CN109701821A - A kind of Glue dripping head and dispensing method for LED die bond - Google Patents
A kind of Glue dripping head and dispensing method for LED die bond Download PDFInfo
- Publication number
- CN109701821A CN109701821A CN201910129420.2A CN201910129420A CN109701821A CN 109701821 A CN109701821 A CN 109701821A CN 201910129420 A CN201910129420 A CN 201910129420A CN 109701821 A CN109701821 A CN 109701821A
- Authority
- CN
- China
- Prior art keywords
- dispensing
- glue
- extruder
- head
- glue dripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coating Apparatus (AREA)
Abstract
The invention discloses a kind of Glue dripping heads for LED die bond, including pneumatic mechanism and glue feed mechanism, the glue feed mechanism is located at below the pneumatic mechanism, the pneumatic mechanism drives the glue feed mechanism, the glue feed mechanism includes two mirror settings for plastic structure, the lower section that the pneumatic mechanism is fixed on for plastic structure, described for plastic structure includes connecting rod, for sebific duct and extruder, the lower section for being fixed on the pneumatic mechanism by the connecting rod for sebific duct, the shape for sebific duct is class " L " type, the extruder is set to the lower end for sebific duct, the upper end for sebific duct is connected with colloid feeding mechanism.The invention also discloses a kind of dispensing methods for LED die bond.A kind of Glue dripping head and dispensing method for LED die bond of the invention can effectively avoid the chip excessive glue problem of traditional dispensing mode, enable what LED chip consolidated to be fitted on substrate, and conductive more preferable with efficiency that is radiating, reliability is stronger.
Description
Technical field
The invention belongs to technical field of semiconductor illumination, specifically, being related to a kind of Glue dripping head for LED die bond and point
Gluing method.
Background technique
Die bond is also known as Die Bond or load.Die bond passes through colloid wafer bonding in the specified region of bracket, and one
As for, the colloid that LED is used is conducting resinl or insulating cement, and on pad, the glue point that insulate makes adhesive dots except pad position
LED is fixed on substrate and is formed heat passage or electric pathway, provides the process of condition for the connection of postorder routing.
Traditional crystal-bonding adhesive coating method is that crystal-bonding adhesive is existed with spherical or drops shape point by automatically dropping glue head
On substrate, LED is covered on substrate and is squeezed crystal-bonding adhesive later, crystal-bonding adhesive is given to apply a lower pressure F, so by spherical or
The crystal-bonding adhesive of drops flattens (such as Fig. 1), and due to the effect of spherical characteristics and surface tension of liquid, crystal-bonding adhesive can be at pressure F
Shakeout into the glue-line of a cylindrical body, it is generally the case that the border circular areas of the cylindrical body can be bigger than the size of chip, due to routine
LED chip be the structure of square body, therefore will lead to more crystal-bonding adhesive and can overflow chip, setting causes conducting resinl to overflow
Perhaps insulating cement covers on pad and then causes LED chip there is a situation where short circuit or failure welding generation pad out, special
It is not to be possible to spill into other pads and cause short-circuit (such as Fig. 2) in the fine wiring of COB light source.Conventional way now
To reduce dispensing amount, but glue amount is very few, i.e., crystal-bonding adhesive it is very few if, often make what LED chip can not be firm to be fitted in substrate
On, therefore the control of glue amount becomes one of the main bugbear in industry.
Further, since arc is generally at the top of spherical or drops crystal-bonding adhesive, therefore, when LED chip is placed on die bond
After on glue, provided that pressure F is not at the middle of LED chip and crystal-bonding adhesive, it would be possible to the lower pressure of LED chip can be made
Raw offset, while the die bond glue-line of LED chip bottom being made unevenly to cause LED chip there is a situation where tilting (such as Fig. 3), thus
It causes die bond bad, is unfavorable for the luminous of chip, heat dissipation and its reliability.
Summary of the invention
Technical problem to be solved of the invention is that providing one kind can be avoided crystal-bonding adhesive spilling pad or dispensing position,
And the Glue dripping head and dispensing method for LED die bond that LED chip and crystal-bonding adhesive can be made to directly fit.
