CN215551786U - Silicon wafer cleaning device of screen printing machine - Google Patents
Silicon wafer cleaning device of screen printing machine Download PDFInfo
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- CN215551786U CN215551786U CN202120883590.2U CN202120883590U CN215551786U CN 215551786 U CN215551786 U CN 215551786U CN 202120883590 U CN202120883590 U CN 202120883590U CN 215551786 U CN215551786 U CN 215551786U
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- silicon wafer
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Abstract
The utility model belongs to the technical field of screen printing machines, and particularly relates to a silicon wafer cleaning device for a screen printing machine, which comprises a machine body, wherein a mounting frame is arranged on the outer side of the machine body, a conveying belt for conveying is arranged on the inner side of the mounting frame, a supporting frame is fixedly connected to the top of the mounting frame, and a limiting component for limiting and a conveying component for conveying are arranged on the supporting frame; when removing dust to the silicon chip, can make it arrange in on the supporting disk, receive the location of first baffle, can make the silicon chip position stable, and the dust absorption pipe directly can be siphoned away the dust and the impurity of silicon chip, then start electric telescopic handle, shrink the supporting disk to the bottom of deflector, then the silicon chip can move along the deflector, then fall into and carry on the conveyer belt, and can spacing the position of silicon chip under the effect of a plurality of leading wheels, make the silicon chip transportation stable, the offset has been avoided appearing, the problem of the effect of leading-in the printer with the printing with the silicon chip is influenced.
Description
Technical Field
The utility model belongs to the technical field of screen printers, and particularly relates to a silicon wafer cleaning device of a screen printer.
Background
The screen printing machine is a machine for applying printing by using a screen printing plate, belongs to one type of printing machine, is a machine for printing characters and images, and is a general name of a machine or equipment for producing printed matters, belongs to a relatively representative printing device in the screen printing machine, is a device for printing silicon wafers, is usually realized by virtue of a rotatable feeding sucker in the feeding process of the existing silicon wafer printing machine, the sucker adsorbs one silicon wafer each time, the silicon wafer is driven by a rotating shaft to descend to be rotated above a conveying belt, and then the silicon wafer is placed on the conveying belt to enter an anode printing process.
SUMMERY OF THE UTILITY MODEL
At present when the printing machine uses, if it is inside that dust and impurity are transported to the printing machine to adhere to on the silicon chip surface, long-time the use, easily influence the effect of printing, some devices can blow to the silicon chip, detach the dust, but lead to the silicon chip to appear offset in the silicon chip transmission easily, the effect of leading-in the printing machine with the silicon chip and printing is influenced. The utility model provides a silicon wafer cleaning device of a screen printer, which has the characteristics of enabling the silicon wafer to be stably transported and avoiding the problems that the position deviation occurs, the silicon wafer is led into the printer and the printing effect is influenced.
The utility model provides the following technical scheme: the utility model provides a screen printing machine silicon chip cleaning device, includes the organism, the organism outside is equipped with the mounting bracket, the mounting bracket inboard is equipped with the conveyer belt that is used for the transmission, just mounting bracket top fixedly connected with support frame, be equipped with the conveying subassembly that is used for spacing subassembly and is used for carrying on the support frame, the conveying subassembly includes deflector, two first baffles and two second baffles, the deflector is fixed on the support frame, sealing connection has the dust absorption pipe that is used for the dust absorption on the support frame.
The limiting assembly comprises an electric telescopic rod and a supporting disk, the electric telescopic rod is fixed on the supporting frame, the supporting disk is fixed on the output end of the electric telescopic rod, and the supporting disk is located between the two first baffles.
The guide plate is provided with a through hole corresponding to the support disc, and the diameter of the through hole is larger than the outer diameter of the support disc.
The first baffle and the second baffle are fixed on two sides of the top of the guide plate, and the guide plate is obliquely arranged.
And a guide cavity is arranged between the two first baffles and the two second baffles.
The guide assembly comprises two connecting plates and a plurality of guide wheels, the two connecting plates are fixed on the guide plates, and the plurality of guide wheels are uniformly distributed on the inner sides of the two connecting plates.
The top of the connecting plate is fixedly connected with a plurality of fixing plates corresponding to the guide wheels, and the guide wheels are rotatably connected with the fixing plates through rotating shafts.
The dust suction pipe is positioned on the outer side of the guide plate and is positioned between the two first baffle plates.
The utility model has the beneficial effects that: through spacing subassembly and the conveying subassembly that sets up, when removing dust to the silicon chip, can make it arrange in on the supporting disk, receive the location of first baffle, can make the silicon chip position stable, and the dust absorption pipe directly can be siphoned away the dust and the impurity of silicon chip, then start electric telescopic handle, shrink the supporting disk to the bottom of deflector, then the silicon chip can move along the deflector, then carry on falling into on the conveyer belt, and can spacing the position of silicon chip under the effect of a plurality of leading wheels, make the silicon chip transportation stable, the offset has been avoided appearing, the problem of the effect of leading-in and printing with the silicon chip is influenced.
