CN109727900B - 基板传送机械手终端受动器 - Google Patents

基板传送机械手终端受动器 Download PDF

Info

Publication number
CN109727900B
CN109727900B CN201811152281.7A CN201811152281A CN109727900B CN 109727900 B CN109727900 B CN 109727900B CN 201811152281 A CN201811152281 A CN 201811152281A CN 109727900 B CN109727900 B CN 109727900B
Authority
CN
China
Prior art keywords
substrate
contact surface
support member
contact
angle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811152281.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN109727900A (zh
Inventor
普及特·阿咖瓦
丹尼尔·格林伯格
徐松文
杰弗里·布罗丁
史蒂芬·V·桑索尼
格伦·莫里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to CN201811152281.7A priority Critical patent/CN109727900B/zh
Publication of CN109727900A publication Critical patent/CN109727900A/zh
Application granted granted Critical
Publication of CN109727900B publication Critical patent/CN109727900B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201811152281.7A 2014-07-03 2015-06-05 基板传送机械手终端受动器 Active CN109727900B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811152281.7A CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201462020769P 2014-07-03 2014-07-03
US62/020,769 2014-07-03
US14/476,224 US9425076B2 (en) 2014-07-03 2014-09-03 Substrate transfer robot end effector
US14/476,224 2014-09-03
PCT/US2015/034333 WO2016003598A1 (en) 2014-07-03 2015-06-05 Substrate transfer robot end effector
CN201811152281.7A CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器
CN201580036350.6A CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580036350.6A Division CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Publications (2)

Publication Number Publication Date
CN109727900A CN109727900A (zh) 2019-05-07
CN109727900B true CN109727900B (zh) 2023-05-09

Family

ID=55017516

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811152281.7A Active CN109727900B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器
CN201580036350.6A Active CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201580036350.6A Active CN106489194B (zh) 2014-07-03 2015-06-05 基板传送机械手终端受动器

Country Status (9)

Country Link
US (1) US9425076B2 (cg-RX-API-DMAC7.html)
EP (1) EP3164883A4 (cg-RX-API-DMAC7.html)
JP (2) JP2017522738A (cg-RX-API-DMAC7.html)
KR (1) KR102509442B1 (cg-RX-API-DMAC7.html)
CN (2) CN109727900B (cg-RX-API-DMAC7.html)
IL (1) IL249505A0 (cg-RX-API-DMAC7.html)
SG (1) SG11201610314UA (cg-RX-API-DMAC7.html)
TW (1) TWI628738B (cg-RX-API-DMAC7.html)
WO (1) WO2016003598A1 (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10312127B2 (en) 2013-09-16 2019-06-04 Applied Materials, Inc. Compliant robot blade for defect reduction
US9536329B2 (en) * 2014-05-30 2017-01-03 Adobe Systems Incorporated Method and apparatus for performing sentiment analysis based on user reactions to displayable content
JP6276317B2 (ja) * 2016-03-31 2018-02-07 平田機工株式会社 ハンドユニットおよび移載方法
US10090188B2 (en) * 2016-05-05 2018-10-02 Applied Materials, Inc. Robot subassemblies, end effector assemblies, and methods with reduced cracking
JP6757646B2 (ja) * 2016-10-27 2020-09-23 川崎重工業株式会社 基板把持ハンド及びそれを備える基板搬送装置
US10781056B2 (en) 2016-12-22 2020-09-22 General Electric Company Adaptive apparatus and system for automated handling of components
US10773902B2 (en) 2016-12-22 2020-09-15 General Electric Company Adaptive apparatus and system for automated handling of components
USD822735S1 (en) * 2017-03-17 2018-07-10 Donald Dimattia, Jr. Positionable end effector link
US10399231B2 (en) 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
CN113329865B (zh) 2018-10-15 2023-12-29 通用电气公司 自动化膜移除的系统和方法
US11600580B2 (en) 2019-02-27 2023-03-07 Applied Materials, Inc. Replaceable end effector contact pads, end effectors, and maintenance methods
JP7415782B2 (ja) * 2020-05-11 2024-01-17 東京エレクトロン株式会社 基板搬送機構及び基板搬送方法
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
CN112060116B (zh) * 2020-09-02 2021-08-24 深圳市大族富创得科技有限公司 一种搬运机器人
JP7580333B2 (ja) * 2021-05-12 2024-11-11 三菱電機株式会社 ウエハハンド、半導体製造装置、および半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
EP0878559A1 (de) * 1997-05-09 1998-11-18 Leybold Systems GmbH Vorrichtung für den Transport von scheibenförmigen Substraten

