CN209877184U - A kind of motherboard and air conditioner - Google Patents

Abstract

The utility model belongs to the field of electric fittings and discloses a mainboard and an air conditioner, wherein the mainboard comprises a base body provided with a chip; two or more than two heat pipes arranged on the base body side by side, wherein the evaporation section of each heat pipe extends into the base body and is arranged along the same edge of the chip in an extending manner, and the condensation section of each heat pipe is arranged on the outer side of the base body. Through set up two or more than two heat pipes side by side on the base member, make its evaporation zone extend to the same edge of chip, the heat transfer medium who is located the heat pipe like this can be in short time with chip edge heat transfer, promote the radiating effect to chip edge to accelerate the heat dissipation to whole chip.

Description

A kind of motherboard and air conditioner

technical field

The utility model relates to the technical field of electrical accessories, for example, a main board and an air conditioner.

Background technique

When the motherboard is running, it will generate heat. If the heat dissipation is not good, it will cause failure. Especially for the main board of the air conditioner, poor heat dissipation will lead to slow and difficult cooling frequency increase, error-prone control logic, insufficient cooling capacity, and high power consumption during operation, causing users to complain. Usually, heat pipes are arranged on the substrate of the motherboard to dissipate heat. The evaporation section of the heat pipe is located inside the substrate, and the condensation section is located outside the substrate. However, its heat dissipation effect on the chip still needs to be improved.

Utility model content

The embodiment of the utility model provides a main board and an air conditioner, which improves the cooling effect on chips. In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. This summary is not an overview, nor is it intended to identify key/critical elements or delineate the scope of these embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.

According to a first aspect of an embodiment of the present disclosure, a motherboard is provided, including:

a substrate provided with a chip;

Two or more heat pipes arranged side by side on the substrate, wherein the evaporation section of each heat pipe extends into the substrate and extends along the same edge of the chip, and the condensation section of each heat pipe is set on the outside of the substrate.

In some optional embodiments, when the number of the heat pipes is two, the evaporation ends of the two heat pipes are arranged facing each other along the edge.

In some optional embodiments, a heat dissipation structure for dissipating heat from the condensation section is also included.

In some optional embodiments, the condensation sections of the two heat pipes are bent toward each other along the heat dissipation structure.

In some optional embodiments, the distance between the opposite ends of the condensation sections of the two heat pipes is b, 2mm≤b≤10mm.

In some optional embodiments, the distance between the opposite ends of the evaporation sections of the two heat pipes is a, 2mm≤a≤10mm.

In some optional embodiments, the evaporating section and the condensing section are communicated through a conveying section, and the length of the conveying section is 10 cm to 20 cm.

In some optional embodiments, the pipe diameters of the evaporating section and the condensing section are 2.5mm-3.0mm.

According to a second aspect of the embodiments of the present disclosure, an air conditioner is provided, including the main board provided in any one of the foregoing optional embodiments.

The technical solution provided by the embodiment of the utility model may include the following beneficial effects:

By arranging two or more heat pipes side by side on the substrate, the evaporation section extends to the same edge of the chip, so that the heat exchange medium located in the heat pipe can exchange heat with the edge of the chip in a short time, improving the efficiency of the edge of the chip. Excellent heat dissipation effect to speed up the heat dissipation of the entire chip.

It should be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present invention.

Description of drawings

The accompanying drawings, which are incorporated in the specification and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and are used together with the specification to explain the principle of the utility model.

Fig. 1 is a front view of a motherboard shown according to an exemplary embodiment;

Fig. 2 is a schematic structural diagram of a motherboard according to an exemplary embodiment;

Fig. 3 is a schematic structural diagram of an outdoor unit of an air conditioner according to an exemplary embodiment.

Among them, 1. Heat pipe; 11. Evaporation section; 12. Condensation section; 13. Conveying section; 2. Heat dissipation structure; 3. Substrate; 31. Chip;

Detailed ways

The following description and the accompanying drawings sufficiently illustrate specific embodiments herein to enable those skilled in the art to practice them. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of the embodiments herein includes the full scope of the claims, and all available equivalents of the claims. Herein, the term "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a structure, means or apparatus comprising a series of elements includes not only those elements but also other elements not expressly listed, or Yes also includes elements inherent to the structure, device or equipment. Various embodiments herein are described in a progressive manner, each embodiment focuses on the differences from other embodiments, and the same and similar parts of the various embodiments may be referred to each other.

The orientation or positional relationship indicated by the terms "upper", "inner", "outer", etc. in this document is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this article and simplifying the description, rather than indicating or implying the Means that a device or element must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the invention. In the description herein, unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, it can also be the internal communication of two elements, it can be a direct connection, or it can be through Intermediaries are indirectly connected, and those skilled in the art can understand the specific meanings of the above terms according to specific situations.

