CN114446840A - Wafer glass powder erasing device - Google Patents
Wafer glass powder erasing device Download PDFInfo
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- CN114446840A CN114446840A CN202210365972.5A CN202210365972A CN114446840A CN 114446840 A CN114446840 A CN 114446840A CN 202210365972 A CN202210365972 A CN 202210365972A CN 114446840 A CN114446840 A CN 114446840A
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- suction pipe
- glass powder
- filter paper
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- 239000011521 glass Substances 0.000 title claims abstract description 42
- 239000000843 powder Substances 0.000 title claims abstract description 37
- 239000000428 dust Substances 0.000 claims abstract description 49
- 238000003860 storage Methods 0.000 claims abstract description 24
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000007935 neutral effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000002161 passivation Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- 210000005224 forefinger Anatomy 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a device is erased to wafer glass powder belongs to the equipment field of making the semiconductor, and the device includes: the paper taking device comprises a paper storage cylinder, a paper taking mechanism, a clamping mechanism and a rotary sucker. The paper storage cylinder is used for stacking and storing filter paper. The paper taking mechanism comprises a paper suction pipe used for taking out the filter paper in the paper storage cylinder, and the paper suction pipe is lifted along the vertical direction. The clamping mechanism comprises a dust cover, two clamping plates which move relatively are arranged in the dust cover and used for compressing the folded filter paper, the dust cover moves in the horizontal direction, and the paper storage cylinder is located below one end of the dust cover in the moving direction. The rotary sucker is used for fixing the wafer and enabling the wafer to rotate, and the rotary sucker is arranged below the other end of the dust cover in the moving direction. The device has higher working efficiency, can ensure the consistent erasing effect of all parts of the wafer, and can avoid dust pollution at the same time.
Description
Technical Field
The invention belongs to the technical field of equipment for manufacturing or processing semiconductors or solid devices, and particularly relates to a wafer glass powder erasing device.
Background
The wafer production mainly comprises the processes of etching, developing, groove etching, glass passivation, metallization, cleaning, scribing and the like. The glass passivation process requires coating and filling glass powder in the grooves on the surface of the wafer, and wiping off the excess glass powder on the surface of the wafer.
Most of the existing methods manually use the folded neutral filter paper to wipe off the glass powder on the surface of the wafer, because an operator usually uses a thumb, a forefinger and a middle finger to pinch the middle part of the folded neutral filter paper, the middle part of the folded neutral filter paper is stably stressed, the glass powder on the surface of the wafer can be effectively wiped off, and the two ends of the bottom edge of the neutral filter paper are slightly stressed and unstable, so that the glass powder on the surface of the wafer cannot be effectively wiped off. This requires the operator to pinch the neutral filter paper to make an irregular reciprocating or rotating motion on the wafer surface to wipe off the glass powder on the wafer surface as much as possible. This approach not only has lower erase efficiency; moreover, the wiping effect is not consistent from place to place on the wafer due to the irregular movement of neutral filter paper by the operator.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides the wafer glass powder erasing device which has higher erasing efficiency, can ensure that the erasing effect of each part of a wafer is consistent, and can prevent dust pollution.
In order to realize the purpose of the invention, the following scheme is adopted:
a wafer glass-powder wiping apparatus comprising: the paper taking device comprises a paper storage cylinder, a paper taking mechanism, a clamping mechanism and a rotary sucker.
The paper storage cylinder is used for stacking and storing filter paper.
The paper taking mechanism comprises a paper suction pipe, the negative pressure is utilized to adsorb the filter paper on the inner top surface of the paper storage cylinder, and the paper suction pipe is arranged in a lifting mode in the vertical direction.
The clamping mechanism comprises a dust cover with an opening at the bottom, two clamping plates which move relatively are arranged in the dust cover, one side, opposite to the clamping plates, of each clamping plate is of a plane structure and used for compressing the filter paper after being folded, the paper suction pipe can be connected with the filter paper to penetrate through the clamping plates when being lifted, the dust cover moves and is arranged along the horizontal direction, and the paper storage cylinder is located below one end of the dust cover in the moving direction.
The rotary sucker is used for fixing the wafer and enabling the wafer to rotate, and the rotary sucker is arranged below the other end of the dust cover in the moving direction.
Furthermore, a lifting device is arranged at the bottom of the paper storage cylinder and used for lifting the filter paper of the paper storage cylinder.