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189455U (cg-RX-API-DMAC7.html) * 1987-12-04 1989-06-13
JPH06151195A (ja) 1992-11-06 1994-05-31 Meidensha Corp 変圧器
US6322119B1 (en) * 1999-07-09 2001-11-27 Semitool, Inc. Robots for microelectronic workpiece handling
JPH10144758A (ja) * 1996-11-11 1998-05-29 Kokusai Electric Co Ltd 基板搬送用プレート
JPH10181878A (ja) * 1996-12-26 1998-07-07 Canon Inc 基板搬送用フィンガ
US5955858A (en) * 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
US5985033A (en) * 1997-07-11 1999-11-16 Applied Materials, Inc. Apparatus and method for delivering a gas
US6722834B1 (en) * 1997-10-08 2004-04-20 Applied Materials, Inc. Robot blade with dual offset wafer supports
TW543079B (en) * 1999-06-03 2003-07-21 Applied Materials Inc Robot blade for semiconductor processing equipment
US6537011B1 (en) * 2000-03-10 2003-03-25 Applied Materials, Inc. Method and apparatus for transferring and supporting a substrate
JP2003065311A (ja) * 2001-08-24 2003-03-05 Nitto Seiko Co Ltd 流体排出用ねじ部品
JP3962609B2 (ja) * 2002-03-05 2007-08-22 東京エレクトロン株式会社 搬送装置
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
JP4275420B2 (ja) * 2003-01-28 2009-06-10 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4339615B2 (ja) 2003-03-04 2009-10-07 株式会社ダイヘン ワークピースの保持機構
US7654596B2 (en) * 2003-06-27 2010-02-02 Mattson Technology, Inc. Endeffectors for handling semiconductor wafers
KR100679269B1 (ko) * 2006-01-04 2007-02-06 삼성전자주식회사 멀티 챔버형 반도체 제조 장치
JP2008108991A (ja) * 2006-10-27 2008-05-08 Daihen Corp ワーク保持機構
US9437469B2 (en) * 2007-04-27 2016-09-06 Brooks Automation, Inc. Inertial wafer centering end effector and transport apparatus
GB2464841B (en) * 2007-05-07 2012-01-18 Symyx Solutions Inc Apparatus and method for moving a substrate
US7669903B2 (en) 2007-10-11 2010-03-02 Crossing Automation, Inc. Ultra low contact area end effector
US8382180B2 (en) * 2007-10-31 2013-02-26 Applied Material, Inc. Advanced FI blade for high temperature extraction
CN101939834B (zh) * 2008-02-06 2012-08-08 爱发科股份有限公司 基板传送用机械手
JP5846917B2 (ja) * 2009-01-11 2016-01-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を移動させるシステム、装置、および方法
JP2010239023A (ja) 2009-03-31 2010-10-21 Tokyo Electron Ltd 基板搬送装置及び基板処理装置
KR102077351B1 (ko) * 2011-12-14 2020-02-13 가부시키가이샤 니콘 기판 홀더 및 한 쌍의 기판 홀더
US10431489B2 (en) 2013-12-17 2019-10-01 Applied Materials, Inc. Substrate support apparatus having reduced substrate particle generation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4558984A (en) * 1984-05-18 1985-12-17 Varian Associates, Inc. Wafer lifting and holding apparatus
EP0878559A1 (de) * 1997-05-09 1998-11-18 Leybold Systems GmbH Vorrichtung für den Transport von scheibenförmigen Substraten

Also Published As

Publication number Publication date
TW201608671A (zh) 2016-03-01
IL249505A0 (en) 2017-02-28
KR20170026595A (ko) 2017-03-08
KR102509442B1 (ko) 2023-03-10
JP2021048406A (ja) 2021-03-25
CN106489194A (zh) 2017-03-08
CN109727900A (zh) 2019-05-07
WO2016003598A1 (en) 2016-01-07
EP3164883A1 (en) 2017-05-10
US9425076B2 (en) 2016-08-23
JP7169334B2 (ja) 2022-11-10
SG11201610314UA (en) 2017-01-27
JP2017522738A (ja) 2017-08-10
TWI628738B (zh) 2018-07-01
CN106489194B (zh) 2020-12-04
US20160005638A1 (en) 2016-01-07
EP3164883A4 (en) 2018-08-01

Similar Documents

Publication Publication Date Title
CN109727900B (zh) 基板传送机械手终端受动器
US10431489B2 (en) Substrate support apparatus having reduced substrate particle generation
CN110050336B (zh) 用于制造半导体装置的晶片边缘提升销设计
JP5574553B2 (ja) 基板搬送装置及び保持装置
TWI520822B (zh) 移動基板的系統、設備與方法
CN104690641A (zh) 用于弯曲晶圆的传送模块
CN103222043A (zh) 一种高传导静电夹盘
CN110021543A (zh) 具有硬掩模的基板载体
JP7268208B2 (ja) ウェハ用の基板処理装置
CN107017196A (zh) 具有防滑和防旋转特征的晶片支撑基座
US10399231B2 (en) Substrate handling contacts and methods
KR20110015887A (ko) 외벽 간극이 형성된 진공 척

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TG01 Patent term adjustment
TG01 Patent term adjustment