Fig. 1 is a front view of a motherboard according to an exemplary embodiment. As shown in Figure 1, a motherboard includes a base 3 provided with a chip 31; two or more heat pipes 1 arranged side by side on the base 3, wherein the evaporation section 11 of each heat pipe 1 extends into the base 3, and Extending along the same edge of the chip 31 , the evaporation section 11 of each heat pipe 1 is located outside the base 3 .

The heat pipe 1 has an evaporating section 11 and a condensing section 12. The heat exchange medium absorbs the heat generated by the chip 31 in the evaporating section 11 and becomes a gaseous state, and turns into a liquid state after releasing the heat in the condensing section 12. In actual use, the main board The orientation is adjusted so that the condensing section 12 is located above the evaporating section 11, and the gaseous heat exchange medium in the evaporating section 11 can flow upwards along the evaporating section 11 to the condensing section 12, and the liquid heat exchange medium formed after condensation moves downward under the action of gravity, reaching The evaporating section 11 continues to absorb heat, so that the circulation of the heat exchange medium is realized by gravity, and no power auxiliary device is required to increase the power of the heat exchange medium.

The evaporation sections 11 of the two heat pipes 1 extend to the same edge of the chip 31 . In this way, the heat exchange medium exchanges heat with different parts of the same edge through the evaporation sections 11 of the two heat pipes 1 . Optionally, when the number of heat pipes 1 is two, the evaporation sections 11 of the two heat pipes 1 are arranged facing each other along the edges. Compared with setting only one evaporation section 11 along the edge of the chip 31 , the circulation path of the heat exchange medium can be shortened, and the heat dissipation at the edge of the chip 31 can be accelerated. Moreover, the edge of the chip 31 near the middle is not easy to dissipate heat, and the two heat pipes 1 are distributed along the edge to speed up the heat exchange in the middle.

In this embodiment, the inside of the heat pipe 1 mainly relies on the gas-liquid phase transition of the heat exchange medium to conduct heat, and the thermal resistance is very small, so it has a high heat conductivity. The heat exchange medium can be a refrigerant, such as R32, R290, R410A And other medium-boiling fluorinated coolants, etc.

Optionally, the evaporation section 11 extends into the base body 3 from the edge of the base body 3 . In this way, to avoid occupying the space near the surface of the base body 3 , other components can be arranged on both sides of the base body 3 .

Optionally, the evaporation section 11 is L-shaped. In this way, the evaporating section 11 protrudes into the substrate 3 and extends directly to the edge of the chip, and then bends along the edge, which is beneficial to transfer heat to the outside of the substrate 3 as soon as possible. Comparing with complex bending in the base body 3 , the impact on the mechanical strength of the base body 3 is reduced, and the space inside the base body 3 is sufficient to arrange other components.

Optionally, the minimum distance between the evaporation section 11 and the edge of the chip is L, 1mm≤L≤5mm. In this way, it is beneficial to fully receive the heat from the edge of the chip and accelerate heat dissipation.

In one embodiment, the distance between the opposite ends of the evaporation sections 11 of the two heat pipes 1 is a, 2mm≤a≤10mm.

If the distance between the opposite ends of the evaporation section 11 is too large, it is not conducive to the heat exchange medium to absorb the heat at the middle position of the edge of the chip; if the distance between the opposite ends of the evaporation section 11 is too small, it will cause the substrate between the ends 3. The mechanical strength is reduced, and it is easy to crack and deform.

In one embodiment, as shown in FIGS. 1 and 3 , a heat dissipation structure 2 for dissipating heat from the condensation section 12 is also included.

Optionally, the condensation sections 12 of the two heat pipes 1 are bent toward each other along the heat dissipation structure 2 .

The condensing section 12 is arranged on the outside of the base body 3, which is conducive to heat dissipation. The heat dissipation structure 2 can promote the heat dissipation of the condensing section 12. The condensing section 12 is bent along the heat dissipation structure 2 to increase the contact area with the heat dissipation structure 2, and can aim at heat dissipation. One side of structure 2 performs rapid heat exchange.

Optionally, the evaporation section 11 extends into the base body 3 from the edge of the base body 3 , and the condensation section 12 extends into the heat dissipation structure 2 from the edge of the heat dissipation structure 2 opposite to the base body 3 . In this way, the motherboard occupies less space.

Optionally, the heat dissipation structure 2 is an aluminum heat dissipation plate. The aluminum heat dissipation plate has good heat dissipation effect and is not easy to be corroded.

Optionally, the heat dissipation structure 2 is an inflatable plate. Optionally, the inflation plate and the base body 3 are in the same plane. Both the aluminum heat dissipation structure 2 and the inflation plate can perform better heat exchange with the condensation section 12 . Optionally, the evaporation section 11 extends into the base body 3 from the edge of the base body 3 , and the condensation section 12 extends into the inflation plate from the edge of the inflation plate opposite to the base body 3 . In this way, the occupation of space can be reduced. Optionally, through holes for enhancing heat dissipation are opened on the surface of the inflation plate. The space flows through the through holes, which speeds up the dissipation of the heat absorbed by the inflatable plate into the air. Optionally, the diameter of the through hole is 1mm˜3mm. If the hole diameter is less than 1 mm, it will be unfavorable for the inflatable plate to transfer heat to the air, and if the hole diameter is higher than 3 mm, it will affect the mechanical strength of the inflatable plate. In this way, heat exchange between the inflation plate and the air is beneficial.

