CN109706487A - A kind of anti-oxidant electroplate liquid of copper facing - Google Patents
A kind of anti-oxidant electroplate liquid of copper facing Download PDFInfo
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- CN109706487A CN109706487A CN201711013008.1A CN201711013008A CN109706487A CN 109706487 A CN109706487 A CN 109706487A CN 201711013008 A CN201711013008 A CN 201711013008A CN 109706487 A CN109706487 A CN 109706487A
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Abstract
A kind of anti-oxidant electroplate liquid of copper facing, in parts by weight, comprising: 30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of copper chloride, 15-20 parts of nickel hydroxide cobaltous sulfate, 10-20 parts of cobalt chloride, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of potassium carbonate, 3-5 parts of acetic acid, 10-15 parts of dibastic sodium phosphate, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, 20-50 parts of potassium hydroxide, 50-80 parts of ethylenediamine tetra-acetic acid, 1000-3000 parts of deionized water.It joined ethylenediamine tetra-acetic acid in electroplate liquid of the present invention, can effectively realize antioxidant effect.
Description
Technical field
The present invention relates to electroplate liquids, and in particular to a kind of copper facing electroplate liquid.
Background technique
In mechanical processing process, the anti-corrosive grease of component surface adherency, cutting fluid, machinery oil, lubricant grease, grinding
Liquid, release agent etc. are mixed and are sticked together with dust, polishing dust, form thicker dirt.If the above dirt is not removed before heat treatment
It goes, then degreasing and rust removal is difficult to clean up after its quenching sinters obstinate solid grease into, and bubble attachment makes to plate thereon when plating
Layer forms gas detention type pin hole.Heat treated part surface inevitably adheres to one layer of greasy dirt, when dust is fallen on the surface,
And mix and stick together with grease, it is difficult to clean up over time, so that workpiece surface be made to form unconspicuous tiny oil mark, applies
Bubble residence forms pin hole thereon when plating.When in addition using mesh band type resistor furnace quenching, the greasy dirt and dust etc. of workpiece surface are miscellaneous
Matter particle is mixed to stick together, and sinters obstinate solid grease into, and when salt made from earth containing a comparatively high percentage of sodium chloride is tempered, the above grease forms with nitro salt obstinate again
Thermopolymer, when plating, are difficult that the above dirt is thoroughly cleared, and bubble hydrogen is easily adhered to above dirt, it is difficult to is discharged, to make
Coating generates pin hole and point phenomenon, and as bubble is gradually grown up, coating can be burst automatically, decortication phenomenon is generated, to lead
Send a telegraph the disadvantage of plating solution difference of hardness, dispersion performance and covering power difference.
In view of the above shortcomings, the designer, is actively subject to research and innovation, to found a kind of new structural copper facing
With electroplate liquid, make it with more the utility value in industry.
Summary of the invention
In order to solve the above technical problems, the object of the present invention is to provide a kind of anti-oxidant electroplate liquids of copper facing.
Technical scheme is as follows:
A kind of anti-oxidant electroplate liquid of copper facing, which is characterized in that in parts by weight, comprising:
30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of copper chloride, 15-20 parts of nickel hydroxide cobaltous sulfate, chlorination
10-20 parts of cobalt, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of potassium carbonate, acetic acid 3-5
Part, 10-15 parts of dibastic sodium phosphate, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, potassium hydroxide 20-50
Part, 50-80 parts of ethylenediamine tetra-acetic acid, 1000-3000 parts of deionized water.
Further, in parts by weight, comprising: 40 parts of copper sulphate, 44 parts of aluminum sulfate, 34 parts of copper chloride, hydroxide
18 parts of nickel cobaltous sulfate, 15 parts of cobalt chloride, 20 parts of ferric sulfate, 15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of potassium carbonate, acetic acid 4
Part, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite, 25 parts of potassium cyanide, 30 parts of sodium stannate, 35 parts of potassium hydroxide, ethylenediamine tetra-acetic acid
60 parts, 2000 parts of deionized water.
A kind of preparation method of the anti-oxidant electroplate liquid of copper facing, it is characterised in that: by copper sulphate, aluminum sulfate, copper chloride, hydrogen-oxygen
Change nickel cobaltous sulfate, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, potassium carbonate, acetic acid, dibastic sodium phosphate, sodium nitrite, cyaniding
It is add to deionized water after potassium, sodium stannate, potassium hydroxide, ethylenediamine tetra-acetic acid are mixed, then after being dispersed by dispersion machine,
The electroplate liquid is obtained after stirring by high-speed mixer.
