CN209877185U - Mainboard and air conditioner - Google Patents

Abstract

The utility model belongs to the field of electric fittings, and relates to a mainboard and an air conditioner, wherein the mainboard comprises a base body provided with a chip; the evaporator tube and the condenser tube form a heat exchange medium closed loop, wherein the evaporator tube extends into the substrate and extends along the edge of the chip, and the condenser tube is arranged on the outer side of the substrate; the capillary tube is arranged between the liquid inlet end of the evaporation tube and the liquid outlet end of the condensation tube in series. The capillary tube is arranged between the liquid outlet end of the condensing tube and the liquid inlet end of the evaporating tube in series, so that when a liquid heat exchange medium located in the condensing tube enters the capillary tube, the liquid heat exchange medium is partially converted into a gaseous state, the gas-liquid two-phase heat exchange medium is formed, the gaseous heat exchange medium promotes the overall flowability of the heat exchange medium, the heat exchange between the heat exchange medium and the base body is enhanced, and the heat dissipation effect of the mainboard is improved.

Description

Mainboard and air conditioner

Technical Field

The utility model relates to an electrical accessories technical field, in particular to mainboard and air conditioner.

Background

Under the high temperature environment in summer, the chip heat dissipation of mainboard is bad, breaks down easily. When the mainboard broke down, can influence the operation of whole device certainly, especially to the mainboard of air conditioner, the heat dissipation is bad will lead to the refrigeration to rise frequently slow, difficult, and control logic easily reports wrong, and the refrigerating output is not enough, and operation power consumption is big, causes the user to complain about. For this situation, a pipeline capable of transmitting a heat exchange medium is usually disposed on the substrate of the motherboard to dissipate heat, but the heat dissipation effect is still to be improved.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a mainboard and air conditioner to improve the radiating effect of mainboard. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.

According to a first aspect of the embodiments of the present disclosure, there is provided a main board, including:

a substrate provided with a chip;

the evaporator tube and the condenser tube form a heat exchange medium closed loop, wherein the evaporator tube extends into the substrate and extends along the edge of the chip, and the condenser tube is arranged on the outer side of the substrate;

and the capillary tube is arranged between the liquid inlet end of the evaporation tube and the liquid outlet end of the condensation tube in series.

In some optional embodiments, a heat dissipation structure for dissipating heat of the condensation pipe is disposed on the condensation pipe.

In some alternative embodiments, the heat dissipation structure is an inflatable panel.

In some optional embodiments, the plate surface of the blowing plate is provided with through holes for allowing air flow to pass through.

In some optional embodiments, the ratio of the inner diameters of the condensation pipe and the capillary pipe is 2.00-3.75.

In some alternative embodiments, the included angle between the outflow pipe section of the condensation pipe and the capillary pipe is alpha, and alpha is more than or equal to 90 degrees and less than 180 degrees.

In some optional embodiments, an angle between the outflow pipe section of the condensation pipe and the capillary pipe is α, and α is 90 °.

According to a second aspect of the embodiments of the present disclosure, an air conditioner is provided, which includes the main board provided in any one of the optional embodiments.

The embodiment of the utility model provides a technical scheme can include following beneficial effect:

the capillary tube is arranged between the liquid outlet end of the condensing tube and the liquid inlet end of the evaporating tube in series, so that when a liquid heat exchange medium located in the condensing tube enters the capillary tube, the liquid heat exchange medium is partially converted into a gaseous state, the gas-liquid two-phase heat exchange medium is formed, the gaseous heat exchange medium promotes the whole flowability of the heat exchange medium, the heat exchange between the heat exchange medium and the edge of the chip is enhanced, and the heat dissipation effect of the mainboard is improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 is a schematic diagram of a motherboard according to an exemplary embodiment;

fig. 2 is a schematic structural view illustrating an outdoor unit of an air conditioner according to an exemplary embodiment.

Wherein, 1, a substrate; 10. a chip; 21. a condenser tube; 22. an evaporation tube; 3. a capillary tube; 4. a blow-up plate; 5. a housing; 6. an axial flow fan.

Detailed Description

The following description and the drawings sufficiently illustrate specific embodiments herein to enable those skilled in the art to practice them. Portions and features of some embodiments may be included in or substituted for those of others. The scope of the embodiments herein includes the full ambit of the claims, as well as all available equivalents of the claims. Herein, the term "comprises," "comprising," or any other variation thereof, is intended to cover a non-exclusive inclusion, such that a structure, apparatus, or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such structure, apparatus, or device. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like herein indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. In the description herein, unless otherwise specified and limited, the term "connected" is to be understood broadly, and may be, for example, a mechanical or electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate medium, and the specific meaning of the term may be understood by those skilled in the art as appropriate.

Herein, the term "and/or" is an associative relationship describing objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.

