CN109945327B

CN109945327B - Mainboard and air conditioner

Info

Publication number: CN109945327B
Application number: CN201910225623.1A
Authority: CN
Inventors: 董旭; 王飞
Original assignee: Qingdao Haier Air Conditioner Gen Corp Ltd; Qingdao Haier Co Ltd
Current assignee: Qingdao Haier Air Conditioner Gen Corp Ltd; Haier Smart Home Co Ltd
Priority date: 2019-03-25
Filing date: 2019-03-25
Publication date: 2024-08-16
Anticipated expiration: 2039-03-25
Also published as: CN109945327A

Abstract

The present invention belongs to the field of electrical accessories, and relates to a mainboard and an air conditioner, wherein the mainboard includes a substrate provided with a chip; an evaporator and a condenser forming a closed loop of a heat exchange medium, wherein the evaporator extends into the substrate and extends along the edge of the chip, and the condenser is arranged on the outside of the substrate; and a capillary arranged in series between the liquid inlet end of the evaporator and the liquid outlet end of the condenser. By arranging the capillary in series between the liquid outlet end of the condenser and the liquid inlet end of the evaporator, when the liquid heat exchange medium in the condenser enters the capillary, part of it is converted into a gaseous state, forming a heat exchange medium with gas-liquid two-phases, and the gaseous heat exchange medium promotes the overall fluidity of the heat exchange medium, enhances the heat exchange between the heat exchange medium and the substrate, and improves the heat dissipation effect of the mainboard.

Description

Mainboard and air conditioner

Technical Field

The invention relates to the technical field of electrical accessories, in particular to a main board and an air conditioner.

Background

In a high-temperature environment in summer, the heat dissipation of the chip of the main board is poor, and faults are easy to occur. When the main board breaks down, the operation of the whole device is inevitably influenced, and particularly for the main board of an air conditioner, the cooling frequency rise is slow and difficult due to poor heat dissipation, the control logic is easy to report errors, the cooling capacity is insufficient, the operation power consumption is high, and the complaints of users are caused. In this case, a pipe capable of transmitting a heat exchange medium is usually provided on a substrate of the motherboard to dissipate heat, but the heat dissipation effect thereof is still to be improved.

Disclosure of Invention

The embodiment of the invention provides a main board and an air conditioner, which are used for improving the heat dissipation effect of the main board. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.

According to a first aspect of an embodiment of the present disclosure, there is provided a motherboard, including:

A substrate provided with a chip;

the evaporation tube and the condensation tube form a closed loop of the heat exchange medium, wherein the evaporation tube stretches into the substrate and extends along the edge of the chip, and the condensation tube is arranged on the outer side of the substrate;

the capillary tube is arranged in series between the liquid inlet end of the evaporation tube and the liquid outlet end of the condensation tube.

In some alternative embodiments, the condensation pipe is provided with a heat dissipation structure for dissipating heat of the condensation pipe.

In some alternative embodiments, the heat dissipating structure is a blown sheet.

In some alternative embodiments, the panel surface of the inflation panel is provided with a through hole for air flow to pass through.

In some alternative embodiments, the ratio of the inner diameter of the condenser tube to the capillary tube is 2.00-3.75.

In some alternative embodiments, the angle between the outflow section of the condenser tube and the capillary tube is α, 90+.α < 180 °.

In some alternative embodiments, the angle between the outflow section of the condenser tube and the capillary tube is α, α=90°.

According to a second aspect of the disclosed embodiments, an air conditioner is provided, including the motherboard provided in any one of the foregoing optional embodiments.

The technical scheme provided by the embodiment of the invention can have the following beneficial effects:

Through setting up the capillary in series between the liquid end of condenser pipe and the income liquid end of evaporating pipe, when making the liquid heat transfer medium that is located the condenser pipe get into the capillary, part changes into the gaseous state, forms the heat transfer medium that has gas-liquid two-phase, gaseous heat transfer medium has promoted the holistic mobility of heat transfer medium, strengthens the heat exchange of heat transfer medium and chip edge, has improved the radiating effect of mainboard.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic diagram of a motherboard according to an exemplary embodiment;

Fig. 2 is a schematic view illustrating a structure of an outdoor unit of an air conditioner according to an exemplary embodiment.

