CN109715866A - Wet treatment system and its operating method - Google Patents
Wet treatment system and its operating method Download PDFInfo
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- CN109715866A CN109715866A CN201780040080.5A CN201780040080A CN109715866A CN 109715866 A CN109715866 A CN 109715866A CN 201780040080 A CN201780040080 A CN 201780040080A CN 109715866 A CN109715866 A CN 109715866A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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Abstract
A kind of electrochemical deposition system is described herein, which has more than two electrochemical deposition modules, which configured and be arranged on a common flat for depositing more than one metals on a substrate.Each electrochemical deposition module includes the anodic compartment for being configured to the volume comprising anolyte fluid, the cathode bays for being configured to the volume comprising catholyte fluid and the film for separating the anodic compartment and the cathode bays.Each electrochemical deposition module further includes a work holder and a loader module, the work holder is arranged to be held the opposite edge of the flexible workpiece between the first and second leg members by a clamping device, the loader module is arranged to for the flexible workpiece being located in the work holder, and holds the flexible workpiece using an air cushion on each opposite flat surfaces of the flexible workpiece simultaneously.
Description
Technical field
The interaction reference of related application: present application be about and advocate on June 27th, 2016 filed in the U.S. it is special
The priority of sharp application case serial number the 15/194th, 086, entire contents are included in this case disclosure by reference in this.
Method and system of the present invention about electrochemical deposition, the electrochemical deposition include various workpiece (such as semiconductors
Substrate) plating.
Background technique
Electrochemical deposition system or workpiece surface wet processed regulating system (such as are partly led with regard to the geometry of type of wafer
Body wafer) and the geometry of panel type for be it is well known that the type of wafer geometry be characterized in that relatively just
Property silicon disk, and panel type geometry is characterized in that bigger and relatively has flexible rectangular substrate.Industrially need
The gained accuracy of the comparable deposited metal of accuracy generated with various wafer equipments can be used to handle panel work for equipment
Part, but still there is suitable or preferable economic productivity compared to existing panel processing equipment.
Electrochemical deposition (ECD) and other processing procedures are (to be such as applied to half as film is applied to various structures and surface
Semiconductor wafer and silicon workpiece or substrate) manufacturing technology.These films may include metal and metal alloy, such as tin, silver, nickel, copper,
Or other metal layers or its alloy.Electrochemical deposition include substrate is positioned within the solution including metal ion, and
Then apply electric current so that metal ion is deposited on substrate from the solution.In general, electric current is between two electrodes (i.e. in yin
Between pole and anode) flowing.When substrate is as cathode, metal can be deposited on it.Electroplating solution may include one kind
The above metal ion type, acid, chelating agent, misfit agent and facilitate plating specific metal some other types additive
Any one of them.In addition to other advantages, these additives can help adhesion and uniformly-coating and reduce membrane stress.Work as electricity
When plating occurs, the metal from electroplating solution is to be consumed, and therefore need replacing to continue electrochemical deposition operation.
In panel processing, traditional system uses the continuous or serial process with horizontally or vertically panel orientation to convey
The handling system of type.As described above, panel processing system, partially due to its transportation system, locks into the process uniformity of difference
And particle generates.More generally useful, these systems lock into the environmental Kuznets Curves of difference.Therefore, inventors have realized that needing the face of improving
Plate is carried and deposition uniformity.
Summary of the invention
Embodiment is the method and system about electrochemical deposition, which includes that various workpiece (are such as partly led
Structure base board and panel) plating.
One important feature of the system for electrochemical deposition is that it is generated with uniform and repeatable characteristic (such as film thickness
Degree, composition and relative to underlying workpiece profile profile) ability.A main electrolyte (system can be used in electrochemical deposition system
Journey electrolyte), which requires supplementation with when consumption.For example, in metal application, metal cation solution is worked as
It may be required supplementation with when consumption.Moreover, when such supplement can not add in-place to execute when, supplementary procedure may be with the function of application
Property and become expensive, thereby increases and it is possible to need the significant downtime of electrochemical deposition tool or submodule to repair and processing procedure weight
It is new qualified, the cost of the owner of deposition tool is adversely affected.
Techniques disclosed herein etc. includes an electrochemical deposition equipment, provides the environment of firm workpiece handling, improvement
Control, the electrolyte circulation system (reaching more reliable and uniform plating comprising improved chemical balance motion) and short simplified
Maintenance time to reach preferable tool availability.
