length of the first refrigerant pipe 101 on the surface of the heat sink 50 can be increased, and the heat dissipation area between the first refrigerant pipe 101 and the heat sink 50 can be increased.

It should be noted that the specific curved shape of the groove 501 is not limited as long as the heat sink 50 has enough space and can facilitate the curved molding of the first refrigerant pipe 101.

The specific structural form of the heat sink 50 is not limited as long as the heat can be dissipated from the circuit board 40. For example, in an embodiment, referring to fig. 5, the heat dissipation member 50 is plate-shaped, and the recess 501 is disposed on a surface of the heat dissipation member 50 facing away from the circuit board 40. Thus, the heat sink 50 has a larger area to provide the recess 501; in addition, it is also convenient to snap the first refrigerant pipe 101 directly from the surface of the heat sink 50 into the groove 501, and assembly is convenient. The plate shape may be a flat plate shape or a curved plate shape, and is not limited herein.

It should be noted that the first refrigerant pipe 101 refers to a tubular structure between the outlet of the condenser 12 and the inlet of the compressor 11 for guiding the flow. Specifically, the first refrigerant pipe 101 includes: a pipe line connected between the condenser 12 and the expansion valve 13, and a pipe line connected between the expansion valve 13 and the evaporator 14; a pipe connected between the evaporator 14 and the inlet of the compressor 11; and the section 14' of the evaporator 14 itself.

For example, in one embodiment, referring to fig. 4, the circuit board 40 and the heat sink 50 are located above the evaporator 14, and a portion of the pipe segment of the evaporator 14 is led out of the evaporator 14 to above the accommodating space 301, and the heat sink 50 is in heat conductive contact. In this embodiment, the circuit board 40 and the heat sink 50 are disposed close to the evaporator 14, and a portion of the tube segment 14' is led out from the evaporator 14 to dissipate heat from the heat sink 50, so that the heat pump system 10 can be conveniently wired, the length of the first refrigerant tube 101 can be reduced, and the production cost can be reduced. It should be noted that a part of the pipe section led out from the evaporator 14 is a part of the refrigeration circuit of the heat pump system, and therefore, the refrigerant in the part of the pipe section led out from the evaporator 14 can flow in the refrigeration circuit of the heat pump system.

In one embodiment, referring to fig. 2, a portion of the evaporator 14 is led out from a side of the evaporator 14 away from the compressor 11, so that the circuit board 40 can be placed further away from the compressor 11 and the motor, and the heat dissipation effect of the compressor 11 and the motor on the circuit board 40 is further reduced.

In other embodiments, a flow passage is formed in the heat sink 50 and is positioned in a refrigerant flow path between an outlet of the condenser 12 and an inlet of the compressor 11 to allow the refrigerant to be in heat-conductive contact with the heat sink 50. That is, the flow channel is on the refrigerant circulation circuit, and the condensing agent is in direct contact with the heat sink 50 and conducts heat during the flowing process of the condensing agent in the flow channel, so that the heat sink 50 can be cooled quickly and effectively.

The compressor 11 may be a fixed-frequency compressor 11 or an inverter compressor 11.

Illustratively, in an embodiment of the present application, the compressor 11 is an inverter compressor, and the circuit board 40 is an inverter control board. That is, the frequency of the compressor 11 is adjustable to continuously vary the output energy. The variable frequency control panel is used for controlling the variable frequency of the variable frequency compressor.

It should be noted that, in the embodiment where the laundry treating apparatus includes the main control board, the variable frequency control board is different from the main control board. The main control board is used for controlling the operation of the whole machine, and the variable frequency control board is used for controlling the variable frequency of the variable frequency compressor. In some embodiments, the main control board and the variable frequency control board may be integrated. In other embodiments, the main control board and the variable frequency control board are arranged separately.

In one embodiment, the electronic frequency control board is provided with an inverter chip for controlling the inverter compressor 11, and the heat sink 50 is disposed at the position of the inverter chip. The frequency conversion chip has a large power and a large heat productivity in the working process, and needs to be effectively cooled, so that in this embodiment, the heat sink 50 is disposed above the frequency conversion chip to effectively cool the frequency conversion chip.

The clothes treatment device, the clothes dryer or the washing and drying all-in-one machine according to the embodiment of the application are not limited herein. It should be noted that, in the embodiment where the laundry treating apparatus is a clothes dryer, the drum assembly 20 may have only one drum. In the embodiment where the laundry treating apparatus is an all-in-one washer dryer, the drum assembly 20 includes an outer tub to an inner drum rotatably disposed therein, and the circuit board 40 is disposed in a region between above the accommodating space 301 and below the outer tub.

The various embodiments/implementations provided herein may be combined with each other without contradiction.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A laundry treating apparatus having an air flow circulation passage, the laundry treating apparatus comprising:

the base (30), the base (30) is provided with an accommodating space (301), and the accommodating space (301) is positioned on the airflow circulating channel;

a heat pump system (10), the heat pump system (10) comprising a compressor (11), an evaporator (14) and a condenser (12); the evaporator (14) and the condenser (12) are disposed in the accommodation space (301);

a cartridge assembly (20), the cartridge assembly (20) disposed above the base (30);

a circuit board (40) electrically connected to the compressor (11), the circuit board (40) being disposed in a region between an upper side of the accommodation space (301) and a lower side of the barrel assembly (20).

2. The laundry treating apparatus according to claim 1, characterized in that the circuit board (40) is horizontally arranged; and/or the base (30) is provided with a cover plate (31) used for closing the accommodating space (301), and the circuit board (40) is supported on the top surface of the cover plate (31).

3. The laundry treating apparatus according to claim 1, further comprising a heat radiating member (50), the heat radiating member (50) being disposed on the circuit board (40) to radiate heat from the circuit board (40).

4. A laundry treatment apparatus according to claim 3, characterized in that the heat pump system (10) has a first refrigerant pipe (101), the first refrigerant pipe (101) being located between the condenser (12) outlet to the compressor (11) inlet, the first refrigerant pipe (101) being routed through the radiator element (50) to dissipate heat from the radiator element (50).

5. The laundry treating apparatus according to claim 4, characterized in that the circuit board (40) and the heat sink (50) are located above the evaporator (14) correspondingly; a portion of the pipe sections of the evaporator (14) is led out of the evaporator (14) above the receiving space (301) and the heat sink (50) is in heat-conducting contact.

6. Laundry treatment apparatus according to claim 5, characterized in that a part of the pipe section of the evaporator (14) leads out from a side of the evaporator (14) facing away from the compressor.

7. Laundry treatment apparatus according to claim 5, characterized in that the side of the heat sink (50) facing away from the circuit board (40) is provided with a groove (501), the first refrigerant pipe (101) passing through the groove (501).

8. The laundry processing apparatus according to claim 7, wherein a layer of heat conductive material is filled between an outer surface of the first refrigerant pipe (101) and a corresponding inner wall of the groove (501).

9. The laundry treating apparatus according to claim 4, characterized in that a flow passage is formed in the heat radiating member (50) on a refrigerant flow path between the outlet of the condenser (12) to the inlet of the compressor (11) to bring the refrigerant into heat conductive contact with the heat radiating member (50).

10. The laundry treatment apparatus according to any one of claims 3-9, characterized in that the compressor (11) is an inverter compressor, the circuit board (40) is an inverter control board, an inverter chip for controlling the inverter compressor is arranged on the inverter control board, and the heat sink (50) is arranged at a position of the inverter chip.