CN109888599A - A kind of passivating method and passivating device suitable for laser discharge cavity - Google Patents
A kind of passivating method and passivating device suitable for laser discharge cavity Download PDFInfo
- Publication number
- CN109888599A CN109888599A CN201910227285.5A CN201910227285A CN109888599A CN 109888599 A CN109888599 A CN 109888599A CN 201910227285 A CN201910227285 A CN 201910227285A CN 109888599 A CN109888599 A CN 109888599A
- Authority
- CN
- China
- Prior art keywords
- discharge cavity
- gas
- passivation
- discharge
- passivating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 59
- 238000002161 passivation Methods 0.000 claims abstract description 62
- 230000008569 process Effects 0.000 claims abstract description 25
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 10
- 150000002367 halogens Chemical class 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 11
- 238000012544 monitoring process Methods 0.000 claims description 9
- 238000004458 analytical method Methods 0.000 claims description 7
- 239000008246 gaseous mixture Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 2
- 239000011797 cavity material Substances 0.000 abstract description 153
- 238000010943 off-gassing Methods 0.000 abstract description 4
- 239000012535 impurity Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 230000002045 lasting effect Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 210000001367 artery Anatomy 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000004868 gas analysis Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 210000003462 vein Anatomy 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000001684 chronic effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
- H01S3/036—Means for obtaining or maintaining the desired gas pressure within the tube, e.g. by gettering, replenishing; Means for circulating the gas, e.g. for equalising the pressure within the tube
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The present invention provides a kind of passivating methods and device suitable for excimer laser discharge cavity.This method comprises: S1, rises to the first temperature for the temperature of discharge cavity, and maintain first temperature to toast to discharge cavity;S2 vacuumizes discharge cavity so that the foreign gas in discharge cavity is discharged;S3 is filled with passivation gas into discharge cavity to be tentatively passivated to discharge cavity;S4 stops baking after preliminary passivation, and is filled with working gas into discharge cavity and carries out electric discharge passivation.This method have the advantages that can quantitative assessment passivating process, avoid discharge cavity material outgassing baneful influence caused by laser performance and reduce passivation cost.Passivating device includes: vacuum bakeout case, display and control unit, vacuum pump, gas feed unit, gas analyzer and halogen filter, discharge cavity to be passivated is placed in the vacuum bakeout case, the apparatus structure is simple, and the equipment used is all common experimental facilities, easy to accomplish and easy to operate.
Description
Technical field
The present invention relates to laser discharge cavity passivating technique fields, more specifically, are related to a kind of sharp suitable for quasi-molecule
The passivating method and passivating device of light device discharge cavity.
Background technique
The laser wave length of excimer laser does not generate fuel factor for material, therefore has in industrial processing field
It is widely applied.Especially in high-end field of lithography, the excimer laser for the characteristics of being provided simultaneously with Gao Zhongying, narrow linewidth and big energy
Device has become the light source that current semiconductor lithography field accounts for absolute leading position.
Currently, commercial mainstream excimer laser is the ArF excimer laser of 193nm and the KrF quasi-molecule of 248nm
Laser.The halogen gas F for being about 0.1% containing certain proportion in the working gas of both lasers2, F2Chemical property
It is very active, there is very strong oxidisability can react with nearly all organic matter and inorganic matter in addition to perfluorochemical.It is quasi-
The electric discharge cavity wall of molecular laser is contacted with working gas, and the impurity that discharge cavity metal material contains is mainly C, Si and puts
The foreign gas of remaining is mainly O when electric chamber assembles2、H2O etc. can be with F2Reaction, causes F2Consumption, works as F2Content lower than just
When Chang Hanliang, the output performance of excimer laser will deteriorate, or even excimer laser is caused to can not work normally.Cause
This before laser normal operation, is needed to discharge cavity inside to enable the work of excimer laser long-time stable
Carry out sufficient Passivation Treatment.The mechanism of passivation can be explained with boundary-layer theory, that is, think that passivation is due to gold inside discharge cavity
Category and F2Effect, metal surface generate it is a kind of it is very thin, fine and close, covering performance is good, is firmly adsorbed on metal
Passivating film on surface, i.e. metal fluoride film.This layer film plays a metal and corrosive medium F2Completely separated effect,
Prevent metal and corrosive medium F2Contact, so that metal be made to stop substantially and corrosive medium F2Reaction form passive state, to reach
Reduce F2The effect of consumption.
Relevant article is passivated about excimer laser discharge cavity at present and patent is considerably less, and most data are also only
Qualitative introduction about passivation.And current commercial excimer laser directlys adopt working gas and carries out electric discharge passivation, needs frequency
Numerous replacement working gas, wherein F2And Ne gas price lattice are extremely expensive, therefore will cause a large amount of economic loss, and discharge cavity
The vacuum degree of exhaust is only about 20kPa, not can guarantee that laser passivation is abundant and remaining gaseous impurity excludes completely completely.This
An outer fatal disadvantage is that electric discharge cavity material can be ceaselessly to foreign gas be discharged inside discharge cavity, so that chronic pollution discharges
Chamber causes F2Consumption, to influence the output performance of laser.
