CN109712919A - A kind of device for wafer filling glass powder - Google Patents
A kind of device for wafer filling glass powder Download PDFInfo
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- CN109712919A CN109712919A CN201910117921.9A CN201910117921A CN109712919A CN 109712919 A CN109712919 A CN 109712919A CN 201910117921 A CN201910117921 A CN 201910117921A CN 109712919 A CN109712919 A CN 109712919A
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- Prior art keywords
- feeding
- scraper
- wafer
- glass powder
- cylinder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
- B65G53/04—Conveying materials in bulk pneumatically through pipes or tubes; Air slides
- B65G53/24—Gas suction systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
A kind of device for wafer filling glass powder, belongs to production of electronic components equipment technical field.It is characterized by comprising bearing device, feeding device (5) and the scrapers (6) for support wafer, feeding device (5) and scraper (6) are arranged on the upside of bearing device, feeding portion is installed on the downside of feeding device (5) and drives feeding portion mobile, scraper (43) is installed on the downside of scraper (6) and drives scraper (43) mobile.This is that glass powder is uniformly placed on wafer by the feeding device of the device of wafer filling glass powder by feeding portion, scraper is removed glass powder extra on wafer by scraper, guarantee that the amount of the glass powder on wafer is moderate, the problem of it is excessive to avoid the occurrence of glass powder, makes post-production complex process, additionally it is possible to avoid the non-uniform problem of glass powder point, glass powder brushing-stroke velocity is fast, brushing quality is stablized, and improves the qualification rate of electronic component, and reduce the production cost of product.
Description
Technical field
A kind of device for wafer filling glass powder, belongs to production of electronic components equipment technical field.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC products for having specific electrical functionality.?
During by wafer production electronic component, the brushing glass powder on wafer is needed, it after dicing can be in chip with guarantee
Side formed glassivation.
Brushing glass powder is manually mixed glass powder with water, then by manually carrying out mostly on wafer at present
Mixed glass powder is brushed on wafer.But the speed of this method brushing is lower, to affect the production of product
Speed, the high production cost of product, and the quality of glass powder brushing depend on the labour capacity of worker, the stability of brushing compared with
Difference causes the qualification rate of electronic component low, further improves the production cost of product.
Summary of the invention
The technical problem to be solved by the present invention is overcoming the deficiencies of the prior art and provide one kind can apply automatically for wafer
Brush glass powder, and the stable device for wafer filling glass powder of brushing quality.
The technical solution adopted by the present invention to solve the technical problems is: it should be the device of wafer filling glass powder, it is special
Sign is: including the bearing device, feeding device and scraper for support wafer, feeding device and scraper are all provided with
It sets on the upside of bearing device, feeding portion is installed on the downside of feeding device and drives feeding portion mobile, the downside peace of scraper
Equipped with scraper and drive scraper mobile.
Preferably, the feeding portion includes feeding pipe, suction bar and feeding cylinder, and feeding is protruded into one end of suction bar
It in pipe, is slidingly and sealingly connected between suction bar and feeding pipe, feeding pipe is mounted on feeding device, and feeding cylinder is mounted on
Expect on device, feeding cylinder is connected with suction bar and drives its axial movement.
Preferably, the feeding pipe is vertically arranged, and the outer diameter of feeding pipe lower end is less than the outer diameter at middle part, and in feeding pipe
Lower end forms suction portion.
Preferably, the feeding device includes feeding translating device and material loading lifting device, material loading lifting device installation
On feeding translating device, feeding portion is arranged on material loading lifting device.
Preferably, the scraper is mounted on scraper by doctor blade holder, and the top of scraper and doctor blade holder sliding connect
It connects, buffer spring is provided between scraper and doctor blade holder.
Preferably, it is fixed with scraper clamping plate on the upside of the scraper, the both ends of scraper clamping plate are symmetrically arranged with mounting pin, scrape
The two sides of knife rest are provided with the installation long hole matched with the mounting pin of respective side, and the top of scraper clamping plate is slidably arranged in scraper
In frame, buffer spring is arranged between scraper clamping plate and doctor blade holder.
Preferably, the two sides of the scraper clamping plate are arranged with doctor blade holder interval.
Preferably, the side of the scraper is provided with V-arrangement knife, the opening up setting of V-arrangement knife, and V-arrangement knife and scraper
It is vertically arranged.
Preferably, the bearing device includes feeding bearing device and scraper bearing device, and feeding device is arranged upper
Expect the upside of bearing device, the downside of scraper bearing device is arranged in scraper.
Preferably, the feeding bearing device includes pallet and feeding rotating electric machine, and pallet is horizontally disposed, feeding rotation
Rotating motor is connected with pallet and drives its rotation, and multiple absorption slots are provided on the upside of pallet, draws slot and is connected with pumping negative pressure device.
