JP2019520484A - Wet processing system and operating method - Google Patents

Abstract

An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured to deposit one or more metals on a substrate is described. Each electrochemical deposition module separates an anode compartment configured to receive a volume of anolyte fluid, a cathode compartment configured to receive a volume of catholyte fluid, and the anode compartment from the cathode compartment Including membranes. Each electrochemical deposition module includes a workpiece holder configured to hold opposite edges of the flexible workpiece between the first leg member and the second leg member by a clamping mechanism; A loader module configured to be positioned within the workpiece holder while holding the flexible workpiece against each opposite flat surface of the flexible workpiece using an air cushion.

Description

This application claims priority to US Patent Application No. 15 / 194,086, filed Jun. 27, 2016, the contents of which are incorporated herein by reference in its entirety. It is.

  The present invention relates to methods and systems for electrochemical deposition including electroplating of various workpieces such as semiconductor substrates.

  Electrochemistry for both wafer-type geometries characterized by relatively rigid silicon circular disks (eg semiconductor wafers) and panel-type geometries characterized by much larger and more flexible rectangular shaped substrates Deposition systems, or workpiece surface wet process conditioning systems are well known. As a result, panel workpieces can be processed with a precision of the deposited metal comparable to the precision provided by various wafer equipment, but nevertheless comparable to existing panel processing equipment or There is a need in the art for equipment with better economic productivity.

  Electrochemical deposition (ECD), among other processes, is used as a fabrication technique to apply coatings to various structures and surfaces, such as semiconductor wafers and silicon workpieces or substrates. Such coatings can include metals and metal alloys such as tin, silver, nickel, copper, or other metal layers, or alloys thereof. Electrochemical deposition requires positioning the substrate in a solution containing metal ions and then applying an electrical current to deposit metal ions from the solution on the substrate. Typically, current flows between the two electrodes, ie between the cathode and the anode. When the substrate is used as a cathode, metal can be deposited thereon. The plating solution can include one or more metal ion types, acids, chelating agents, complexing agents, and any of several other types of additives that help to plate certain metals. . Such additives can help to enable adhesion and uniform plating, and can reduce film stress, among other benefits. When plating takes place, metal from the plating solution is consumed and therefore needs to be replaced to continue the electrochemical deposition operation.

  In panel processing, conventional systems use continuous or sequential process conveyor type handling systems where the panel orientation is either horizontal or vertical. As indicated above, in panel processing systems, in part as a result of their conveyor systems, process uniformity is poor and particles are also generated. More generally, environmental control is inadequate in these systems. Thus, the inventors recognize that there is a need for improved panel handling and deposition uniformity.

U.S. Patent Application No. 15 / 193,595 U.S. Patent Application No. 15 / 193,890

  Embodiments relate to methods and systems for electrochemical deposition including electroplating of various workpieces such as semiconductor substrates and panels.

  An important feature of the systems used for electrochemical deposition is that of those systems capable of producing films with uniform and repeatable features, such as film thickness, composition, and contours to the underlying workpiece contour. It is an ability. The electrochemical deposition system can use a main electrolyte (process electrolyte), which needs replenishment as soon as it is depleted. By way of example, the application of metal may require replenishment of the metal cation solution as soon as it is depleted. Also, when such replenishment can not be performed in situ, the replenishment procedure can be expensive depending on the application, and also for requalification of services and processes of electrochemical deposition tools or submodules. Significant downtime may be required, which adversely affects the cost of ownership of the deposition tool.

  The techniques disclosed herein have been simplified, including, among others, robust workpiece handling, improved environmental control, and improved chemical management to obtain more reliable and uniform plating. Electrolyte deposition system, as well as an electrochemical deposition system that provides short maintenance times for greater tool availability.