The parts of the device not involved are the same as or can be implemented using prior art.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a transfer module according to the present invention;
FIG. 3 is a schematic view of the structure of the guide plate according to the present invention;
FIG. 4 is a schematic view of a guide assembly according to the present invention;
in the figure: 1. a body; 2. a mounting frame; 21. a conveyor belt; 3. a support frame; 31. a dust collection pipe; 4. a limiting component; 41. an electric telescopic rod; 42. a support disc; 5. a transfer assembly; 51. a guide plate; 511. a through hole; 52. a first baffle plate; 53. a second baffle; 54. a guide cavity; 6. a guide assembly; 61. a connecting plate; 62. a guide wheel; 63. a fixing plate; 64. a rotating shaft.
Detailed Description
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a screen printing machine silicon chip cleaning device, including organism 1, 1 outside of organism is equipped with mounting bracket 2, 2 inboard conveyer belts 21 that are used for the transmission that are equipped with of mounting bracket, and 2 top fixedly connected with support frame 3 of mounting bracket, be equipped with on the support frame 3 and be used for spacing subassembly 4 and the conveying subassembly 5 that is used for carrying, conveying subassembly 5 includes deflector 51, two first baffles 52 and two second baffles 53, deflector 51 is fixed on support frame 3, sealing connection has the dust absorption pipe 31 that is used for the dust absorption on the support frame 3.
In this embodiment: when the silicon wafer cleaning device is used, the limiting component 4 for limiting and the conveying component 5 for conveying are arranged on the supporting frame 3, the supporting frame 3 plays a role in connection, the silicon wafer is placed on the supporting plate 42 and positioned by the first baffle plate 52, the position of the silicon wafer can be stabilized, the dust and impurities of the silicon wafer can be directly sucked away by the dust suction pipe 31, the dust suction pipe 31 can be connected with an external dust collector, the technology is the prior art, then the electric telescopic rod 41 is started, the supporting plate 42 is driven to be contracted to the bottom of the guide plate 51 through the through hole 511, the through hole 511 has enough space for the supporting plate 42 to pass through, the supporting plate 42 can be far away from the silicon wafer at the moment, the first baffle plate 52 and the second baffle plate 53 can limit the position of the silicon wafer, the silicon wafer can move along the guide plate 51 and then fall onto the conveying belt 21 for conveying, when the silicon wafer moves along the conveyor belt 21, the silicon wafer is limited by the second baffle 53 and can be positioned between the guide wheels 62, the position of the silicon wafer can be limited under the action of the guide wheels 62, the silicon wafer is stably transported, the problem that the effect of guiding the silicon wafer into the printer and printing is influenced due to position deviation is avoided, the silicon wafer is conveyed into the printer body 1 by the conveyor belt 21 through the feeding port of the printer body 1 to be printed, and the conveying principle is the prior art.
The limiting assembly 4 comprises an electric telescopic rod 41 and a supporting disc 42, the electric telescopic rod 41 is fixed on the supporting frame 3, the supporting disc 42 is fixed on the output end of the electric telescopic rod 41, the supporting disc 42 is positioned between the two first baffles 52, the guide plate 51 is provided with a through hole 511 corresponding to the supporting disc 42, and the diameter of the through hole 511 is larger than the outer diameter of the supporting disc 42; the silicon chip can be placed on the supporting disc 42, the electric telescopic rod 41 is started, the supporting disc 42 is contracted to the bottom of the guide plate 51 through the through hole 511, the through hole 511 has enough space for the supporting disc 42 to pass through, at the moment, the supporting disc 42 can be far away from the silicon chip, and then the silicon chip can move along the guide plate 51.
The two first baffle plates 52 and the two second baffle plates 53 are fixed on two sides of the top of the guide plate 51, the guide plate 51 is arranged in an inclined manner, and a guide cavity 54 is formed between the two first baffle plates 52 and the two second baffle plates 53; the first baffle plate 52 and the second baffle plate 53 can limit the position of the silicon wafer, the height of the first baffle plate 52 is larger than that of the second baffle plate 53, when the supporting plate 42 drives the silicon wafer to move, the first baffle plate 52 can sufficiently limit the silicon wafer, the guide plate 51 can facilitate the silicon wafer to move to the conveying belt 21 in the guide cavity 54, and the guide plate 51 can be made of Teflon and has good self-sliding property.
The guide assembly 6 comprises two connecting plates 61 and a plurality of guide wheels 62, the two connecting plates 61 are fixed on the guide plate 51, the guide wheels 62 are uniformly distributed on the inner sides of the two connecting plates 61, the top of the connecting plate 61 is fixedly connected with a plurality of fixing plates 63 corresponding to the guide wheels 62, and the guide wheels 62 are rotatably connected with the fixing plates 63 through rotating shafts 64; the connecting plate 61 is connected to the guide plate 51, so that the connecting plate 61 and the guide wheel 62 are not in contact with the conveyor belt 21, when the silicon wafer moves along the conveyor belt 21, the silicon wafer is limited by the second baffle 53 and can be positioned between the guide wheels 62, and the guide wheels 62 can rotate under the action of the rotating shaft 64, so that the silicon wafer can be stably limited in position.