Summary of the invention
One of the objects of the present invention is to provide a kind of new passivating methods suitable for laser discharge cavity, to solve tradition
Passivating method caused by discharge cavity be easy contaminated, and be passivated the relatively high problem of cost.
The second object of the present invention is to provide a kind of passivating device that the passivating method can be implemented, passivating device structure
Simply, easy to accomplish and easy to operate.
In order to solve the above-mentioned technical problems, the present invention provides a kind of passivating methods suitable for laser discharge cavity, should
Method includes:
The temperature of the discharge cavity is risen to the first temperature by S1, and maintain first temperature with to the discharge cavity into
Row baking;
S2 vacuumizes the discharge cavity so that the foreign gas in the discharge cavity is discharged;
Passivation gas is filled in S3, Xiang Suoshu discharge cavity to be tentatively passivated to the discharge cavity;
S4 stops baking after preliminary passivation, and is filled with working gas into the discharge cavity and carries out electric discharge passivation.
Preferably, step S1 includes:
S11 heats up to the discharge cavity, and is vacuumized to the discharge cavity residual in the discharge cavity to be discharged
The first foreign gas deposited;
S12 maintains the first temperature 20-24h, so that group when the temperature of the discharge cavity rises to the first temperature
The second foreign gas is released at the material of the discharge cavity.
Preferably, in step s 12, " the first temperature 20-24h is maintained, so that forming the material of the discharge cavity
Release the second foreign gas " the step of further include: each component content of second foreign gas is monitored using mass spectrograph.
Preferably, first temperature is 90-110 DEG C.
Preferably, in step s 11, described " and the discharge cavity is vacuumized residual in the discharge cavity to be discharged
The step of the first foreign gas deposited " includes: to stop vacuumizing when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa;With
And
In step s 2, described " the foreign gas quilt so that in the discharge cavity to be vacuumized to the discharge cavity
The step of discharge " includes: to stop vacuumizing when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa.
Preferably, step S3 includes:
It is filled with passivation gas in S31, Xiang Suoshu discharge cavity to be tentatively passivated, when the pressure in the discharge cavity reaches
Stop being filled with the passivation gas when one setting value, wherein contain the F that content is X in the passivation gas2;
S32 monitors the F by mass spectrograph2Remaining content, if the F2Remaining content be lower than 50%X when, enter
Otherwise step S33 continues to monitor the F2Remaining content;
S33 vacuumizes the discharge cavity, when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa, stops taking out
Vacuumizing is returned again to step S31;
S34 counts the total time that the preliminary passivating process carries out, when the total time reaching 20-24h, to described
Discharge cavity is vacuumized, and when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa, stops vacuumizing.
It is highly preferred that the passivation gas is F2/ He gaseous mixture;And the range of the X is 300-500mbar;And/or
The range of first setting value is 0.02-0.1MPa.
Preferably, step S4 includes:
It is filled with working gas in S41, Xiang Suoshu discharge cavity, laser is made to start to discharge, exports pulse;
S42 exports the energy of pulse described in complete monitoring, when the energy is reduced to the 50% of initial output pulse energy
When, S43 is entered step, the energy for monitoring the output pulse is otherwise continued;
S43 vacuumizes the discharge cavity, when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa, stops taking out
Vacuumizing is returned again to step S41;
S44 counts the pulse total quantity of the laser output, when the pulse total quantity is less than the second setting value,
Continue electric discharge passivation;When the pulse total quantity is greater than or equal to the second setting value, stop electric discharge passivation, wherein described second
The range of setting value is 1.5 hundred million -2.5 hundred million.
In order to further solve above-mentioned technical problem, the present invention also provides a kind of suitable for being passivated laser discharge cavity
Device, the passivating device are used to implement above-mentioned passivating method, and described device includes:
Vacuum bakeout case, discharge cavity to be passivated are placed in the vacuum bakeout case;
Display and control unit is controlled and is shown for the temperature and pressure to the vacuum bakeout case and the discharge cavity;
Vacuum pump, for being vacuumized to the discharge cavity and the vacuum bakeout case;
Gas feed unit, for providing passivation gas to the discharge cavity.
Preferably, described device further include:
Gas analyzer, for being sampled analysis to the gas in the discharge cavity and in the vacuum bakeout case;
The halogen filter being connect with the vacuum pump and the gas analyzer, the halogen for being filtered to remove in exhaust gas
Element;
And several operated pneumatic valves, the starting valve are respectively provided at the vacuum bakeout case and the vacuum pump, institute
State the gas piping and the discharge cavity and the vacuum pump, the gas analyzer, the gas that gas analyzer connects
On the gas piping of feed unit connection, for controlling the on-off of corresponding gas piping respectively.