According to an embodiment, a kind of electrochemical deposition system is described, which has more than two electrifications
Deposition module is learned, which configured and be arranged on a common flat on a substrate
Deposit more than one metals.Each electrochemical deposition module includes the anode for being configured to accommodate the volume of anolyte fluid
Compartment is configured to accommodate a cathode bays of the volume of catholyte fluid and divides the anodic compartment and the cathode bays
The film separated.Each electrochemical deposition module further includes a load port and a loader module, which is configuration
At one group of flexible workpiece is received, each flexible workpiece defines the through hole of metal filling to be used, which is configuration
It is located in a work holder at from the load port one flexible workpiece of reception and by the flexible workpiece, and simultaneously in the flexibility
The flexible workpiece is held using an air cushion on each opposite flat surfaces of workpiece.The work holder has first and the
The headstock component that two leg members separate, wherein the work holder is arranged to by a clamping device in first He
The opposite edge of the flexible workpiece is held between second leg member, which is applied to this for plural electric contact piece and scratches
Property workpiece this etc. opposite flat surfaces, wherein the grade electric contact pieces are surrounded by an elastic sealing element, and when this is scratched
Property workpiece be that the headstock component provides tension to the flexible workpiece when being held by the work holder.In addition, each electrification
Learning deposition module includes a transport mechanism, which is arranged to flexible workpiece by work holder from the loader
Module is sent to a given electrochemical deposition module, and a given workpiece is lowered into the given electrochemical deposition module.One
Electrical system, which is configured to the flexible workpiece, to be applied a current to when this gives and is held in electrochemical deposition module
Each opposite flat surfaces of the flexible workpiece so that each opposite flat surfaces be subject to metal plating and this etc. pass through
Perforation is filled using metal.One device for removing module is arranged to remove the flexible workpiece from the work holder, and will
The flexible workpiece is sent to a dump port, which is configuration to receive this group of flexible workpiece.
System disclosed herein and technology provide several advantages.Firm workpiece handling and environmental Kuznets Curves and efficient work
Part process allows improved processing procedure efficiency (comprising process uniformity and yield) and reduces particle pollution.Simplified chemical process
Management excludes cost and complexity.In addition, having on the plate of processing system or more holding from the offer of plate chemicals generation system
Easy chemical concentration management.
Certainly, for the sake of clarity, the discussion sequence of different step and feature as described herein is presented.In general, these
Step can be executed in any suitable order.In addition, although each different feature, technology, configuration etc. herein can be at this
The different places of disclosure are discussed, but each concept independently of one another or can be bonded to each other and be carried out.Therefore, this hair
It is bright to embody and examine closely in a number of different ways.
Notice that each embodiment and/or increase for pointing out this disclosure or claimed invention is not known in the invention summarized section
Novel state sample implementation.Instead the invention content only provides the preliminary discussion of different embodiments, and is better than known skill
The novelty corresponding points of art.For the present invention and embodiment additional detail and/or possible view, reader can refer to lower section into
The embodiment chapters and sections of one step discussion and the corresponding diagram of this disclosure.
Detailed description of the invention
The more complete understanding of various embodiments of the present invention and adjoint many of these advantages, reference are said in detailed below
It is bright, when considering especially in conjunction with alterations, it will be better understood.Schema is not necessarily to scale, but focuses on explanation
Feature, principle and conceptive.
Fig. 1 illustrates the schematic diagram of electrochemical deposition system according to an embodiment.
Fig. 2A and 2B provides the view of electrochemical deposition module according to another embodiment.
Fig. 3 provides the sectional view of electrochemical deposition module according to another embodiment.
Fig. 4 provides the perspective view of electrochemical deposition system according to still another embodiment.
Specific embodiment
Techniques disclosed herein includes an electrochemical deposition equipment, provides firm workpiece handling system, simplification follows
Loop system, improved chemical balance motion system are to reach more reliable and uniform plating and short maintenance time to reach preferable
Tool availability.