Preferably, the feeding bearing device further includes feeding pallet lift cylinder, and pallet includes the fixed part of annular
And the lifting unit with fixed part coaxial arrangement, the piston rod of feeding pallet lift cylinder are arranged on the downside of lifting unit, upper material torr
The piston rod of disk lifting cylinder is connected with lifting unit and pushes its lifting.
Compared with prior art, the present invention has the beneficial effects that
1, this is that glass powder is uniformly placed on wafer by the feeding device of the device of wafer filling glass powder by feeding portion,
Scraper is removed glass powder extra on wafer by scraper, and the amount so as to guarantee the glass powder on wafer is moderate,
The problem of it is excessive to avoid the occurrence of glass powder, makes post-production complex process, additionally it is possible to avoid the non-uniform problem of glass powder point, glass
Glass powder brushing-stroke velocity is fast, and the quality brushed is stablized, and improves the qualification rate of electronic component, and reduce being produced into for product
This.
2, feeding cylinder drives the axial movement of feeding bar, to glass powder is drawn in feeding pipe, and can be by feeding
Glass powder in pipe is uniformly transferred on wafer, and feeding is convenient, and the amount of feeding is easily controllable, avoids the glass powder mistake brushed
It is more.
3, feeding pipe lower end is provided with feeding portion, can either facilitate absorption glass powder, but can facilitate glass powder is accurate
Be placed on wafer.
4, material loading lifting device drives the lifting of suction portion, and feeding translation mechanism drives material loading lifting device translation, thus side
Just feeding portion completes glass powder being transported to the movement on wafer, flexible movements.
5, it is provided with buffer spring between scraper and doctor blade holder, can guarantee that scraper and wafer directly fit reliably, in turn
Guarantee to shave the extra glass powder on wafer, additionally it is possible to scraper be avoided to damage wafer.
6, buffer spring is arranged between scraper clamping plate and doctor blade holder, keeps scraper convenient for disassembly and assembly, the peace of scraper holder board ends
Dress pin is matched with the installation long hole of respective side, realizes the guiding to scraper.
7, scraper clamping plate two sides are arranged with doctor blade holder interval, make glass powder Shi Huiyu wafer of the scraper on scraping wafer
An acute angle is formed, avoids scraper is vertical with wafer from damaging wafer, additionally it is possible to guarantee to shave extra glass powder.
8, V-arrangement knife can be matched with scraper, the glass powder bonded on scraper be removed, and V-arrangement knife can be by removing
Glass powder focuses on middle part, facilitates the recycling and reusing of the glass powder of removing, reduces production cost.
9, feeding bearing device matches to realize with feeding device and uniformly send glass powder to wafer, scraper
It is matched with scraper bearing device, realizes and strike off glass powder extra on wafer, make between scraper and feeding device
Work do not interfere mutually, improve work efficiency.
10, it is provided with multiple absorption slots on pallet, wafer can be sucked by absorption slot and guarantees that wafer is smooth,
Facilitate and be uniformly placed into glass powder on wafer, pallet is connected with the feeding rotating electric machine for driving its rotation, so as to make
Wafer rotation, and then it is evenly distributed in the glass powder on wafer on wafer under the influence of centrifugal force.
11, feeding pallet lift cylinder is connected with lifting unit and lifting unit is pushed to go up and down, and facilitates the pick-and-place of wafer, also facilitates
Pallet matches the automatic transfer for realizing wafer with manipulator.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the device of wafer filling glass powder.
Fig. 2 is the schematic top plan view of the device of wafer filling glass powder.
Fig. 3 is the stereoscopic schematic diagram of wafer casket lifting device.
Fig. 4 is the stereoscopic schematic diagram of wafer casket.
Fig. 5 is the stereoscopic schematic diagram for feeding manipulator and the manipulator that discharges.
Fig. 6 is the stereoscopic schematic diagram of centering body.
Fig. 7 is the schematic front view of feeding device.
Fig. 8 is the main view schematic cross-sectional view of feeding pipe and suction bar cooperation.
Fig. 9 is the stereoscopic schematic diagram of glass powder agitating device and feeding bearing device.
Figure 10 is the partial enlarged view in Fig. 9 at A.
Figure 11 is the schematic front view of scraper.
Figure 12 is the stereoscopic schematic diagram of scraper and doctor blade holder.
Figure 13 is the left view schematic cross-sectional view of scraper and doctor blade holder cooperation.
Figure 14 is the scheme of installation of V-arrangement knife.
Figure 15 is the stereoscopic schematic diagram of scraper bearing device.
Figure 16 is the main view schematic cross-sectional view of pallet connecting tube.