Compared with prior art, the passivating method provided by the invention suitable for laser discharge cavity introduces high-temperature baking
Foreign gas in the cavity material that discharges effectively can be released and be discharged, avoided by discharge cavity and vacuum
Discharge cavity material outgassing bad influence lasting caused by laser performance;Meanwhile introducing content to foreign gas
And F2Remaining content carries out on-Line Monitor Device, being capable of quantitative assessment passivating process;Without consuming Ne gas in preliminary passivating process,
Reduce passivation cost.The passivating device structure that the passivating method can be implemented provided is simple, and the equipment used is all common
Experimental facilities, it is easy to accomplish and easy to operate.
Detailed description of the invention
Fig. 1 is influence diagram of the different impurities content to KrF excimer laser output energy.
Fig. 2 is the flow chart of passivating method according to one embodiment.
Fig. 3 is the structural schematic diagram of passivating device according to one embodiment.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawing and specific implementation
Invention is further described in detail for example.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention,
It is not intended to limit the present invention.
In order to keep the narration of this disclosure more detailed with it is complete, below for embodiments of the present invention and specific real
It applies example and proposes illustrative description;But this not implements or uses the unique forms of the specific embodiment of the invention.Embodiment
In cover multiple specific embodiments feature and to construction with operate these specific embodiments method and step it is suitable with it
Sequence.However, can also reach identical or impartial function and sequence of steps using other specific embodiments.
Referring to Fig. 1, Fig. 1 show influence of the different impurities content to KrF excimer laser output energy, shown in figure
Show that the impurity concentration of ppm magnitude can cause the sharp-decay of output energy, therefore, is highly desirable to provide a kind of suitable for swashing
The passivating method and device of light device discharge cavity, referring to Fig. 2, Fig. 2 is a kind of passivating method process provided in an embodiment of the present invention
Figure carries out specific explanations to the present invention below with reference to Fig. 2.
The present invention provides a kind of passivating method suitable for laser discharge cavity, the passivating method the following steps are included:
The temperature of discharge cavity is risen to the first temperature by step S1, and maintains first temperature to toast to discharge cavity.
High-temperature baking material outgassing process is introduced in this step, discharge cavity material can be made to deflate at high temperature, the excessively high meeting of temperature
The sealing performance of guiding discharge chamber is destroyed, the too low effect that can reduce material outgassing of temperature, some realities according to the present invention
Example is applied, the range of the first suitable temperature is 90-110 DEG C, and in some preferred embodiments, the first temperature of setting is 100 DEG C,
Discharge cavity can be maintained to be in first temperature range by heating equipment any suitable in this field or constant temperature system,
Purpose is toasted to realize.Other embodiments according to the present invention, the step specifically further comprise following steps: step S11, right
Discharge cavity heats up, and the first foreign gas of remaining when discharge cavity assembling is discharged is vacuumized to the discharge cavity;Step
Rapid S12 maintains first temperature 20-24h, so that forming the discharge cavity when the temperature of discharge cavity rises to the first temperature
Material releases the second foreign gas, subsequently into step S2.In step s 11, it can be used any suitable in this field
Equipment realizes the condition of high vacuum degree in discharge cavity to vacuumize to discharge cavity, such as by the lasting exhaust of vacuum pump, at this
In some embodiments of invention, when the vacuum degree of discharge cavity reaches 0.1-0.5Pa, stop vacuumizing, that is, can guarantee discharge cavity
The first foreign gas of remaining is discharged when assembling, and in some preferred embodiments, the vacuum degree set is 0.1Pa.In step
In S12, any suitable gas analysis instrument in this field can be used, containing for each ingredient in the second foreign gas is monitored online
Amount, such as mass spectrograph, by being sampled analysis to the gas in discharge cavity to obtain containing for each ingredient in the second foreign gas
Amount, so that whether the second foreign gas in rational judgment electric discharge cavity material is released effectively out.In some preferred implementations
In example, step S12 be continue for for 24 hours, be during which that 4h has carried out 6 samplings, the 6 groups of impurity gas obtained according to sampling with the sampling period
Whether the foreign gas in body content data rational judgment electric discharge cavity material is released effectively out.
Step S2 vacuumizes discharge cavity so that the foreign gas in the discharge cavity is discharged.In this step,
Primarily to the second foreign gas that the material that step S12 high temperature toasts composition discharge cavity releases is discharged.According to this
Some embodiments of invention vacuumize discharge cavity by the lasting exhaust realization of vacuum pump, when the vacuum degree of discharge cavity
When reaching 0.1-0.5Pa, stop vacuumizing, in some preferred embodiments, the vacuum degree set can guarantee and put as 0.1Pa
The foreign gas of electric cavity material high temperature release is effectively discharged, and CO is thus greatly reduced2、H2O, Air etc. remains in discharge cavity
Interior impurity bad influence lasting caused by laser performance.It uses simultaneously and introduces mass spectrograph to foreign gas progress
On-line monitoring, being capable of foreign gas release conditions in quantitative assessment material.