Fig. 1 is a schematic structural diagram of a motherboard according to an exemplary embodiment. As shown in fig. 1, a main board includes a base 1 provided with a chip 10; the evaporation tube 22 and the condensation tube 21 form a heat exchange medium closed loop, wherein the evaporation tube 22 extends into the substrate 1 and extends along the edge of the chip 10, and the condensation tube 21 is arranged on the outer side of the substrate 1; and the capillary tube 3 is arranged between the liquid inlet end of the evaporation tube 22 and the liquid outlet end of the condensation tube 21 in series.

The heat exchange medium flows to the evaporation tube 22, absorbs heat generated by the chip 10 to become a gas state, then flows to the condensation tube 21 to release heat to become a liquid state, and heat dissipation of the chip 10 is realized through circulating flow between the evaporation tube 22 and the condensation tube 21. Capillary 3 sets up between the income liquid end of evaporating pipe 22 and the play liquid end of condenser pipe 21, after liquid heat transfer medium flows out from the play liquid end of condenser pipe 21, get into capillary 3, partial heat transfer medium converts the gaseous state into, like this, form gas, liquid mixed heat transfer medium, gaseous heat transfer medium can promote the holistic mobility of heat transfer medium, make heat transfer medium's circulation power reinforcing, thereby improve heat transfer medium to chip 10's heat exchange effect, promote the heat dispersion of mainboard.

In actual use, the orientation of the main plate is adjusted to be that the condensation pipe 21 is positioned above the evaporation pipe 22, so that when a heat exchange medium enters the capillary tube 3 from the liquid outlet end of the condensation pipe 21, gravity can enhance the flowing power of the heat exchange medium, the flow velocity of the heat exchange medium is increased, and the heat exchange effect is enhanced.

Optionally, the base 1 is a PCB printed circuit board.

Optionally, the evaporating pipe 22 and the condensing pipe 21 are made of aluminum or copper. The capillary 3 is made of aluminum, copper or plastic hose. Therefore, throttling expansion and pipeline arrangement of the refrigerant can be considered, and heat exchange between the heat exchange medium and the outside is facilitated.

In one embodiment of the present invention, the inner diameter ratio of the condenser tube 21 to the capillary tube 3 is 2.00-3.75. If the inner diameter ratio of the pipe is higher than 3.75, the circulation of the heat exchange medium is not facilitated; if the ratio of the inner diameters of the tubes is less than 2.00, vaporization of the heat exchange medium is not facilitated. Therefore, within the scope of this embodiment, it is favorable to forming the heat exchange medium of the gas-liquid mixture of the right amount proportion, can promote the whole mobility of heat exchange medium, can carry out effective heat exchange with chip 10 again.

Alternatively, the inflow pipe section of the evaporation pipe 22 extends from one end of the edge of the base body 1, the outflow pipe section extends from the other end of the same edge of the base body 1, and the inflow pipe section and the outflow pipe section of the evaporation pipe 22 are bent toward each other along the same edge of the chip 10 and communicate with each other. In this way, the heat exchange medium in the evaporating tubes 22 can exchange heat with the edge of the chip 10, and the space near the surface of the substrate 1 can be prevented from being occupied, and other components can be arranged on two sides of the surface of the substrate 1.

Alternatively, the evaporation tube 22 and the capillary tube 3 form a U-shaped structure. Therefore, the space occupation is saved on the basis of ensuring the heat exchange effect.

Alternatively, the inflow and outflow sections of the condensation duct 21 are both straight tubes and arranged in parallel. Therefore, the space occupation is saved on the basis of ensuring the heat exchange effect.

In an embodiment of the present invention, the condensation pipe 21 is provided with a heat dissipation structure for dissipating heat from the condensation pipe 21.

The heat dissipation structure can promote the heat dissipation of the condensation duct 21. Optionally, the heat dissipation structure is a heat dissipation plate. Optionally, the heat sink is aluminum. The aluminum heat dissipation plate has good heat dissipation effect and is not easy to corrode. Optionally, the condensation duct 21 extends from the edge of the heat dissipation plate into the heat dissipation plate. Thus, the space near the plate surface of the heat dissipation plate is not occupied.

Optionally, the heat dissipation structure is a blown sheet 4. The expansion plate 4 can perform good heat exchange with the condensation duct 21. Optionally, a blowing plate 4 is connected in series to the condensation duct 21. The plate structure of the inflation plate 4 occupies less space. Alternatively, the edge of the blowing plate 4 is provided with a pipeline inlet and a pipeline outlet, the inflow pipe section of the condensation pipe 21 is communicated with the pipeline inlet, and the outflow pipe section is communicated with the pipeline outlet. In this way, the space outside the panel surface of the inflation panel 4 is prevented from being occupied by the condensation duct 21.

Optionally, the plate surface of the inflation plate 4 is provided with through holes for allowing the air flow to pass through. The air flows through the through holes, and the heat absorbed by the blowing plate 4 is quickly dissipated in the air. Optionally, the aperture of the through hole is 1mm to 3 mm. If the aperture is less than 1mm, it is disadvantageous that the blowing plate 4 transfers heat to the air, and if the aperture is more than 3mm, it affects the mechanical strength of the blowing plate 4. In this way, the heat exchange of the blowing plate 4 with the air is facilitated.