Optionally, the condensation section 12 is in close contact with the plate surface of the heat dissipation structure 2 . In this way, the heat absorption of the cooling section 12 by the heat dissipation structure 2 can also be realized.

Optionally, the condensation section 12 extends into the heat dissipation structure 2 . Optionally, the condensation section 12 runs through the heat dissipation structure 2 . Optionally, the condensation section 12 is L-shaped. In this way, it is beneficial for the condensation section 12 to transfer heat to the heat dissipation structure 2 .

In one embodiment, as shown in FIG. 2 , the distance between the opposite ends of the condensation sections 12 of the two heat pipes 1 is b, where 2mm≤b≤10mm. If the distance between the opposite ends of the condensation section 12 is too large, it is not conducive to the heat transfer medium to quickly transfer heat to the middle position of the edge of the heat dissipation structure; if the distance between the opposite ends of the condensation section 12 is too small, it will cause the gap between the ends The mechanical strength of the heat dissipation structure between them is reduced, and it is easy to crack and deform.

In one embodiment of the present invention, the evaporation section 11 and the condensation section 12 are communicated through a conveying section 13, and the length of the conveying section 13 is 10cm-20cm.

Optionally, the conveying section 13 is a straight pipe. Optionally, the conveying section 13 is made of aluminum or copper.

In one embodiment of the present invention, the condensation section 12 is embedded in the heat dissipation structure 2 . In one embodiment of the present utility model, the evaporation section 11 is embedded in the base body 3 . In one embodiment of the present invention, the tube diameters of the evaporating section 11 and the condensing section 12 are 2.5mm-3.0mm. In this way, the flow and heat transfer of the heat exchange medium are facilitated. Optionally, the heat pipe 1 is made of aluminum or copper. In this way, the circulation and heat exchange of the heat exchange medium is facilitated.

An embodiment of the present disclosure also provides an air conditioner, including the main board provided in any one of the foregoing embodiments. The air conditioner adopts this easy-to-dissipate motherboard, which can prevent the air conditioner from slow and difficult cooling frequency increase due to poor heat dissipation of the motherboard, easy error reporting of control logic, insufficient cooling capacity, and high power consumption during operation, so as to meet the needs of users.

Fig. 3 is a schematic structural view of an air conditioner outdoor unit according to an exemplary embodiment. As shown in Fig. 3 , an embodiment of the present disclosure further provides an air conditioner outdoor unit, including the main board provided by any one of the foregoing embodiments. The motherboard is installed in the outdoor unit of the air conditioner. Due to the better heat dissipation effect of the motherboard, it can prevent the air conditioner from being slow and difficult to increase the cooling frequency due to poor heat dissipation of the motherboard, easy to report errors in the control logic, insufficient cooling capacity, and high power consumption during operation, etc. Usage requirements.

Optionally, the outdoor unit includes a casing 4 , the main board is arranged in the casing 4 , and the casing 4 also includes an axial fan 5 . Optionally, the main board is arranged on the flow path of the airflow generated by the axial fan 5 . In this way, the wind blown by the axial flow fan 5 can enhance the cooling effect on the main board.

The present invention is not limited to the structures which have been described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (9)

1. A motherboard, characterized in that, comprising: a substrate provided with a chip; Two or more heat pipes arranged side by side on the substrate, wherein the evaporation section of each heat pipe extends into the substrate and extends along the same edge of the chip, and the condensation section of each heat pipe is set on the outside of the substrate. 2 . The motherboard according to claim 1 , wherein when the number of the heat pipes is two, the evaporation ends of the two heat pipes are arranged facing each other along the edge. 3. The motherboard according to claim 1, further comprising a heat dissipation structure for dissipating heat from the condensation section. 4. The motherboard according to claim 3, wherein the condensation sections of the two heat pipes are bent towards each other along the heat dissipation structure. 5 . The motherboard according to claim 4 , wherein the distance between the opposite ends of the condensation sections of the two heat pipes is b, 2mm≤b≤10mm. 6 . The motherboard according to claim 2 , wherein the distance between the opposite ends of the evaporation sections of the two heat pipes is a, 2mm≤a≤10mm. 7. The main board according to claim 1, characterized in that, the evaporation section and the condensation section are communicated through a delivery section, and the length of the delivery section is 10cm-20cm. 8 . The main board according to claim 1 , wherein the pipe diameters of the evaporating section and the condensing section are 2.5 mm to 3.0 mm. 9. An air conditioner, comprising the main board according to any one of claims 1-8.