Step S3 is filled with passivation gas into discharge cavity to be tentatively passivated to discharge cavity.The step is in order to putting
A small amount of F is filled in electric chamber2, 90-110 DEG C of high-temperature baking is still used, accelerates F under hot environment2With the anti-of cavity material of discharging
It answers, one layer of fine and close fluoride film is formed in the inner wall of discharge cavity, to realize preliminary passivation.In some embodiments of the present invention
In, the passivation gas selected is F2/ He gaseous mixture, specific operating procedure are as follows: step S31 is filled with passivation into discharge cavity
Gas is tentatively passivated, and stops being filled with passivation gas when the pressure in discharge cavity reaches the first setting value, wherein the passivation
The F that content is X is contained in gas2;Step S32, under high temperature environment, F2It reacts with electric discharge cavity material and is persistently disappeared
It consumes, monitors F using mass spectrograph2Remaining content, can the preliminary passivating process of quantitative assessment, if F2Remaining content be lower than
When 50%X, S33 is entered step, otherwise continues to monitor F2Remaining content;Step S33, works as F2Remaining content be lower than 50%X
When, discharge cavity is vacuumized, the remaining passivation gas being discharged in discharge cavity re-fills in order to be back in step S31
Passivation gas continues preliminary passivating process, and in step S33, the vacuum degree that still discharge cavity is worked as in selection reaches 0.1-0.5Pa
When, stop vacuum pumping, preferably vacuum degree is 0.1Pa;Step S34 counts the total time that the preliminary passivating process carries out, when
When total time reaches 20-24h, more sufficiently finer and close fluoride film is preferably formed with the cavity wall that ensures to discharge for 24 hours, it can be complete
The preliminary passivating process of pairs of discharge cavity.Finally the discharge cavity is vacuumized again, the remaining passivation in discharge cavity is discharged
Gas carries out electric discharge passivation in order to enter step in S4, in the step, the vacuum degree that still discharge cavity is worked as in selection reaches 0.1-
When 0.5Pa, stop vacuum pumping, preferably vacuum degree is 0.1Pa.
It should be noted that the range of the first setting value is 0.02-0.1MPa, in some preferred implementations in step S31
First setting value is 0.05 MPa in example, judges to be by the way that whether the pressure in observation discharge cavity reaches first setting value
No sufficient passivation gas.In the present invention, the passivation gas used is F2/ He gaseous mixture, does not consume Ne gas, drops significantly
Low passivation cost, and about F2Charge selection, charge excessively causes to waste, and charge is very few to will lead to process repetition
Number is excessive, increases the complexity of operation, according to some embodiments of the present invention, single F2Charge scope control exist
The range of X in 300-500mbar, i.e. step S31 is 300-500mbar.
Step S4 stops baking after preliminary passivation, and is filled with working gas into the discharge cavity and carries out electric discharge passivation.
Complete baking exhaust and F2After preliminary passivation, the discharge cavity of excimer laser is to F2Wear rate just significantly reduce.Most
The electric discharge of replacement working gas carries out the final passivation of excimer laser discharge cavity and passivation effect confirmation afterwards.The process is quasi- point
The real work state of sub- laser, by the electric discharge under real working condition, the fluoride for forming discharge cavity internal material is thin
Film is finer and close, reduces cavity material to the greatest extent to F2Consumption.Steps are as follows for concrete implementation: step S41, Xiang Fang electricity
It is intracavitary to be filled with working gas, make laser start to discharge, exports pulse;Step S42, complete monitoring export the energy of pulse, when
When output pulse energy is reduced to the 50% of initial output pulse energy, S43 is entered step, otherwise continues to monitor the output arteries and veins
The energy of punching;Step S43 vacuumizes the discharge cavity, and the remaining working gas in discharge cavity is discharged in order to be back to
Working gas is re-filled in step S41 continues electric discharge passivation;In the step, the vacuum degree that still discharge cavity is worked as in selection reaches
When 0.1-0.5Pa, stop vacuum pumping, preferably vacuum degree is 0.1Pa;Step S44, the entire passivating process that discharges is with the arteries and veins that discharges
It rushes number to be recorded, therefore counts the pulse total quantity of laser output, when pulse total quantity is less than the second setting value, after
Continuous electric discharge passivation;When pulse total quantity is greater than or equal to the second setting value, stop electric discharge passivation, some realities according to the present invention
Example is applied, the range of the second setting value is 1.5 hundred million -2.5 hundred million, in some preferred embodiments, it is filled with working gas electric discharge for the first time,
The output energy attenuation speed of laser generally compares comparatively fast, and energy can be reduced to the 50% of initial output energy after two or three hours
Left and right, replaces second of working gas at this time, continues electric discharge passivation, and complete monitoring exports energy, and energy attenuation speed can be obvious
It is slower than the electric discharge of first time working gas, after energy attenuation is the 50% of primary power, third time working gas is replaced, continues to put
Electricity passivation, complete monitoring export energy, and energy attenuation rate continues to decline, and laser discharges always passivation, up to accumulated discharge
When passivation umber of pulse reaches 200,000,000, so that it may stop electric discharge, be finally completed the passivating process of excimer laser discharge cavity.