The technical solution of present invention solution above-mentioned technical problem are as follows:
A kind of Glue dripping head for LED die bond, including pneumatic mechanism and glue feed mechanism, the glue feed mechanism are located at the pneumatic motor
Below structure, the pneumatic mechanism drives the glue feed mechanism, and the glue feed mechanism includes two mirror settings for plastic structure, institute
State the lower section that the pneumatic mechanism is fixed on for plastic structure, described for plastic structure includes connecting rod, for sebific duct and extruder, the confession
Sebific duct is fixed on the lower section of the pneumatic mechanism by the connecting rod, and the shape for sebific duct is class " L " type, the extruder
It is set to the lower end for sebific duct, the upper end for sebific duct is connected with colloid feeding mechanism, described in two of mirror image
Extruder is oppositely arranged in level.
Specifically, the extruder includes interconnecting piece and extruder head, the extruder head is set to the side of the interconnecting piece
It is described to be fixedly connected for sebific duct with the interconnecting piece and company is connected with the extruder head and close to the lower surface of the interconnecting piece
It connects.
Specifically, the end of the extruder head is ramped shaped diagonally downward, middle part is hollow.
Specifically, the upper surface of the extruder head is equipped with the of same size of the extruder head and extends towards horizontal direction
Baffle, the inside upper surface of the lower surface of the baffle and the extruder head is in same plane, and the extension of the baffle is long
Degree is 1.5 ~ 2.5 times of the end ramps orthographic projection distance of the extruder head.
Specifically, the pneumatic mechanism includes the pneumatic pawl of two mirror settings, it is described to be fixed on institute for plastic structure correspondence
It states on pneumatic pawl.
Specifically, the shape of the connecting rod is class L shape, the transverse bar of the connecting rod offers fixed described for sebific duct
Through-hole, the vertical bar of the connecting rod are fixed on the pneumatic pawl.
The further technical solution of present invention solution above-mentioned technical problem are as follows:
A kind of dispensing method for LED die bond is included the following steps: using a kind of such as above-mentioned Glue dripping head for LED die bond
Connection, Glue dripping head is fixedly installed on dispenser, the glue conveying box of colloid feeding mechanism is fixed with for sebific duct upper end
Connection；
Corresponding information substrate in dispenser, the glue amount supply of corresponding setting colloid feeding mechanism are called in setting；
For plate, dispenser is transported counterpart substrate to dispensing operation position by conveyer belt；
Dispensing, dispenser control Glue dripping head and carry out dispensing to substrate；
Ejecting plate, the substrate that dispensing is completed are transported to next step process by conveyer belt and carry out LED die bond.
Specifically, further including following steps in the dispensing step:
Positioning, dispenser are moved to N dispensing position according to preset information substrate, by Glue dripping head；
Closure, starts the pneumatic mechanism of Glue dripping head, the extruder head of the mirror settings end close to each other to baffle is bonded to each other；
Fitting, dispenser is by Glue dripping head vertical depression, until the extruder bottom surface of Glue dripping head fits on substrate, at this point, squeezing out
Head is corresponding in the N dispensing position of substrate；
Dispensing starts colloid feeding mechanism, colloid is delivered to Glue dripping head, by the cooperation for sebific duct and extruder, by colloid
Point is squeezed out on substrate；
Separation, starts the pneumatic mechanism of Glue dripping head, the extruder head level of mirror settings is divided right and left, and is detached from crystal-bonding adhesive and squeezes out
Capitiform is at single crystal-bonding adhesive；
It resets, Glue dripping head vertical ascent is made extruder leave substrate by dispenser, completes the dispensing work of N dispensing position；
The step of repeating, repeating positioning, closure, fitting, dispensing, separation and reset, until the dispensing position on substrate is complete
At dispensing.
Specifically, the shape of the crystal-bonding adhesive is inverted trapezoidal.
The invention has the following advantages: by mirror settings for plastic structure, make for glue mode from being vertically converted to
Level, and use is bilateral for glue, it is substantially uniform at the top of the crystal-bonding adhesive after making a little to directly fit LED chip, it uses simultaneously
The design of baffle keeps crystal-bonding adhesive top surface more smooth, so that LED chip is fitted in crystal-bonding adhesive upper surface, this
Outside, using the extruder head with slope, make the colloid after squeezing out after extruder head is taken away in up big and down small inverted trapezoidal, to make
When LED chip pushes under the action of pressure F, the bottom of crystal-bonding adhesive can hold extra colloid, to guarantee crystal-bonding adhesive not
Dispensing position can be overflowed, the chip excessive glue problem of traditional dispensing mode is avoided, enables what LED chip consolidated to be fitted on substrate,
Conductive more preferable with the efficiency of heat dissipation, reliability is stronger.