Wherein, 1, a basal body; 10. a chip; 21. a condensing tube; 22. an evaporation tube; 3. a capillary tube; 4. an inflation plate; 5. a housing; 6. an axial flow fan.

Detailed Description

The following description and the drawings sufficiently illustrate specific embodiments herein to enable those skilled in the art to practice them. Portions and features of some embodiments may be included in, or substituted for, those of others. The scope of the embodiments herein includes the full scope of the claims, as well as all available equivalents of the claims. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a structure, apparatus, or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such structure, apparatus, or device. Various embodiments are described herein in a progressive manner, each embodiment focusing on differences from other embodiments, and identical and similar parts between the various embodiments are sufficient to be seen with each other.

The terms "upper," "lower," "vertical," "horizontal," "inner," "outer," and the like herein refer to an orientation or positional relationship based on that shown in the drawings, for ease of description and simplicity of description only, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention. In the description herein, unless otherwise specified and defined, the term "connected" is to be construed broadly, and for example, may be a mechanical connection or an electrical connection, may be a communication between two elements, may be a direct connection, or may be an indirect connection via an intermediary, and the specific meaning of the term may be understood by those skilled in the art according to circumstances.

Herein, the term "and/or" is an association relation describing an object, meaning that three relations may exist. For example, a and/or B, represent: a or B, or, A and B.

Fig. 1 is a schematic diagram showing a structure of a motherboard according to an exemplary embodiment. As shown in fig. 1, a motherboard includes a substrate 1 provided with a chip 10; an evaporation tube 22 and a condensation tube 21 forming a closed loop of heat exchange medium, wherein the evaporation tube 22 extends into the substrate 1 and extends along the edge of the chip 10, and the condensation tube 21 is arranged outside the substrate 1; and a capillary tube 3 arranged in series between the liquid inlet end of the evaporation tube 22 and the liquid outlet end of the condensation tube 21.

The heat exchange medium flows to the evaporation tube 22 to absorb heat generated by the chip 10 into a gaseous state, then flows to the condensation tube 21 to release the heat into a liquid state, and the heat dissipation of the chip 10 is realized by the circulation flow between the evaporation tube 22 and the condensation tube 21. The capillary tube 3 is arranged between the liquid inlet end of the evaporation tube 22 and the liquid outlet end of the condensation tube 21, when the liquid heat exchange medium flows out from the liquid outlet end of the condensation tube 21, the liquid heat exchange medium enters the capillary tube 3, and part of the heat exchange medium is converted into a gaseous state, so that the gaseous heat exchange medium and the liquid mixed heat exchange medium are formed, the gaseous heat exchange medium can improve the whole fluidity of the heat exchange medium, the circulating power of the heat exchange medium is enhanced, the heat exchange effect of the heat exchange medium on the chip 10 is improved, and the heat dissipation performance of the main board is improved.

In actual use, the orientation of the main board is adjusted to be that the condensing tube 21 is positioned above the evaporating tube 22, so that when the heat exchange medium enters the capillary tube 3 from the liquid outlet end of the condensing tube 21, the gravity can enhance the flow power of the heat exchange medium, so that the flow speed of the heat exchange medium is increased, and the heat exchange effect is enhanced.

Alternatively, the substrate 1 is a PCB printed circuit board.

Optionally, the evaporating tube 22 and the condensing tube 21 are made of aluminum or copper. The capillary tube 3 is made of aluminum, copper or plastic hose. Therefore, the throttling expansion and the pipeline arrangement of the refrigerant can be considered, and the heat exchange between the heat exchange medium and the outside is facilitated.