In figure: 1, rack 2, warehouse for drying 3, charging manipulator 4, wafer casket 401, support slot 5, feeding device
6, scraper 7, conveyer belt 8, discharging manipulator 9, glass powder agitating device 10, feeding bearing device 11, V-arrangement
Knife 12, scraper bearing device 13, wafer casket lifting motor 14, wafer casket crane 15, wafer casket strut 16, into
Expect that pan carriage 17, manipulator translating rails 18, charging cylinder 19, wafer supporting plate 1901, resigning mouthful 20, discharging are flat
Move frame 21, discharging cylinder 22, centering lifting cylinder 23, centering cylinder 24, centering mould 25, feeding portal frame
26, feeding flat-removing air cyclinder 27, feeding lifting cylinder 28, feeding cylinder 29, feeding pipe 2901, suction portion 30, suction
Expect bar 31, feeding pallet lift cylinder 32, feeding rotating electric machine 33, pallet 3301, lifting unit 34, stirring cylinder
35, hopper 36, agitating shaft 37, stirring connecting rod 38, stirring block 39, scraper portal frame 40, scraper flat-removing air cyclinder
41, scraper lifting cylinder 42, doctor blade holder 4201, installation long hole 43, scraper 44, scraper clamping plate 45, mounting pin
46, baffle 47, scraper rotating electric machine 48, scraper pallet lift cylinder 49, pallet connecting tube 50, to female connector 51,
Drive sleeve 52, buffer spring.
Specific embodiment
Fig. 1 ~ 16 are highly preferred embodiment of the present invention, and 1 ~ 16 the present invention will be further described with reference to the accompanying drawing.
A kind of device for wafer filling glass powder, including for support wafer bearing device, feeding device 5 and scrape
Expect that device 6, feeding device 5 and scraper 6 are arranged on the upside of bearing device, the downside of feeding device 5 is provided with feeding portion
And driving feeding portion mobile, the downside of scraper 6 is equipped with scraper 43 and drives scraper 43 mobile.This is wafer filling glass
Glass powder is uniformly placed on wafer by the feeding device 5 of the device of powder by feeding portion, and scraper 6 will by scraper 43
Extra glass powder is removed on wafer, and the amount so as to guarantee the glass powder on wafer is moderate, and it is excessive to avoid the occurrence of glass powder,
The problem of making post-production complex process, additionally it is possible to avoid the non-uniform problem of glass powder point, glass powder brushing-stroke velocity is fast, and applies
The quality of brush is stablized, and improves the qualification rate of electronic component, and reduce the production cost of product.
The present invention will be further described combined with specific embodiments below, however persons familiar with the art it is to be appreciated that
Here in connection with the detailed description that attached drawing provides be in order to preferably explain, structure of the invention necessarily have exceeded it is limited these
Embodiment, and for some equivalents or common approach, it is no longer described in detail herein, but still fall within the guarantor of the application
Protect range.
Specific: as shown in Figure 1 and 2: feeding device 5 is mounted on 1 upside of rack, scraper 6 by feeding portal frame 25
It is mounted on 1 upside of rack by scraper portal frame 39, feeding portal frame 25 is parallel with scraper portal frame 39 and interval is arranged.Support
Device includes feeding bearing device 10 and scraper bearing device 12, and feeding bearing device 10 and scraper bearing device 12 are installed in
1 upside of rack, and the underface of feeding device 5 is arranged in feeding bearing device 10, the setting of scraper bearing device 12 is filled in scraper
6 positive downside is set, so that the work of feeding device 5 and scraper 6 be separated, avoids feeding device 5 and scraper 6
Work mutually interferes, and improves work efficiency.
This for wafer filling glass powder device further include the wafer casket lifting device being mounted in rack 1, centralising device,
Glass powder agitating device 9, conveyer belt 7, charging manipulator 3, discharging manipulator 8 and warehouse for drying 2, wafer casket lifting device and defeated
The two sides for sending band 7 to be symmetricly set on rack 1, feeding portal frame 25 and the setting of scraper portal frame 39 are in wafer casket lifting device and defeated
Send between band 7, and wafer casket lifting device close to feeding portal frame 25 be arranged, centralising device setting wafer casket lifting device with
Between feeding portal frame 25, warehouse for drying 2 is located at outside the middle part of conveyer belt 7, and the upside of warehouse for drying 2 is provided with blast pipe, from
And hot wind can be sent into warehouse for drying 2, the wafer in warehouse for drying 2 is dried by hot wind, can also be arranged in warehouse for drying 2
Heating plate.The setting of manipulator 3 is fed in 25 side of feeding portal frame, the side of scraper portal frame 39 is arranged in the manipulator 8 that discharges,
To complete the movement of wafer transfer.The side of feeding bearing device 10 is arranged in glass powder agitating device 9, to facilitate feeding
Glass powder in glass powder agitating device 9 is delivered on the wafer on feeding bearing device 10 by device 5.
It is provided with wafer elevating cylinder on the downside of the input terminal of conveyer belt 7, the piston rod of wafer elevating cylinder is vertically set upward
It sets, wafer bracket is provided on the upside of wafer elevating cylinder, wafer is placed in wafer bracket by discharging manipulator 8, and is passed through
Wafer is placed on conveyer belt 7 by wafer elevating cylinder.