Detailed description of the invention
Fig. 1 is that LED chip is bonded crystal-bonding adhesive stress condition schematic diagram in traditional die bond technique.
Fig. 2 is that crystal-bonding adhesive overflows situation schematic diagram in traditional die bond technique.
Fig. 3 is that LED chip tilts situation schematic diagram in traditional die bond technique.
Fig. 4 is the schematic perspective view of Glue dripping head of the present invention.
Fig. 5 is the position the A enlarged structure schematic diagram of Glue dripping head of the present invention.
Fig. 6 is that the LED chip of the embodiment of the present invention is bonded the schematic diagram of crystal-bonding adhesive.
The meaning that each serial number indicates in attached drawing is as follows:
1 pneumatic mechanism, 11 pneumatic pawls, 2 connecting rods, 3 for sebific duct, 4 interconnecting pieces, 5 extruder heads, 6 baffles, 7LED chip, 8 crystal-bonding adhesives, and 9
Substrate.
Specific embodiment
It elaborates with reference to the accompanying drawing to the present invention.
A kind of Glue dripping head for LED die bond of the embodiment of the present invention as illustrated in figures 4-5, including pneumatic mechanism 1 with for glue
Mechanism, the glue feed mechanism are located at 1 lower section of pneumatic mechanism, and the pneumatic mechanism 1 drives the glue feed mechanism, described for glue
Mechanism includes two mirror settings for plastic structure, and the lower section that the pneumatic mechanism 1 is fixed on for plastic structure is described for glue
Structure includes connecting rod 2, for sebific duct 3 and extruder, described to be fixed under the pneumatic mechanism 1 for sebific duct 3 by the connecting rod 2
Side, the shape for sebific duct 3 are class " L " type, and the extruder is set to the lower end for sebific duct 3, described for sebific duct 3
Upper end be connected with colloid feeding mechanism, two extruders of mirror image are oppositely arranged in level.Mirror settings for glue
Structure makes two extruders in horizontal positioned, so original vertical is changed to for the mode of glue it is horizontal for glue, so as to avoid
Tradition is formed by spherical or drops for glue mode, therefore the colloid of its bottom is more uniformly and controlled shape, one-pass molding
The top surface of crystal-bonding adhesive 8 be also class square structure similar with LED chip 7, therefore, LED chip 7 can be good at it is direct with it is solid
Brilliant glue 8 is bonded to each other, as shown in Figure 6.
Specifically, the extruder includes interconnecting piece 4 and extruder head 5, the extruder head 5 is set to the interconnecting piece 4
Side and close to the lower surface of the interconnecting piece 4, it is described be fixedly connected for sebific duct 3 with the interconnecting piece 4 and with the extruder head 5
Conducting connection.Specifically, the end of the extruder head 5 is ramped shaped diagonally downward, middle part is hollow.Specifically, the extrusion
First 5 upper surface is equipped with the of same size of the extruder head 5 and towards baffle 6 extending to the horizontal direction, under the baffle 6
The inside upper surface of surface and the extruder head 5 is in same plane, and the development length of the baffle 6 is the extruder head 5
1.5 ~ 2.5 times of end ramps orthographic projection distance.When the lower surface of extruder head 5 close to interconnecting piece 4 makes 4 adhesive substrates 9 of interconnecting piece,
Extruder head 5 be also be bonded substantially with substrate 9, guarantee from extruder head 5 out colloid can first time adhesive substrates 9, into
One step control colloid output quantity, using the extruder head 5 of ramped shaped, be in order to make 8 two sides of the crystal-bonding adhesive after dispensing formed slope,
And then entire crystal-bonding adhesive 8 is set to form up big and down small structure, and then crystal-bonding adhesive 8 is enable to have a surplus in the effect for the F that is under pressure
Ground extension is without overflowing dispensing position.In addition, the setting of baffle 6, further makes the upper surface of the crystal-bonding adhesive 8 after the completion of dispensing
A smooth plane is formed, and then can be bonded with LED chip 7, meanwhile, also further prevent to lead when crystal-bonding adhesive 8 is excessively high
Cause it under the suppressing action of pressure F, the case where excessive spill-out occur occurs.
