CN109904575B - Artificial surface plasmon transmission line based on Delta Stubs structure - Google Patents
Artificial surface plasmon transmission line based on Delta Stubs structure Download PDFInfo
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- CN109904575B CN109904575B CN201910170334.6A CN201910170334A CN109904575B CN 109904575 B CN109904575 B CN 109904575B CN 201910170334 A CN201910170334 A CN 201910170334A CN 109904575 B CN109904575 B CN 109904575B
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Abstract
The invention relates to the technical field of electronic devices, in particular to an artificial surface plasmon transmission line based on a Delta Stubs structure. The transmission line structure comprises two layers, the upper layer is a metal conduction band, the lower layer is a substrate, the metal conduction band is a groove structure, the depth of the groove determines the color degree, two arms on the inner side of the groove are respectively provided with triangular open line ports, the ports and the connection points of the groove structure are divided by the groove structure according to a preset proportion, and adjacent triangular open lines are not intersected. The triangular open lines are respectively arranged on the inner walls at the two sides of the SSP-TL, so that the length of a wavelength transmission line of each groove arm is reduced, the size structure of the SSP-TL is reduced, and the miniaturization of the SSP-TL is realized; meanwhile, the triangular opening line has a simple structure and can be realized through a simple process, so that the method is favorable for popularization and application.
Description
Technical Field
The invention relates to the technical field of electronic devices, in particular to an artificial surface plasmon transmission line based on a Delta Stubs structure.
Background
An artificial Surface Plasmon Transmission Line (SSP-TL) is widely used in microwave circuits, such as filters, leaky-wave antennas, power dividers, and the like. The SSP-TL of the traditional unit structure is composed of a groove type metal conduction band and a substrate, the control capability of an electromagnetic field is weak, the depth of a groove is increased in a mode of increasing the binding capability of a dispersion enhanced electromagnetic field under normal conditions, but the depth of the groove is limited, the depth of the groove can be greatly increased only by increasing the height of a groove arm, and the size of the SSP-TL is increased inevitably.
Disclosure of Invention
In order to solve the technical problem, the artificial surface plasmon transmission line based on the Delta stub structure is formed by adding two triangular opening lines on the inner wall of a groove on the basis of a traditional unit period groove structure, wherein the triangular opening lines are connected with the inner walls of the two grooves in a micro-strip mode.
In order to achieve the purpose, the invention adopts the following specific technical scheme:
the utility model provides an artifical surface plasmon polariton transmission line based on Delta stub structure, mainly includes the transmission line, the transmission line structure includes two-layerly altogether, and the upper strata is the metal conduction band, and the lower floor is the substrate, the metal conduction band is the groove structure, two arms of recess inboard are provided with triangle open circuit line port respectively, the port with will between the tie point of groove structure the groove structure is cut apart according to predetermineeing the proportion, and adjacent triangle open circuit line does not intersect.
The invention is further improved, and the triangular open route is a microstrip line. In application, the microstrip-type triangular open circuit lines can be regarded as a series of transmission lines with different characteristic impedances, and the transmission lines are connected together in a cascading mode, so that after the microstrip transmission lines in SSP-TL are optimized, conductor loss and radiation loss can be effectively reduced, chromatic dispersion is increased, and the constraint capacity of an electromagnetic field is enhanced.
The invention further improves, the characteristic impedance of the triangular open circuit line is represented by the equation:
and obtaining.
The invention further improves that the transmission line is a transmission line with a unit periodic structure.
The invention further improves that the SSP-TL substrate is simulated and processed by Rogers 5880, and the metal conduction band is simulated and processed by metal copper.
The invention has the beneficial effects that: the triangular open lines are respectively arranged on the inner walls at the two sides of the SSP-TL, so that the length of a wavelength transmission line of each groove arm is reduced, the size structure of the SSP-TL is reduced, and the miniaturization of the SSP-TL is realized; meanwhile, the triangular opening line has a simple structure and can be realized through a simple process, so that the method is favorable for popularization and application.
Drawings
FIG. 1 is a schematic diagram of the structural composition of SSP-TL of the present invention;
FIG. 2 is a diagram of the aggregate shape and equivalent circuit of the Delta Stubs of the present invention;
FIG. 3 is a graph showing the comparison of the dispersion curve simulation results of the SSP-TL of the present invention and the conventional SSP-TL.
Detailed Description
In order to enhance the understanding of the present invention, the present invention will be described in further detail with reference to the following examples, which are provided for the purpose of illustration only and are not intended to limit the scope of the present invention.