By the excimer laser discharge cavity of above-mentioned passivation process, in use process in the future, cavity is to F2Disappear
Consumption rate is substantially reduced, therefore the service life of working gas can be substantially improved, and greatly improve excimer laser output performance
Stability and saved operating cost.
Another aspect of the present invention additionally provides a kind of passivating device that above-mentioned passivating method can be implemented, which includes:
Vacuum bakeout case, discharge cavity to be passivated are placed in the vacuum bakeout case;Display and control unit, for vacuum bakeout case and wait be passivated
Discharge cavity temperature and pressure controlled and shown;Vacuum pump, for vacuum bakeout case and discharge cavity to be passivated into
Row vacuumizes;Gas feed unit, for providing passivation gas to discharge cavity;Gas analyzer, for in discharge cavity and true
Gas in empty baking box is sampled analysis;The halogen filter connecting with vacuum pump and gas analyzer is filtered out for crossing
The halogen in exhaust gas is removed, guarantees that the exhaust gas for being discharged into atmosphere reaches the discharge standard of environmental safety requirements.
It please refers to shown in Fig. 3, Fig. 3 is a kind of passivating device structural schematic diagram provided in an embodiment of the present invention, passivation dress
It sets including vacuum bakeout case 201, display and control unit, vacuum pump 214, F2/ He gaseous mixture 213, residual gas analyzer 212 and halogen filtering
Device 215, laser discharge cavity 204 are placed in the vacuum bakeout case 201.Wherein, display and control unit includes being set to the vacuum bakeout case
Oven temperature setting interface 202 and oven pressure on 201 set interface 203 and put with what laser discharge cavity 204 was connect
Electric chamber temperature display interface 205 and electric discharge cavity pressure display interface 206, required for being set by oven temperature setting interface 202
Baking temperature, by oven pressure set interface 203 set oven required for vacuum degree, pass through discharge cavity temperature display circle
The temperature in discharge cavity is observed in face 205, the pressure in discharge cavity is observed by electric discharge cavity pressure display interface 206, in this implementation
In example, which is 20-200 DEG C, temperature fluctuation≤± 1 DEG C, vacuum model
It encloses for 1-0.01MPa.In this embodiment, halogen filter 215 is used to carry out F to exhaust gas2Filtering.In this embodiment, should
Passivating device further includes 5 operated pneumatic valve 207-211, and wherein operated pneumatic valve 207 is arranged in vacuum bakeout case 201 and residual gas analysis
On the gas piping that instrument 212 connects, the gas that laser discharge cavity 204 is connect with residual gas analyzer 212 is arranged in operated pneumatic valve 208
On body pipeline, operated pneumatic valve 209 is arranged in laser discharge cavity 204 and F2On the gas piping that/He gaseous mixture 213 connects, gas
Movable valve 210 is arranged on the gas piping that laser discharge cavity 204 is connect with vacuum pump 214, and operated pneumatic valve 211 is arranged true
On the gas piping that empty baking box 201 is connect with vacuum pump 214, these operated pneumatic valves for controlling corresponding gas piping respectively
On-off.The specific operation method is as follows for the passivating device:
Discharge cavity baking process: laser discharge cavity 204 is placed in vacuum bakeout case 201, passes through baking box temperature
It sets interface 202 and sets the operating temperature of baking box as 100 DEG C, open pneumatic operated valve 211, close other pneumatic operated valves, open vacuum
It pumps 214 pairs of vacuum bakeout casees to be exhausted, interface 203 is set by baking box pressure and observes vacuum oven pressure, is set when reaching
When definite value 0.1Mpa, pneumatic operated valve 211 is closed, closes vacuum pump 214.Pneumatic operated valve 210 is opened, other pneumatic operated valves are closed, is opened true
Sky 214 pairs of laser discharge cavities of pump are exhausted, and the observation of interface 206 electric discharge cavity pressure are set by electric discharge cavity pressure, when reaching
When setting value 0.1Pa, pneumatic operated valve 210 is closed, closes vacuum pump 214, the exhaust to discharge cavity is completed, is set by discharge cavity temperature
Observe discharge cavity temperature in demarcation face 205.Started to discharge the baking process of cavity material at this time, which needs lasting 24 small
When, it needs inside the concentration of monitoring foreign gas at times, including discharge cavity and inside vacuum bakeout case, to be imitated to deflating
Fruit is assessed, it is proposed that sampling period be 4 hours, that is, obtain 6 groups of foreign gas concentration datas.Pneumatic operated valve 207 is opened, is closed
Other pneumatic operated valves open residual gas analyzer 212, can be sampled analysis to the residual gas ingredient inside vacuum bakeout case 201.It beats
Pneumatic operated valve 208 is opened, other pneumatic operated valves are closed, opens residual gas analyzer 212, it can be to the residual gas ingredient inside laser discharge cavity
It is sampled analysis.
