CN109781281A - 在活性等离子中用于原位测量的高温传感器晶片 - Google Patents

在活性等离子中用于原位测量的高温传感器晶片 Download PDF

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Publication number
CN109781281A
CN109781281A CN201811367416.1A CN201811367416A CN109781281A CN 109781281 A CN109781281 A CN 109781281A CN 201811367416 A CN201811367416 A CN 201811367416A CN 109781281 A CN109781281 A CN 109781281A
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CN
China
Prior art keywords
substrate
bracket
supporting legs
assembly module
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811367416.1A
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English (en)
Chinese (zh)
Inventor
梅·孙
厄尔·詹森
伐汉特·奎利
史帝芬·夏瑞特
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KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of CN109781281A publication Critical patent/CN109781281A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/12—Protective devices, e.g. casings for preventing damage due to heat overloading
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2215/00—Details concerning sensor power supply
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Vapour Deposition (AREA)
CN201811367416.1A 2013-01-07 2014-01-06 在活性等离子中用于原位测量的高温传感器晶片 Pending CN109781281A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361749872P 2013-01-07 2013-01-07
US61/749,872 2013-01-07
US13/787,178 2013-03-06
US13/787,178 US9222842B2 (en) 2013-01-07 2013-03-06 High temperature sensor wafer for in-situ measurements in active plasma
CN201480004168.8A CN104903991B (zh) 2013-01-07 2014-01-06 在活性等离子中用于原位测量的高温传感器晶片

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480004168.8A Division CN104903991B (zh) 2013-01-07 2014-01-06 在活性等离子中用于原位测量的高温传感器晶片

Publications (1)

Publication Number Publication Date
CN109781281A true CN109781281A (zh) 2019-05-21

Family

ID=51060920

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811367416.1A Pending CN109781281A (zh) 2013-01-07 2014-01-06 在活性等离子中用于原位测量的高温传感器晶片
CN201480004168.8A Active CN104903991B (zh) 2013-01-07 2014-01-06 在活性等离子中用于原位测量的高温传感器晶片

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201480004168.8A Active CN104903991B (zh) 2013-01-07 2014-01-06 在活性等离子中用于原位测量的高温传感器晶片

Country Status (6)

Country Link
US (1) US9222842B2 (enExample)
JP (1) JP6184518B2 (enExample)
KR (1) KR101972202B1 (enExample)
CN (2) CN109781281A (enExample)
TW (1) TWI601220B (enExample)
WO (1) WO2014107665A1 (enExample)

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US9891114B2 (en) * 2014-05-28 2018-02-13 Hamilton Sundstrand Corporation Flexible laminated thermocouple
US11150140B2 (en) 2016-02-02 2021-10-19 Kla Corporation Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
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US10651095B2 (en) * 2016-08-11 2020-05-12 Applied Materials, Inc. Thermal profile monitoring wafer and methods of monitoring temperature
US20180366354A1 (en) * 2017-06-19 2018-12-20 Applied Materials, Inc. In-situ semiconductor processing chamber temperature apparatus
KR102393780B1 (ko) 2017-07-19 2022-05-03 (주)포인트엔지니어링 공정분위기 측정센서
US11114321B2 (en) 2017-08-17 2021-09-07 Tokyo Electron Limited Apparatus and method for real-time sensing of properties in industrial manufacturing equipment
KR102010448B1 (ko) * 2017-09-20 2019-08-13 (주)에스엔텍 가스 유량 센서 및 가스 유량 측정 장치
KR20190133926A (ko) 2018-05-24 2019-12-04 한국과학기술원 웨이퍼형 복합 무선 센서 및 이를 이용한 웨이퍼 처리 챔버 센싱 방법
JP7357191B2 (ja) 2018-06-18 2023-10-06 東京エレクトロン株式会社 製造装置における特性の低干渉でのリアルタイム感知
US10916411B2 (en) 2018-08-13 2021-02-09 Tokyo Electron Limited Sensor-to-sensor matching methods for chamber matching
KR102136466B1 (ko) * 2018-09-11 2020-07-22 주식회사 이큐셀 고온 공정 진단이 가능한 웨이퍼 센서
US11371892B2 (en) * 2019-06-28 2022-06-28 Fluke Corporation Platinum resistance temperature sensor having floating platinum member
KR102382971B1 (ko) * 2019-11-05 2022-04-05 이트론 주식회사 반도체 공정 진단을 위한 온도 센서 장치 및 이의 제조 방법
US11589474B2 (en) * 2020-06-02 2023-02-21 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source
US11924972B2 (en) 2020-06-02 2024-03-05 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source

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US20120148283A1 (en) * 2010-12-10 2012-06-14 Canon Kabushiki Kaisha Image forming apparatus

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US20100294051A1 (en) * 2002-01-24 2010-11-25 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
US20050101161A1 (en) * 2003-11-07 2005-05-12 Kurt Weiblen Sensor module
EP1640335A2 (fr) * 2004-09-28 2006-03-29 Commissariat A L'Energie Atomique Composant d'encapsulation de micro-systèmes électromécaniques intégrés et procédé de réalisation du composant
US7972884B2 (en) * 2008-03-19 2011-07-05 Kabushiki Kaisha Toshiba Micromechanical device and method of manufacturing micromechanical device
US20120148283A1 (en) * 2010-12-10 2012-06-14 Canon Kabushiki Kaisha Image forming apparatus

Also Published As

Publication number Publication date
TW201442131A (zh) 2014-11-01
KR101972202B1 (ko) 2019-04-24
WO2014107665A1 (en) 2014-07-10
US20140192840A1 (en) 2014-07-10
JP2016505218A (ja) 2016-02-18
TWI601220B (zh) 2017-10-01
CN104903991A (zh) 2015-09-09
KR20150104145A (ko) 2015-09-14
JP6184518B2 (ja) 2017-08-23
US9222842B2 (en) 2015-12-29
CN104903991B (zh) 2018-12-11

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Application publication date: 20190521

RJ01 Rejection of invention patent application after publication