Be arranged side by side two of wafer casket lifting device are removably equipped with crystalline substance on the upside of each wafer casket lifting device
Circle casket 4, wafer are arranged in wafer casket 4, and two wafer casket lifting devices work alternatively, to realize continuous production.It is right
Middle device is used for the centering of wafer, guarantees that glass powder feeding is accurate, and charging manipulator 3 is used for wafer in wafer casket, to middle dress
It sets and is transported between feeding bearing device 10, discharging manipulator 8 is used for wafer in feeding bearing device 10, scraper bearing device
It is transported between 12 and conveyer belt 7, charging manipulator 3 and discharging manipulator 8 work independently, and improve work efficiency.
As shown in Figure 3: wafer casket lifting device includes wafer casket crane 14 and wafer casket lifting motor 13, rack 1
On be provided with vertical wafer casket riser guide, wafer casket crane 14 is slidably mounted on wafer casket riser guide, wafer casket
The upside of crane 14 is provided with more vertically arranged wafer casket struts 15, and the upside of wafer casket strut 15 is provided with wafer casket
Supporting plate, wafer casket 4 are detachably arranged on the upside of wafer casket supporting plate, and the middle and lower part of rack 1 is arranged in wafer casket crane 14, brilliant
Circle casket strut 15 is slidably connected with rack 1.The output shaft of wafer casket lifting motor 13 is upward and setting is in wafer casket crane 14
Downside, be rotatably equipped with lifting screw in rack 1, lifting screw is vertically arranged, and lifting screw and wafer casket lifting motor
13 output shaft is coaxially connected and keeps rotating synchronously, and is provided with the lifting matched with lifting screw on wafer casket crane 14
Nut facilitates the lifting of control wafer casket 4, and convenient accurate control is brilliant to realize the lifting of wafer casket crane 14
The distance that circle casket 4 is gone up and down.
As shown in Figure 4: wafer casket 4 is the open rectangular box body in front and rear sides, the spacing of the left and right sides of wafer casket 4
It is gradually increased from back to front, is arranged at intervals with multiple support slots 401, wafer casket 4 on the two sides inner wall of wafer casket 4 from the bottom to top
The corresponding support slot 401 in two sides matches support wafer.
As shown in Figure 5: the upside of rack 1 is provided with manipulator translating rails 17, and manipulator translating rails 17 are perpendicular to upper
Expect the plane setting where portal frame 25, and manipulator translating rails 17 are horizontally disposed there are two.Feed manipulator 3 and discharging machine
Tool hand 8 is slidably mounted on manipulator translating rails 17.
Feeding manipulator 3 includes charging pan carriage 16, charging cylinder 18 and wafer supporting plate 19, and charging pan carriage 16 is slided
Be mounted on manipulator translating rails 17, charging pan carriage 16 is connected with charging linear motor, the setting of charging linear motor into
Expect the downside of pan carriage 16, charging linear motor is connected with charging pan carriage 16 and drives its translation, and charging cylinder 18 is mounted on
The upside of pan carriage 16 is fed, and the piston rod for feeding cylinder 18 is arranged towards the side of wafer casket 4, feeds the piston of cylinder 18
Bar is vertically arranged with manipulator translating rails 17, and wafer supporting plate 19 is mounted on the piston rod of charging cylinder 18, to realize crystalline substance
Round pick-and-place.
The manipulator 8 that discharges includes discharging pan carriage 20, discharging cylinder 21 and wafer supporting plate 19, and discharging pan carriage 20 is slided
It is mounted on manipulator translating rails 17, discharging pan carriage 20 is connected with discharging linear motor, and the setting of discharging linear motor is going out
Expect the downside of pan carriage 20, discharging linear motor is connected with discharging pan carriage 20 and drives its translation, and discharging cylinder 21 is mounted on
The upside for the pan carriage 20 that discharges, and the piston rod of discharging cylinder 21 is arranged towards the side of conveyer belt 7, the piston of discharging cylinder 21
Bar is vertically arranged with manipulator translating rails 17, and wafer supporting plate 19 is mounted on the piston rod of discharging cylinder 21, to realize crystalline substance
Round pick-and-place.Charging pan carriage 16 is arranged in close to the side of conveyer belt 7 in discharging pan carriage 20.
Wafer supporting plate 19 is circle, and the side of wafer supporting plate 19 is provided with for the piston rod with charging cylinder 18 or goes out
Expect the connected interconnecting piece of the piston rod of cylinder 21, the upside of wafer supporting plate 19, which is provided with, draws hole, draws hole and is connected with pumping negative pressure
Device avoids wafer from being detached from wafer supporting plate 19 so that wafer is sucked.Pumping negative pressure device is vacuum pump.Wafer supporting plate 19 is separate
The side of manipulator translating rails 17 is provided with the resigning mouthful 1901 of middle part indent, and wafer is lifted off wafer supporting plate to facilitate
19, also facilitate wafer supporting plate 19 to draw wafer.