F2Preliminary passivating process: after completing 24 hours discharge cavity baking process, and then carry out F2Preliminary passivating process,
Pneumatic operated valve 210 is opened, other pneumatic operated valves are closed, vacuum pump 214 is opened and laser discharge cavity is exhausted, pass through discharge cavity pressure
Power sets the observation electric discharge cavity pressure of interface 206 and closes pneumatic operated valve 210 when reaching setting value 0.1Pa, closes vacuum pump 214,
Complete the exhaust to discharge cavity.Pneumatic operated valve 209 is opened, other pneumatic operated valves is closed, passivation gas F is filled with into discharge cavity2/He,
The observation electric discharge cavity pressure of interface 206, which is set, by electric discharge cavity pressure closes pneumatic operated valve 209 when reaching setting value 0.05MPa,
Complete the inflation to discharge cavity.Start the preliminary F of discharge cavity at this time2Passivation.Process F2It can persistently be consumed, need to pass through
Residual gas analyzer 212 monitors F2Content opens pneumatic operated valve 208, closes other pneumatic operated valves, opens residual gas analyzer 212, can be right
Residual gas ingredient inside laser discharge cavity is sampled analysis F2Content, when content be lower than initial content 50% when, lead to
Vacuum pump is crossed to be exhausted and re-fill new F2/ He continues F2Preliminary passivation, with the progress of the process, F2Disappear
Consumption speed can gradually decrease, when continue 24 it is small when after, the F of discharge cavity can be completed2The preliminary passivating process of baking.
The passivating device structure that the passivating method can be implemented of above-mentioned offer is simple, and the equipment used is all common reality
Equipment is tested, it is easy to accomplish and easy to operate.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of passivating method suitable for laser discharge cavity, which comprises the following steps:
The temperature of the discharge cavity is risen to the first temperature by S1, and maintains first temperature to dry to the discharge cavity
It is roasting;
S2 vacuumizes the discharge cavity so that the foreign gas in the discharge cavity is discharged;
Passivation gas is filled in S3, Xiang Suoshu discharge cavity to be tentatively passivated to the discharge cavity;
S4 stops baking after preliminary passivation, and is filled with working gas into the discharge cavity and carries out electric discharge passivation.
2. passivating method as described in claim 1, which is characterized in that step S1 includes:
S11 heats up to the discharge cavity, and is vacuumized to the discharge cavity remaining in the discharge cavity to be discharged
First foreign gas;
S12 maintains the first temperature 20-24h when the temperature of the discharge cavity rises to the first temperature, so that composition institute
The material for stating discharge cavity releases the second foreign gas.
3. passivating method as claimed in claim 2, which is characterized in that in step s 12, " maintain the first temperature 20-
For 24 hours, so that the material for forming the discharge cavity releases the second foreign gas " the step of further include: it is monitored using mass spectrograph
Each component content of second foreign gas.
4. passivating method as claimed in any one of claims 1-3, which is characterized in that first temperature is 90-110 DEG C.
5. passivating method as claimed in claim 2, which is characterized in that in step s 11, it is described " and to the discharge cavity into
Row is vacuumized so that the first foreign gas remaining in the discharge cavity is discharged " the step of include: vacuum degree when the discharge cavity
When reaching 0.1-0.5Pa, stop vacuumizing;And
In step s 2, described " discharge cavity being vacuumized so that the foreign gas in the discharge cavity is discharged "
The step of include: to stop vacuumizing when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa.
6. passivating method as described in claim 1, which is characterized in that step S3 includes:
Passivation gas is filled in S31, Xiang Suoshu discharge cavity to be tentatively passivated, and is set when the pressure in the discharge cavity reaches first
Stop being filled with the passivation gas when definite value, wherein contain the F that content is X in the passivation gas2;
S32 monitors the F by mass spectrograph2Remaining content, if the F2Remaining content be lower than 50%X when, enter step
Otherwise S33 continues to monitor the F2Remaining content;
S33 vacuumizes the discharge cavity, when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa, stops vacuumizing
Operation, returns again to step S31;
S34 counts the total time that the preliminary passivating process carries out, when the total time reaching 20-24h, to the electric discharge
Chamber is vacuumized, and when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa, stops vacuumizing.