  According to one embodiment, an electrochemical deposition system having two or more electrochemical deposition modules disposed on a common platform and configured to deposit one or more metals on a substrate is described Ru. Each electrochemical deposition module separates an anode compartment configured to contain a volume of anolyte fluid, a cathode compartment configured to contain a volume of catholyte fluid, and an anode compartment from the cathode compartment Including membranes. Each electrochemical deposition module is configured to receive a flexible workpiece set, each flexible workpiece defining a through hole to be filled with metal, from the loading port and from the loading port to the flexible workpiece A loader module configured to receive pieces and position the flexible workpiece within the workpiece holder while holding the flexible workpiece against the opposite flat surfaces of the flexible workpiece using an air cushion Further includes The workpiece holder has a header member separating the first leg member and the second leg member, wherein the workpiece holder is configured to connect opposite edges of the flexible workpiece with the first leg member. Between the second leg member, configured to be held by the clamping mechanism, the clamping mechanism applies electrical contacts, surrounded by an elastomeric seal, on opposite flat sides of the flexible workpiece, and the header The member tensions the flexible workpiece when held by the workpiece holder. In addition, each electrochemical deposition module transports the flexible workpiece from the loader module to the given electrochemical deposition module by the workpiece holder and lowers the given workpiece into the given electrochemical deposition module Configured to include a transport mechanism. Each opposite flat surface of the flexible workpiece is plated with metal and the through holes are filled with metal on each opposite flat surface of the flexible workpiece when the electrical system is held in a given electrochemical deposition module , Are configured to apply a current. The unloader module is configured to remove the flexible workpiece from the workpiece holder and to carry the flexible workpiece to an unloading port configured to receive the flexible workpiece set.

  The systems and techniques disclosed herein provide several advantages. Reliable workpiece handling and environmental control, as well as efficient workpiece flow, can improve process performance and reduce particle contamination, including process uniformity and yield. Simplified chemical flow management eliminates cost and complexity. Furthermore, having the chemical generation system on board or off board in close proximity to the processing system makes chemical concentration management easier.

  Of course, the order of discussion of the various steps and features described herein is presented for the sake of clarity. In general, these steps may be performed in any suitable order. Additionally, although each of the various features, techniques, configurations, etc. may be discussed herein at various places in the present disclosure, each of these concepts may be practiced independently of one another. It is intended that they may be implemented in combination with one another. Accordingly, the present invention can be embodied and viewed in many different ways.

  It should be noted that this summary section does not describe in detail every embodiment and / or increasingly novel aspect of the present invention as described in this disclosure or the claims. Rather, this summary provides only a preliminary discussion of the various embodiments and the corresponding new points over conventional techniques. For further details and / or possible aspects of the invention and embodiments, the reader is directed to the section of the disclosure for carrying out the invention and the corresponding figures, which are discussed further below.

  A more complete understanding of the various embodiments of the present invention and the attendant advantages thereof will be readily apparent when the following detailed description is considered in conjunction with the accompanying drawings. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating features, principles, and concepts.

FIG. 1 is a schematic view of an electrochemical deposition system according to one embodiment. FIG. 7 is a diagram of an electrochemical deposition module according to another embodiment. FIG. 7 is a diagram of an electrochemical deposition module according to another embodiment. FIG. 7 is a cross-sectional view of an electrochemical deposition module according to another embodiment. FIG. 7 is a perspective view of an electrochemical deposition system according to yet another embodiment.

  The techniques disclosed herein provide a reliable workpiece handling system, a simplified circulation system, an improved chemical management system for more reliable and uniform plating, and greater tool availability. Includes an electrochemical deposition system that provides a short maintenance time.

  The systems and techniques disclosed herein can be embodied as electrochemical deposition systems or modules of systems, or workpiece surface wet process conditioning systems. Exemplary systems include both wafer-type geometries (eg, semiconductor wafers) characterized by relatively rigid silicon circular disks and panel-type geometries characterized by much larger and more flexible rectangular shaped substrates. Including wet processing systems capable of handling or adjusting various types and sizes of workpieces, including: One embodiment includes an electrochemical deposition apparatus for depositing metal on a substrate. FIG. 1 shows a schematic view of an electrochemical deposition system 100 according to one embodiment. The electrochemical deposition system 100 comprises two or more processing modules described below, such as an electrochemical deposition module, disposed on a common platform and configured to deposit one or more metals on a workpiece. Including. Each processing module, eg, each electrochemical deposition module, includes an anode compartment configured to contain a volume of anolyte fluid, a cathode compartment configured to contain a volume of catholyte fluid, and an anode compartment It contains a membrane that separates from the cathode compartment.

  The electrochemical deposition system 100 is a loading port for receiving a set of workpieces, receives workpieces entering the electrochemical deposition system 100 through the load / input stage 112, and flexes each received workpiece. It has a loading port that includes a loader module 110 for loading into a workpiece holder 125, such as a rigid panel holder (PH). Each workpiece may include a flexible panel, for example, flexible rectangular panels of various dimensions. The workpiece may include one or more blind holes to be filled with a material such as metal or one or more through holes. The filling of the one or more holes may be single-sided deposition, ie deposition from one side of the workpiece, or double-sided deposition, ie deposition from both sides of the workpiece (e.g. if the hole is a through hole).

