CN214152873U

CN214152873U - Compressing device of wafer glass powder wiping device

Info

Publication number: CN214152873U
Application number: CN202120469205.XU
Authority: CN
Inventors: 孟萌; 李向东; 毕立东
Original assignee: Yangxin Cenxiang Electronic Technology Co ltd; Shandong Caiju Electronic Technology Co ltd
Current assignee: Yangxin Cenxiang Electronic Technology Co ltd; Shandong Caiju Electronic Technology Co ltd
Priority date: 2021-03-04
Filing date: 2021-03-04
Publication date: 2021-09-07
Anticipated expiration: 2031-03-04

Abstract

A pressing device of a wafer glass powder wiping device belongs to the technical field of wafer processing auxiliary equipment. The method is characterized in that: the wafer pressing device comprises a pressing device and a pressing plate (9), wherein the pressing device is connected with the pressing plate (9) and pushes the pressing device to move along the direction close to or far away from a wafer, and a pressing part used for pressing the wafer is arranged on the pressing plate (9). This closing device's of wafer glass powder wiping arrangement pressure device promotes the clamp plate motion to make the clamp plate compress tightly the wafer, pressure device can guarantee that the clamp plate is invariable to the pressure of wafer, and the portion of compressing tightly cleans the wafer through the kraft paper, and then guarantees to clean the thickness of the glass powder on the back wafer even, and the wafer cleans fastly, the thickness homogeneous of glass powder, and control is convenient, guarantees that the qualification rate of the chip of processing out is high, has reduced the manufacturing cost of chip.

Description

Compressing device of wafer glass powder wiping device

Technical Field

A pressing device of a wafer glass powder wiping device belongs to the technical field of wafer processing auxiliary equipment.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions. In the process of producing electronic components through wafers, glass powder needs to be coated on the wafers to ensure that glass protective layers can be formed on the side portions of chips after cutting.

When the glass powder is coated on the wafer, the glass powder is difficult to be uniformly coated, namely, the thicknesses of the glass powder at different positions on the wafer are different, so that the subsequent processing procedures of the wafer are influenced, the quality of a chip is further influenced, and the chip yield is low. In order to solve the above technical problems, after the glass frit is coated on the wafer, the glass frit on the wafer needs to be wiped to ensure that the thickness of the glass frit is uniform. In the process of wiping the glass powder on the wafer, the pressure on the wafer is kept constant all the time to ensure that the thickness of the glass powder on the wafer is uniform, the wafer can only be wiped by workers at present, but the pressure is difficult to ensure to be constant through manual wiping, the wiping quality is difficult to ensure, and the thickness of the glass powder after wiping is difficult to ensure to be uniform. The problems cannot be solved in the industry at present, and the technical problem greatly influences the qualified rate of chip production.

Disclosure of Invention

The to-be-solved technical problem of the utility model is: the pressing device of the wafer glass powder wiping device overcomes the defects of the prior art, can ensure constant pressure on a wafer and enables the thickness of glass powder on the wafer to be uniform.

The utility model provides a technical scheme that its technical problem adopted is: the compressing device of the wafer glass powder wiping device is characterized in that: the wafer pressing device comprises a pressing device and a pressing plate, wherein the pressing device is connected with the pressing plate and pushes the pressing device to move along the direction close to or far away from a wafer, and a pressing part used for pressing the wafer is arranged on the pressing plate.

Preferably, a flexible plate is arranged on one side of the pressing plate to form the pressing part. The lateral part of clamp plate is provided with the flexplate, can enough guarantee the pressure to the wafer, can avoid again causing the damage to the wafer.

Preferably, both sides of the pressure plate are provided with circular arc-shaped transition parts. The both sides of clamp plate all are provided with transition portion, can guarantee the smooth and easy motion of kraft paper to the portion downside that compresses tightly, have realized the continuous wiping of wafer.

Preferably, the device further comprises a pressure adjusting device, the pressure plate is arranged on the lower side of the pressurizing device in a lifting mode, and the pressure adjusting device is connected with the pressure plate. The pressure adjusting device is convenient for adjusting the pressure of the pressing part on the wafer, and the thickness of the glass powder on the wafer is convenient to adjust.

Preferably, the pressure adjusting device comprises a vertical rod and a balancing weight, the lower end of the vertical rod is connected with the pressing plate, the upper end of the vertical rod is connected with the pressurizing device in a sliding mode, and the balancing weight is arranged on the upper side of the pressing plate. Adjust the pressure that compresses tightly the portion to the wafer through the balancing weight, it is convenient to adjust, and can guarantee to compress tightly the portion invariable to the pressure of wafer, and adopt the spring to adjust the pressure that compresses tightly the portion, can appear the wafer uneven and lead to the unstable problem of pressure.

Preferably, the pressurizing device comprises a pressurizing cylinder, and a piston rod of the pressurizing cylinder is connected with the pressure plate. The pressurization of the wafer is realized through the pressurization cylinder, and the control is convenient.

Preferably, the guiding device and the guiding device are arranged on two opposite sides of the pressing plate and used for guiding the kraft paper. The guiding-in device can be with the leading-in kraft paper to the downside that compresses tightly the portion, and the guiding-out device can be exported the kraft paper after using, guarantees that the kraft paper aligns with the portion that compresses tightly, and can make kraft paper and the portion laminating of compressing tightly reliable, guarantees to wipe the wafer stably.

Preferably, the guiding device comprises a pressing wheel and a pressing wheel pressing spring, the pressing wheel is arranged on one side of the pressing plate, and the pressing wheel pressing spring is connected with the pressing wheel and pushes the pressing wheel to press and press kraft paper. The pinch roller compression spring pushes the pinch roller to compress the kraft paper, so that the kraft paper on the kraft paper input side of the pressing plate is ensured to be tightened.

Preferably, the leading-out device comprises a leading-out roller, and the leading-out roller is arranged on the upper side of the pressing plate. The guiding-out roller can guide out the kraft paper after use, and is convenient for collecting the kraft paper after use.

Preferably, the guide-out roller comprises an upper pressing roller and a lower pressing roller which are arranged side by side, and the upper pressing roller is connected with a pressing roller pressing spring for pushing the upper pressing roller to press the lower pressing roller. Go up the compression roller and cooperate the kraft paper of pressing from both sides after pressing from both sides the clamp use with lower compression roller, both made things convenient for the collection of the kraft paper after using, can make the kraft paper of the portion downside that compresses tightly again maintain invariable pressure, avoid receiving the influence of the kraft paper collection speed of output.

Compared with the prior art, the utility model discloses the beneficial effect who has is: this closing device's of wafer glass powder wiping arrangement pressure device promotes the clamp plate motion to make the clamp plate compress tightly the wafer, pressure device can guarantee that the clamp plate is invariable to the pressure of wafer, and the portion of compressing tightly cleans the wafer through the kraft paper, and then guarantees to clean the thickness of the glass powder on the back wafer even, and the wafer cleans fastly, the thickness homogeneous of glass powder, and control is convenient, guarantees that the qualification rate of the chip of processing out is high, has reduced the manufacturing cost of chip.

Drawings

Fig. 1 is a perspective view of a pressing device of a wafer glass powder wiping device.

Fig. 2 is a partially enlarged view of a portion a in fig. 1.

Fig. 3 is a perspective view of the platen after installation.

Fig. 4 is a front view of the platen after installation.

Fig. 5 is a partially enlarged view of B in fig. 4.

In the figure: 1. the paper winding machine comprises a rack 2, a pressurizing cylinder 3, a paper winding shaft 4, a winding motor 5, a winding shaft 6, a lifting frame 7, a lifting guide rail 8, a flexible plate 9, a pressing plate 901, a transition part 902, a mounting groove 10, a pressing wheel 11, a lower pressing roller 12, a coded disc 13, an upper pressing roller 1301, a limiting part 14, a supporting block 15, a pressing roller pressing spring 16, a lifting plate 17, a vertical rod 18, a bearing plate 19, a balancing weight 20, a mounting frame 21, a guide rod 22, a mounting shaft 23, a pressing wheel pressing spring 24 and a reversing rod.

Detailed Description

Fig. 1 to 5 are preferred embodiments of the present invention, and the present invention will be further explained with reference to fig. 1 to 5.

A pressing device of a wafer glass powder wiping device comprises a pressing device and a pressing plate 9, wherein the pressing device is connected with the pressing plate 9 and pushes the pressing device to move along the direction close to or far away from a wafer, and a pressing part used for pressing the wafer is arranged on the pressing plate 9. This closing device's of wafer glass powder wiping arrangement pressure device promotes clamp plate 9 motion to make the clamp plate compress tightly the wafer, pressure device can guarantee that clamp plate 9 is invariable to the pressure of wafer, and the portion of compressing tightly cleans the wafer through the kraft paper, and then guarantees to clean the thickness of the glass powder on the back wafer even, and the wafer cleans fastly, the thickness homogeneous of glass powder, and control is convenient, guarantees that the qualification rate of the chip of processing out is high, has reduced the manufacturing cost of chip.

The present invention is further described with reference to specific embodiments, however, it will be understood by those skilled in the art that the detailed description given herein with respect to the drawings is for better explanation and that the present invention is necessarily to be construed as limited to those embodiments, and equivalents or common means thereof will not be described in detail but will fall within the scope of the present application.

Specifically, the method comprises the following steps: as shown in FIGS. 1-2: the pressurizing device is installed on the rack 1, a paper reel shaft 3 for placing kraft paper rolls and a winding shaft 5 for collecting kraft paper after use are further arranged on the pressurizing device, the winding shaft 5 is connected with a winding motor 4 for driving the winding shaft to rotate, and the winding motor 4 is installed on the pressurizing device and moves synchronously along with the pressurizing device. The paper reel 3 and the winding reel 5 are respectively arranged on two sides of the pressing plate 9, so that automatic replacement of kraft paper is realized, and further, continuous wiping of glass powder on the wafer is realized.

The pressurizing device comprises a lifting frame 6 and a pressurizing cylinder 2, vertical lifting guide rails 7 are installed on two sides of the rack 1, two sides of the lifting frame 6 are slidably installed on the lifting guide rails 7 respectively, so that the lifting frame 6 can vertically lift, the pressure of a wafer is perpendicular to the wafer, and the constant pressure is guaranteed. The pressurizing cylinder 2 is arranged on the upper side of the rack 1, the pressurizing cylinder 2 is vertically arranged, and a piston rod of the pressurizing cylinder 2 is connected with the middle part of the lifting frame 6 and pushes the lifting frame to lift. The paper reel 3 and the winding shaft 5 are respectively arranged at two sides of the lifting frame 6.

The leading-in device for leading in kraft paper and the leading-out device for leading out used kraft paper are arranged on two sides of the lifting frame 6 respectively, the leading-in device and the leading-out device are arranged on two sides of the pressing plate 9 respectively, the leading-in device is arranged on the lower side of the paper winding shaft 3, and the leading-out device and the winding shaft 5 are arranged at the same height. The upside of gatherer is provided with switching-over pole 24, and switching-over pole 24 is installed on crane 6, and switching-over pole 24 can lead the kraft paper, makes the kraft paper enter into the gatherer.

The derivation device includes the derivation roller, in this embodiment, the derivation roller includes upper compression roller 13 and lower compression roller 11, upper compression roller 13 sets up the upside at lower compression roller 11 side by side, lower compression roller 11 rotates to be installed on crane 6, install on crane 6 of upper compression roller 13 liftable, be provided with two supporting shoes 14 on crane 6, supporting shoe 14 sets up the both ends upside at upper compression roller 13, be provided with compression roller pressure spring 15 between the one end that supporting shoe 14 and upper compression roller 13 correspond, compression roller pressure spring 15 is in compression state, the one end of compression roller pressure spring 15 is supported on supporting shoe 14, the rotatable connection of one end that the other end and upper compression roller 13 correspond, thereby promote upper compression roller 13 and compress tightly lower compression roller 11. Go up compression roller 13 and lower compression roller 11 and cooperate and derive the kraft paper after using, can also guarantee that the pressure of the kraft paper of clamp plate 9 downside is invariable, can not receive the pivoted influence of rolling axle 5.

The end of the upper compression roller 13 can be provided with a bearing seat, and the compression roller compression spring 15 is connected with the bearing seat and pushes the upper compression roller 13 to move downwards. The diameter at the both ends of going up compression roller 13 all is greater than the diameter at middle part to all form spacing portion 1301 at the both ends of going up compression roller 13, spacing portion 1301 is close to the toper that one side at last compression roller 13 middle part was for following the direction diameter crescent who keeps away from last compression roller 13 middle part, in order to guarantee that the kraft paper rolling is more neat on rolling axle 5.

When using the kraft paper to clean the wafer, clean the back of accomplishing, the kraft paper that has used up need move and roll to rolling axle 5 on to guarantee to the effect of cleaning of wafer, consequently when cleaning new wafer, need the kraft paper to move one section in order to guarantee that new kraft paper is aligned with new wafer, if the distance of moving is too short, the condition of kraft paper used repeatedly can appear, influence the effect of cleaning of wafer, if the distance of moving overlength, then can waste the kraft paper. And a coded disc 12 is arranged on the lower pressing roll 11 to accurately measure the movement distance of the kraft paper, so that the movement length of the kraft paper can be accurately controlled conveniently.

As shown in FIGS. 3-5: the lifter plate 16 is installed to the middle part downside of

crane

6, and 16 levels of lifter plate set up, and the lifter plate 16 goes up and down along with crane 6 synchronous. The pressing plates 9 are arranged on the lower side of the lifting plate 16 at intervals, a horizontal bearing plate 18 is arranged between the pressing plates 9 and the lifting plate 16, the pressing plates 9 are arranged on the lower side of the bearing plate 18 at intervals, and the pressing plates 9 are connected with the bearing plate 18 and synchronously lifted along with the bearing plate 18. The vertical pole setting 17 that is provided with of upside of lifter plate 16, pole setting 17 have a plurality of, and in this embodiment, pole setting 17 is provided with four, and four pole setting 17 surround into the cuboid frame, the lower extreme of pole setting 17 simultaneously with clamp plate 9 and bearing plate 18 fixed connection, threaded connection has stop nut behind lifter plate 16 is passed in the upper end slip of pole setting 17, bearing plate 18 and clamp plate 9 can slide the setting with lifter plate 16 relatively promptly.

Install balancing weight 19 at bearing plate 18 upside, form pressure regulating device, balancing weight 19 is provided with a plurality of pieces from lower to upper as required to rely on the gravity of balancing weight 19 to adjust the pressure of clamp plate 9 to the wafer, pressure is invariable, and adjusts the convenience. And the pressure of the pressing part is adjusted by adopting the spring, so that the problem of unstable pressure caused by uneven wafer can be caused.

The guiding device sets up in one side of bearing plate 18, the guiding device includes installation axle 22, pinch roller 10 and mounting bracket 20, mounting bracket 20 is the portal frame that the level set up, the both sides of mounting bracket 20 are connected with bearing plate 18's the side slidable that corresponds respectively, installation axle 22 level sets up, the both ends of installation axle 22 link to each other with mounting bracket 20's the side that corresponds respectively, the rotatable installation of pinch roller 10 is on installation axle 22, pinch roller 10 is provided with a plurality of along installation axle 22 side by side. Still install guide bar 21 on mounting bracket 20, guide bar 21 perpendicular to installation axle 22 sets up, the one end of guide bar 21 links to each other with installation axle 22, other end slidable links to each other with mounting bracket 20, guide bar 21 radially sets up along installation axle 22, guide bar 21 overcoat is equipped with pinch roller compression spring 23, pinch roller compression spring 23 is in compression state, the one end of pinch roller compression spring 23 is supported on mounting bracket 20, the other end is supported on installation axle 22, and promote the lateral part that pinch roller 10 compresses tightly bearing plate 18, make pinch roller 10 cooperate with the lateral part of bearing plate 18 and compress tightly the kraft paper, make the smooth clamp plate 9 downside of sending into of kraft paper, and cooperate with the eduction gear, make the kraft paper laminate with the clamping part of clamp plate 9.

The both sides lower part of clamp plate 9 all is provided with the radius angle, forms transition portion 901, makes the slip that the kraft paper can be smooth and easy, avoids causing the damage to the kraft paper, has realized the automatic change of kraft paper to wipe the wafer in succession.

A flexible plate 8 is mounted on the underside of the pressure plate 9 to form a compression part. The middle part of the lower side of the pressing plate 9 is provided with a mounting groove 902, the mounting groove 902 is a T-shaped groove, the upper part of the flexible plate 8 is provided with a mounting part matched with the T-shaped groove, the mounting part of the flexible plate 8 can be slidably mounted in the mounting groove 902, so that the flexible plate 8 can be conveniently replaced, the flexible plate 8 is a plastic plate, a rubber plate or a silica gel plate, and in the embodiment, the flexible plate 8 is the rubber plate and can be prevented from damaging the wafer.

While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical substance of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. The utility model provides a closing device of wafer glass powder device which characterized in that: the wafer pressing device comprises a pressing device and a pressing plate (9), wherein the pressing device is connected with the pressing plate (9) and pushes the pressing device to move along the direction close to or far away from a wafer, and a pressing part used for pressing the wafer is arranged on the pressing plate (9).

2. The compacting apparatus of a wafer glass powder dusting apparatus of claim 1, wherein: and a flexible plate (8) is arranged on one side of the pressing plate (9) to form the pressing part.

3. The pressing device of the wafer glass powder wiping device according to claim 1 or 2, characterized in that: arc-shaped transition parts (901) are arranged on two sides of the pressing plate (9).

4. The compacting apparatus of a wafer glass powder dusting apparatus of claim 1, wherein: the device is characterized by further comprising a pressure adjusting device, wherein the pressing plate (9) is arranged on the lower side of the pressurizing device in a lifting mode, and the pressure adjusting device is connected with the pressing plate (9).

5. The compacting apparatus of a wafer glass powder dusting apparatus of claim 4, wherein: pressure adjusting device include pole setting (17) and balancing weight (19), the lower extreme and clamp plate (9) of pole setting (17) link to each other, the upper end is connected with pressure device slidable, balancing weight (19) set up in clamp plate (9) upside.

6. The compacting apparatus of a wafer glass powder dusting apparatus of claim 1, wherein: the pressurizing device comprises a pressurizing cylinder (2), and a piston rod of the pressurizing cylinder (2) is connected with a pressure plate (9).

7. The compacting apparatus of a wafer glass powder dusting apparatus of claim 1, wherein: the kraft paper guiding device further comprises a guiding device and a guiding device which are arranged on two opposite sides of the pressing plate (9) and used for guiding kraft paper.

8. The compacting apparatus of a wafer glass powder dusting apparatus of claim 7, wherein: the guiding device comprises a pressing wheel (10) and a pressing wheel pressing spring (23), the pressing wheel (10) is arranged on one side of the pressing plate (9), and the pressing wheel pressing spring (23) is connected with the pressing wheel (10) and pushes the pressing wheel to press kraft paper.

9. The compacting apparatus of a wafer glass powder dusting apparatus of claim 7, wherein: the guiding-out device comprises a guiding-out roller, and the guiding-out roller is arranged on the upper side of the pressing plate (9).

10. The compacting apparatus of a wafer glass powder dusting apparatus of claim 9, wherein: the guide-out roller comprises an upper pressing roller (13) and a lower pressing roller (11) which are arranged side by side, wherein the upper pressing roller (13) is connected with a pressing roller pressing spring (15) for pushing the upper pressing roller to press the lower pressing roller (11).