System disclosed herein and technology can be presented as that the module of electrochemical deposition system or a system or workpiece surface are wet
Formula handles regulating system.Example system includes to be capable of handling or adjust the wet treatment system of the workpiece of various types and size,
Both the geometry (such as semiconductor crystal wafer) of the above-mentioned type and size comprising type of wafer and geometry of panel type,
The former is characterized in that the silicon disk of relative stiffness, and the latter is characterized in that bigger and more flexible rectangular substrate.One implements
Example is comprising for by the electrochemical deposition equipment on metal deposit to substrate.Fig. 1 illustrates electrochemical deposition system according to an embodiment
The schematic diagram of system 100.Electrochemical deposition system 100 includes the more than two processing modules being described below, such as common one
The electrochemical deposition module of more than one metals is configured and is used to deposit on workpiece on platform.Each processing module (such as it is every
One electrochemical deposition module) comprising being configured to accommodate the anodic compartment of the volume of anolyte fluid, being configured to accommodate cathode
The cathode bays of the volume of electrolyte flow and the film for separating anodic compartment and cathode bays.
Electrochemical deposition system 100 has load port to receive one group of workpiece, which includes dress
Device module 110 is carried, which, which is used to receive, enters electrochemical deposition system 100 by loading/input station 112
Workpiece and each received workpiece is loaded into work holder 125, such as flexible panel holder (PH).Each workpiece
It may include flexible panel, such as the flexible rectangular panel of various sizes.Workpiece may include being filled out using material (such as metal)
More than one non-through hole or more than one through hole filled.The filling in more than one hole may include single sided deposition (i.e. from workpiece
One side deposition) or double-sided deposition (i.e. from the two sides of workpiece deposit (such as in the case where hole is through hole)).
In order to which control surrounds the environment of each workpiece during being loaded into work holder, loader can be mobile in workpiece
And an equipment is used during loading, to apply air cushion by each opposite flat surfaces to flexible workpiece to execute essence nothing and connect
The carrying of the workpiece of touching.According to some embodiments, work holder 125 may include separating the first and second leg members
Headstock component can be grasped, wherein the work holder is arranged to incite somebody to action between the first and second leg members by clamping device
The opposite edge of flexible workpiece is held, which is optionally applied to the opposite of flexible workpiece for electric contact piece
Flat surfaces, wherein the grade electric contact pieces are surrounded by elastic sealing element.When flexible workpiece is by work holder 125
When being held, which also can provide tension to flexible workpiece.
In addition, electrochemical deposition system 100 includes transport mechanism, which is arranged to by work holder
Flexible workpiece is sent to a given processing module (such as electrochemical deposition module) from loader module 110 by 125, and one is given
Determine workpiece and lowers into the given processing module.For example, referring to Fig.1, once being selected for the work holder of processing
125 be to be loaded, can be along processing path 115(referring to the PH processing path in Fig. 1) advance, in more than one pretreatment
It is pre-processed in module 120 (when needed)；In more than one processing module 130,132,134,136,138
Reason；And it is post-processed (when needed) in more than one post-processing module 140.Pretreatment may include, but are not limited to cleaning
And/or the workpiece that wetting is to be processed.Processing, which may include, but are not limited to, deposits the material of such as metal to workpiece.After moreover,
Processing may include, but are not limited to rinse and/or dry workpiece.
Electrochemical deposition system 100 further includes device for removing module, which is arranged to hold from workpiece
Device removes flexible workpiece, and the flexible workpiece is sent to dump port, which is arranged to receive the group flexibility work
Part.For example, in some embodiments that Fig. 1 is shown, after the treatment, the work holder of processed workpiece is carried
125 may proceed to device for removing module 150, wherein each workpiece is to be subject to removal and be sent to removal/output station 152 to leave electricity
Chemical deposition system 100.Once removal, work holder 125 can be back to along return path 155 loader module 110(referring to
PH return path in Fig. 1) to receive another workpiece.Notice that multiple work holders may be employed, some of workpiece are solid
Holder is fixed in store buffer.The more detailed description of example work holder can be in Shen on June 27th, 2016
It is found in U.S. Patent Application No. 15/193595 please, entire contents are included in this case disclosure by reference in this.
The more detailed description of example workpiece loader module can U.S. Patent Application No. 15/ filed on June 27th, 2016
It is found in No. 193890, entire contents are included in this case disclosure by reference in this.