Further, inhale paper tube bottom surface and be the plane, be equipped with two and be listed as through-hole and a rectangular hole, it has the rectangular cavity that all communicates with through-hole and rectangular hole to inhale the paper intraduct, the rectangular intracavity is equipped with the T template, the diaphragm of T template slides and locates the rectangular cavity, the riser of T template is worn to locate in the rectangular hole, the riser bottom surface is equipped with the adhesive linkage, it is equipped with the suction pipe joint to inhale paper tube at least one end, the position of wearing to establish of suction pipe joint is located between the bottom surface in bottom surface and the rectangular cavity of diaphragm, through suction pipe joint to inhale the inside step-down or pressurization of paper tube, can make the T template remove along the direction of perpendicular to bottom surface.
Furthermore, the bottom surface of the transverse plate is provided with a supporting rod, and when the bottom surface of the supporting rod is just in contact with the bottom surface of the rectangular cavity, the bottom surface of the vertical plate is flush with or protrudes out of the bottom surface of the paper suction pipe by a preset distance.
Furthermore, an elastic sheet is arranged above the plane structure on one side, opposite to the clamping plates, the upper section of the elastic sheet inclines towards the middle of the two clamping plates, and the elastic sheet is made of rubber.
Furthermore, the upper part of the paper suction pipe is connected with a cross beam, one end of the cross beam is used for being connected with a telescopic rod of the lifting device, the cross beam and the paper suction pipe are arranged in parallel, and a guide cover with a triangular section is arranged above the cross beam.
Further, the dust cover lateral wall corresponds the removal orbit of inhaling the paper tube and has seted up the bar groove for hold inhaling the paper tube, the bar groove is located between the splint of both sides, and the bar groove is equipped with a pair of rubber door curtain.
Furthermore, the periphery of the rotary sucker is provided with an annular cover, the inner wall of the annular cover is provided with an exhaust hole for absorbing and removing dust formed by the glass powder, the outer diameter of the dust cover is smaller than the inner diameter of the annular cover, and when the glass powder is removed, the lower section of the dust cover is inserted into the annular cover.
Furthermore, the clamping plates are driven by cylinders, and the cylinders are arranged on the outer sides of the dust covers.
Furthermore, the outer walls of the two sides of the paper suction pipe are of arc structures.
The invention has the beneficial effects that: utilize the mechanism of getting paper to realize automatic paper of getting to carry out automatic fifty percent discount to filter paper through getting paper mechanism and fixture cooperation, and utilize filter paper to accomplish the automatic work of erasing to the wafer glass powder through clamping structure and rotating chuck cooperation, make the wafer glass powder of this application erase the device and have higher degree of automation, thereby effectively promoted work efficiency. The filter paper is integrally clamped along the folding edge of the filter paper by the clamping plate, so that the two ends of the folding part of the filter paper have good stable structures, all parts of the filter paper, which are in contact with the wafer, have the same pressed structure, and the consistency of the effect of wiping glass powder at each part of the wafer is ensured. The annular cover and the dust cover are arranged aiming at the station for erasing the glass powder, so that the glass powder can be effectively prevented from flying, and the dust pollution is prevented.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a view showing a state where a paper suction tube according to the present invention takes out a filter paper from a paper storage cylinder.
Fig. 2 shows an enlarged view at a in fig. 1.
Fig. 3 is a view showing a state where the paper suction pipe feeds the filter paper into the dust cover.
Fig. 4 shows an enlarged view at B in fig. 3.
Fig. 5 is a view showing a state where the filter paper rubs off the glass frit.
Fig. 6 shows an enlarged view at C in fig. 5.
Fig. 7 shows a state in which the suction tube enters the dust cap with filter paper.
FIG. 8 is a view showing a state where the pipette is passed through between the clamping plates with filter paper.
Fig. 9 shows a state in which the suction paper tube is over the nip plate with the filter paper.
Fig. 10 is a view showing a state where the suction paper tube is inserted downward between the clamping plates with the filter paper.
FIG. 11 is a view showing a state in which the filter paper is folded in half by fitting the clamp plate to the paper suction pipe.
FIG. 12 is a view showing a state in which the folded filter paper is sandwiched by the clamp plates.
Fig. 13 shows an internal structure view of the paper suction pipe.
Fig. 14 shows a cross-sectional view when the suction paper tube adsorbs filter paper.