In one embodiment of the present invention, the ratio of the inside diameter of the condenser tube 21 to the capillary tube 3 is 2.00-3.75. If the inner diameter ratio of the tube is higher than 3.75, the circulation of the heat exchange medium is not facilitated; if the tube inside diameter ratio is less than 2.00, vaporization of the heat exchange medium is not facilitated. Therefore, in the range of this embodiment, a proper proportion of gas-liquid mixed heat exchange medium is advantageously formed, so that the fluidity of the whole heat exchange medium can be improved, and the heat exchange with the chip 10 can be effectively performed.

Alternatively, the inflow section of the evaporation tube 22 extends from one end of the edge of the base 1, the outflow section extends from the other end of the same edge of the base 1, and the inflow section and the outflow section of the evaporation tube 22 are bent toward and communicate with each other along the same edge of the chip 10. In this way, the heat exchange medium in the evaporation tube 22 is beneficial to heat exchange with the edge of the chip 10, and the space near the surface of the substrate 1 is avoided, and other components can be arranged on two sides of the surface of the substrate 1.

Optionally, the evaporation tube 22 and the capillary tube 3 form a U-shaped structure. Thus, space occupation is saved on the basis of guaranteeing the heat exchange effect.

Alternatively, the inflow pipe section and the outflow pipe section of the condensation pipe 21 are straight pipes and are arranged in parallel. Thus, space occupation is saved on the basis of guaranteeing the heat exchange effect.

In one embodiment of the present invention, the condensation duct 21 is provided with a heat dissipation structure for dissipating heat from the condensation duct 21.

The heat radiation structure can promote heat radiation of the condenser tube 21. Optionally, the heat dissipation structure is a heat dissipation plate. Optionally, the heat dissipation plate is aluminum. The aluminum heat dissipation plate has good heat dissipation effect and is not easy to corrode. Alternatively, the condensation duct 21 extends into the heat sink from the edge of the heat sink. Thus, the space near the plate surface of the heat dissipation plate is not occupied.

Alternatively, the heat dissipation structure is an expansion plate 4. The expansion plate 4 can perform better heat exchange with the condenser tube 21. Optionally, a blow-up plate 4 is connected in series to the condenser tube 21. The panel structure of the inflation panel 4 occupies less space. Optionally, the edge of the inflation plate 4 is provided with a pipeline inlet and a pipeline outlet, the inflow pipe section of the condensation pipe 21 is communicated with the pipeline inlet, and the outflow pipe section is communicated with the pipeline outlet. In this way, the space outside the panel surface of the expansion panel 4 is prevented from being occupied by the condenser tube 21.

Optionally, the panel surface of the inflation panel 4 is provided with a through hole for the air flow to pass through. The air flows through the through holes, so that the heat absorbed by the inflation plate 4 is quickly dissipated into the air. Optionally, the aperture of the through hole is 1 mm-3 mm. If the aperture is less than 1mm, it is disadvantageous for the expansion plate 4 to transfer heat to the air, and if the aperture is more than 3mm, it affects the mechanical strength of the expansion plate 4. This facilitates the heat exchange between the expansion plate 4 and the air.

In one embodiment of the invention, a portion of the evaporation tube 22 is embedded in the substrate 1. The portion embedded in the substrate 1 is used for heat exchange with the chip 10.

In one embodiment of the invention, the angle between the outflow section of the condenser tube 21 and the capillary tube 3 is alpha, 90 deg. alpha < 180 deg.. When the position of the main board is adjusted to the capillary tube 3 to be in a vertical state, the outflow tube section of the condensation tube 21 is positioned above the capillary tube 3, and the heat exchange medium of the outflow tube section can have sufficient power to flow into the capillary tube 3 under the influence of gravity.

In one embodiment of the invention, the angle between the outflow section of the condenser tube 21 and the capillary tube 3 is α, α=90°. When the position of the main plate is adjusted to the vertical state of the capillary tube 3, the outflow pipe section of the condenser pipe 21 is in a horizontal state, so that the heat exchange medium flowing into the outflow pipe section flows to the outflow pipe section. Alternatively, the inflow and outflow sections of the condenser tube 21 are straight and parallel. When the position of the main board is adjusted to the vertical state of the capillary tube 3, the outflow tube section and the inflow tube section of the condensation tube 21 are both in the horizontal state, so that the heat exchange medium flowing into the tube section is beneficial to flowing into the outflow tube section, and the heat exchange medium flowing out of the tube section can flow into the capillary tube 3; in addition, make the mainboard be convenient for install inside whole device, occupy less to the space.