Electrochemical deposition system 100 further includes chemical balance motion system 160, single in more than one processing for managing
Treatment fluid in first (i.e. module 120,130,132,134,136,138,140).Chemical balance motion may include, but are not limited to confession
It answers, supplement, with agent, heating, cooling, circulation, recycling, storage, monitoring, discharge, reduction etc..In addition, electrochemical deposition system
100 include electrical management system 170, for controlling the operability of electrochemical deposition system 100.Electrical management may include but not
It is limited to scheduling, coordination, monitoring, adjustment, communication etc..For example, electrical management system 170 can be according to the instruction of computer code
Transmission and receive signal, with control workpiece move through electrochemical deposition system 100 or control plural module 120,130,132,
134,136,138,140 chemical property, chemical component, temperature, flow rate etc..In addition, when flexible workpiece is given
When being held in electrochemical deposition module, electrical management system 170 can be configured to apply a current to one of the flexible workpiece
Or two opposite flat surfaces.In doing so, one or two opposed surfaces can metal lining, and non-through hole and/or pass through
Perforation is filled using metal.
View referring now to Fig. 2A, the electrochemical deposition module with plural number ECD unit is to be subject to according to another embodiment
It provides.As shown, Fig. 2A provides the top view of anolyte storage tank 230, plural cathode bays and a film, anode electricity
Solution liquid storage tank 230 is to be set to the volume for accommodating anolyte fluid 232, which is arranged to accommodate cathode electricity
The volume of electrolyte fluid, and the film separates the anolyte fluid 232 and plural cathode bays 200.Anolyte
Storage tank 230 includes the anolyte storage tank for accommodating anolyte fluid 232, and plural cathode bays 200 are in anode electricity
It is configured in solution liquid storage tank.Anolyte storage tank 230 may include anolyte supply and reserve tank 262, Anodic
Electrolyte can be recycled, is supplemented and/or be adjusted again, and then using anolyte side pumping system 264 and anode electricity
Solution liquid storage tank 230 swaps.In addition, anolyte storage tank 230 may include catholyte supply and reserve tank 266,
Middle catholyte can be recycled, is supplemented and/or be adjusted again, and then using catholyte side pumping system 268 with
Plural cathode bays 200 swap.Chemical balance motion system 260 can be with anolyte and catholyte supply and storage
Slot 262,266 etc. interfaces with, management fluid level, chemical component, chemicals quality, chemical temperatures, chemical agent etc..Citing and
Speech, chemical balance motion system 260 can be such that anolyte and/or catholyte solution regenerates, comprising add or replacement water,
Acid, anion solutions, cationic solution, chelating agent, misfit agent, smoothing agent, acceleration or deceleration agent etc..
According to some embodiments, workpiece W may include with size range from about 50cm × 50cm to 100cm × 100cm
Flexible rectangular substrate.Therefore, the range of the fluid depth in anolyte storage tank 230 can be positive from 90cm to 150cm
The range of the width of pole electrolyte storage tank 230 can be from 90cm to 150cm.Each ECD module be designed to it is relatively narrow, citing and
Speech, anode are designed to anode or the anticathode width of anode to be less than 20cm.Therefore, plural cathode bays 200(ECD mould
Block) it can be configured within the anolyte storage tank that length is up to 120cm.Plural number in anolyte storage tank 230
The submergence of cathode bays 200 is partially submerged, provides the effective use in space.And therefore, among other things, one of this embodiment
Advantage is the single container of anolyte fluid 232, and the chemicals and fluid management system simplified with one is with economic configuration
It services plural number ECD module, save cost of equipment, chemicals and factory floor space.
Fig. 2 B provides the top view of the cathode bays 200 configured between opposite anode assemblies 240,241.Accommodate workpiece
The work holder 215 of W is configured in frame 210, and the frame 210 is relative to the fluid influenced on the surface of workpiece W
Other significant components of the ECD module of flow field and field uniformity, it is advantageously and repeatedly that work holder 215 is accurately fixed
Position is within positive or negative 0.1 to 1.0mm, preferably within positive or negative 0.5mm.Cathode bays 200 may include electric field forming group
Part 201,204, the electric field forming assembly 201,204 are to be configured on the surface of workpiece W about 3 between 10mm, preferably
Surface 4mm apart from workpiece W.Cathode bays 200 can further include fluid agitation component 202,205, the fluid agitations group such as this
Part 202,205 is configured close to the surface of workpiece W, preferably within the 10mm on the surface of workpiece W.