As shown in Figure 6: centralising device includes centering lifting cylinder 22, centering cylinder 23 and centering mould 24, centering lifting
Cylinder 22 is mounted in rack 1, and the piston rod of centering lifting cylinder 22 is vertically arranged upward, and centering cylinder 23 is mounted on centering
On the piston rod of lifting cylinder 22, centering cylinder 23 is vertically arranged, and centering mould 24 is mounted on centering cylinder 23, and centering mould 24 wraps
Two blocks of centering plates arranged side by side are included, the adjacent side of two centering plates is provided with the arc concave shape portion of middle part indent, centering gas
Cylinder 23 is connected with the centering plate of two sides simultaneously and pushes two centering plates are synchronous to move in the opposite direction, to complete pair of wafer
In, and then facilitate the processing of subsequent wafer.Centering cylinder 23 can realize using two cylinders, two cylinders respectively with it is corresponding
The centering plate of side is connected and centering plate is pushed to translate.
As shown in Fig. 7 ~ 8: feeding device 5 includes feeding translating device and material loading lifting device, the installation of feeding translating device
On feeding portal frame 25, material loading lifting device is slidably mounted on feeding portal frame 25, and feeding translating device and feeding are gone up and down
Device, which is connected, pushes it to translate along feeding portal frame 25, is provided with feeding portion on the downside of material loading lifting device.
Material loading lifting device includes feeding lifting cylinder 27 and feeding pan carriage, and the upside of feeding portal frame 25 is equipped with
Expect translating rails, feeding translating rails are perpendicular to manipulator translating rails 17 and are horizontally disposed with, and feeding pan carriage is slidably mounted on
On feeding translating rails, feeding translating device is feeding flat-removing air cyclinder 26, and feeding flat-removing air cyclinder 26 is parallel to feeding translating rails
Setting, the piston rod of feeding flat-removing air cyclinder 26 are connected with feeding pan carriage and push its translation.The piston of feeding lifting cylinder 27
Bar is vertically arranged downward, and material-taking rack is equipped on the piston rod of feeding lifting cylinder 27, and feeding portion is mounted on material-taking rack, thus
It realizes and is transferred to the glass powder in glass powder agitating device 9 on the wafer of 10 upside of feeding bearing device.
Feeding portion includes feeding cylinder 28, feeding pipe 29 and suction bar 30, and feeding cylinder 28 is mounted on material-taking rack simultaneously
With material-taking rack synchronization lifting, the piston rod of feeding cylinder 28 is arranged downward, and feeding pipe 29 is mounted vertically on material-taking rack, suction bar
30 lower end sliding is protruded into feeding pipe 29, is tightly connected between 29 inner wall of suction bar 30 and feeding pipe, the upper end of suction bar 30
It is connected with the piston rod of feeding cylinder 28 and with its synchronization lifting, so that glass is drawn in the cooperation by feeding pipe 29 and suction bar 30
Glass powder, also facilitates and glass powder is transferred on wafer.The outer diameter of the lower end of feeding pipe 29 is less than the outer diameter at middle part, thus in feeding
The lower end of pipe 29 forms suction portion 2901, that is, facilitates absorption glass powder, and facilitate glass powder being accurately transferred to wafer
Designated position.
As shown in Fig. 9 ~ 10: glass powder agitating device 9 includes stirring cylinder 34, hopper 35 and stirring block 38, hopper 35
For the semi-cylindrical that middle part is recessed, hopper 35 is horizontally disposed, and the upside of hopper 35 is equipped with agitating shaft 36, agitating shaft 36 and hopper
35 coaxial arrangements are simultaneously rotatablely connected with hopper 35, and the piston rod of stirring cylinder 34 is connected with agitating shaft 36 and pushes agitating shaft 36 past
Multiple rotation.The both ends of agitating shaft 36 are symmetrically arranged with stirring connecting rod 37, and stirring connecting rod 37 is arranged in hopper 35, stir connecting rod 37
One end is connected with agitating shaft 36 and the synchronous hunting with the rotation of agitating shaft 36, and the setting of stirring block 38 is in 35 bottom of hopper, stirring
The setting of block 38 is between two stirring connecting rods 37, and the two sides of stirring block 38 are fixedly connected with the stirring connecting rod 37 of respective side respectively,
To be stirred by stirring block 38 to glass powder.Since glass powder is not soluble in water, 38 moment of stirring block is to glass powder
Stirring, the bottom for avoiding glass powder from being settled down to water causes glass powder to mix with water unevenly.
The side of stirring block 38 is provided with the material taking mouth of middle part indent, when stirring block 38 is rocked to close to feeding bearing device
When 10 side, the material taking mouth of stirring block 38 upward, to facilitate the feeding action of feeding pipe 29, also facilitates control glass just
The amount of glass powder.
Feeding bearing device 10 includes feeding pallet lift cylinder 31, feeding rotating electric machine 32 and pallet 33, upper material torr
The piston rod of disk lifting cylinder 31 is mounted vertically in upward in rack 1, and feeding rotating electric machine 32 is mounted on feeding pallet lift gas
In the rack 1 of 31 side of cylinder, the upside of rack 1 is equipped with blocking cylinder, and blocking cylinder is vertically arranged cylinder, and blocking cylinder is upper
The open setting in end, the diameter of blocking cylinder are greater than the diameter of pallet 33, and pallet 33 is rotatably arranged in blocking cylinder.Feeding pallet lift
The underface of pallet 33 is arranged in cylinder 31, and the piston rod of feeding pallet lift cylinder 31 passes through pallet connecting tube 49 and pallet 33
It is connected and pallet 33 is pushed to go up and down, pallet connecting tube 49 is connect with the piston rod rotation of feeding pallet lift cylinder 31, feeding rotation
Rotating motor 32 is connected by synchronous belt with pallet connecting tube 49, to realize the rotation of pallet 33, can pass through centrifugal force
Effect will be such that glass powder is evenly distributed in whole wafer, and blocking cylinder plays the role of stopping glass powder.
Pallet 33 includes that the fixed part of annular and the lifting unit 3301 with fixed part coaxial arrangement, lifting unit 3301 are arranged
The disk completed, the piston rod and lifting unit of feeding pallet lift cylinder 31 are encircled into fixed part, and with fixed part
3301 are connected and push its lifting, to match with wafer supporting plate 19, realize that the feeding of wafer is sent out.The upside of pallet 33 is set
It is equipped with absorption slot, slot setting is drawn in 33 upside of pallet, draws slot and be connected with pumping negative pressure device, so as to which wafer is sucked,
It can also will guarantee the smooth expansion of wafer.Pumping negative pressure device is vacuum pump.
It is as shown in figure 11: scraper 6 include scraper flat-removing air cyclinder 40, scraper lifting cylinder 41, scraper pan carriage and
Scraper crane is provided with scraper translating rails on the upside of scraper portal frame 39, and scraper translating rails are parallel to feeding translating rails
Setting, scraper pan carriage are slidably mounted on scraper translating rails, and scraper flat-removing air cyclinder 40 is mounted on scraper portal frame 39, is scraped
The piston rod of material flat-removing air cyclinder 40 is connected with scraper pan carriage and pushes its translation, and scraper lifting cylinder 41 is mounted vertically in scraper
In pan carriage, the piston rod of scraper lifting cylinder 41 is arranged downward, scraper crane be mounted on scraper lifting cylinder 41 and with
41 synchronization lifting of scraper lifting cylinder, scraper 43 are mounted on the downside of scraper crane, thus by glass powder extra on wafer
Extension.
As shown in Figure 12 ~ 13: scraper 43 is mounted on scraper clamping plate 44, and scraper clamping plate 44 is mounted on by doctor blade holder 42 and is scraped
Expect on crane, scraper 43 is vertically arranged with scraper translating rails.Doctor blade holder 42 is the rectangular box of downside opening, scraper holder
The upside of plate 44 is protruded into doctor blade holder 42 and is slidably connected with doctor blade holder 42, and the both ends of scraper clamping plate 44 are symmetrically arranged with mounting pin
45, the two sides of doctor blade holder 42 are provided with the installation long hole 4201 matched with the mounting pin 45 of respective side, and installation long hole 4201 is perpendicular
To setting, so that the lifting to scraper clamping plate 44 is oriented to, it is provided with buffer spring 52 between scraper clamping plate 44 and doctor blade holder 42, delays
It rushes spring 52 and is in compressive state, and buffer spring 52 is arranged in doctor blade holder 42, to guarantee scraper 43 to the pressure of wafer
Stablize, avoids damage wafer.
The two sides of scraper clamping plate 44 side corresponding with doctor blade holder 42 interval be arranged, and the side of scraper clamping plate 44 with scrape
Baffle 46 is installed, baffle 46 is fixedly connected with doctor blade holder 42, and scraper clamping plate 44 is upper close to 46 side of baffle between knife rest 42
Side is the arc of middle part evagination, so as to guarantee that scraper 43 and wafer are at an acute angle when scraping glass powder, guarantees scraping
Glass powder is reliable, and avoids damage wafer.The lower end that the side of baffle 46 is arranged in doctor blade holder 42 is arranged lower than the other side, to keep away
Exempt to counteract the swing of scraper 43.
As shown in figure 14: the side of scraper portal frame 39 is provided with V-arrangement knife 11, the opening up setting of V-arrangement knife 11, and V
Shape knife is vertically arranged with scraper 43, and scraper 43 is arranged in close to the side of baffle 46, when scraper 43 has scraped glass powder in V-arrangement knife 11
When, glass powder can be stained on scraper 43, scraper 6 drives scraper 43 to fit with V-arrangement knife 11 at this time, then drives scraper again
43 rise, so that the glass powder that the glass powder on scraper 43 is scraped, and scraped by V-arrangement knife 11 can converge in V-arrangement knife 11
Middle part, the collection of the glass powder conveniently scraped realize the recycling of extra glass powder, save raw material, reduce production
Cost.
As shown in figure 15: scraper bearing device 12 includes scraper pallet lift cylinder 48, scraper rotating electric machine 47 and support
The piston rod of disk 33, scraper pallet lift cylinder 48 is mounted vertically in upward in rack 1, and scraper rotating electric machine 47 is mounted on scraper
In the rack 1 of 48 side of pallet lift cylinder, the underface of pallet 33, scraper pallet liter is arranged in scraper pallet lift cylinder 48
The piston rod of sending down abnormally ascending cylinder 48 by pallet connecting tube 49 be connected with pallet 33 and push pallet 33 lifting, pallet connecting tube 49 with scrape
The piston rod rotation of material torr disk lifting cylinder 48 connects, and scraper rotating electric machine 47 is connected by synchronous belt with pallet connecting tube 49,
To realize the rotation of pallet 33, scraper pallet lift cylinder 48 pushes the lifting unit 3301 of pallet 33 to go up and down, thus with crystalline substance
Circle supporting plate 19 matches realization and picks and places wafer.It is provided with the sensor for detecting wafer position on scraper portal frame 39, senses
Device detects the relative position of slot and scraper 43 on wafer, and drives wafer rotation by scraper rotating electric machine 47, to make crystalline substance
The angle of round slot and scraper 43 is 45 °, avoids scraper 43 from protruding into the slot of wafer, leads to glass powder lack of fill, influence electricity
The qualification rate of subcomponent.
As shown in figure 16: the upper end of pallet connecting tube 49 is connected with lifting unit 3301, and pallet connecting tube 49 and lifting unit
3301 absorption slot is connected, the lower end closed setting of pallet connecting tube 49.Docking is arranged with outside the lower part of pallet connecting tube 49
The outer wall interval of set 50, inner wall and pallet connecting tube 49 to female connector 50 is arranged, and connects to the upper and lower ends of female connector 50 and pallet
It is provided with sealing ring between adapter tube 49, so that pallet connects to negative pressure cavity is formed between female connector 50 and pallet connecting tube 49
The through-hole being connected with negative pressure cavity is provided on pipe 49, to being provided with the butt hole being connected with negative pressure cavity in female connector 50, thus
It is convenient to be connected with pumping negative pressure device, female connector 50 and pallet connecting tube 49 are rotatablely connected.The setting of two sides up and down to female connector 50
Have for the limit sleeve limited to female connector 50, thus avoid that relative displacement occurs between female connector 50 and pallet connecting tube 49,
Guarantee to sealed reliable between female connector 50 and pallet connecting tube 49.
Drive sleeve 51 is arranged with outside the top of pallet connecting tube 49, drive sleeve 51 is coaxially connected with pallet connecting tube 49 and protects
Synchronous rotation is held, drive sleeve 51 is for installing synchronous pulley.Drive sleeve 51 can slide axially with pallet connecting tube 49.
The above described is only a preferred embodiment of the present invention, being not that the invention has other forms of limitations, appoint
What those skilled in the art changed or be modified as possibly also with the technology contents of the disclosure above equivalent variations etc.
Imitate embodiment.But without departing from the technical solutions of the present invention, according to the technical essence of the invention to above embodiments institute
Any simple modification, equivalent variations and the remodeling made, still fall within the protection scope of technical solution of the present invention.
Claims (10)
1. a kind of device for wafer filling glass powder, it is characterised in that: including bearing device, the feeding dress for support wafer
(5) and scraper (6) are set, feeding device (5) and scraper (6) are arranged on the upside of bearing device, feeding device (5)
Downside feeding portion is installed and drives feeding portion mobile, scraper (43) is installed on the downside of scraper (6) and drives scraper
(43) mobile.
2. the device according to claim 1 for wafer filling glass powder, it is characterised in that: the feeding portion includes taking
Expects pipe (29), suction bar (30) and feeding cylinder (28), one end of suction bar (30) are protruded into feeding pipe (29), suction bar
(30) it is slidingly and sealingly connect between feeding pipe (29), feeding pipe (29) is mounted on feeding device (5), feeding cylinder (28)
It is mounted on feeding device (5), feeding cylinder (28) is connected with suction bar (30) and drives its axial movement.
3. the device according to claim 2 for wafer filling glass powder, it is characterised in that: the feeding pipe (29) is perpendicular
To setting, the outer diameter of feeding pipe (29) lower end is less than the outer diameter at middle part, and forms suction portion (2901) in feeding pipe (29) lower end.
4. the device according to claim 1 or 2 for wafer filling glass powder, it is characterised in that: the feeding device
It (5) include feeding translating device and material loading lifting device, material loading lifting device is mounted on feeding translating device, the setting of feeding portion
On material loading lifting device.
5. the device according to claim 1 for wafer filling glass powder, it is characterised in that: the scraper (43) passes through
Doctor blade holder (42) is mounted on scraper (6), and top and the doctor blade holder (42) of scraper (43) are slidably connected, scraper (43) with scrape
Buffer spring (52) are provided between knife rest (42).