  In order to control the environment surrounding each workpiece during loading into the workpiece holder, the loader utilizes air cushions on each opposite flat surface of the flexible workpiece during movement and loading of the workpiece. An apparatus can be used that performs substantially contactless handling of the workpiece. According to some embodiments, the workpiece holder 125 can include a grippable header member separating the first and second leg members, wherein the workpiece holder is flexible. A clamping mechanism configured to hold opposite edges of the flexible workpiece between the first leg member and the second leg member, the clamping mechanism optionally including the opposite ends of the flexible workpiece The flat surface is provided with electrical contacts surrounded by an elastomeric seal. The header member can also tension the flexible workpiece as held by the workpiece holder 125.

  In addition, the electrochemical deposition system 100 transports the flexible workpiece from the loader module 110 by the workpiece holder 125 to a given processing module, eg, an electrochemical deposition module, and the given workpiece is given a given processing module Includes a transport mechanism configured to be lowered into. For example, referring to FIG. 1, after being loaded, the workpiece holder 125 designated for processing may proceed along the process path 115 (see PH process path in FIG. 1), one or more as required. Pre-processed in multiple pre-processing modules 120, processed in one or more processing modules 130, 132, 134, 136, 138, and post-processed in one or more post-processing modules 140 as needed It can be done. Pretreatment may include, but is not limited to, washing and / or wetting the workpiece to be treated. Processing may include, but is not limited to, depositing a material such as metal on the workpiece. Also, post-treatments may include, but are not limited to, rinsing and / or drying the workpiece.

  The electrochemical deposition system 100 is configured to remove the flexible workpiece from the workpiece holder and convey the flexible workpiece to an unloading port configured to receive the flexible workpiece set. It further includes an unloader module. For example, in some embodiments as shown in FIG. 1, following processing, a workpiece holder 125 supporting the processed workpiece can be advanced to the unloader module 150 where each workpiece is unloaded, It is transferred to the unloading / output stage 152 and exits the electrochemical deposition system 100. After being unloaded, workpiece holder 125 can return to loader module 110 along return path 155 (see PH return path in FIG. 1) to receive another workpiece. It should be noted that multiple workpiece holders can be used, with some workpiece holders held in the storage buffer. A more detailed description of an example workpiece holder can be found in US Patent Application No. 15 / 193,595, filed June 27, 2016, which is incorporated herein by reference in its entirety. A more detailed description of an example workpiece loader module can be found in US patent application Ser. No. 15 / 193,890, filed Jun. 27, 2016, which is incorporated herein by reference in its entirety.

  Electrochemical deposition system 100 further includes a chemical management system 160 for managing the processing fluid in one or more processing cells, ie, modules 120, 130, 132, 134, 136, 138, 140. Chemical controls may include, but are not limited to, supply, refill, charge, heat, cool, circulate, recycle, store, monitor, discharge, reduce, and the like. Additionally, the electrochemical deposition system 100 includes an electrical management system 170 for controlling the operability of the electrochemical deposition system 100. Electrical controls may include, but are not limited to, scheduling, coordination, monitoring, coordination, communication, and the like. For example, the electrical management system 170 may control the movement of the workpiece through the electrochemical deposition system 100 or the chemical composition, temperature, etc. of the plurality of modules 120, 130, 132, 134, 136, 138, 140. Signals may be sent and received according to computer coding instructions to control chemical properties such as flow rates. In addition, the electrical management system 170 can be configured to apply current to the opposite flat surface of one or both of the flexible workpieces when held within a given electrochemical deposition module . By doing so, one or both opposite surfaces can be plated with metal and the blind holes and / or through holes are filled with metal.