According to the above aspect of the present invention, the present invention has at least the following advantages:
It joined ethylenediamine tetra-acetic acid in electroplate liquid of the present invention, can effectively realize antioxidant effect.
Specific embodiment
With reference to embodiment, the embodiment of the present invention is furthur described in detail.Following embodiment is used for
Illustrate the present invention, but is not intended to limit the scope of the invention.
A kind of preparation method of the anti-oxidant electroplate liquid of copper facing, by copper sulphate, aluminum sulfate, copper chloride, nickel hydroxide cobaltous sulfate,
Cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, potassium carbonate, acetic acid, dibastic sodium phosphate, sodium nitrite, potassium cyanide, sodium stannate,
It is add to deionized water after potassium hydroxide, ethylenediamine tetra-acetic acid are mixed, then after being dispersed by dispersion machine, passes through high-speed stirring
The electroplate liquid is obtained after mixing machine stirring.
Embodiment 1
A kind of anti-oxidant electroplate liquid of copper facing, in parts by weight, comprising:
30 parts of copper sulphate, 40 parts of aluminum sulfate, 30 parts of copper chloride, 15 parts of nickel hydroxide cobaltous sulfate, 10 parts of cobalt chloride, ferric sulfate
15 parts, 10 parts of frerrous chloride, 10 parts of cuprous oxide, 15 parts of potassium carbonate, 3 parts of acetic acid, 10 parts of dibastic sodium phosphate, 15 parts of sodium nitrite,
20 parts of potassium cyanide, 20 parts of sodium stannate, 20 parts of potassium hydroxide, 50 parts of ethylenediamine tetra-acetic acid, 1000 parts of deionized water.
Embodiment 2
A kind of anti-oxidant electroplate liquid of copper facing, in parts by weight, comprising:
40 parts of copper sulphate, 45 parts of aluminum sulfate, 45 parts of copper chloride, 18 parts of nickel hydroxide cobaltous sulfate, 15 parts of cobalt chloride, ferric sulfate
20 parts, 15 parts of frerrous chloride, 12 parts of cuprous oxide, 18 parts of potassium carbonate, 4 parts of acetic acid, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite,
25 parts of potassium cyanide, 30 parts of sodium stannate, 30 parts of potassium hydroxide, 30 parts of ethylenediamine tetra-acetic acid, 2000 parts of deionized water.
Embodiment 3
A kind of anti-oxidant electroplate liquid of copper facing, in parts by weight, comprising:
50 parts of copper sulphate, 50 parts of aluminum sulfate, 60 parts of copper chloride, 20 parts of nickel hydroxide cobaltous sulfate, 20 parts of cobalt chloride, ferric sulfate
30 parts, 20 parts of frerrous chloride, 15 parts of cuprous oxide, 20 parts of potassium carbonate, 5 parts of acetic acid, 15 parts of dibastic sodium phosphate, 20 parts of sodium nitrite,
30 parts of potassium cyanide, 50 parts of sodium stannate, 50 parts of potassium hydroxide, 80 parts of ethylenediamine tetra-acetic acid, 3000 parts of deionized water.
It joined ethylenediamine tetra-acetic acid in electroplate liquid of the present invention, can effectively realize antioxidant effect.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (3)
1. a kind of anti-oxidant electroplate liquid of copper facing, which is characterized in that in parts by weight, comprising:
30-50 parts of copper sulphate, 40-50 parts of aluminum sulfate, 30-60 parts of copper chloride, 15-20 parts of nickel hydroxide cobaltous sulfate, cobalt chloride 10-
20 parts, 15-30 parts of ferric sulfate, 10-20 parts of frerrous chloride, 10-15 parts of cuprous oxide, 15-20 parts of potassium carbonate, 3-5 parts of acetic acid, phosphorus
10-15 parts of sour hydrogen sodium, 15-20 parts of sodium nitrite, 20-30 parts of potassium cyanide, 20-50 parts of sodium stannate, 20-50 parts of potassium hydroxide, second
50-80 parts of ethylenediamine tetraacetic acid (EDTA), 1000-3000 parts of deionized water.