6. the device according to claim 5 for wafer filling glass powder, it is characterised in that: on the upside of the scraper (43)
It is fixed with scraper clamping plate (44), the both ends of scraper clamping plate (44) are symmetrically arranged with mounting pin (45), and the two sides of doctor blade holder (42) are set
It is equipped with the installation long hole (4201) matched with the mounting pin of respective side (45), the top of scraper clamping plate (44), which is slidably arranged in, scrapes
In knife rest (42), buffer spring (52) is arranged between scraper clamping plate (44) and doctor blade holder (42).
7. the device according to claim 6 for wafer filling glass powder, it is characterised in that: the scraper clamping plate (44)
Two sides with doctor blade holder (42) be spaced be arranged.
8. the device according to claim 1 for wafer filling glass powder, it is characterised in that: the one of the scraper (43)
Side is provided with V-arrangement knife (11), the opening up setting of V-arrangement knife (11), and V-arrangement knife (11) is vertically arranged with scraper (43).
9. the device according to claim 1 for wafer filling glass powder, it is characterised in that: the bearing device includes
Feeding bearing device (10) and scraper bearing device (12), feeding device (5) are arranged in the upside of feeding bearing device (10), scrape
Expect device (6) setting in the downside of scraper bearing device (12).
10. the device according to claim 9 for wafer filling glass powder, it is characterised in that: the feeding support dress
Setting (10) includes pallet (33) and feeding rotating electric machine (32), and pallet (33) is horizontally disposed, feeding rotating electric machine (32) and support
Disk (33) is connected and drives its rotation, and multiple absorption slots are provided on the upside of pallet (33), draws slot and is connected with pumping negative pressure device.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910117921.9A CN109712919A (en) | 2019-02-15 | 2019-02-15 | A kind of device for wafer filling glass powder |
| US17/429,339 US20220013378A1 (en) | 2019-02-15 | 2020-02-14 | Apparatus for filling wafer with glass powder |
| KR1020217024730A KR102551148B1 (en) | 2019-02-15 | 2020-02-14 | Equipment for filling glass powder into wafers |
| PCT/CN2020/075300 WO2020164595A1 (en) | 2019-02-15 | 2020-02-14 | Apparatus for filling wafer with glass powder |
| EP20755131.8A EP3926666B1 (en) | 2019-02-15 | 2020-02-14 | Apparatus for filling wafer with glass powder |
| JP2021547402A JP7076650B2 (en) | 2019-02-15 | 2020-02-14 | Equipment for filling wafers with glass powder |
| JP2022080381A JP7300539B2 (en) | 2019-02-15 | 2022-05-16 | Equipment for filling wafers with glass powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910117921.9A CN109712919A (en) | 2019-02-15 | 2019-02-15 | A kind of device for wafer filling glass powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109712919A true CN109712919A (en) | 2019-05-03 |
Family
ID=66264457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910117921.9A Pending CN109712919A (en) | 2019-02-15 | 2019-02-15 | A kind of device for wafer filling glass powder |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220013378A1 (en) |
| EP (1) | EP3926666B1 (en) |
| JP (2) | JP7076650B2 (en) |
| KR (1) | KR102551148B1 (en) |
| CN (1) | CN109712919A (en) |
| WO (1) | WO2020164595A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020164595A1 (en) * | 2019-02-15 | 2020-08-20 | 山东才聚电子科技有限公司 | Apparatus for filling wafer with glass powder |
| CN112592073A (en) * | 2020-12-30 | 2021-04-02 | 惠州市宝斯特实业有限公司 | Mildew-proof powder coating equipment for glass |
| CN112864058A (en) * | 2021-03-04 | 2021-05-28 | 山东才聚电子科技有限公司 | Wafer glass powder wiping device |
| CN114446840A (en) * | 2022-04-08 | 2022-05-06 | 四川上特科技有限公司 | Wafer glass powder erasing device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116525488A (en) * | 2023-04-26 | 2023-08-01 | 华中科技大学 | Direct writing filling device for wafer channel |
| CN117393480B (en) * | 2023-10-16 | 2024-03-19 | 济南兰星电子有限公司 | Automatic glass paste wiping device for diode chip production |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020164595A1 (en) | 2020-08-20 |
| KR102551148B1 (en) | 2023-07-03 |
| EP3926666A1 (en) | 2021-12-22 |
| JP7300539B2 (en) | 2023-06-29 |
| KR20210110694A (en) | 2021-09-08 |
| EP3926666B1 (en) | 2023-03-29 |
| JP2022116078A (en) | 2022-08-09 |
| EP3926666A4 (en) | 2022-05-04 |
| JP2022517437A (en) | 2022-03-08 |
| US20220013378A1 (en) | 2022-01-13 |
| JP7076650B2 (en) | 2022-05-27 |
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