  Turning now to FIG. 2A, a diagram of an electrochemical deposition module having a plurality of ECD cells according to another embodiment is shown. As shown, FIG. 2A shows an anolyte reservoir 230 configured to receive a volume of anolyte fluid 232, a plurality of cathode compartments configured to receive a volume of catholyte fluid, and an anode. A top view of the membrane separating liquid fluid 232 from the plurality of cathode compartments 200 is shown. Anolyte reservoir 230 includes an anolyte reservoir containing anolyte fluid 232, in which a plurality of cathode compartments 200 are located. Anolyte reservoir 230 may include anolyte supply and storage reservoir 262, in which case the anolyte is recirculated, replenished, and / or reconditioned, and then anolyte using anolyte pump system 264. It may be replaced with reservoir 230. Additionally, the anolyte reservoir 230 may include a catholyte supply and storage reservoir 266, in which case the catholyte is recirculated, replenished, and / or reconditioned, and then using the catholyte pump system 268. Multiple cathode compartments 200 may be replaced. A chemical management system 260 interfaces with the anolyte supply and storage reservoir 262 and the catholyte supply and storage reservoir 266 to, among other things, fluid level, chemical composition, chemical quality, chemical temperature, chemical dosing. Etc can be managed. For example, the chemical management system 260 may include the addition or replacement of water, acids, anion solutions, cation solutions, chelating agents, complexing agents, leveling agents, accelerators or moderators, etc. Or the catholyte can be recovered.

  According to some embodiments, the workpiece W can include a flexible rectangular substrate having dimensions ranging in size from approximately 50 cm × 50 cm to 100 cm × 100 cm. As a result, the fluid depth within the anolyte reservoir 230 may range in depth from 90 cm to 150 cm, and the width of the anolyte reservoir 230 may range from 90 cm to 150 cm. Each ECD module may be designed to be relatively narrow, for example, its width may be designed to be less than 20 cm anode to anode or less than 20 cm anode to cathode. As a result, multiple cathode compartments 200 (ECD modules) can be placed in the anolyte reservoir over a range of lengths up to 120 cm. By immersing or partially immersing the plurality of cathode compartments 200 in the anolyte reservoir 230, efficient use of space is possible. Thus, among the many of the present embodiments, one advantage is that the container of the anolyte fluid 232 is single and the simplified chemical and fluid management system provides multiple ECD modules in an economical arrangement. And it saves consumption of equipment, chemistry and factory footprint.

  FIG. 2B shows a top view of the cathode compartment 200 positioned between opposing anode assemblies 240, 241. A workpiece holder 215 containing a workpiece W is positioned in the frame 210, which frame ECD affects the uniformity of the electric field and fluid flow field at the surface of the workpiece W. It is advantageously and repeatably positioned within plus or minus 0.1 to 1.0 mm, preferably within plus or minus 0.5 mm, relative to the other critical elements of the module. The cathode compartment 200 can include field shaping elements 201, 204 located approximately between 3 and 10 mm of the surface of the workpiece W, preferably 4 mm from the surface of the workpiece W. The cathode compartment 200 can further include fluid stirring elements 202, 205 positioned proximate to the surface of the workpiece W, preferably within 10 mm of the surface of the workpiece W.

  An ion exchange membrane 203, 206 defines the boundary between the cathode compartment 200 and the anode compartment containing the opposite anode assembly 240, 241, and anolyte fluid 232 in the anode compartment and the cathode in the cathode compartment 200. A separation between liquid 220 is performed. One advantage, among others, is the compact geometry provided by defining the boundary between the anolyte fluid 232 and the catholyte 220, in which case the anolyte fluid 232 and the catholyte 220 are in operation. It is not necessary to incorporate large-scaled wall structures to accommodate the hydrostatic pressure of the catholyte for each workpiece W.

  Each opposing anode assembly 240, 241 can include a multi-zone anode 242, eg, an anode disposed as a radial ring, or an anode disposed on a grid, eg, in an orthogonal direction. In the present embodiment, two opposing anode assemblies 240, 241 are shown facing the cathode compartment. However, in other embodiments, a single anode assembly may face the cathode compartment.

  FIG. 3 shows a detailed cross-sectional view of an ECD module according to one embodiment. A workpiece holder 315 positions the workpiece W between the field shaping elements 330, the fluid stirring elements 310, the ion exchange membrane 325 held by the support structure 320, and the anode assembly 340 holding the anodes 342. As shown, the field shaping element 330 extends proximate to the exposed surface of the workpiece W and is configured to improve the uniformity of the deposition process. In addition, as shown, the fluid agitation element 310 extends close to the exposed surface of the workpiece W to increase shear of the fluid near the exposed surface of the workpiece W, as well as mass, momentum, and Configured to increase heat transfer.