Specifically, the pneumatic mechanism 1 includes the pneumatic pawl 11 of two mirror settings, it is described to be fixed on for plastic structure correspondence
On the pneumatic pawl 11.Pneumatic mechanism 1 can drive pneumatic pawl 11 to carry out moving left and right for horizontal direction, make the two of mirror settings
Only pneumatic pawl 11 corresponding can move left and right in the horizontal direction, and then two extruders of glue feed mechanism can be driven same
Step is moved, so that colloid can be separated from after the completion of dispensing by playing dispensing, and then guarantees that the shape of inverted trapezoidal will not be because
When Glue dripping head is separated from substrate 9, it is touched and deforms.Specifically, the shape of the connecting rod 2 is class L shape, the company
The transverse bar of bar 2 offers the fixed through-hole for sebific duct 3, and the vertical bar of the connecting rod 2 is fixed on the pneumatic pawl 11.
It is mutually matched using the connecting rod 2 of class L shape with for sebific duct 3, guarantees that the horizontal pipeline for sebific duct 3 keeps horizontality.
The further technical solution of present invention solution above-mentioned technical problem are as follows:
A kind of dispensing method for LED die bond, includes the following steps:
Connection, Glue dripping head is fixedly installed on dispenser, the glue conveying box of colloid feeding mechanism is fixed with for 3 upper end of sebific duct
Connection；Dispensing relies on intelligent dispenser, can carry out dispensing automatically, it is therefore desirable in advance install Glue dripping head.
Corresponding information substrate in dispenser, the glue amount supply of corresponding setting colloid feeding mechanism are called in setting；Dispensing
Corresponding information substrate is preset in machine, the information substrate can by the controller of dispenser in dispenser direct compilation,
It can also be by copy after the completion of external compiling into dispenser and then being verified, different substrate 9, corresponding information substrate is not
Together.Colloid feeding mechanism is configured generally according to the colloid amount of actual demand, directly matching colloid amount, without by multiple
Other miscellaneous control modes guarantee that colloid amount will not deviate.
For plate, dispenser is transported counterpart substrate 9 to dispensing operation position by conveyer belt；Conveyer belt can directly and substrate
Supply machine line, and then make to automate for plate.
Dispensing, dispenser control Glue dripping head and carry out dispensing to substrate 9；Specifically, further including following steps in the step:
Positioning, dispenser are moved to N dispensing position according to preset information substrate, by Glue dripping head；Usual one piece of substrate 9 needs more
A position dispensing, rather than one, what N herein was represented is the set of { 1,2,3,4,5,6 ..., n }.
Closure, starts the pneumatic mechanism 1 of Glue dripping head, by the extruder head 5 of the mirror settings end phase close to each other to baffle 6
Mutually fitting；When baffle 6 being closed, and then closing dispensing colloid towards upper channel, guarantee that 8 top surface of crystal-bonding adhesive is smooth.
Fitting, dispenser is by Glue dripping head vertical depression, until the extruder bottom surface of Glue dripping head fits on substrate 9, at this point,
Extruder head 5 is corresponding in the N dispensing position of substrate 9；Extruder is bonded with substrate 9, it is ensured that the colloid of extrusion at the first time with
Substrate 9 is bonded.
Dispensing starts colloid feeding mechanism, colloid is delivered to Glue dripping head, will by the cooperation for sebific duct 3 and extruder
Colloid squeezes out point on substrate 9；At this point, squeeze out colloid under the action of the slope of baffle 6 and extruder head 5, the die bond of formation
The shape of glue 8 is inverted trapezoidal, and inverted trapezoidal is highly preferred embodiment of the invention, but it is normal for, other rectangular structures are also
It can satisfy present invention effect to be achieved, avoid will appear such as spherical or drops crystal-bonding adhesive 8 because squeezing, to excessive
Out, especially spherical or drops its bottom of structure is maximum, once being squeezed, bottom can extend to the outside at the first time, from
And the range for overflowing it is far longer than rectangular structure, therefore, even if being other square structures of non-inverted trapezoidal structure, also answers
When falling within scope of the present invention.
Separation, starts the pneumatic mechanism 1 of Glue dripping head, 5 level of extruder head of mirror settings is divided right and left, crystal-bonding adhesive 8 is made
It is detached from extruder head 5 and forms single crystal-bonding adhesive 8；When dispensing is completed, pneumatic mechanism 1 removes extruder head 5, makes crystal-bonding adhesive 8 into one
One-step forming.
It resets, Glue dripping head vertical ascent is made extruder leave substrate 9 by dispenser, completes the dispensing work of N dispensing position
Make；Dispensing of every completion, is both needed to reset Glue dripping head, and then substrate 9 is made to be able to carry out subsequent step.
The step of repeating, repeating positioning, closure, fitting, dispensing, separation and reset, until the dispensing position on substrate 9
Complete dispensing.
Ejecting plate, the substrate 9 that dispensing is completed are transported to next step process by conveyer belt and carry out LED die bond.
The above content is combine specific preferred embodiment to the further description done of the present invention, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (9)
1. a kind of Glue dripping head for LED die bond, including pneumatic mechanism (1) and glue feed mechanism, the glue feed mechanism is located at described
Below pneumatic mechanism (1), the pneumatic mechanism (1) drives the glue feed mechanism, it is characterised in that: the glue feed mechanism includes two
A mirror settings for plastic structure, the lower section that the pneumatic mechanism (1) is fixed on for plastic structure is described to include for plastic structure
Connecting rod (2), for sebific duct (3) and extruder, it is described to be fixed on the pneumatic mechanism (1) by the connecting rod (2) for sebific duct (3)
Lower section, the shape for sebific duct (3) are class " L " type, and the extruder is set to the lower end for sebific duct (3), described
It is connected for the upper end of sebific duct (3) with colloid feeding mechanism, two extruders of mirror image are oppositely arranged in level.
2. a kind of Glue dripping head for LED die bond according to claim 1, it is characterised in that: the extruder includes connection
Portion (4) and extruder head (5), the extruder head (5) are set to the side of the interconnecting piece (4) and close to the interconnecting pieces (4)
Lower surface, it is described to be fixedly connected for sebific duct (3) with the interconnecting piece (4) and connection is connected with the extruder head (5).
3. a kind of Glue dripping head for LED die bond according to claim 2, it is characterised in that: the end of the extruder head (5)
For ramped shaped diagonally downward, middle part is hollow.
4. a kind of Glue dripping head for LED die bond according to claim 3, it is characterised in that: the upper table of the extruder head (5)
Face is equipped with the of same size of the extruder head (5) and towards baffle extending to the horizontal direction (6), the following table of the baffle (6)
The inside upper surface of face and the extruder head (5) is in same plane, and the development length of the baffle (6) is the extruder head
(5) 1.5 ~ 2.5 times of end ramps orthographic projection distance.
5. a kind of Glue dripping head for LED die bond described in -4 any one according to claim 1, it is characterised in that: described pneumatic
Mechanism (1) includes the pneumatic pawl (11) of two mirror settings, described to be fixed on the pneumatic pawl (11) for plastic structure correspondence.
6. a kind of Glue dripping head for LED die bond according to claim 5, it is characterised in that: the shape of the connecting rod (2) is
Class L shape, the transverse bar of the connecting rod (2) offer the fixed through-hole for sebific duct (3), the vertical bar of the connecting rod (2)
It is fixed on the pneumatic pawl (11).
7. a kind of dispensing method for LED die bond, which is characterized in that solid for LED using one kind as described in claim 1-6
Brilliant Glue dripping head, includes the following steps:
Connection, Glue dripping head is fixedly installed on dispenser, the glue conveying box of colloid feeding mechanism is fixed with for sebific duct upper end
Connection；
Corresponding information substrate in dispenser, the glue amount supply of corresponding setting colloid feeding mechanism are called in setting；
For plate, dispenser is transported counterpart substrate to dispensing operation position by conveyer belt；
Dispensing, dispenser control Glue dripping head and carry out dispensing to substrate；
Ejecting plate, the substrate that dispensing is completed are transported to next step process by conveyer belt and carry out LED die bond.
8. dispensing method according to claim 7, which is characterized in that further include following steps in the dispensing step:
Positioning, dispenser are moved to N dispensing position according to preset information substrate, by Glue dripping head；
Closure, starts the pneumatic mechanism of Glue dripping head, the extruder head of the mirror settings end close to each other to baffle is bonded to each other；
Fitting, dispenser is by Glue dripping head vertical depression, until the extruder bottom surface of Glue dripping head fits on substrate, at this point, squeezing out
Head is corresponding in the N dispensing position of substrate；
Dispensing starts colloid feeding mechanism, colloid is delivered to Glue dripping head, by the cooperation for sebific duct and extruder, by colloid
Point is squeezed out on substrate；
Separation, starts the pneumatic mechanism of Glue dripping head, the extruder head level of mirror settings is divided right and left, and is detached from crystal-bonding adhesive and squeezes out
Capitiform is at single crystal-bonding adhesive；
It resets, Glue dripping head vertical ascent is made extruder leave substrate by dispenser, completes the dispensing work of N dispensing position；
The step of repeating, repeating positioning, closure, fitting, dispensing, separation and reset, until the dispensing position on substrate is complete
At dispensing.
9. dispensing method according to claim 8, it is characterised in that: the shape of the crystal-bonding adhesive is inverted trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910129420.2A CN109701821B (en) | 2019-02-21 | 2019-02-21 | Dispensing head and dispensing method for LED die bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910129420.2A CN109701821B (en) | 2019-02-21 | 2019-02-21 | Dispensing head and dispensing method for LED die bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109701821A true CN109701821A (en) | 2019-05-03 |
| CN109701821B CN109701821B (en) | 2023-05-23 |
Family
ID=66264704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910129420.2A Active CN109701821B (en) | 2019-02-21 | 2019-02-21 | Dispensing head and dispensing method for LED die bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109701821B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116213198A (en) * | 2023-05-04 | 2023-06-06 | 合肥同晶电子有限公司 | Automatic dispensing system of crystal resonator |
| CN118099297A (en) * | 2024-03-05 | 2024-05-28 | 瀚思科技发展(北京)有限公司 | Picture uniformity improving method for LED |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002231734A (en) * | 2001-02-06 | 2002-08-16 | Oki Data Corp | Substrate unit, semiconductor element, mounting method and manufacturing method there of |
| JP2005219274A (en) * | 2004-02-04 | 2005-08-18 | Bridgestone Corp | Method and apparatus for replacing cap of extruder |
| CN206028070U (en) * | 2016-09-18 | 2017-03-22 | 李政道 | Curtain can be once accomplished and gluey rifle device of gluing is beaten |
| CN106807591A (en) * | 2015-12-01 | 2017-06-09 | 鸿骐新技股份有限公司 | The glue applying mechanism of adjustable dispensing angle |
| CN206444840U (en) * | 2017-01-16 | 2017-08-29 | 湖北恒盛有机硅有限责任公司 | A kind of sealant extrusion device |
| CN206911648U (en) * | 2017-06-26 | 2018-01-23 | 苏州光宝科技股份有限公司 | A kind of six degree of freedom point gum machine |
| JP2018024146A (en) * | 2016-08-09 | 2018-02-15 | 住友ゴム工業株式会社 | Method for extrusion molding extrusion head and tire rubber member |
| CN207056906U (en) * | 2017-08-01 | 2018-03-02 | 昆山佰易仪器设备有限公司 | A kind of point gum machine of scalable Glue dripping head |
-
2019
- 2019-02-21 CN CN201910129420.2A patent/CN109701821B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002231734A (en) * | 2001-02-06 | 2002-08-16 | Oki Data Corp | Substrate unit, semiconductor element, mounting method and manufacturing method there of |
| JP2005219274A (en) * | 2004-02-04 | 2005-08-18 | Bridgestone Corp | Method and apparatus for replacing cap of extruder |
| CN106807591A (en) * | 2015-12-01 | 2017-06-09 | 鸿骐新技股份有限公司 | The glue applying mechanism of adjustable dispensing angle |
| JP2018024146A (en) * | 2016-08-09 | 2018-02-15 | 住友ゴム工業株式会社 | Method for extrusion molding extrusion head and tire rubber member |
| CN206028070U (en) * | 2016-09-18 | 2017-03-22 | 李政道 | Curtain can be once accomplished and gluey rifle device of gluing is beaten |
| CN206444840U (en) * | 2017-01-16 | 2017-08-29 | 湖北恒盛有机硅有限责任公司 | A kind of sealant extrusion device |
| CN206911648U (en) * | 2017-06-26 | 2018-01-23 | 苏州光宝科技股份有限公司 | A kind of six degree of freedom point gum machine |
| CN207056906U (en) * | 2017-08-01 | 2018-03-02 | 昆山佰易仪器设备有限公司 | A kind of point gum machine of scalable Glue dripping head |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116213198A (en) * | 2023-05-04 | 2023-06-06 | 合肥同晶电子有限公司 | Automatic dispensing system of crystal resonator |
| CN118099297A (en) * | 2024-03-05 | 2024-05-28 | 瀚思科技发展(北京)有限公司 | Picture uniformity improving method for LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109701821B (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109701821A (en) | A kind of Glue dripping head and dispensing method for LED die bond | |
| CN109243313A (en) | A kind of small spacing LED display panel of high contrast COB encapsulation | |
| JP2016515310A (en) | LIGHT EMITTING ELEMENT PACKAGE, BACKLIGHT UNIT, LIGHTING DEVICE, AND LIGHT EMITTING ELEMENT PACKAGE MANUFACTURING METHOD | |
| CN209680441U (en) | A kind of Glue dripping head for LED die bond | |
| CN111029454A (en) | Flip lamp bead die bonding and eutectic all-in-one machine and flip lamp bead packaging process | |
| CN116314550A (en) | CSP (chip scale package) structure of forward-mounted LED (light emitting diode) chip, preparation method of CSP structure and COB (chip on board) light source | |
| CN106505043B (en) | The manufacturing method and manufacturing device of semiconductor device | |
| CN209691752U (en) | A kind of double-colored temperature COB light source | |
| CN106449950A (en) | Manufacturing method of MLCOB light source | |
| CN207868197U (en) | A kind of LED lamp bead of wiring board | |
| CN111244077A (en) | Double-color temperature COB light source and manufacturing method thereof | |
| CN206878028U (en) | A kind of 360 degree of uniformly light-emitting white light LEDs elements | |
| CN215342647U (en) | Full-automatic solid brilliant device is used in LED production | |
| CN206386707U (en) | LED/light source module | |
| CN214505540U (en) | LED lamp source module | |
| CN211670205U (en) | LED lamp strip | |
| CN110021588A (en) | A kind of LED display mould group of band cup lamp bead and preparation method thereof | |
| CN209981213U (en) | LED device | |
| CN110021586A (en) | A kind of LED lamp bead of wiring board and preparation method thereof | |
| CN107470091B (en) | LED COB (chip on board) dam dispensing all-in-one machine and implementation method thereof | |
| CN104879678B (en) | Backlight module | |
| CN209641250U (en) | LED upside-down mounting display screen | |
| CN209489108U (en) | A kind of liquid metal printer | |
| CN108336081B (en) | COB light source and COB base plate | |
| US20070261779A1 (en) | Backlight unit and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 5th Floor, Building 3, Hongfa Innovation Park, Jiuwei Zhoushi Road, Xixiang Street, Baoan District, Shenzhen, Guangdong 518000 Applicant after: Guangdong Jingrui Semiconductor Co.,Ltd. Address before: 5th Floor, Building 3, Hongfa Innovation Park, Jiuwei Zhoushi Road, Xixiang Street, Baoan District, Shenzhen, Guangdong 518000 Applicant before: SHENZHEN JINGRUI PHOTOELECTRIC CO.,LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: Floor 3-4, Building A, Mingfengda Industrial Park, Baoshan Road, Tianliao Community, Yutang Street, Guangming District, Shenzhen, Guangdong 518000 Patentee after: Guangdong Jingrui Semiconductor Co.,Ltd. Address before: 5th Floor, Building 3, Hongfa Innovation Park, Jiuwei Zhoushi Road, Xixiang Street, Baoan District, Shenzhen, Guangdong 518000 Patentee before: Guangdong Jingrui Semiconductor Co.,Ltd. |