The dust suction pipe 31 is positioned outside the guide plate 51, and the dust suction pipe 31 is positioned between the two first baffles 52; when the dust suction pipe 31 is used, the output end of the electric telescopic rod 41 is in an extending state, so that the supporting disc 42 can support a silicon wafer, the dust suction pipe 31 can be directly opposite to the silicon wafer, and the dust on the silicon wafer can be removed by the dust suction pipe 31.
The working principle and the using process of the utility model are as follows: when the silicon wafer cleaning device is used, the silicon wafer is placed on the supporting disc 42 and positioned by the first baffle plate 52, the position of the silicon wafer can be stabilized, dust and impurities of the silicon wafer can be directly sucked away by the dust suction pipe 31, the dust suction pipe 31 can be connected with an external dust collector, the technology is the prior art, then the electric telescopic rod 41 is started, the supporting disc 42 is driven to be contracted to the bottom of the guide plate 51 through the through hole 511, the through hole 511 has enough space for the supporting disc 42 to pass through, at the moment, the supporting disc 42 can be far away from the silicon wafer, the positions of the silicon wafer can be limited by the first baffle plate 52 and the second baffle plate 53, the silicon wafer can move along the guide plate 51 and then fall onto the conveyor belt 21 for conveying, when the silicon wafer moves along the conveyor belt 21 and is limited by the second baffle plate 53, the silicon wafer can be positioned between the guide wheels 62, the positions of the silicon wafer can be limited by the plurality of the guide wheels 62, the silicon wafer is stably transported, the problem that the effect of guiding the silicon wafer into the printer and printing is affected due to the fact that position deviation occurs is avoided, and the conveying belt 21 conveys the silicon wafer into the printer body 1 through the feeding port of the printer body 1 to perform printing processing.
Claims (8)
1. The utility model provides a screen printing machine silicon chip cleaning device which characterized in that: the conveyor belt conveyor comprises a conveyor body, the machine body outside is equipped with the mounting bracket, the mounting bracket inboard is equipped with the conveyer belt that is used for the transmission, just mounting bracket top fixedly connected with support frame, be equipped with the conveying subassembly that is used for spacing subassembly and is used for carrying on the support frame, the conveying subassembly includes deflector, two first baffles and two second baffles, the deflector is fixed on the support frame, sealing connection has the dust absorption pipe that is used for the dust absorption on the support frame.
2. The silicon wafer cleaning device for the screen printer according to claim 1, wherein: the limiting assembly comprises an electric telescopic rod and a supporting disk, the electric telescopic rod is fixed on the supporting frame, the supporting disk is fixed on the output end of the electric telescopic rod, and the supporting disk is located between the two first baffles.
3. The silicon wafer cleaning device for the screen printing machine according to claim 2, wherein: the guide plate is provided with a through hole corresponding to the supporting disc, and the diameter of the through hole is larger than the outer diameter of the supporting disc.
4. The silicon wafer cleaning device for the screen printer according to claim 1, wherein: the two first baffles and the two second baffles are fixed on two sides of the top of the guide plate, and the guide plate is obliquely arranged.
5. The silicon wafer cleaning device for the screen printer according to claim 1, wherein: a guide cavity is arranged between the two first baffles and the two second baffles.
6. The silicon wafer cleaning device for the screen printer according to claim 1, wherein: still include the direction subassembly, the direction subassembly includes two connecting plates and a plurality of leading wheel, two the connecting plate is all fixed on the deflector, a plurality of leading wheel evenly distributed is two the connecting plate is inboard.
7. The silicon wafer cleaning device for the screen printer according to claim 6, wherein: the top of the connecting plate is fixedly connected with a plurality of fixing plates corresponding to the guide wheels, and the guide wheels are rotatably connected with the fixing plates through rotating shafts.
8. The silicon wafer cleaning device for the screen printer according to claim 1, wherein: the dust collection pipe is located outside the guide plate, and the dust collection pipe is located between the two first baffles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120883590.2U CN215551786U (en) | 2021-04-27 | 2021-04-27 | Silicon wafer cleaning device of screen printing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120883590.2U CN215551786U (en) | 2021-04-27 | 2021-04-27 | Silicon wafer cleaning device of screen printing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215551786U true CN215551786U (en) | 2022-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120883590.2U Active CN215551786U (en) | 2021-04-27 | 2021-04-27 | Silicon wafer cleaning device of screen printing machine |
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| CN (1) | CN215551786U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114852660A (en) * | 2022-05-11 | 2022-08-05 | 昆山瑞源智能装备有限公司 | Pushing device convenient to adjust for six-color metal plate printing machine |
-
2021
- 2021-04-27 CN CN202120883590.2U patent/CN215551786U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114852660A (en) * | 2022-05-11 | 2022-08-05 | 昆山瑞源智能装备有限公司 | Pushing device convenient to adjust for six-color metal plate printing machine |
| CN114852660B (en) * | 2022-05-11 | 2024-01-30 | 昆山瑞源智能装备有限公司 | Pushing device for convenient-to-adjust six-color metal plate printer |
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