Fig. 15 shows a cross-sectional view of the suction pipe when the filter paper is unfastened.
The labels in the figure are: the paper storage device comprises a paper storage cylinder-10, a paper taking mechanism-20, a paper suction pipe-21, a through hole-211, a rectangular hole-212, a rectangular cavity-213, a T-shaped plate-22, a transverse plate-221, a vertical plate-222, a support rod-223, a suction pipe joint-23, a cross beam-24, a guide cover-25, a clamping mechanism-30, a dust cover-31, a strip-shaped groove-311, a rubber door curtain-312, a clamping plate-32, an elastic sheet-33, a rotary suction cup-40 and an annular cover-41.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
As shown in fig. 1 to 12, a wafer glass frit erasing apparatus includes: a paper storage cylinder 10, a paper taking mechanism 20, a clamping mechanism 30 and a rotary sucker 40.
Specifically, as shown in fig. 1 to 3, a paper storage container 10 for stacking and storing filter papers is provided.
Preferably, the bottom of the paper storage cylinder 10 is provided with a lifting device for lifting the filter paper of the paper storage cylinder 10, so that the height of the filter paper on the top surface is kept within a set range for the suction of the paper suction pipe 21.
Specifically, as shown in fig. 2 and 7 to 12, the pickup mechanism 20 includes a suction pipe 21 that is vertically disposed, and the suction pipe 21 is in a horizontal state. The paper suction pipe 21 sucks the filter paper on the inner top surface of the paper storage cylinder 10 in a negative pressure or bonding mode, the sucking position of the paper suction pipe 21 penetrates through the center line of the filter paper, and the paper suction pipe 21 is matched with the clamping mechanism 30 through the lifting movement of the paper suction pipe 21 to realize the function of folding the filter paper in half.
Specifically, as shown in fig. 5 to 12, the clamping mechanism 30 includes a dust cover 31 with an open bottom. Two clamping plates 32 which move relatively are arranged in the dust cover 31, one side of each clamping plate 32 is of a plane structure and is used for pressing the folded filter paper, and the length of each plane structure is larger than the maximum length or the diameter of the filter paper. The clamping plates 32 are driven by air cylinders which are arranged on the outer side of the dust cover 31.
As shown in fig. 8, 10 and 11, the paper suction pipe 21 can be lifted and lowered with the filter paper passing through the gap between the clamping plates 32, thereby performing a function of folding the filter paper in half. After the folding operation of the filter paper is completed and the filter paper is clamped and fixed by the clamping plate 32, the paper suction pipe 21 can be drawn out from the folded filter paper by horizontally moving the dust cover 31.
More specifically, the dust cover 31 is provided to move in the horizontal direction, and the paper storage 10 is located below one end of the dust cover 31 in the moving direction. The moving mode can be realized by adopting the structure of an electrode screw rod.
Specifically, as shown in fig. 1 and 6, the spin chuck 40 is provided below the other end of the dust cover 31 in the moving direction to fix and rotate the wafer.
When the device works, the paper suction pipe 21 is matched with the clamping mechanism 30 to enable the filter paper to form a double-folded structure, and the double-folded filter paper is clamped and fixed by the clamping plate 32. Specifically, as shown in fig. 7, the filter paper is first moved upward into the dust cover 31 by the suction tube 21, and the distance between the clamping plates 32 is greater than the width of the suction tube 21. The suction tube 21 is passed upwardly between the jaws 32 carrying the filter paper as shown in figure 8 until the suction tube 21 and filter paper are in the position shown in figure 9 with the filter paper passing fully upwardly over the jaws 32. Then the suction pipe 21 carries the filter paper to move downwards, as shown in fig. 10, the suction pipe 21 carries the filter paper to pass downwards between the clamping plates 32, and the two sides of the filter paper are blocked upwards, and the filter paper gradually forms a bent shape as shown in fig. 11. The suction tube 21 continues to descend until the suction tube 21 completely passes down the clamping plate 32. The clamp plate 32 moves toward the center to press the filter paper, and then the dust cap 31 moves along the length direction of the paper suction pipe 21 to draw the paper suction pipe 21 out of the filter paper. The state in which the filter paper is held by the nip plate 32 is shown in fig. 12.
