CN109909608B - 晶圆加工方法及装置 - Google Patents
晶圆加工方法及装置 Download PDFInfo
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CN110216389A (zh) * | 2019-07-01 | 2019-09-10 | 大族激光科技产业集团股份有限公司 | 一种晶圆的激光加工方法及系统 |
CN113894426A (zh) * | 2020-06-22 | 2022-01-07 | 大族激光科技产业集团股份有限公司 | 一种半导体晶片的激光加工方法及系统 |
CN112536535A (zh) * | 2020-12-09 | 2021-03-23 | 苏州工业园区纳米产业技术研究院有限公司 | 绝缘体硅片的切割方法及芯片 |
CN112894165A (zh) * | 2021-01-20 | 2021-06-04 | 湖北五方晶体有限公司 | 一种玻璃有机层复合材料激光切割方法 |
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JP2006086509A (ja) * | 2004-08-17 | 2006-03-30 | Denso Corp | 半導体基板の分断方法 |
CN103612015A (zh) * | 2013-05-20 | 2014-03-05 | 湘能华磊光电股份有限公司 | 一种led晶片切割方法 |
CN107538136A (zh) * | 2017-07-31 | 2018-01-05 | 山东浪潮华光光电子股份有限公司 | 一种利用激光切割蓝宝石衬底led芯片的方法 |
CN109461701A (zh) * | 2018-09-27 | 2019-03-12 | 全球能源互联网研究院有限公司 | 一种功率芯片的复合划片方法及半导体器件 |
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US7550367B2 (en) * | 2004-08-17 | 2009-06-23 | Denso Corporation | Method for separating semiconductor substrate |
JP5449665B2 (ja) * | 2007-10-30 | 2014-03-19 | 浜松ホトニクス株式会社 | レーザ加工方法 |
CN102751398B (zh) * | 2012-06-21 | 2014-12-10 | 华灿光电股份有限公司 | 一种倒三角形发光二极管芯片的制作方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2006086509A (ja) * | 2004-08-17 | 2006-03-30 | Denso Corp | 半導体基板の分断方法 |
CN103612015A (zh) * | 2013-05-20 | 2014-03-05 | 湘能华磊光电股份有限公司 | 一种led晶片切割方法 |
CN107538136A (zh) * | 2017-07-31 | 2018-01-05 | 山东浪潮华光光电子股份有限公司 | 一种利用激光切割蓝宝石衬底led芯片的方法 |
CN109461701A (zh) * | 2018-09-27 | 2019-03-12 | 全球能源互联网研究院有限公司 | 一种功率芯片的复合划片方法及半导体器件 |
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Inventor after: Wang Tingru Inventor after: Gao Yunfeng Inventor after: Fan Xiaozhen Inventor after: Liu Xiao Inventor after: Chen Chang Inventor after: Yang Shenming Inventor after: Li Fuhai Inventor after: Wu Lijie Inventor after: Lu Jiangang Inventor after: Yin Jiangang Inventor before: Wang Tingru Inventor before: Gao Yunfeng Inventor before: Fan Xiaozhen Inventor before: Liu Xiao Inventor before: Chen Chang Inventor before: Yang Shenming Inventor before: Li Fuhai Inventor before: Wu Lijie Inventor before: Lu Jiangang Inventor before: Yin Jiangang |
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Effective date of registration: 20220803 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518051 Dazu laser building, 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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