Alternatively, the inflow pipe section and the outflow pipe section of the evaporation pipe 22 are straight pipes and parallel, and the substrate 1 and the evaporation pipe 22 are located on the same plane. Alternatively, the inflow pipe section and the outflow pipe section of the condensation pipe 21 are straight pipes and parallel, and the condensation pipe 21 and the inflation plate 4 are located on the same plane. Thus, the occupation of the space by the main board can be reduced.

The air conditioner provided by the embodiment comprises the main board provided by any one of the embodiments. The air conditioner adopts the main board, the main board is easy to radiate, the phenomena that the air conditioner is slow and difficult in refrigerating frequency rise due to poor heat radiation of the main board, the control logic is easy to report errors, the refrigerating capacity is insufficient, the running power consumption is high and the like can be prevented, and the use requirement of a user can be met; and the main board occupies less space and is suitable for being arranged in an air conditioner.

Fig. 2 is a schematic view illustrating a structure of an outdoor unit of an air conditioner according to an exemplary embodiment. As shown in fig. 2, an embodiment of the present disclosure further provides an outdoor unit of an air conditioner, including the motherboard provided in any one of the foregoing embodiments. The main board is arranged in the air conditioner outdoor unit, and the main board has good heat dissipation effect, so that the phenomena of slow and difficult refrigerating frequency rise, easy error reporting of control logic, insufficient refrigerating capacity, high running power consumption and the like of the air conditioner due to poor heat dissipation of the main board can be prevented, and the use requirement of a user is met; and the main board occupies less space and is suitable for being arranged in the air conditioner outdoor unit.

Optionally, the outdoor unit comprises a casing 5, the main board is arranged in the casing 5, and the casing 5 further comprises an axial flow fan 6. Alternatively, the main plate is disposed on the flow path of the air flow generated by the axial flow fan 6. In this way, the heat radiation effect on the motherboard can be enhanced by the wind blown out by the axial flow fan 6.

The present invention is not limited to the structure that has been described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims

1. A motherboard, comprising:

A substrate having a chip;

An evaporation tube and a condensation tube forming a closed loop of a heat exchange medium, wherein the evaporation tube extends into the substrate and along the edge of the chip, and the condensation tube is arranged on the outside of the substrate;

A capillary tube is arranged in series between the liquid inlet end of the evaporating tube and the liquid outlet end of the condensing tube; the inner diameter ratio of the condensing tube to the capillary tube is 2.00 to 3.75;

Among them, the angle between the outflow pipe section of the condenser and the capillary is α, α=90°; the capillary is in a vertical state, the outflow pipe section and the inflow pipe section of the condenser are both in a horizontal state, and the inflow pipe section and the outflow pipe section of the condenser are both straight pipes and parallel.

2. The mainboard according to claim 1 is characterized in that a heat dissipation structure for dissipating heat from the condenser is provided on the condenser.

3. The mainboard according to claim 2, characterized in that the heat dissipation structure is a blown plate.

4. The mainboard according to claim 3 is characterized in that a through hole for air flow to pass through is opened on the plate surface of the inflation plate.

5. The mainboard according to any one of claims 1 to 4, characterized in that the inlet pipe section of the evaporation pipe extends from one end of the edge of the base, and the outlet pipe section of the evaporation pipe extends from the other end of the same edge of the base.

6 . The mainboard according to claim 1 , wherein the evaporation tube and the capillary tube form a U-shaped structure.

7. The mainboard according to any one of claims 1 to 4, characterized in that the evaporation tube and the condensation tube are made of aluminum or copper, and the capillary tube is made of aluminum, copper or a plastic hose.

8. An air conditioner, comprising the mainboard according to any one of claims 1 to 7.