Then, the dust cover 31 is moved to above the spin chuck 40 by means of the lead screw motor, and the operator places the wafer on the spin chuck 40 in advance. Then, the dust cover 31 is controlled to descend by a predetermined height through the lifting device, as shown in fig. 6, the bottom of the folded filter paper is contacted with the top surface of the wafer, and the filter paper is extruded and deformed within a predetermined range, so that the bottom surface of the filter paper is attached to the surface of the wafer. Then the wafer is rotated rapidly by the rotation of the rotary sucker 40, and the wafer is continuously contacted and rubbed with the bottom surface of the filter paper in the rotating process, so that the purpose of wiping the glass powder on the surface of the wafer is achieved.
Preferably, as shown in fig. 13 to 15, the bottom surface of the paper suction pipe 21 is a plane, and two rows of through holes 211 and one rectangular hole 212 are provided, and a rectangular cavity 213 communicating with both the through holes 211 and the rectangular hole 212 is provided inside the paper suction pipe 21. The T-shaped plate 22 is arranged in the rectangular cavity 213, the transverse plate 221 of the T-shaped plate 22 is arranged in the rectangular cavity 213 in a sliding mode, and the vertical plate 222 of the T-shaped plate 22 penetrates through the rectangular hole 212.
More specifically, the bottom surface of the vertical plate 222 is provided with an adhesive layer, at least one end of the paper suction pipe 21 is provided with a suction pipe connector 23, and the penetrating position of the suction pipe connector 23 is positioned between the bottom surface of the horizontal plate 221 and the bottom surface of the rectangular cavity 213. The T-shaped plate 22 is moved in a direction perpendicular to the bottom surface by depressurizing or pressurizing the inside of the paper suction tube 21 through the suction joint 23.
As shown in fig. 14, when the paper suction pipe 21 sucks filter paper, the suction pipe connector 23 sucks air below the horizontal plate 221 in the rectangular cavity 213 by a vacuum pump or an air suction pump, and depressurizes the inside of the paper suction pipe 21 to form a negative pressure state between the bottom surface of the horizontal plate 221 and the bottom surface of the rectangular cavity 213, so that the T-shaped plate 22 moves downward to move the vertical plate 222 downward along the rectangular hole 212. The bottom surfaces of the final risers 222 are flush with or protrude above the bottom surface of the suction tube 21. The negative pressure is used for absorbing the filter paper through the through holes 211, and meanwhile, the adhesive layer on the bottom surface of the vertical plate 222 is used for adhering the filter paper, so that the absorption stability of the filter paper is improved, and the filter paper is prevented from falling off when the paper absorbing pipe 21 with the filter paper passes through the clamping plates 32.
As shown in fig. 15, when the paper suction pipe 21 releases the filter paper, the T-shaped plate 22 is moved upward by applying pressure between the bottom surface of the horizontal plate 221 and the bottom surface of the rectangular cavity 213 through the suction joint 23, the vertical plate 222 is retracted into the rectangular hole 212, the adhesive layer on the bottom surface of the vertical plate 222 is separated from the filter paper, the suction force of the negative pressure to the filter paper through the through hole 211 is cut off, and then the dust cover 31 is moved toward the end of the rotary suction cup 40, so that the paper suction pipe 21 is drawn out from the folded filter paper, and the separation from the filter paper is completed.
Preferably, as shown in fig. 14 and 15, the bottom surface of the horizontal plate 221 is provided with a support bar 223, and when the bottom surface of the support bar 223 is just in contact with the bottom surface of the rectangular cavity 213, the bottom surface of the vertical plate 222 is flush with the bottom surface of the paper suction pipe 21 or protrudes a predetermined distance from the bottom surface of the paper suction pipe 21. The support rod 223 is used for limiting a certain range of the T-shaped plate 22, so that the riser 222 is prevented from protruding too much from the bottom surface of the paper suction pipe 21 to cause that the through hole 211 can not suck the filter paper.
Preferably, as shown in fig. 6 to 12, an elastic piece 33 is arranged above the plane structure on the opposite side of the clamping plate 32, the upper section of the elastic piece 33 is inclined towards the middle of the two clamping plates 32, and the elastic piece 33 is made of rubber. As shown in fig. 10 and 11, when the paper suction pipe 21 carries the filter paper to pass through the clamping plate 32 downwards, the upper section edge of the filter paper can be gradually folded towards the middle by the elastic sheet 33 to form a double-folded structure, so that the filter paper is prevented from bouncing to two sides due to the elasticity of the filter paper; and the elastic sheet 33 is made of rubber, so that the two sides of the filter paper keep certain tension when folded, and the two sides of the filter paper can be kept symmetrical when folded.