  FIG. 4 shows a perspective view of an electrochemical deposition system according to yet another embodiment. The electrochemical deposition system 500 includes a loader module 510 and an unloader module 550, with a plurality of processing modules 520, 530, 540 disposed therebetween. Processing module 520 may include a pretreatment module, such as a pre-rinse module. Processing module 530 may include an electrochemical deposition module. The processing module 540 may also include post-processing modules, such as a rinse module and a drying module. Although the loader module 510 and the unloader module 550 are shown at the distal end of the electrochemical deposition system 500, these loading and unloading modules are placed close to the same end of the overall system May be done. The workpiece W may be loaded into the workpiece holder 525, translated by the workpiece transfer system 560, and oriented such that it may be positioned within the plurality of processing modules 520, 530, 540.

  The system herein can be used to efficiently use the plating solution to produce an electrochemical deposition system having a relatively small footprint compared to conventional deposition systems. For example, each electrochemical deposition module can be configured to hold less than about 30 liters of plating solution. In some embodiments, the common platform can include less than about 16 electrochemical deposition modules and can be configured to plate 100 flexible workpieces per hour. A common platform can span floor space less than about 250 square feet. Thus, the systems herein can provide relatively high throughput using relatively small systems and using relatively little plating solution per workpiece.

  In the foregoing description, specific details are set forth such as the specific geometry of the processing system, as well as descriptions of various components and processes used therein. However, the techniques herein may be practiced in other embodiments that depart from these specific details, and such details are for the purpose of description and not limitation. I want you to understand. Embodiments disclosed herein are described with reference to the accompanying drawings. Similarly, for purposes of explanation, specific numbers, materials, and configurations are set forth in order to provide a thorough understanding. Nevertheless, embodiments may be practiced without such specific details. Components having substantially the same functional structure are represented by the same reference numerals, and thus redundant descriptions may be omitted.

  Various techniques are described as separate steps in order to aid in the understanding of the various embodiments. The order of description should not be construed as implying that these steps necessarily depend on the order. In fact, these steps need not be performed in the order presented. The described steps may be performed in a different order than the described embodiments. Various additional steps may be performed and / or the described steps may be omitted in additional embodiments.

  As used herein, "substrate" or "target substrate" generally refers to an object to be treated in accordance with the present invention. The substrate may comprise any material portion or structure of a device, in particular a semiconductor device or other electronic device, for example a semiconductor wafer, a base substrate structure such as a reticle, or on or over a base substrate structure Can be a layer such as a thin film. Thus, the substrate is not limited to any particular base structure, underlying layer, or underlying layer that is patterned or unpatterned, and any such layer or base structure, And any combination of layers and / or base structures is contemplated. Although this description may refer to a particular type of substrate, this is for illustrative purposes only.

  Those skilled in the art will also appreciate that many variations of the above described process steps can be used to achieve the same objectives as the present invention. Such variations are intended to be covered by the scope of the present disclosure. Accordingly, the foregoing description of the embodiments of the present invention is not intended to be limiting. Instead, any limitations to the embodiments of the invention are presented in the appended claims.

100 Electrochemical Deposition System
110 loader module
112 Load / input stage
115 Process Route
120 preprocessing module
125 Workpiece holder
130 processing modules
132 processing modules
134 processing modules
136 processing modules
138 processing modules
140 post processing module
150 Unloader module
152 Unload / Output Stage
155 return route
160 Chemical Management System
170 Electrical Management System
200 cathode compartment
201 Field shaping element
202 Fluid Stirring Element
203 Ion exchange membrane
204 Field shaping element
205 Fluid Stirring Element
206 Ion exchange membrane
210 frames
215 Workpiece holder
220 catholyte
230 Anolyte Reservoir
232 Anolyte Fluid
240 anode assembly
241 anode assembly
242 multi-zone anode
260 Chemical Management System
262 Anolyte Supply and Storage Reservoir
264 Anolyte Pump System
266 Catholyte Supply and Storage Reservoir
268 Catholyte Pump System
310 Fluid Stirring Element
315 Workpiece holder
320 Support structure
325 Ion exchange membrane
330 Field shaping element
340 anode assembly
342 anode
500 Electrochemical Deposition System
510 Loader module
520 processing module
525 work piece holder
530 processing module
540 processing modules
550 Unloader Module
560 Workpiece Transfer System
W work piece

Claims (16)