Amberplex 203,206 be defined on cathode bays 200 and the anode comprising opposite anode assemblies 240,241 every
Between between boundary, and provide anolyte fluid 232 in anodic compartment and the catholyte in cathode bays 200
Separation between liquid 220.Among other things, a benefit is by between anolyte fluid 232 and catholyte 220
The close geometry for defining boundary and providing, in which during operation, anolyte fluid 232 and catholyte 220
Fluid pressure be across flexible amberplex and balanced so that not needing comprising wide wall construction for each work
The hydrostatic pressure of part W inhibition catholyte.
For example, each opposite anode assemblies 240,241 may include multi-region anode 242, such as: in radial directions
Configure the anode configured on the anode of cyclization, or grid in that orthogonal direction.In this embodiment, two opposite sun
Pole component 240,241 is opposing cathode compartment and is shown.However, in other embodiments, single anode assemblies can be towards
Cathode bays.
Fig. 3 provides the detailed drawing in side sectional elevation of ECD module according to an embodiment.Workpiece W is located in by work holder 315
Electric field forming assembly 330, fluid agitation component 310, the amberplex 325 and receiving anode held by support construction 320
Between 342 anode assemblies 340.It as shown, exposed surface of the electric field forming assembly 330 in workpiece W extends about, and is to match
It is set to the uniformity for improving deposition manufacture process.In addition, as shown, fluid agitation component 310 prolongs near the exposed surface of workpiece W
It stretches, and is arranged to increase fluid shear force and enhances quality, momentum and the heat transmitting near the exposed surface of workpiece W.
Fig. 4 provides the perspective view of electrochemical deposition system according to still another embodiment.Electrochemical deposition system 500 includes dress
Device module 510 and device for removing module 550 are carried, wherein complex processing module 520,530,540 is arranged in therebetween.Processing module
520 may include preprocessing module, such as pre- rinse module.Processing module 530 may include electrochemical deposition module.Moreover, processing
Module 540 may include post-processing module, such as rinse or irradiation modules.Although loader module 510 and device for removing module 550 are
It is shown as in the long-range of electrochemical deposition system 500, but these are loaded and removal module can be near the same end of whole system
It is configured.Workpiece W can be loaded into work holder 525, by workpiece transfer system 560 translate, and oriented with
It is positioned within complex processing module 520,530,540.
Using this paper system, electrochemical deposition system can be generated, efficiently molten using being electroplated
Liquid, and there is relatively small occupied area compared with traditional depositing system.For example, each electrochemical deposition module can match
It is set to the electroplating solution of less than about 30 liters of receiving.In some embodiments, common flat may include being less than about 16 electrochemistry
Deposition module, and can be configured to that 100 flexible workpieces are electroplated per hour.Common flat can take up an area less than about 250 square feet
Ground space.Therefore, the relatively little of electroplating solution that relatively small system and every workpiece can be used to use for the system of this paper provides
Relatively high productivity.
Detail has been illustrated in description previous, the particular geometries of such as processing system and is wherein used
Various assemblies and processing procedure description.It should be understood, however, that technology can be in the other embodiments away from these details herein
It is carried out, and these details are for the purpose of explaining rather than limit.Embodiment disclosed herein is subject to reference to accompanying drawings
Description.Similarly, to understand the purpose selected, specific number, material and configuration have been illustrated to be understood so that offer is complete.
Only pipe is in this way, embodiment can be implemented without these details.With substantially the same functional structure
Component is indicated with similar reference symbol, and therefore the description of any redundancy may be omitted.
Various technologies are described to help to understand various embodiments with multiple separate operations.The sequence of description is not
It should be construed as to imply that these operations are that inevitable sequence is interdependent.Really, these operations are not required to be executed with the sequence of statement.Institute
It states operation and can be different from the sequence of the embodiment and executed.In the additional examples, various additional operations can add
It may be omitted with execution and/or the operation.
" substrate " or " target base plate " as employed herein refers to object handled according to the present invention.Substrate may include group
Any material part of part (especially semiconductor or other electronic building bricks) or structure, and may be, for example, basal substrate structure, it is all
As on semiconductor crystal wafer, times contracting light shield or basal substrate structure or covered one layer (such as film) of basal substrate structure.Cause
This, substrate be not limited to any specific underlying structure, bottom or coating, patterning or non-patterned, but, be imagine with
Any combination comprising any such layer or underlying structure and layer and/or underlying structure.This description can refer to special substrate
Type, but this is only for the purpose of explanation.
It is skillful in the personage of the technology it will also be appreciated that operation for techniques described above, can make many variations, and still
Reach same target of the invention.These variations are intended to by the range of this disclosure.Therefore, the embodiment of the present invention
Previous description be not intended to be restrictive.More precisely, any restrictions of the embodiment of the present invention are presented in following application
In the scope of the patents.
Claims (16)
1. a kind of electrochemical deposition system, characterized by comprising:
More than two electrochemical deposition modules are configured on a common flat and are to be disposed for depositing on a substrate
More than one metals, each electrochemical deposition module includes:
One anodic compartment is configured to accommodate the volume of anolyte fluid；
One cathode bays are configured to accommodate the volume of catholyte fluid；And
One load port is configured to receive one group of flexible workpiece；
One loader module is configured to receive a flexible workpiece from the load port and the flexible workpiece is located in a workpiece to consolidate
In holder, and the flexible workpiece is held using an air cushion on each opposite flat surfaces of the flexible workpiece simultaneously；
The work holder has the headstock component for separating the first and second leg members, which is to match
It is set to the opposite edge for holding the flexible workpiece between first and second leg member by a clamping device, the clamping
Plural electric contact piece is applied to the opposite flat surfaces such as this of the flexible workpiece by mechanism, wherein when the flexible workpiece is by this
When work holder is held, which surrounded by the elastic sealing element for the flexible workpiece, should
Work holder system is configured to the two sides of the flexible workpiece being exposed to electroplating solution；
One transport mechanism is configured to that flexible workpiece is sent to a given electrochemistry from the loader module by work holder
Deposition module, and a given workpiece is lowered into the given electrochemical deposition module；
One electrical system is configured to when the flexible workpiece be when this gives and is held in electrochemical deposition module, by electric current
Each opposite flat surfaces of the flexible workpiece are applied to, so that each opposite flat surfaces are subject to plating with metal；
One device for removing module is configured to remove the flexible workpiece from the work holder, and the flexible workpiece is sent to one and is unloaded
Except port, which is configuration to receive this group of flexible workpiece.
2. electrochemical deposition system as described in claim 1, which is characterized in that wherein, the load port and the dump port
It is to be configured in the different location of the electrochemical deposition system.
3. electrochemical deposition system as claimed in claim 2, which is characterized in that wherein, which is arranged to certainly should
Work holder is back to the loader module by device for removing module.
4. electrochemical deposition system as claimed in claim 2, which is characterized in that wherein, the load port and the dump port
It is position in the opposite end of the electrochemical deposition system.
5. electrochemical deposition system as described in claim 1, which is characterized in that wherein, which includes one
Chemical balance motion system, which is coupled to more than one electrochemical deposition module and be configured for should
At least one of them of more than one electrochemical deposition module is used to deposit more than one metal components of more than one metals.
6. electrochemical deposition system as claimed in claim 5, which is characterized in that wherein, which includes one
Screw conveyor, for metal powder to be delivered to a metal distribution system.
7. electrochemical deposition system as described in claim 1, which is characterized in that further include:
The film that the anodic compartment and the cathode bays are separated.
8. electrochemical deposition system as described in claim 1, which is characterized in that wherein, each electrochemical deposition module includes
One agitating member, the agitating member are arranged to stir electroplating solution on the opposite surface of the flexible workpiece.
9. electrochemical deposition system as described in claim 1, which is characterized in that wherein when the flexible workpiece is in the given electricity
When being positioned in chemical deposition module, each opposite flat surfaces of the flexible workpiece face an anode, wherein each scratch
Property workpiece defines the through hole that metal to be used is filled.
10. electrochemical deposition system as described in claim 1, which is characterized in that wherein, each electrochemical deposition module is to match
It is set to and contains less than 30 liters of electroplating solution.
11. electrochemical deposition system as described in claim 1, which is characterized in that wherein, which includes complex elastic
Component, the grade elastic components the flexible workpiece this etc. assign a chucking power on opposite flat surfaces.
12. electrochemical deposition system as claimed in claim 11, which is characterized in that wherein, which includes
One Pneumatic gasbag, the Pneumatic gasbag are arranged to open the clamping device upon inflation.
13. electrochemical deposition system as described in claim 1, which is characterized in that the common flat includes less than 16 electrifications
Deposition module is learned, and is configured to that 100 flexible workpieces are electroplated per hour.