More preferably, as shown in fig. 4 and 8, a cross beam 24 is connected above the paper suction pipe 21, one end of the cross beam 24 is used for connecting a telescopic rod of the lifting device, the cross beam 24 is arranged in parallel with the paper suction pipe 21, and a guide cover 25 with a triangular cross section is arranged above the cross beam 24. As shown in fig. 11, when the elastic sheet 33 folds the two sides of the folded filter paper toward the middle, the two side walls of the guide cover 25 form a support and guide structure for the filter paper to prevent the filter paper from being stuck, and the elastic sheet 33 presses the filter paper against the side wall of the guide cover 25 to make the filter paper have a certain resistance when moving downward, so as to ensure that the two sides of the folded filter paper are stretched straight, prevent any one side of the folded filter paper from being wrinkled, and when the filter paper is completely clamped by the clamping plate, the guide cover 25, the beam 24 and the paper suction tube 21 are all in a cavity formed after the filter paper is folded.
Preferably, as shown in fig. 4 and 12, a strip-shaped groove 311 is formed in the side wall of the dust cover 31 corresponding to the moving track of the paper suction tube 21 for accommodating the paper suction tube 21, the strip-shaped groove 311 is located between the clamping plates 32 on both sides, and the strip-shaped groove 311 is provided with a pair of rubber curtains 312. When the paper suction pipe 21 passes through the strip-shaped groove 311, the rubber door curtain 312 can be avoided by utilizing the elastic deformation of the rubber door curtain, when the paper suction pipe 21 is moved out, the rubber door curtain 312 automatically recovers the elastic force, the strip-shaped groove 311 is closed, and the glass powder is prevented from flying when being erased, so that the dust pollution is further avoided.
Preferably, as shown in fig. 1, the outer circumference of the rotary suction cup 40 is provided with an annular cover 41, and the inner wall of the annular cover 41 is provided with an exhaust hole for absorbing and removing dust formed by wiping glass powder to prevent the glass powder from scattering.
It is further preferable that the outer diameter of the dust cover 31 is smaller than the inner diameter of the annular cover 41, and as shown in fig. 6, when the glass frit is erased, the lower section of the dust cover 31 is inserted into the annular cover 41 to form a sealed working environment, thereby further preventing the glass frit from scattering.
Preferably, as shown in fig. 11, 14 and 15, the outer walls of the paper suction pipe 21 are formed in a circular arc structure on both sides. Facilitating the smooth transition between the suction pipe 21 and the filter paper, and helping the cross section of the contact portion of the filter paper with the surface of the wafer to form an oval structure as shown in fig. 6 and 12. The structure can ensure that the two sides of the folded part of the filter paper have moving supporting strength, and simultaneously, the bottom of the folded part of the filter paper is of an arc structure, when the filter paper is extruded, the bottom of the filter paper is in surface contact with the wafer, and no matter the wafer rotates clockwise or anticlockwise, the bottom of the filter paper can be in smooth contact with the wafer, so that the glass powder on the surface of the wafer can be erased by soft force. If the folded bottom edge of the filter paper is completely attached tightly, the bottom edge is in a linear structure, and the edge angle of the bottom edge is too sharp, the glass powder in the corrosion groove is likely to be erased together, so that the strength of the wafer after passivation scribing is influenced.
The above description is only a preferred embodiment of the invention and is not intended to be exhaustive or to limit the invention to the precise form disclosed. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (10)
1. A wafer glass powder erasing device is characterized by comprising:
a paper storage cylinder (10) for stacking and storing filter paper;
the paper taking mechanism (20) comprises a paper absorbing pipe (21) which is arranged in a lifting way along the vertical direction and is used for absorbing the filter paper on the inner top surface of the paper storage cylinder (10);
the clamping mechanism (30) comprises a dust cover (31) with an opening at the bottom, two clamping plates (32) which move relatively are arranged in the dust cover (31), one opposite side of each clamping plate (32) is of a plane structure and used for pressing folded filter paper, the paper suction pipe (21) can be used for enabling the filter paper to pass through the clamping plates (32) when being lifted, the dust cover (31) is arranged in a moving mode along the horizontal direction, and the paper storage cylinder (10) is located below one end of the dust cover (31) in the moving direction;
and a rotary chuck (40) for fixing the wafer and rotating the wafer, wherein the rotary chuck (40) is arranged below the other end of the dust cover (31) in the moving direction.