7. passivating method as claimed in claim 6, which is characterized in that the passivation gas is F2/ He gaseous mixture;And the X
Range be 300-500mbar;And/or
The range of first setting value is 0.02-0.1MPa.
8. passivating method as described in claim 1, which is characterized in that step S4 includes:
It is filled with working gas in S41, Xiang Suoshu discharge cavity, laser is made to start to discharge, exports pulse;
S42 exports the energy of pulse described in complete monitoring, when the energy is reduced to the 50% of initial output pulse energy,
S43 is entered step, the energy for monitoring the output pulse is otherwise continued;
S43 vacuumizes the discharge cavity, when the vacuum degree of the discharge cavity reaches 0.1-0.5Pa, stops vacuumizing
Operation, returns again to step S41;
S44, the pulse total quantity for counting the laser output continue when the pulse total quantity is less than the second setting value
Electric discharge passivation;When the pulse total quantity is greater than or equal to the second setting value, stop electric discharge passivation, wherein second setting
The range of value is 1.5 hundred million -2.5 hundred million.
9. a kind of passivating device suitable for laser discharge cavity, which is characterized in that the passivating device is used to implement claim
Passivating method described in any one of 1-8, described device include:
Vacuum bakeout case, discharge cavity to be passivated are placed in the vacuum bakeout case;
Display and control unit is controlled and is shown for the temperature and pressure to the vacuum bakeout case and the discharge cavity;
Vacuum pump, for being vacuumized to the discharge cavity and the vacuum bakeout case;
Gas feed unit, for providing passivation gas to the discharge cavity.
10. device as claimed in claim 9, which is characterized in that described device further include:
Gas analyzer, for being sampled analysis to the gas in the discharge cavity and in the vacuum bakeout case;
The halogen filter being connect with the vacuum pump and the gas analyzer, the halogen for being filtered to remove in exhaust gas;
And several operated pneumatic valves, the starting valve are respectively provided at the vacuum bakeout case and the vacuum pump, the gas
The gas piping and the discharge cavity of the connection of body analyzer and the vacuum pump, the gas analyzer, the gas supply
On the gas piping of unit connection, for controlling the on-off of corresponding gas piping respectively.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910227285.5A CN109888599A (en) | 2019-03-25 | 2019-03-25 | A kind of passivating method and passivating device suitable for laser discharge cavity |
PCT/CN2019/129180 WO2020192217A1 (en) | 2019-03-25 | 2019-12-27 | Passivating method and passivating apparatus applicable to laser discharge chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910227285.5A CN109888599A (en) | 2019-03-25 | 2019-03-25 | A kind of passivating method and passivating device suitable for laser discharge cavity |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109888599A true CN109888599A (en) | 2019-06-14 |
Family
ID=66934105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910227285.5A Pending CN109888599A (en) | 2019-03-25 | 2019-03-25 | A kind of passivating method and passivating device suitable for laser discharge cavity |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN109888599A (en) |
WO (1) | WO2020192217A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111307924A (en) * | 2020-02-24 | 2020-06-19 | 中国科学院微电子研究所 | Detection device and method for detecting passivation degree of discharge cavity part of excimer laser |
WO2020192217A1 (en) * | 2019-03-25 | 2020-10-01 | 北京科益虹源光电技术有限公司 | Passivating method and passivating apparatus applicable to laser discharge chamber |
CN113767281A (en) * | 2019-11-27 | 2021-12-07 | 昭和电工株式会社 | Method for measuring fluorine gas concentration in halogen-containing fluoride gas by mass spectrometer |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6644324B1 (en) * | 2000-03-06 | 2003-11-11 | Cymer, Inc. | Laser discharge chamber passivation by plasma |
CN102517540A (en) * | 2011-12-20 | 2012-06-27 | 广东华南特种气体研究所有限公司 | Passivation method of excimer laser gas configuration device |
CN103259160A (en) * | 2013-04-25 | 2013-08-21 | 中国科学院光电研究院 | Electromagnetic force sealing window device of laser discharging cavity |
CN107287553A (en) * | 2017-05-23 | 2017-10-24 | 中国科学院光电研究院 | Dry and pre-passivating device and method |
CN108414612A (en) * | 2018-01-25 | 2018-08-17 | 中国科学院光电研究院 | A kind of detection method and module of excimer laser discharge cavity gas |