2. the anti-oxidant electroplate liquid of a kind of copper facing according to claim 1, which is characterized in that in parts by weight, comprising:
40 parts of copper sulphate, 44 parts of aluminum sulfate, 34 parts of copper chloride, 18 parts of nickel hydroxide cobaltous sulfate, 15 parts of cobalt chloride, 20 parts of ferric sulfate, chlorine
Change ferrous 15 parts, 12 parts of cuprous oxide, 18 parts of potassium carbonate, 4 parts of acetic acid, 12 parts of dibastic sodium phosphate, 18 parts of sodium nitrite, potassium cyanide 25
Part, 30 parts of sodium stannate, 35 parts of potassium hydroxide, 60 parts of ethylenediamine tetra-acetic acid, 2000 parts of deionized water.
3. a kind of preparation method of the anti-oxidant electroplate liquid of copper facing according to claim 2, it is characterised in that: by copper sulphate,
Aluminum sulfate, copper chloride, nickel hydroxide cobaltous sulfate, cobalt chloride, ferric sulfate, frerrous chloride, cuprous oxide, potassium carbonate, acetic acid, phosphoric acid
After hydrogen sodium, sodium nitrite, potassium cyanide, sodium stannate, potassium hydroxide, ethylenediamine tetra-acetic acid are mixed, then pass through dispersion machine dispersion
After be add to deionized water, the electroplate liquid is obtained after stirring by high-speed mixer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711013008.1A CN109706487A (en) | 2017-10-26 | 2017-10-26 | A kind of anti-oxidant electroplate liquid of copper facing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711013008.1A CN109706487A (en) | 2017-10-26 | 2017-10-26 | A kind of anti-oxidant electroplate liquid of copper facing |
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| CN109706487A true CN109706487A (en) | 2019-05-03 |
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| CN201711013008.1A Pending CN109706487A (en) | 2017-10-26 | 2017-10-26 | A kind of anti-oxidant electroplate liquid of copper facing |
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Citations (7)
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| CN101545123A (en) * | 2009-03-30 | 2009-09-30 | 哈尔滨汽轮机厂有限责任公司 | Method for non-cyanide copper electroplating of steel parts |
| CN101550570A (en) * | 2009-04-15 | 2009-10-07 | 昆明理工大学 | Non-cyanide electro cooper plating bath of EDTA system and use method thereof |
| CN104120462A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Method for carrying out cyanide-free cuprous brass electroplating on steel cord and method for passivating brass coating |
| CN104911656A (en) * | 2015-06-13 | 2015-09-16 | 梁胜光 | Metal alloy electroplating liquid |
| CN105780071A (en) * | 2016-05-19 | 2016-07-20 | 大连理工大学 | Cyanide-free Au-Sn alloy plating solution and preparing method and application thereof |
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
| CN106337195A (en) * | 2016-11-16 | 2017-01-18 | 武汉奥克特种化学有限公司 | Acidic zinc-plated carrier and a preparation method and application thereof |
-
2017
- 2017-10-26 CN CN201711013008.1A patent/CN109706487A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101545123A (en) * | 2009-03-30 | 2009-09-30 | 哈尔滨汽轮机厂有限责任公司 | Method for non-cyanide copper electroplating of steel parts |
| CN101550570A (en) * | 2009-04-15 | 2009-10-07 | 昆明理工大学 | Non-cyanide electro cooper plating bath of EDTA system and use method thereof |
| CN104120462A (en) * | 2014-06-25 | 2014-10-29 | 济南大学 | Method for carrying out cyanide-free cuprous brass electroplating on steel cord and method for passivating brass coating |
| CN104911656A (en) * | 2015-06-13 | 2015-09-16 | 梁胜光 | Metal alloy electroplating liquid |
| CN105780071A (en) * | 2016-05-19 | 2016-07-20 | 大连理工大学 | Cyanide-free Au-Sn alloy plating solution and preparing method and application thereof |
| CN106119911A (en) * | 2016-08-21 | 2016-11-16 | 无锡瑾宸表面处理有限公司 | Stable type electroplate liquid |
| CN106337195A (en) * | 2016-11-16 | 2017-01-18 | 武汉奥克特种化学有限公司 | Acidic zinc-plated carrier and a preparation method and application thereof |
Non-Patent Citations (1)
| Title |
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| 刘雅敏 等: "《药物制剂常用辅料》", 31 January 1994, 天津科技翻译出版公司 * |
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Application publication date: 20190503 |