In one embodiment of the invention, part of the evaporator tubes 22 is embedded in the base body 1. The portion embedded in the substrate 1 is used for heat exchange with the chip 10.

In one embodiment of the present invention, the angle between the outflow pipe section of the condensation pipe 21 and the capillary 3 is α, α is greater than or equal to 90 ° and less than 180 °. When the position of the main board is adjusted to be vertical to the capillary tube 3, the outflow pipe section of the condensation pipe 21 is positioned above the capillary tube 3, and the heat exchange medium flowing out of the outflow pipe section can have sufficient power to flow into the capillary tube 3 under the influence of gravity.

In an embodiment of the present invention, the angle between the outflow pipe section of the condensation pipe 21 and the capillary tube 3 is α, which is 90 °. When the position of the main board is adjusted to be vertical to the capillary tube 3, the outflow pipe section of the condensation pipe 21 is in a horizontal state, which is beneficial to the heat exchange medium flowing into the pipe section to flow to the outflow pipe section. Alternatively, the inflow and outflow sections of the condenser tube 21 are both straight tubes and parallel. When the position of the main board is adjusted to be in a vertical state of the capillary tube 3, the outflow tube section and the inflow tube section of the condensation tube 21 are both in a horizontal state, so that the heat exchange medium flowing into the tube sections can flow to the outflow tube section, and the heat exchange medium flowing out of the tube sections can flow into the capillary tube 3; in addition, the mainboard is convenient to install inside the whole device, and the occupation of space is less.

Optionally, the inflow section and the outflow section of the evaporation tube 22 are both straight tubes and parallel, and the substrate 1 and the evaporation tube 22 are located on the same plane. Optionally, the inflow pipe section and the outflow pipe section of the condensation pipe 21 are both straight pipes and parallel, and the condensation pipe 21 and the inflation plate 4 are located on the same plane. Thus, the occupation of the space by the mainboard can be reduced.

According to the air conditioner provided by the embodiment, the air conditioner comprises the main board provided by any one of the previous embodiments. The air conditioner adopts the mainboard, the mainboard is easy to radiate heat, the phenomena of slow and difficult refrigeration frequency rise, easy error reporting of control logic, insufficient refrigeration quantity, large running power consumption and the like of the air conditioner due to poor heat radiation of the mainboard can be prevented, and the use requirements of users are met; moreover, the main board occupies less space and is suitable for being arranged inside the air conditioner.

Fig. 2 is a schematic structural view illustrating an outdoor unit of an air conditioner according to an exemplary embodiment. As shown in fig. 2, an embodiment of the present disclosure further provides an outdoor unit of an air conditioner, including the main board provided in any of the foregoing embodiments. The mainboard is arranged in the air conditioner outdoor unit, and the mainboard has good heat dissipation effect, so that the phenomena of slow and difficult refrigeration frequency rise, easy error reporting of control logic, insufficient refrigeration capacity, high running power consumption and the like of the air conditioner due to poor heat dissipation of the mainboard can be prevented, and the use requirements of users are met; in addition, the main board occupies less space and is suitable for being arranged inside the air conditioner outdoor unit.

Optionally, the outdoor unit includes a casing 5, the main board is disposed in the casing 5, and the casing 5 further includes an axial fan 6. Alternatively, the main plate is provided on the flow path of the airflow generated by the axial flow fan 6. In this way, the wind blown by the axial fan 6 can enhance the heat radiation effect to the main board.

The present invention is not limited to the structures that have been described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims (8)

1. A motherboard, comprising:

a substrate provided with a chip;

the evaporator tube and the condenser tube form a heat exchange medium closed loop, wherein the evaporator tube extends into the substrate and extends along the edge of the chip, and the condenser tube is arranged on the outer side of the substrate;

and the capillary tube is arranged between the liquid inlet end of the evaporation tube and the liquid outlet end of the condensation tube in series.

2. The main board according to claim 1, wherein the condensation duct is provided with a heat dissipation structure for dissipating heat from the condensation duct.

3. The motherboard of claim 2, wherein the heat dissipation structure is an intumescent plate.

4. The main plate according to claim 3, wherein the plate surface of the inflation plate is provided with through holes for allowing an air flow to pass therethrough.

5. The main plate according to claim 1, wherein a ratio of a tube inner diameter of the condensation tube to a tube inner diameter of the capillary tube is 2.00 to 3.75.

6. The main plate of claim 1, wherein an angle between the outflow pipe section of the condenser pipe and the capillary tube is α, and 90 ° α < 180 °.

7. The primary plate of claim 6, wherein an angle between the outlet tube section of the condenser tube and the capillary tube is α, α being 90 °.

8. An air conditioner, characterized by comprising the main board as claimed in any one of claims 1 to 7.