Example (b): as shown in fig. 1, an artificial surface plasmon transmission line based on a Delta stub structure is manufactured on a Rogers 5800 substrate with a relative dielectric constant of 2.2 and a thickness of 0.508mm, an upper layer metal conduction band is processed by metal Cu and has a thickness of 0.035mm, a transmission line structure with triangular opening lines is arranged in a groove of SSP-TL, a port of each triangular opening line is connected to the inner wall of the corresponding groove, the groove structure is divided according to a preset proportion between the ports and the connection points of the groove structure, and adjacent triangular opening lines do not intersect; the triangular open circuit is a microstrip line, and in the preparation process of the PCB, the triangular open circuit is simple in structure and beneficial to the arrangement of transmission lines on the PCB, and can be regarded as a series of transmission lines with different characteristic impedances, wherein the transmission lines are connected in a cascading mode.
In this embodiment, as shown in fig. 2, the model of the triangular open route can be equivalent to n transmission line segments with a length δ, on the reference plane T, the open end of the triangular open route is short-circuited, and the width of the transmission line is represented by the following formula: obtaining n, wherein n is the number of transmission lines contained in the triangular open route; in addition, in the delta open circuit line, the characteristic impedance of each transmission line is obtained by the equation of a standard microstrip line except that the characteristic impedance of the last transmission line is obtained by the equation of:
and obtaining the dielectric constant of the PCB substrate in the coupler, the effective dielectric constant of the microstrip line, W the width of the microstrip line and d the thickness of the PCB substrate.
In this embodiment, as shown in fig. 1, the optimized SSP-TL transmission line has the following dimensions: l1=1.5mm, L2=2mm, W1=1.25mm, W2=0.3mm,
。
in the embodiment, as shown in fig. 3, the dispersion curve simulation result of the Delta Stubs structure-based SSP-TL of the present invention and the conventional SSP-TL is shown, compared with the conventional SSP-TL, the cut-off frequency of the SSP-TL provided by the present invention is greatly reduced, the dispersion effect is increased, and the confinement capability of the electromagnetic field is enhanced.
In the embodiment, on the basis of a traditional unit period groove structure, two triangular opening lines are additionally arranged on the inner wall of the groove, and the triangular opening lines are connected with the inner walls of the two grooves in a microstrip mode; in practical application, the triangular open circuit line in a micro-strip form can be regarded as a series of transmission lines with different characteristic impedances, the transmission lines are connected together in a cascading mode, so that after the micro-strip transmission line in the SSP-TL is optimized, conductor loss, radiation loss and chromatic dispersion can be effectively reduced, the constraint capacity of an electromagnetic field is enhanced, the length of a wavelength transmission line of each groove arm is reduced by respectively arranging the triangular open circuit lines on the inner walls of two sides of the SSP-TL, the size structure of the SSP-TL is reduced, the miniaturization of the SSP-TL is realized, and meanwhile, the triangular open circuit line structure is simple, so that the three-phase three.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The artificial surface plasmon transmission line based on the Delta stub structure is characterized by comprising a transmission line, wherein the structure of the transmission line comprises two layers, the upper layer is a metal conduction band, the lower layer is a substrate, the metal conduction band is a groove structure, two arms inside the groove are respectively provided with a triangular open line port, the port and a connection point of the groove structure divide the groove structure according to a preset proportion, adjacent triangular open lines are not intersected, and the triangular open lines are microstrip lines.
2. The Delta Stubs structure-based artificial surface plasmon transmission line of claim 1, wherein said transmission line is a transmission line of a unit periodic structure.
3. The Delta Stubs structure-based artificial surface plasmon transmission line of claim 1, wherein the substrate is simulated and processed by Rogers 5880, and the metal conduction band is simulated and processed by copper.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910170334.6A CN109904575B (en) | 2019-03-07 | 2019-03-07 | Artificial surface plasmon transmission line based on Delta Stubs structure |
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| CN109904575B true CN109904575B (en) | 2022-01-07 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105703041A (en) * | 2016-03-28 | 2016-06-22 | 南京航空航天大学 | Artificial surface plasmon-based miniaturized low-pass filter |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105703041A (en) * | 2016-03-28 | 2016-06-22 | 南京航空航天大学 | Artificial surface plasmon-based miniaturized low-pass filter |
Non-Patent Citations (2)
| Title |
|---|
| 《A Novel Transition Device and Multiple Band-pass Filter using Ring Resonator Based on Spoof Surface Plasmon Polaritons at Microwave Frequency》;Rahul Kumar Jaiswal 等;《2017 IEEE MTT-S International Microwave and RF Conference (IMaRC)》;20171213;第103-106页 * |
| 《Reduction of wide-band crosstalk for guiding microwave in corrugated metal strip lines with subwavelength periodic hairpin slits》;J.J.Wu 等;《IET Microwaves, Antennas & Propagation》;20120403;第6卷(第2期);231-237页 * |
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