14. electrochemical deposition system as claimed in claim 13, which is characterized in that the common flat takes up an area less than 250 squares
The ground space of foot.
15. a kind of electrochemical deposition system, characterized by comprising:
More than two electrochemical deposition modules are configured on a common flat and are disposed for depositing one on a substrate
Kind or more metal, each electrochemical deposition module includes:
One electroplating solution compartment is configured to accommodate the volume of electroplating solution；
One load port is configured to receive one group of workpiece；
One loader module is configured to receive a workpiece from the load port and the workpiece is located in a work holder,
And the workpiece is held using an air cushion on each opposite flat surfaces of the workpiece simultaneously；
The work holder has the headstock component for separating the first and second leg members, work holder configuration
At the opposite edge for holding the workpiece between first and second leg member by a clamping device, which will
Plural electric contact piece is applied to the opposite flat surfaces such as this of the workpiece, wherein when the workpiece is subject to by the work holder
When fixing, which surrounded by the elastic sealing element for the workpiece, which is arranged to
The two sides of the workpiece is exposed to electroplating solution；
One transport mechanism is configured to that workpiece is sent to a given electrochemical deposition from the loader module by work holder
Module, and a given workpiece is lowered into the given electrochemical deposition module；
One electrical system is configured to when the workpiece be to apply electric current when this gives and is held in electrochemical deposition module
To each opposite flat surfaces of the workpiece, so that each opposite flat surfaces are plated with metal or on the contrary flat
Surface one of them is plated with metal；
One device for removing module is configured to remove the workpiece from the work holder, and the workpiece is sent to a dump port, should
Dump port is arranged to receive this group of workpiece.
16. electrochemical deposition system as claimed in claim 15, which is characterized in that wherein, an anode and the workpiece are contacts
One identical electroplating solution.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/194,086 US20170370017A1 (en) | 2016-06-27 | 2016-06-27 | Wet processing system and method of operating |
| US15/194,086 | 2016-06-27 | ||
| PCT/US2017/038192 WO2018005155A1 (en) | 2016-06-27 | 2017-06-19 | Wet processing system and method of operating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109715866A true CN109715866A (en) | 2019-05-03 |
Family
ID=60675354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780040080.5A Withdrawn CN109715866A (en) | 2016-06-27 | 2017-06-19 | Wet treatment system and its operating method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20170370017A1 (en) |
| JP (1) | JP2019520484A (en) |
| KR (1) | KR20190018530A (en) |
| CN (1) | CN109715866A (en) |
| DE (1) | DE112017003189B4 (en) |
| TW (1) | TWI649460B (en) |
| WO (1) | WO2018005155A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113882004A (en) * | 2021-10-28 | 2022-01-04 | 京东方科技集团股份有限公司 | Substrate carrier and electrochemical deposition apparatus |
| CN115708416A (en) * | 2021-06-18 | 2023-02-21 | 株式会社荏原制作所 | Plating apparatus and plating method |
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| US10283396B2 (en) | 2016-06-27 | 2019-05-07 | Asm Nexx, Inc. | Workpiece holder for a wet processing system |
| US11608563B2 (en) * | 2019-07-19 | 2023-03-21 | Asmpt Nexx, Inc. | Electrochemical deposition systems |
| CN110499528B (en) * | 2019-09-26 | 2021-04-23 | 浙江君悦标准件有限公司 | Fastener electroplating production line |
| EP3825445A1 (en) * | 2019-11-22 | 2021-05-26 | Semsysco GmbH | Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate |
| US11542626B2 (en) * | 2020-10-08 | 2023-01-03 | Honeywell International Inc. | Systems and methods for enclosed electroplating chambers |
| US11942341B2 (en) | 2022-01-26 | 2024-03-26 | Asmpt Nexx, Inc. | Adaptive focusing and transport system for electroplating |
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Also Published As
| Publication number | Publication date |
|---|---|
| DE112017003189T5 (en) | 2019-04-25 |
| JP2019520484A (en) | 2019-07-18 |
| TW201812116A (en) | 2018-04-01 |
| US20170370017A1 (en) | 2017-12-28 |
| TWI649460B (en) | 2019-02-01 |
| KR20190018530A (en) | 2019-02-22 |
| DE112017003189B4 (en) | 2020-12-03 |
| WO2018005155A1 (en) | 2018-01-04 |
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