Two or more electrochemical deposition modules disposed on a common platform and configured to deposit one or more metals on the substrate, each electrochemical deposition module comprising
An anode compartment configured to contain a volume of anolyte fluid,
A cathode compartment configured to contain a volume of catholyte fluid,
The two or more electrochemical deposition modules comprising
A loading port configured to receive the flexible workpiece set;
A flexible workpiece is received from the loading port and held in the workpiece holder while the flexible workpiece is held using an air cushion against each opposing flat surface of the flexible workpiece. A loader module configured to position,
The workpiece holder has a header member separating the first leg member and the second leg member, and opposite edges of the flexible workpiece are the first leg member and the second leg. A member configured to be held by a clamping mechanism between the members, the flexible workpiece when the clamping mechanism is held by the workpiece holder on opposite flat sides of the flexible workpiece Said loader module applying to the pieces an electrical contact surrounded by an elastomeric seal, and wherein said holder is configured to expose both sides of said workpiece to a plating solution;
Transport configured to transport a flexible workpiece from the loader module to a given electrochemical deposition module by a workpiece holder and to lower a given workpiece into the given electrochemical deposition module Mechanism,
Configured to apply a current to each opposite flat surface of the flexible workpiece when held within the given electrochemical deposition module such that each opposite flat surface is plated with metal The electrical system,
An unloader module configured to remove the flexible workpiece from the workpiece holder and to transport the flexible workpiece to an unloading port configured to receive the flexible workpiece set An electrochemical deposition system comprising:   The electrochemical deposition system according to claim 1, wherein the loading port and the unloading port are located at different positions of the electrochemical deposition system.   The electrochemical deposition system of claim 2, wherein the transport mechanism is configured to return the workpiece holder from the unloader module to the loader module.   The electrochemical deposition system according to claim 2, wherein the loading port and the unloading port are located at opposite ends of the electrochemical deposition system.   Coupled to one or more electrochemical deposition modules, one or more of at least one of the one or more electrochemical deposition modules to deposit the one or more metals The electrochemical deposition system according to claim 1, comprising a chemical management system configured to supply the metal component of   6. The electrochemical deposition system of claim 5, wherein the chemical management system comprises a helical conveyor for transporting metal powder to a metal supply system. The electrochemical deposition system of claim 1, further comprising a membrane that separates the anode compartment from the cathode compartment.   The electrochemical deposition system of claim 1, wherein each of the electrochemical deposition modules includes a stirring member configured to stir the plating solution on opposite sides of the flexible workpiece.   When the flexible workpieces are positioned within the given electrochemical deposition module, each opposing flat surface of the flexible workpieces faces the anode, and each flexible workpiece is filled with metal The electrochemical deposition system of claim 1, defining a through hole to be formed.   The electrochemical deposition system of claim 1, wherein each electrochemical deposition module is configured to hold less than 30 liters of the plating solution.   The electrochemical deposition system of claim 1, wherein the clamping mechanism comprises an elastic member that provides a clamping force on opposite flat surfaces of the flexible workpiece.   The electrochemical deposition system of claim 11, comprising an air bladder configured to open the clamping mechanism when inflated.   The electrochemical deposition system of claim 1, wherein the common platform includes less than 16 machines of the electrochemical deposition module and is configured to plate 100 flexible workpieces per hour.   The electrochemical deposition system of claim 13, wherein the common platform spans a floor area of less than 250 square feet. Two or more electrochemical deposition modules disposed on a common platform and configured to deposit one or more metals on the substrate, each electrochemical deposition module comprising
The two or more electrochemical deposition modules comprising a plating solution compartment configured to contain a volume of plating solution;
A loading port configured to receive a workpiece set;
A loader module configured to receive a workpiece from the loading port and position the workpiece in a workpiece holder while holding the workpiece against each opposite flat surface of the workpiece using an air cushion And
The workpiece holder has a header member separating the first leg member and the second leg member, and opposite edges of the workpiece are formed by the first leg member and the second leg member. In between, adapted to be held by a clamping mechanism, said clamping mechanism being surrounded on both opposite flat sides of said workpiece by an elastomeric seal against said workpiece when held by said workpiece holder Applying the electrical contacts, and the holder is configured to expose both sides of the workpiece to the plating solution;
A transport mechanism configured to transport workpieces from the loader module to a given electrochemical deposition module by a workpiece holder and to lower a given workpiece into the given electrochemical deposition module;
Each opposite flat surface is plated with metal or one opposite flat surface is plated with metal on each opposite flat surface of the workpiece when held in the given electrochemical deposition module Electrical system, configured to apply a current, and
An electrochemical deposition system comprising: an unloader module configured to remove the workpiece from the workpiece holder and to carry the workpiece to an unloading port configured to receive the set of workpieces.   16. The electrochemical deposition system of claim 15, wherein the anode and the workpiece contact the same plating solution.