2. The device for wiping off the glass powder on the wafer as claimed in claim 1, wherein a lifting device is arranged at the bottom of the paper storage cylinder (10) and is used for lifting the filter paper of the paper storage cylinder (10).
3. The device for wiping off glass powder on a wafer according to claim 1, wherein the bottom surface of the paper suction tube (21) is a plane and is provided with two rows of through holes (211) and a rectangular hole (212), the paper suction tube (21) is internally provided with a rectangular cavity (213) communicated with the through holes (211) and the rectangular hole (212), a T-shaped plate (22) is arranged in the rectangular cavity (213), a transverse plate (221) of the T-shaped plate (22) is slidably arranged in the rectangular cavity (213), a vertical plate (222) of the T-shaped plate (22) is arranged in the rectangular hole (212) in a penetrating way, the bottom surface of the vertical plate (222) is provided with an adhesive layer, at least one end of the paper suction tube (21) is provided with a suction pipe joint (23), the penetrating position of the suction pipe joint (23) is positioned between the bottom surface of the transverse plate (221) and the bottom surface of the rectangular cavity (213), the T-shaped plate (22) can move along the direction vertical to the bottom surface by depressurizing or pressurizing the inside of the paper suction pipe (21) through the suction pipe joint (23).
4. The apparatus for wiping off glass powder on a wafer as claimed in claim 3, wherein the bottom surface of the horizontal plate (221) is provided with a support bar (223), and when the bottom surface of the support bar (223) is just in contact with the bottom surface of the rectangular cavity (213), the bottom surface of the vertical plate (222) is flush with the bottom surface of the paper suction pipe (21) or protrudes a predetermined distance from the bottom surface of the paper suction pipe (21).
5. The apparatus for wiping off glass powder from a wafer as claimed in claim 1, characterized in that an elastic sheet (33) is provided above the planar structure on the opposite side of the clamping plate (32), and the upper section of the elastic sheet (33) is inclined toward the middle of the clamping plates (32).
6. The device for wiping off the glass powder on the wafer as claimed in claim 1, wherein a beam (24) is connected above the paper suction pipe (21), one end of the beam (24) is used for connecting a telescopic rod of a lifting device, the beam (24) and the paper suction pipe (21) are arranged in parallel, and a guide cover (25) with a triangular section is arranged above the beam (24).
7. The device for wiping off the glass powder on the wafer as claimed in claim 1, wherein the side wall of the dust cover (31) is provided with a strip-shaped groove (311) corresponding to the moving track of the paper suction tube (21) for accommodating the paper suction tube (21), the strip-shaped groove (311) is located between the clamping plates (32) at two sides, and the strip-shaped groove (311) is provided with a pair of rubber curtains (312).
8. The wafer glass powder erasing device according to claim 1, wherein the outer periphery of the rotary suction cup (40) is provided with an annular cover (41), the inner wall of the annular cover (41) is provided with an exhaust hole for absorbing and removing dust formed by erasing glass powder, the outer diameter of the dust cover (31) is smaller than the inner diameter of the annular cover (41), and when the glass powder is erased, the lower section of the dust cover (31) is inserted into the annular cover (41).
9. The apparatus for wiping off glass powder on wafer as claimed in claim 1, wherein the clamping plates (32) are driven by air cylinders which are arranged outside the dust cover (31).
10. The device for wiping off glass powder on a wafer as claimed in claim 1, wherein the outer walls of the two sides of the paper suction pipe (21) are in a circular arc structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210365972.5A CN114446840B (en) | 2022-04-08 | 2022-04-08 | Wafer glass powder erasing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210365972.5A CN114446840B (en) | 2022-04-08 | 2022-04-08 | Wafer glass powder erasing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114446840A true CN114446840A (en) | 2022-05-06 |
| CN114446840B CN114446840B (en) | 2022-07-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210365972.5A Active CN114446840B (en) | 2022-04-08 | 2022-04-08 | Wafer glass powder erasing device |
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|---|---|---|---|---|
| JP2006167508A (en) * | 2004-12-13 | 2006-06-29 | Toray Ind Inc | Method and device for cleaning die for coating application and method and apparatus for manufacturing member for display |
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| CN114446840B (en) | 2022-07-01 |
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