CN207894871U (en) * | 2018-01-25 | 2018-09-21 | 中国科学院光电研究院 | A kind of detection module of excimer laser discharge cavity gas |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103178440A (en) * | 2013-01-18 | 2013-06-26 | 西安卓铭光电科技有限公司 | Method and device for passivating cavity surface of semiconductor laser |
CN104377543B (en) * | 2014-11-14 | 2017-09-26 | 西安立芯光电科技有限公司 | A kind of semiconductor laser cavity mirror preparation method |
CN109888599A (en) * | 2019-03-25 | 2019-06-14 | 北京科益虹源光电技术有限公司 | A kind of passivating method and passivating device suitable for laser discharge cavity |
-
2019
- 2019-03-25 CN CN201910227285.5A patent/CN109888599A/en active Pending
- 2019-12-27 WO PCT/CN2019/129180 patent/WO2020192217A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6644324B1 (en) * | 2000-03-06 | 2003-11-11 | Cymer, Inc. | Laser discharge chamber passivation by plasma |
CN102517540A (en) * | 2011-12-20 | 2012-06-27 | 广东华南特种气体研究所有限公司 | Passivation method of excimer laser gas configuration device |
CN103259160A (en) * | 2013-04-25 | 2013-08-21 | 中国科学院光电研究院 | Electromagnetic force sealing window device of laser discharging cavity |
CN107287553A (en) * | 2017-05-23 | 2017-10-24 | 中国科学院光电研究院 | Dry and pre-passivating device and method |
CN108414612A (en) * | 2018-01-25 | 2018-08-17 | 中国科学院光电研究院 | A kind of detection method and module of excimer laser discharge cavity gas |
CN207894871U (en) * | 2018-01-25 | 2018-09-21 | 中国科学院光电研究院 | A kind of detection module of excimer laser discharge cavity gas |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020192217A1 (en) * | 2019-03-25 | 2020-10-01 | 北京科益虹源光电技术有限公司 | Passivating method and passivating apparatus applicable to laser discharge chamber |
CN113767281A (en) * | 2019-11-27 | 2021-12-07 | 昭和电工株式会社 | Method for measuring fluorine gas concentration in halogen-containing fluoride gas by mass spectrometer |
EP4067300A4 (en) * | 2019-11-27 | 2024-01-03 | Resonac Corporation | Method for measuring fluorine gas concentration in halogen-fluoride-containing gas using mass spectrometer |
US11984308B2 (en) | 2019-11-27 | 2024-05-14 | Resonac Corporation | Method for measuring concentration of fluorine gas in halogen fluoride-containing gas using mass spectrometer |
CN111307924A (en) * | 2020-02-24 | 2020-06-19 | 中国科学院微电子研究所 | Detection device and method for detecting passivation degree of discharge cavity part of excimer laser |
CN111307924B (en) * | 2020-02-24 | 2023-05-12 | 中国科学院微电子研究所 | Detection device and method for detecting passivation degree of excimer laser discharge cavity component |
Also Published As
Publication number | Publication date |
---|---|
WO2020192217A1 (en) | 2020-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109888599A (en) | A kind of passivating method and passivating device suitable for laser discharge cavity | |
US6914927B2 (en) | Laser discharge chamber passivation by plasma | |
CA1295215C (en) | Cleaning of metal articles | |
TW201246294A (en) | Control device for material gas, control method, control program and control system thereof | |
EP0738684A1 (en) | Ozone generating apparatus | |
CN110174439B (en) | Experimental device for generate hydrogen longitudinal concentration gradient in closed cabin | |
CN209860343U (en) | Passivation device suitable for laser instrument discharge chamber | |
US20150153003A1 (en) | Nitric oxide cylinder filling apparatus and method | |
CN207894871U (en) | A kind of detection module of excimer laser discharge cavity gas | |
CN110486617A (en) | A kind of air distribution system and its passivating method and ballasting method containing fluorine mixed gas | |
CN214441493U (en) | Device for cleaning and inert coating gas sampling tank | |
CN110268503A (en) | Cleaning method | |
CN108414612A (en) | A kind of detection method and module of excimer laser discharge cavity gas | |
CN114323909A (en) | Method for improving pre-hydrogen filling speed of metal sample in hydrogen embrittlement test | |
Huang et al. | Hydriding of zirconium alloys in hydrogen gas | |
CN108754407B (en) | Uranium surface UC1-xNxSolid solution preparation method, product and application thereof | |
Claytor et al. | Evolution of tritium from deuterided palladium subject to high electrical currents | |
JP2507518B2 (en) | Vacuum exhaust device | |
Akaishi et al. | Simulation of hydrogen outgassing in ultrahigh vacuum chamber and fusion device by recombination limited model | |
JPS5545386A (en) | Method and apparatus for preservation of food | |
US11549371B2 (en) | Method for pickling a turbomachine component | |
JPS5791719A (en) | Adsorbing device for exhaust gas | |
CN111816541B (en) | Thermal noise suppression system of low-temperature laser interferometry optical system | |
CN118762599A (en) | Teaching device for applying ideal gas equation in solid hydrogen storage | |
JPS6456886A (en) | Dry etching method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |